BD26502GUL is “Matrix LED Driver” that is the most suitable for the cellular phone.
It can control 7x17(119 dot) LED Matrix by internal 7-channel PMOS SWs and 17-channel LED drivers.
It can control the luminance and firefly lighting of the LED matrix by the setting of the internal register.
It supports SPI and I2C interface.
VCSP50L4 (4.1mm
It adopts the very thin CSP package that is the most suitable for the slim phone.
●Features
1) LED Matrix driver (7x17)
・It has 7-channel PMOS SWs and 17-channel current drivers with 1/7 timing driven sequentially. ・Put ON/OFF(for every dot). ・The current drivers can drive 0-20.00mA current with 16 step(for every dot). ・64 steps of the luminance control by PWM (common setting for all dots) ・Continuous (TDMA off ) lighting function for LED14-LED17 ・Easy register setting by A/B 2-side map for each dot.
2) Automatic Slope function
・Cycle time, Slope time can be set for each dot.
3) 8-direction automatic scroll function.
4) Interface
・SPI and I・For I
5) Thermal shutdown
6) Small and thin CSP package
・62pin VCSP50L4(4.1mm
*This chip is not designed to protect itself against radioactive rays.
*This material may be changed on its way to designing.
*This material is not the official specification.
●Absolute Maximum Ratings (Ta=25
Maximum voltage (note2) VMAX 7 V
Maximum voltage (note1) VIOMAX 4.5 V
Power Dissipation (note3) Pd 1550 mW
Operating Temperature Range Topr -40 ~ +85 ℃
Storage Temperature Range Tstg -55 ~ +150 ℃
note1) VIO,RESETB,CE,SDA,SCL,IFMODE,SYNC,CLKIN,CLKOUT,TEST1,TEST2,TEST3,TESTO, DO terminal
note2) Except the above
note3) Power dissipation deleting is 12.4mW/
The power dissipation of the IC has to be less than the one of the package.
・When IFMODE is set to “H”, it can interface with SPI format.
・The serial interface is four terminals (serial clock terminal (SCL), serial data input terminal (SDA), and chip
selection input terminal (CE)).
(1)Write operation
・Data is taken into an internal shift register with rising edge of CLK. (Max of the frequency is 13MHz.)
・The receive data becomes enable in the “H” section of CE. (Active “H”.)
・The transmit data is forwarded (with MSB-First) in the order of write command “0”(1bit), the control register address
When IFMODE is set to “L”, it can interface with I2C BUS format.
(1) Slave address
CE A7 A6 A5 A4 A3 A2 A1 R/W
L 1 1 1 0 1 0 0
H 1 1 1 0 1 0 1
(2) Bit Transfer
SCL transfers 1-bit data during H. During H of SCL, SDA cannot be changed at the time of bit transfer. If SDA changes
while SCL is H, START conditions or STOP conditions will occur and it will be interpreted as a control signal.
(3) START and STOP condition
When SDA and SCL are H, data is not transferred on the I
while SCL has been H, it will become START (S) conditions, and an access start, if SDA changes from L to H while SCL
has been H, it will become STOP (P) conditions and an access end.
SDA
SCL
SDA
SDA a state of stability
Data are effective
Fig.6 Bit transfer (I
Technical Note
0
SDA
:
It can change
2
C format)
2
C- bus. This condition indicates, if SDA changes from H to L
(4) Acknowledge
SCL
S P
START condition
Fig.7 START/STOP condition (I
2
STOP condition
C format)
It transfers data 8 bits each after the occurrence of START condition. A transmitter opens SDA after transfer 8bits data,
and a receiver returns the acknowledge signal by setting SDA to L.
A register address is transferred by the next 1 byte that transferred the slave address and the write-in command. The
3rd byte writes data in the internal register written in by the 2nd byte, and after 4th byte or, the increment of register
address is carried out automatically. However, when a register address turns into the last address (77h), it is set to 00h
by the next transmission. After the transmission end, the increment of the address is carried out.
