BD3533/31/32 is a termination regulator compatible with JEDEC DDR-SDRAM, which functions as a linear po wer supply
incorporating an N-channel MOSFET and provides a sink/source current capability up to 1A, 1.5A, and 3A respectively. A
built-in high-speed OP-AMP specially designed offers an excellent transient response. Requires 3.3 volts or 5.0 volts as a
bias power supply to drive the N-channel MOSFET. Has an independent reference voltage input pin (VDDQ) and an
independent feedback pin (VTTS) to maintain the accuracy in voltage required by JEDEC, and offers an excellent o utput
voltage accuracy and load regulation. Also has a reference power supply output pin (VREF) for DDR-SDRAM or a
memory controller. When EN pin turns to “Low”, VTT output becomes “Hi-Z” while VREF output is kept unchanged,
compatible with “Self Refresh” state of DDR-SDRAM.
Features
1) Incorporates a push-pull power supply for termination (VTT)
2) Incorporates a reference voltage circuit (VREF)
3) Incorporates an enabler
4) Incorporates an undervoltage lockout (UVLO)
5). Employs SOP8 package
6) Employs MSOP8 package
7) Employs HQFN20V package
8) Employs HTSSOP-B20 package
9) Employs VQFN28V package
10) Incorporates a thermal shutdown protector (TSD)
11) Operates with input voltage from 2.7 to 5.5 volts
12) Compatible with Dual Channel (DDR-II)
Use
Power supply for DDR I/II - SDRAM
●Line up
Parameter BD3533F/FVM/EKN BD3531F BD3532F/EFV/KN
Output Current ±1.0A ±1.5A ±3A
Vcc Range 2.7V~5.5V 4.5V~5.5V 4.3~5.5V
Soft Start Function ○ × ○
Temperature -20~100℃ -10~100℃ -40~100℃
Package SOP8/MSOP8/HQFN20V SOP8 SOP8/HTSSOP-B20/VQFN28
Oct. 2008
●ABSOLUTE MAXIMUM RATINGS
◎BD3533F/FVM/EKN
Parameter Symbol
Input Voltage VCC 7
Enable Input Voltage VEN 7
Termination Input Voltage VTT_IN 7
VDDQ Reference Voltage VDDQ 7
Output Current ITT 3 1 3 A
Power Dissipation1 Pd1 560 *3 437.5
Power Dissipation2 Pd2 690 *4
Power Dissipation3 Pd3
Power Dissipation4 Pd4
Operating Temperature Range Topr -20~+100 -20~+100 -20~+100 ℃
Storage Temperature Range Tstg -55~+150 -55~+150 -55~+150 ℃
Maximum Junction Temperature Tjmax +150 +150 +150 ℃
*1 Should not exceed Pd.
*2 Instantaneous surge voltage, back electromotive force and voltage under less than 10% duty cycle.
*3 Reduced by 4.48mW for each increase in Ta of 1℃ over 25℃(With no heat sink).
*4 Reduced by 5.52mW for each increase in Ta of 1℃ over 25℃(When mounted on a board 70mm×70mm×1.6mm Glass-epoxyPCB).
*5 Reduced by 3.5mW for each increase in Ta of 1℃ over 25℃(With no heat sink).
*6 Ta≧25℃(no heat sink)4mW/℃ increase.
*7 Ta≧25℃(when mounted on 70mm x 70mm x 1.6mm Glass-epoxy PCB which does not have copper on the back side).
*8 Ta≧25℃(when mounted on 70mm x 70mm x 1.6mm Glass-epoxy PCB which has 1 layer ( 60mm x 60mm ) of copper on the back side)14mW/℃ increase.
*9 Ta≧25℃(When mounted on board 70mm x 70mm x 1.6mm Glass-epoxy PCB which has 2 layers ( 60mm x 60mm ) of copper on the back side )16mW/℃
increase.
