ROHM BD35281HFN Technical data

A
High Performance Regulators for PCs
BD35281HFN
Description
The BD35281HFN ultra low-dropout linear regulator operates from a very low input supply, and offers ideal performance in low input voltage to low output voltage applications. It incorporates a built-in N-MOSFET power transistor to minimize the input-to-output voltage differential to the ON resistance (R the regulator realizes high current output (Iomax=1.5A) with reduced conversion loss, and thereby obviates the switching regulator and its power transistor, choke coil, and rectifier diode. Thus, the BD35281HFN designed to enable significant package profile downsizing and cost reduction. In BD35281HFN, The NRCS (soft start) function enables a controlled output voltage ramp-up, which can be programmed to whatever power supply sequence is required.
Features
1) Internal high-precision reference voltage circuit (0.65V±1%)
2) Internal high-precision output voltage circuit
3) Built-in V
4) NRCS (soft start) function reduces the magnitude of in-rush current
5) Internal Nch MOSFET driver offers low ON resistance (100mΩ typ)
6) Built-in short circuit protection (SCP)
7) Built-in current limit circuit (1.5A min)
8) Built-in thermal shutdown (TSD) circuit
9) Small package HSON8 : 2.9mm×3.0mm×0.6mm
10) Tracking function
Applications
Notebook computers, Desktop computers, LCD-TV, DVD, Digital appliances
Absolute maximum ratings (Ta=25)
undervoltage lockout circuit (VCC=3.80V)
CC
ON max=150mΩ) level. By lowering the dropout voltage in this way,
No.11030EAT38
Parameter Symbol Ratings Unit
Input Voltage 1 VCC +6.0 *1 V
Input Voltage 2 VIN +6.0 *1 V
Maximum Output Current IO 2*1 A
Enable Input Voltage VEN -0.3+6.0 V
Power Dissipation 1 Pd1 0.63 *2 W
Power Dissipation 2 Pd2 1.35 *3 W
Power Dissipation 3 Pd3 1.75*4 W
Operating Temperature Range Topr -10~+100
Storage Temperature Range Tstg -55~+125
Maximum Junction Temperature Tjmax +150
*1 Should not exceed Pd. *2 Reduced by 5.04mW/ for each increase in Ta≧25℃ (when mounted on a 70mm×70mm×1.6mm glass-epoxy board, 1-layer, copper foil area : less than 0.2%) *3 Reduced by 10.8mW/ for each increase in Ta≧25℃ (when mounted on a 70mm×70mm×1.6mm glass-epoxy board, 1-layer, copper foil area : less than 7.0%) *4 Reduced by 14.0mW/ for each increase in Ta≧25℃ (when mounted on a 70mm×70mm×1.6mm glass-epoxy board, 1-layer, copper foil area : less than 65.0%)
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© 2011 ROHM Co., Ltd. All rights reserved.
1/15
2011.01 - Rev.
A
BD35281HFN
Operating Voltage (Ta=25℃)
Parameter Symbol
Ratings
Min. Max.
Unit
Input Voltage 1 VCC 4.3 5.5 V
Input Voltage 2 VIN 1.5 VCC-1 *5 V
Output Voltage Setting Range IO 1.2 (fixed) V
Enable Input Voltage VEN -0.3 5.5 V
NRCS Capacity CNRCS 0.001 1 µF
*5 VCC and VIN do not have to be implemented in the order listed.
This product is not designed for use in radioactive environments.
Electrical Characteristics (Unless otherwise specified, Ta=25℃, VCC=5V, VEN=3V, VIN=1.7V)
Parameter Symbol
Min. Typ. Max.
Limits
Unit Condition
Bias Current ICC - 0.7 1.2 mA
VCC Shutdown Mode Current IST - 0 10 µA VEN=0V
Output Voltage IO 1.5 - - A
Technical Note
Feedback Voltage 1 VOS1 1.188 1.200 1.212 V
Feedback Voltage 2 VOS2 1.176 1.200 1.224 V Tj=-10 to 100
Line Regulation 1 Reg.l1 - 0.1 0.5 %/V VCC=4.3V to 5.5V
Line Regulation 2 Reg.l2 - 0.1 0.5 %/V VIN=1.5V to 3.3V
Load Regulation Reg.L - 0.5 10 mV IO=0 to 1.5A
=1.5A,VIN=1.2V,
I
Output ON Resistance RON - 100 150 mΩ
Standby Discharge Current I
1 - - mA VEN=0V, VO=1V
DEN
O
Tj=-10 to 100
[ENABLE]
Enable Pin Input Voltage High EN
Enable Pin Input Voltage Low EN
2 - - V
HIGH
0 - 0.8 V
LOW
Enable Input Bias Current IEN - 7 10 µA VEN=3V
[NRCS]
NRCS Charge Current I
NRCS Standby Voltage V
12 20 28 µA
NRCS
- 0 50 mV VEN=0V
STB
[UVLO]
VCC Undervoltage Lockout Threshold Voltage
VCC Undervoltage Lockout Hysteresis Voltage
VIN Undervoltage Lockout Threshold Voltage
VCCUVLO 3.5 3.8 4.1 V VCC:Sweep-up
V
HYS 100 160 220 mV VCC:Sweep-down
CC
UVLO 0.72 0.84 0.96 V VIN:Sweep-up
V
IN
[SCP]
SCP Start up Voltage V
SCP Threshold Voltage T
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© 2011 ROHM Co., Ltd. All rights reserved.