This register should not change into “1 “→” 0” at the time of START (30h, D0) register =“1” setup (under lighting operation).
This register must be set to “0” after LED putting out lights (“START register = 0”), and please surely stop an internal oscillation circuit.
Address 11H < LED1-6 Enable >
Address
(Index)
R/W Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
11H W - - LED6ONLED5ONLED4ONLED3ON LED2ON LED1ON
Initial value 00H 0 0 0 0 0 0 0 0
Bit 0 : LED1ON
“0” : LED1
“1” : LED1
LED1 ON/OFF setting
OFF(initial) ON
Bit 1 : LED2ON
“0” : LED2
“1” : LED2
LED2 ON/OFF setting
OFF(initial) ON
Bit 2 : LED3ON
“0” : LED3
“1” : LED3
LED3 ON/OFF setting
OFF(initial) ON
Bit 3 : LED4ON
“0” : LED4
“1” : LED4
LED4 ON/OFF setting
OFF(initial) ON
Bit 4 : LED5ON
“0” : LED5
“1” : LED5
LED5 ON/OFF setting
OFF(initial) ON
Bit 5 : LED6ON
“0” : LED6
“1” : LED6
LED6 ON/OFF setting
OFF(initial) ON
* Current setting follows ILEDAXXSET[3:0] or ILEDBXXSET[3:0] register.
Bit 0 : LED14TDMAON TDMA control Enable setting for LED14
“0” : TDMA control for LED14 is OFF
LED current value is set by ILEDAD0SET[3:0] or ILEDBD0SET[3:0] (it changes by the OAB [7Fh, D1] register).
It becomes the setting value of ILEDAD0SET [3:0] until scroll reset is carried out
by SCLRST (2Eh, D0) register =“1” after a scroll stop, under scrolling.
“1” : TDMA control for LED14 is ON (initial)
Bit 1 : LED15TDMAON TDMA control Enable setting for LED15
“0” : TDMA control for LED15 is OFF
LED current value is set by ILEDAE0SET[3:0] or ILEDBE0SET[3:0]. (it changes by the OAB [7Fh, D1] register).
It becomes the setting value of ILEDAE0SET [3:0] until scroll reset is carried out
by SCLRST (2Eh, D0) register =“1” after a scroll stop, under scrolling.
“1” : TDMA control for LED15 is ON (initial)
Bit 2 : LED16TDMAON TDMA control Enable setting for LED16
“0” : TDMA control for LED16 is OFF
LED current value is set by ILEDAF0SET[3:0] or ILEDBF0SET[3:0]. (it changes by the OAB [7Fh, D1] register).
It becomes the setting value of ILEDAF0SET [3:0] until scroll reset is carried out
by SCLRST (2Eh, D0) register =“1” after a scroll stop, under scrolling.
“1” : TDMA control for LED16 is ON (initial)
Bit 3 : LED17TDMAON TDMA control Enable setting for LED17
“0” : TDMA control for LED17 is OFF
LED current value is set by ILEDAG0SET[3:0] or ILEDBG0SET[3:0]. (it changes by the OAB [7Fh, D1] register).
It becomes the setting value of ILEDAG0SET [3:0] until scroll reset is carried out
by SCLRST (2Eh, D0) register =“1” after a scroll stop, under scrolling.
“1” : TDMA control for LED17 is ON (initial)
* The setting change at the time of START (30h, D0) register =“1” of this register is prohibition.
* LED, which is set to “0”(TDMA off), is put on and not controlled by SYNC terminal however
SYNCON (21h,D2) register is set to “1”.
* Please use this register only in the following combination.
*Setting time is based on OSC frequency, and the above-mentioned shows the value under Typ (1.2MHz).
*Setting time changes on CLKIN terminal input frequency at the external clock operation.