◎BD3531F
Parameter Symbol Limit Unit
Input Voltage VCC 7 *1 V
EN Input Voltage VEN 7 *1 V
Termination Input Voltage VTT_IN 7 *1 V
VDDQ Reference Voltage VDDQ 7 *1 V
Output Current ITT 3 A
Power Dissipation1 Pd1 560 *2 mW
Power Dissipation2 Pd2 690 *3 mW
Operating Temperature Range Topr
Storage Temperature Range Tstg
Maximum Junction Temperature Tjmax +150 ℃
*1 Should not exceed Pd.
*2 Reduced by 4.48mW for each increase in Ta of 1℃ over 25℃(With no heat sink).
*3 Reduced by 5.52mW for each increase in Ta of 1℃ over 25℃(When mounted on a board 70mm×70mm×1.6mm Glass-epoxyPCB).
◎BD3532F/EFV/KN
Parameter Symbol
Input Voltage VCC 7 *1 7 *1 7 *1 V
Enable Input Voltage VEN 7 *1 7 *1 7 *1 V
Termination Input Voltage VTT_IN 7 *1 7 *1 7 *1 V
VDDQ Reference Voltage VDDQ 7 *1 7 *1 7 *1 V
Output Current ITT 3 3 3 A
Power Dissipation1 Pd1 560 *2 - 460 *5 mW
Power Dissipation2 Pd2 690 *3
Operating Temperature Range Topr -40~+100 -40~+100 -40~+100 ℃
Storage Temperature Range Tstg -55~+150 -55~+150 -55~+150 ℃
Maximum Junction Temperature Tjmax +150 +150 +150 ℃
*1 Should not exceed Pd.
*2 Reduced by 4.48mW for each increase in Ta of 1℃ over 25℃(With no heat sink).
*3 Reduced by 5.52mW for each increase in Ta of 1℃ over 25℃(When mounted on a board 70mm×70mm×1.6mm Glass-epoxyPCB).
*4 Reduced by 8.0mW for each increase in Ta of 1℃ over 25℃(When mounted on a board 70mm×70mm×1.6mm Glass-epoxyPCB).
*5 Reduced by 3.68mW for each increase in Ta of 1℃ over 25℃(With no heat sink).
*6 Reduced by 5.80mW for each increase in Ta of 1℃ over 25℃(When mounted on a board 70mm×70mm×1.6mm Glass-epoxyPCB).
BD3533F BD3533FVM
*1*2
7
*1*2
7
*1*2
7
*1*2
7
*1*2
7
*1*2
7
*1*2
7
*1*2
7
*5
500
-
- -
- -
-10~
-55~
BD3532F BD3532EFV
℃
℃
1000 *
BD3532KN Unit
4
2/16
BD3533EKN Unit
*1*2
V
*1*2
V
*1*2
V
*1*2
V
*6
mW
750 *7 mW
1750 *8 mW
2000 *9 mW
6
725 *
mW
●RECOMMENDED OPERATING CONDITIONS
◎BD3533F/FVM/EKN(Ta=25℃)
Parameter Symbol MIN MAX Unit
Input Voltage VCC 2.7 5.5 V
Termination Input Voltage VTT_IN 1.0 5.5 V
VDDQ Reference Voltage VDDQ 1.0 2.75 V
Enable Input Voltage VEN -0.3 5.5 V
◎BD3531F(Ta=25℃)
Parameter Symbol MIN MAX Unit
Input Voltage VCC 4.5 5.5 V
Termination Input Voltage VTT_IN 1.0 5.5 V
EN Input Voltage VEN -0.3 5.5 V
◎BD3532F/EFV/KN(Ta=25℃)
Parameter Symbol MIN MAX Unit
Input Voltage VCC 4.3 5.5 V
Termination Input Voltage VTT_IN 1.0 5.5 V
EN Input Voltage VEN -0.3 5.5 V
★ No radiation-resistant design is adopted for the present product.