Power Management Switch ICs for PCs and Digital Consumer Products
2ch High Side Switch ICs
for USB Devices and Memory Cards
BD2062FJ,BD2066FJ
●Description
High side switch for USB is a high side switch having over-current protection used in power supply line of universal serial
bus (USB). Its switch unit has two channels of N-channel power MOSFET. And, over-current detection circuit, thermal
shutdown circuit, under-voltage lockout and soft-start circuit are built in.
●Features
1) Dual N-MOS High Side Switch
2) Current Limit Threshold 2.4A
3) Control Input Logic
Active-Low : BD2062FJ
Active-High : BD2066FJ
4) Soft-Start Circuit
5) Over-Current Detection
6) Thermal Shutdown
7) Under-Voltage Lockout
8) Open-Drain Error Flag Output
9) Reverse Current Protection When Switch Off
10) Flag Output Delay Filter Built In
11) Power Supply Voltage Range 2.7V~5.5V
12) TTL Enable Input
13) 0.8ms Typical Rise Time
14) 1μA Max Standby Current
●Applications
PC, PC peripheral USB hub in consumer appliances, Car accessory, and so forth
●Line Up Matrix
No.11029EBT15
Parameter BD2062FJ BD2066FJ
Current limit threshold (A) 2.4 2.4
Control input logic Low High
Number of channels 2ch 2ch
Package SOP-J8 SOP-J8
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BD2062FJ,BD2066FJ
●Absolute Maximum Ratings (Ta=25℃)
Parameter Symbol Ratings Unit
Supply voltage VIN -0.3 ~ 6.0 V
Enable input voltage VEN -0.3 ~ 6.0 V
/OC voltage V/OC -0.3 ~ 6.0 V
/OC sink current IS/OC ~ 5 mA
OUT voltage VOUT -0.3 ~ 6.0 V
Storage temperature TSTG -55 ~ 150 ℃
Power dissipation Pd 675*1 mW
*1 Mounted on 70mm * 70mm * 1.6mm glass-epoxy PCB. Derating : 5.4mW/ oC above Ta=25 oC
* This product is not designed for protection against radioactive rays.
●Operating Conditions
Parameter Symbol
Operating voltage VIN 2.7 - 5.5 V
Operating temperature TOPR -40 - 85 ℃
Min. Typ. Max.
Ratings
Technical Note
Unit
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2011.05 - Rev.B
BD2062FJ,BD2066FJ
●Electrical Characteristics
○BD2062FJ (Unless otherwise specified VIN = 5.0V, Ta = 25℃)
Parameter Symbol
Min. Typ. Max.
Limits
Technical Note
Unit Conditions
Operating current
Standby current
/EN input voltage
/EN input current
/OC output low voltage
/OC output leak current
/OC delay time
On-resistance
Switch leak current ILSW - - 1.0 μA V/EN = 5V, VOUT = 0V
Reverse leak current ILREV - - 1.0 μA VOUT = 5.5V, VIN = 0V
Current limit threshold
Short circuit current
Output rise time
IDD -
ISTB - 0.01 1 μA V/EN = 5V , OUT=OPEN
V/EN 2.0 - - V High input
V/EN - - 0.8 V Low input
I/EN -1.0 0.01 1.0 μA V/EN = 0V or V/EN = 5V
V/OCL - - 0.5 V I/OC = 1mA
IL/OC - 0.01 1 μA V/OC = 5V
T/OC 10 15 20 ms
RON -
ITH
ISC
TON1 - 0.8 10 ms RL = 10Ω
1.5 2.4 3.0
1.1 1.5 2.1
130 180
80 125
μA V/EN = 0V , OUT=OPEN
mΩ IOUT = 500mA
A
V
OUT
= 0V
A
L = 47μF (RMS)
C
Output turn-on time
Output fall time
Output turn-off time
UVLO threshold
TON2 - 1.1 20 ms RL = 10Ω
TOFF1 - 5 20 μs RL = 10Ω
TOFF2 - 10 40 μs RL = 10Ω
VTUVH 2.1 2.3 2.5 V Increasing VIN
VTUVL 2.0 2.2 2.4 V Decreasing VIN
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2011.05 - Rev.B
BD2062FJ,BD2066FJ
○BD2066FJ (Unless otherwise specified VIN = 5.0V, Ta = 25 ℃)
Parameter Symbol
Operating current IDD - 130 180 μA VEN = 5V , OUT=OPEN
Standby current ISTB - 0.01 1 μA VEN = 0V , OUT=OPEN
Min. Typ. Max.