Example)
CLKIN input frequency=1.2MHz→”000”: 0.1sec (it is the same as the above)
CLKIN input frequency=2.4MHz→”000”: 0.05sec
CLKIN input frequency= 0.6MHz→”000”: 0.2sec
Bit 0 : CLRA Reset A-pattern register
“0” : A-pattern register is not reset and writable(initial value)
“1” : A-pattern register is reset
Bit 0 : CLRB Reset B-pattern register
“0” : B-pattern register is not reset and writable(initial value)
“1” : B-pattern register is reset
*CLRA and CLRB register return to 0 automatically.
Address 7FH < Register map change >
Address
(Index)
R/W Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
7FH W - - - - - IAB OAB RMCG
Initial value 00H 0 0 0 0 0 0 0 0
Bit 0 : RMCG Change register map
“0” : Control register is selected(initial value)
“1” : A-pattern register or B-pattern register is selected
Bit 1 : OAB Select register to output for matrix
“0” : A-pattern register is selected(initial value)
“1” : B-pattern register is selected
Bit 2 : IAB Select register to write matrix data
“0” : A-pattern register is selected(initial value)
“1” : B-pattern register is selected
* It is prohibition to write A-pattern data when A-pattern is displaying (OAB=0).
Also, it is prohibition to write B-pattern data when B-pattern is displaying (OAB=1).
Change of a display picture should be done by change of the OAB register, after updating of a non-displaying pattern register.
Bit 5-4 : SDLYAXX[1:0] SLOPE delay setting for A-pattern matrix
“00” : No delay(initial value)
“01” : 1/4x(slope cycle time)
“10” : 1/2x(slope cycle time)
“11” : 3/4x(slope cycle time)
Bit 7-6 : SCYCAXX[1:0] SLOPE cycle time setting for A-pattern matrix
“00” : No SLOPE control(initial value)
“01” : 1s(=slope cycle time)
“10” : 2s(=slope cycle time)
“11” : 3s(=slope cycle time)
* The “XX” shows the matrix number from “00” to “G6”. Please refer 7x17 LED Matrix coordinate.
*Setting time is based on OSC frequency, and the above-mentioned shows the value under Typ (1.2MHz).
*Setting time changes on CLKIN terminal input frequency at the external clock operation.
Example)
CLKIN input frequency=1.2MHz→”01”: Slope cycle =1sec (it is the same as the above)
CLKIN input frequency=2.4MHz→”01”: Slope cycle =0.5sec
CLKIN input frequency=0.6MHz→”01”: Slope cycle =2sec
Bit 5-4 : SDLYBXX[1:0] SLOPE delay setting for B-pattern matrix
“00” : No delay(initial value)
“01” : 1/4x(slope cycle time)
“10” : 1/2x(slope cycle time)
“11” : 3/4x(slope cycle time)
Bit 7-6 : SCYCBXX[1:0] SLOPE cycle time setting for B-pattern matrix
“00” : No SLOPE control(initial value)
“01” : 1s(=slope cycle time)
“10” : 2s(=slope cycle time)
“11” : 3s(=slope cycle time)
* The “XX” shows the matrix number from “00” to “G6”. Please refer 7x17 LED Matrix coordinate.
*Setting time is based on OSC frequency, and the above-mentioned shows the value under Typ (1.2MHz).
*Setting time changes on CLKIN terminal input frequency at the external clock operation.
Example)
CLKIN input frequency=1.2MHz→”01”: Slope cycle =1sec (it is the same as the above)
CLKIN input frequency=2.4MHz→”01”: Slope cycle =0.5sec
CLKIN input frequency=0.6MHz→”01”: Slope cycle =2sec
(B) DC current Each matrix dot 0~20.00mA (16 step)
ILEDAXXSET
ILEDBXXSET
4
* The “XX” shows the matrix number from “00” to “G6”. Please refer 7x17 LED Matrix coordinate.
Duty is variable by PWMSET[5:0] or slope control between 0/63 and 63/63.
Duty 1/63=10clk)
(
~~
LED Drive
Internal enable signal
Clk
(ex.1.2MHz at
internal OSC)
Minimum width=5clk
OFF
~
(A) PWM Duty
~
680clk = 1/7TDMA
LED output current timing and PWM cycle
Fig.12
635clk of PWM period is set in the 1/7 TDMA period (680clk).