VO×0.3 VO×0.4 VO×0.5 V
OSCP
45 90 200 µsec
SCP
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2011.01 - Rev.
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BD35281HFN
v
v
v
v
v
v
v
v
v
v
v
v
Reference Data
Vo
66mV
50mV/di
Io
1A/di
2A
Fig.1 Transient Response
(0A1.5A)
Co=100µF
cfb=1000pF
Vo
50mV/di
51mV
Io
1A/di
2A
Fig.4 Transient Response
(1.5A→0A)
Co=100µF
cfb=1000pF
Ven
VNRCS
Vo
Fig.7 Waveform at output start
V
CC
Ven
V
IN
Vo
Fig.10 Input sequence
T(10µsec/div)
T(100µsec/div)
T(200µsec/div)
VIN→VCC→Ven
Vo
2A/di
91mV
Io
2A
50mV/di
Fig.2 Transient Response
(0A→1.5A)
Co=47µF
cfb=1000pF
Vo
80mV
50mV/di
Io
2A
1A/di
Fig.5 Transient Response
(1.5A→0A)
Co=47µF
cfb=1000pF
Ven
VNRCS
Vo
Fig.8 Waveform at output OFF
Ven
V
IN
Vo
V
CC
Fig.11 Input sequence
T(10µsec/div)
T(100µsec/div)
T(200µsec/div)
Ven →VCC→V
Technical Note
Vo
50mV/di
108mV
Io
1A/di
Fig.3 Transient Response
Vo
1A/di
98mV
2A
Io
50mV/di
Fig.6 Transient Response
V
CC
Ven
V
IN
Vo
V
CC
Ven
V
IN
Vo
IN
Fig.12 Input sequence
2A
T(10µsec/div)
(0A→1.5A)
Co=22µF
cfb=1000pF
T(100µsec/div)
(1.5A0A)
Co=22µF
cfb=1000pF
VCC→VIN→Ven
Fig.9 Input sequence
VCCVen VIN
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© 2011 ROHM Co., Ltd. All rights reserved.
3/15
2011.01 - Rev.
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BD35281HFN
Reference Data
V
CC
Ven
V
IN
Vo
Fig.13 Input sequence
0.9
0.8
0.7
Icc [mA]
0.6
0.5
0.4
-50 -25 0 25 50 75 100 125 150 Tj [℃]
Fig.16 Tj-ICC
30
25
20
15
IINSTB [µ A]
10
5
0
-50 -25 0 25 50 75 100 125 150 Tj [℃]
Fig.19 Tj-IINSTB
150
130
110
90
RON [mO]
70
50
-50 -25 0 25 50 75 100 125 150
Tj [℃]
Fig.22 Tj-R
(Vcc=5V/Vo=1.2V)
V
Ven V
ON
V
CC
Ven
V
IN
Vo
Ven →VIN→V
Fig.14 Input sequence
2.0
1.8
1.6
IIN [m A]
1.4
1.2
1.0
-50 -25 0 25 50 75 100 125 150 Tj [℃]
Fig.17 Tj-IIN
20
19
18
17
16
15
14
INRCS [µA]
13
12
11
10
-50 -25 0 25 50 75 100 125 150
Tj [℃]
Fig.20 Tj-NRCS
135
RON [mO]
125
115
105
95
85
75
Vo=2 .5V
Vo=1 .8V
Vo=1 .5V
Vo=1 .2V
Vo=1 .0V
34 56 78
Vcc [V]
Fig.23 Vcc- R
ON
Technical Note
1.25
1.23
1.21
Vo [V]
1.19
1.17
CC
1.15
-50 -25 0 25 50 75 100 125 150 Tj [℃]
Fig.15 Tj-Vo (Io=0mA)
3.0
2.5
2.0
1.5
ISTB [µA]
1.0
0.5
0.0
-50 -25 0 25 50 75 100 125 150
Tj [℃]
Fig.18 Tj-ICCSTB
10
9
8
7
6
5
IEN [µ A]
4
3
2
1
0
-50 -25 0 25 50 75 100 125 150
Tj [℃]
Fig.21 Tj-IEN
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© 2011 ROHM Co., Ltd. All rights reserved.
4/15
2011.01 - Rev.
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BD35281HFN
Block Diagram
VCC
V
CC
1
EN
2
Reference
Block
C1
V
CC
UVLO2
UVLO1
EN
UVLO1
VIN
UVLOLATCH
CL
VREF1
NRCS
VCC
NRCS0.3.
VREF1×0.4
FB
TSD
SCP/TSD
LATCH
EN UVLO1
LATCH
CL UVLO1 UVLO2 TSD SCP
NRCS
C
3
NRCS
EN/UVLO
NRCS
Pin Layout Pin Function
EN
V
CC
Current
Limit
VREF2
8
GND
R2
R1
R2
R1
Technical Note
VIN
4
V
O
5
6
V
OS
7
FB
VIN
C2
C
FB
V
C3
O
Vcc
EN
NRCS
VIN
PIN No.
6
1
8
GND
PIN name PIN Function
1 VCC Power Supply Pin
2 EN Enable Input Pin
2
FIN
7
FB
4 VIN Input Voltage Pin
3 NRCS
In-rush Current Protection (NRCS) Capacitor Connection Pin
5 VO Output Voltage Pin
3
6
Vos
6 VOS Output Voltage Control Pin
4
5
Vo
7 FB Reference Voltage Feedback Pin
8 GND Ground Pin
- FIN Connected to heatsink and GND
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© 2011 ROHM Co., Ltd. All rights reserved.
5/15
2011.01 - Rev.
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