Limits
Unit Condition
Technical Note
EN input voltage
EN input current IEN -1.0 0.01 1.0 μA VEN = 0V or VEN = 5V
/OC output low voltage V/OCL - - 0.5 V I/OC = 1mA
/OC output leak current IL/OC - 0.01 1 μA V/OC = 5V
/OC delay time T/OC 10 15 20 ms
On-resistance RON - 80 125 mΩ IOUT = 500mA
Switch leak current ILSW - - 1.0 μA VEN = 0V, VOUT = 0V
Reverse leak current ILREV - - 1.0 μA VOUT = 5.5V, VIN = 0V
Current limit threshold ITH 1.5 2.4 3.0 A
Short circuit current ISC 1.1 1.5 2.1 A
Output rise time TON1 - 0.8 10 ms RL = 10Ω
Output turn-on time TON2 - 1.1 20 ms RL = 10Ω
Output fall time TOFF1 - 5 20 μs RL = 10Ω
VEN 2.0 - - V High input
VEN - - 0.8 V Low input
VOUT = 0V
C
L = 47μF (RMS)
Output turn-off time TOFF2 - 10 40 μs RL = 10Ω
V
UVLO threshold
TUVH 2.1 2.3 2.5 V Increasing VIN
VTUVL 2.0 2.2 2.4 V Decreasing VIN
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2011.05 - Rev.B
BD2062FJ,BD2066FJ
●Measurement Circuit
VIN
1µF
A
GND
/OC1
Technical Note
IN
V
1µF
GND
/OC1
IN
EN
V
EN
V
EN1
EN2
OUT1
OUT2
/OC2
IN
EN
V
EN
V
EN1
EN2
OUT1
OUT2
/OC2
RL C
L
Operating current EN, /EN input voltage, Output rise, fall time
Inrush current
EN
V
VEN
VIN
1µF
GND
IN
EN1
EN2
IOUT
/OC1
OUT1
OUT2
/OC2
VDD
IOUT
VEN
VEN
VIN
1µF
GND
IN
EN1
EN2
/OC1
OUT1
OUT2
/OC2
10k10k
IOUT
On-resistance, Over-current detection /OC output low voltage
Fig.1 Measurement circuit
●Timing Diagram
○BD2062FJ
TOFF1
TON1
○BD2066FJ
TOFF1
TON1
RLC
IOUT
L
VOUT
V/
EN
10%
TON2
50%
90%
90%
50%
T
OFF2
10%
VOUT
V
EN
10%
TON2
50%
90%
90%
50%
T
10%
OFF2
Fig.2 Timing diagram Fig.3 Timing diagram
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BD2062FJ,BD2066FJ
Technical Note
●Electrical Characteristic Curves (Reference Data)
180
TA=25℃ TA=25℃
160
(uA)
140
DD
120
100
80
60
40
20
OPERATING CURRENT: I
0
23456
(uA)
DD
SUPPLY VOLTAGE: VIN (V)
Fig.4 Operating current
EN, /EN enable
1
VIN=5V
0.8
0.6
0.4
0.2
STANDBY CURRENT: I
0
-50 0 50 100
AMBIENT TEMPERATURE: TA (℃)
Fig.7 Standby current
EN, /EN disable
180
VIN=5V
160
(uA)
140
DD
120
100
80
60
40
20
OPERATING CURRENT: I
0
-50 0 50 100
AMBIENT TEMPERATURE: TA (℃)
Fig.5 Operating current
EN, /EN enable
2
TA=25℃
(V)
EN
1.5
1
0.5
EN INPUT VOLTAGE: V
0
23456
Low to High
High to Low High to Low
SUPPLY VOLTAGE: V
(V)
IN
Fig.8 EN, /EN input voltage Fig.9 EN, /EN input voltage
1
0.8
(uA)
DD
0.6
0.4
0.2
STANDBY CURRENT: I
0
23456
SUPPLY VOLTAGE: V
Fig.6 Standby current
EN, /EN disable
2
VIN=5V
(V)
EN
1.5
1
0.5
EN INPUT VOLTAGE: V
0
-50 0 50 100
Low to High