PWM is operated 63 steps of 10clk. TDMA period is 3.97s (@1.2MHz).
Moreover, it has the starting waiting time of a constant current driver by 5clk(s).
PWM”H” time turns into ON time after waiting 5 clk.
(However, LED driver is set “OFF” compulsorily at PWM=0% setting.)
It can be controlled Delay and SLOPE cycle time for LED driver current.
Item Control object Control detail
(A) Delay Each matrix dot
(B) SLOPE cycle time Each matrix dot 0~3sec (4 step)
* The “XX” shows the matrix number from “00” to “G6”. Please refer 7x17 LED Matrix coordinate.
PWM Duty
100%
0% Time
1/4 of SLOPE cycle time
0~3/4 x slope cycle time
(4 step)
Technical Note
Setting Registers
Name * Bits
SDLYAXX
SDLYBXX
SCYCAXX
SCYCBXX
2
2
SLOPE 3
SLOPE operation
Repeat SLOPE 1-4
START
(A) Delay
SLOPE 1 SLOPE 2 SLOPE 4
(B) SLOPE cycle time
Fig.14
When SLPEN=“1” and PWMEN=SCLEN=“0”, SLOPE operation starts (like upper figure).
After “Delay” time SLOPE1-4 operation repeat.
Each period of SLOPE1-4 is 1/4 of SLOPE cycle time.
SLOPE 1: 1 step is 1/63 of SLOPE 1 period. Duty is increased 1.587% step by step.
SLOPE 2: Duty is fixed at 100%.
SLOPE 3: 1 step is 1/63 of SLOPE 1 period. Duty is decreased 1.587% step by step.
SLOPE 4: Duty is fixed at 0%.
Please take sufficient wait time for each Power/Control signal.
However, if VBAT<2.1V(typ) or Ta >T
(typ:175℃), the command input is not effective because of the protection operation
TSD
4. Reset
There are two kinds of reset, software reset and hardware reset
(1)Software reset
・All the registers are initialized by SFTRST=“1”.
・SFTRST is an automatically returned to “0”. (Auto Return 0).
(2)Hardware reset
・It shifts to hardware reset by changing RESETB pin “H” → “L”.
・The condition of all the registers under hardware reset pin is returned to the Initial Value
and it stops accepting all address.all LED driver turn off.
・It’s possible to release from a state of hardware reset by changing RESETB pin “L” → “H”.
RESETB pin has delay circuit. It doesn’t recognize as hardware reset in “L” period under 5s.
5. Thermal shutdown
A thermal shutdown function is effective at all blocks of those other than VREF.
Return to the state before detection automatically at the time of release.
The thermal shutdown function is detection temperature that it works is about 175
Detection temperature has a hysteresis, and detection release temperature is about 150
℃
℃(Design reference value)
6. UVLO Function (VBAT Voltage Low-Voltage Detection)
UVLO function is effective at all blocks of those other than VREF, and when detected, those blocks function is stopped.
Return to the state before detection automatically at the time of release.
7. I/O
When the RESETB pin is Low, the input buffers (SDA and SCL) are disabling for the Low consumption power.
VBAT
VIO
Technical Note
EN
RESETB=L, Output “H”
Level
Shift
LOGIC
SCL
(SDA)
RESETB
Input disabling by RESETB
Fig.16
8. Standard Clock Input and Output
It is possible to carry out synchronous operation of two or more ICs using the input-and-output function of a standard clock.
CLKOUT
CLKIN
Register : CLKOUT
OSC
SEL
TDMA
Controller
SYNC
Register : CLKIN
PMOS
Switch
LED
Driver
LED Matrix
Register: SYNCON
Fig.17 I/O part equivalent circuit diagram
・When a clock is supplied from the exterior
Inputting an external standard clock from CLKIN and setting register CLKIN=1, IC operates with the clock inputted
from CLKIN as a standard clock.