AMBIEN T T EMPER ATURE: T
100
TA=25℃ TA=25℃
(mV)
80
/OC
60
40
20
/OC OUTPUT VOLTAGE: V
0
23456
Fig.10 /OC output low voltage Fig.11 /OC output low voltage Fig.12 On-resistance
SUPPLY VOLTAGE: V
(V)
IN
100
VIN=5V
(mV)
80
/OC
60
40
20
/OC OUTPUT VOLTAGE: V
0
-50 0 50 100
AMBIENT TEMPERATURE: T
A
(℃)
120
100
(mΩ)
ON
80
60
40
20
ON RESISTANCE: R
0
23456
SUPPLY VOLTAGE: VIN (V)
120
VIN=5V VIN=5V
100
(mΩ)
ON
80
60
3
TA=25℃
(A)
TH
2.5
3
(A)
TH
2.5
40
20
ON RESISTANCE: R
0
-50 0 50 100
AMBIENT TEMPERATURE: TA (℃)
Fig.13 On-resistance
2
CURRENT LIMT THRESHOLD: I
1.5
23456
SUPPLY VOLTAGE: V
(V)
IN
Fig.14 Current limit threshold
2
1.5
CURRENT LIMIT THRESHOLD: I
-50 0 50 100
AMBIENT TEMPERATURE: TA (℃)
Fig.15 Current limit threshold
(V)
IN
(℃)
A
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2011.05 - Rev.B
BD2062FJ,BD2066FJ
Technical Note
1
TA=25℃
0.8
(ms)
ON1
0.6
0.4
0.2
OUTPUT RISE TIME: T
0
23456
SUPPLY VOLTAGE: V
(V)
IN
Fig.16 Short circuit current Fig.17 Short circuit current Fig.18 Output rise time
2
VIN=5V
(A)
SC
1.5
1
0.5
SHORT CIRCUIT CURRENT:I
0
-50 0 50 100
AMBIENT TEMPERATURE: TA (℃)
1
TA=25℃
0.8
(ms)
0.6
ON1
0.4
RISE TIME: T
0.2
0
23456
SUPPLY VOLTAGE: V
1
VIN=5V
0.8
(ms)
0.6
ON1
0.8
(ms)
ON2
0.6
1
TA=25℃
0.8
(ms)
ON2
0.6
1
VIN=5V
0.4
RISE TIME: T
0.2
0
-50 0 50 100
AMBIENT TEMPERATURE: T
(℃)
A
Fig.19 Output rise time Fig.20 Output turn-on time Fig.21 Output turn-on time
0.4
0.2
TURN ON TIME: T
0
23456
SUPPLY VOLTAGE: V
(V)
IN
0.4
0.2
TURN ON TIME: T
0
-50 0 50 100
AMBIENT TEMPERATURE: T
5
TA=25℃
4
(us)
3
OFF1
2
FALL TIME: T
1
0
23456
SUPPLY VOLTAGE: VIN (V)
Fig.22 Output fall time Fig.23 Output fall time Fig.24 Output turn-off time
5
VIN=5V
4
(us)
3
OFF1
2
FALL TIME: T
1
0
-50 0 50 100
AMBIENT TEMPERATURE: TA (℃)
10
TA=25℃
8
(us)
OFF2
6
4
2
TURN OFF TIME: T
0
23456
SUPPLY VOLTAGE: VIN (V)
10
VIN=5V
8
(us)
OFF2
6
4
2
TURN OFF TIME: T
0
-50 0 50 100
AMBIENT TEMPERATURE: TA (℃)
Fig.25 Output turn-off time Fig.26 /OC delay time Fig.27 /OC delay time
20
TA=25℃
15
(ms)
/OC
10
5
/OC DELAY TIME: T
0
23 456
SUPPLY VOLT AGE: V
(V)
IN
20
VIN=5V
(ms)
15
/OC
10
5
/OC DELAY TIME: T
0
-50 0 50 100
AMBIENT TEMPER ATU RE: T
(V)
IN
(℃)
A
(℃)
A
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BD2062FJ,BD2066FJ
p
2.5
(V)
2.4
UVLO
2.3
2.2
2.1
UVLO THRESHOLD: V
2
-50 0 50 100
AMBIENT TEMPERATURE: T
Fig.28 UVLO threshold voltage Fig.29 UVLO hysteresis voltage
V
UVLOH
V
UVLOL
(℃)
A
0.2
(V)
0.15
HYS
0.1
0.05
UVLO HYSTERESIS: V
0
-50 0 50 100
AMBIENT TEMPER ATU RE: TA(℃)