・When the built-in oscillation circuit of one IC is used
When a clock cannot be supplied from the exterior, it is possible to synchronize between ICs by the connection as
the following figure.
When a clock is strung
IC1
IC2
IC3
OSC
OSC
OSC
CLKOUT CLKIN
CLKOUT CLKIN
CLKOUT CLKIN
When a clock is supplied from IC1
IC1
IC2
IC3
OSC
OSC
OSC
CLKOUT CLKIN
CLKOUT CLKIN
CLKOUT CLKIN
It is an example of application for the usage of two or more.
9. External ON/OFF Synchronization (SYNC Terminal)
Lighting of LED that synchronized with the external signal is possible.
By setting H/L of SYNC terminal, LED drivers output is set ON/OFF.
It’s asynchronous operation with the internal TDMA control.
CLKOUT
CLKIN
Register : CLKOUT
OSC
SEL
TDMA
Controller
SYNC
Register : CLKIN
PMOS
Switch
LED
Driver
LED Matrix
Register : SYNCON
Fig.19 I/O part equivalent circuit diagram
10. About terminal processing of the function which is not used
Please set up a test terminal and the unused terminal as the following table.
Especially, if an input terminal is not fixed, it may occur the unstable state of a device and the unexpected internal current.
Terminal name Processing Reason
SYNC GND Short The input terminal
CLKIN GND Short The input terminal
CLKOUT Open The output terminal
TEST1 – TEST5 GND Short The input terminal for a test
TESTO Open The output terminal for a test
DO Open The output terminal
LED Terminal GND Short
SW Terminal VINSW Short
In order to avoid an unfixed state.
(A register setup in connection with LED terminal that is not used is forbidden.)
In order to avoid an unfixed state.
(A register setup in connection with SW terminal that is not used is forbidden.)
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Power supply and ground line
Design PCB pattern to provide low impedance for the wiring between the power supply and the ground lines. Pay attention
to the interference by common impedance of layout pattern when there are plural power supplies and ground lines.
Especially, when there are ground pattern for small signal and ground pattern for large current included the external
circuits, please separate each ground pattern. Furthermore, for all power supply pins to ICs, mount a capacitor between
the power supply and the ground pin. At the same time, in order to use a capacitor, thoroughly check to be sure the
characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low
temperature, thus determining the constant.
(3) Ground voltage
Make setting of the potential of the ground pin so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no pins are at a potential lower than the ground voltage including an actual electric
transient.
(4) Short circuit between pins and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between pins or between the pin
and the power supply or the ground pin, the ICs can break down.
(5) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(6) Input pins
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input pin. Therefore, pay thorough attention not to handle the input pins, such as to apply to the input pins a voltage lower
than the ground respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input
pins when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to
the input pins a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics.
(7) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(8) Thermal shutdown circuit (TSD)
This LSI builds in a thermal shutdown (TSD) circuit. When junction temperatures become detection temperature or higher,
the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating
the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do
not continuously use the LSI with this circuit operating or use the LSI assuming its operation.
(9) Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in
actual states of use.
(10) About the pin for the test, the un-use pin
Prevent a problem from being in the pin for the test and the un-use pin under the state of actual use. Please refer to a
function manual and an application notebook. And, as for the pin that doesn't specially have an explanation, ask our
company person in charge.
(11) About the rush current
For ICs with more than one power supply, it is possible that rush current may flow instantaneously due to the internal
powering sequence and delays. Therefore, give special consideration to power coupling capacitance, power wiring, width
of ground wiring, and routing of wiring.
(12) About the function description or application note or more.
The function description and the application notebook are the design materials to design a set. So, the contents of the
materials aren't always guaranteed. Please design application by having fully examination and evaluation include the
external elements.
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which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
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The technical information specied herein is intended only to show the typical functions of and
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Notice
The Products specied in this document are intended to be used with general-use electronic
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The Products specied in this document are not designed to be radiation tolerant.
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Please be sure to implement in your equipment using the Products safety measures to guard
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