●Waveform Data(BD2062FJ)
/EN
1V/div
VOUT
1V/div
V/OC
1V/div
IIN
0.5A/div
Fig.30 Output rise characteristics Fig.31 Output fall characteristics
TIME 200us/div
VIN=5V
CL=100uF
RL=5Ω
/EN
1V/div
VOUT
1V/div
V/OC
1V/div
IIN
0.5A/div
VIN=5V
CL=100uF
RL=5Ω
TIME 1ms/div TIME 200us/div
VOUT1
1V/div
V/OC1
1V/div
VOUT2
1V/div
IOUT1
1.0A/div
Fig.33 Inrush current
VIN=5V
CL=220uF
C=10uF
RL=5Ω
TIME 200us/div TIME 5ms/div
VOUT1
1V/div
V/OC1
1V/div
VOUT2
1V/div
IOUT1
0.5A/div
VIN=5V
CL=47uF
Fig.34 Over-current response
ramped load
VOUT1
1V/div
V/OC1
1V/div
VOUT2
1V/div
IOUT1
1.0A/div
Fig.35 Over-current response
1Ωload connected at enable
TIME 2ms/div TIME 2ms/div TIME 100ms/div
VIN=5V
CL=47uF
/EN
1V/div
VOUT
1V/div
VOC
1V/div
IOUT1
0.5A/div
Fig.36 Over-current response
enable to short circuit
VIN=5V
CL=47uF
RL=1Ω
Technical Note
/EN
1V/div
VOUT
1V/div
V/OC
1V/div
IIN
0.5A/div
CL=47uF
CL=220uF
CL=47uF
Fig.32 Inrush current
CL=47uF, 100uF, 147uF, 220uF
V/OC2
1V/div
VOUT1
1V/div
V/OC1
1V/div
IOUT1
0.5A/div
Fig.37 Thermal shutdown
res
onse
VIN=5V
RL=5Ω
CL=220uF
VIN=5V
CL=47uF
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BD2062FJ,BD2066FJ
/
/
●Block Diagram
/EN1
EN1
Gate
Logic1
OCD1
TSD1
Delay
Charge
Pump1
Technical Note
/OC1
IN
UVLO
/EN2
EN2
GND
Gate
Logic2
OCD2
Charge
Pump2
Delay
TSD2
OUT1
OUT2
/OC2
GND
1
2
IN
Top View
EN1
3
(EN1)
EN2
4
(EN2)
Fig.38 Block diagram Fig.39 Pin configuration
●Pin Description
○BD2062FJ
Pin No. Symbol I / O Pin function
1 GND - Ground.
Power supply input.
2 IN -
Input terminal to the switch and power supply input terminal of the
internal circuit.
Enable input.
3, 4 /EN I
Switch on at Low level.
High level input > 2.0V, Low level input < 0.8V.
Error flag output.
5, 8 /OC O
Low at over-current, thermal shutdown.
Open drain output.
8
7
6
5
/OC1
OUT1
OUT2
/OC2
○BD2066FJ
6, 7 OUT O Switch output.
Pin No. Symbol I / O Pin function
1 GND - Ground.
Power supply input.
2 IN -
Input terminal to the switch and power supply input terminal of the
internal circuit.
Enable input.
3, 4 EN I
Switch on at High level.
High level input > 2.0V, Low level input < 0.8V
Error flag output.
5, 8 /OC O
Low at over-current, thermal shutdown.
Open drain output.
6, 7 OUT O Switch output.
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BD2062FJ,BD2066FJ
/
/
●I/O Circuit
Symbol Pin No Equivalent circuit
EN1(/EN1)
EN2(/EN2)
/OC1
/OC2
OUT1
OUT2
3, 4
5, 8
6, 7
/EN1(EN1)
/EN2(EN2)
OC1
OC2
OUT1
OUT2
Technical Note
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BD2062FJ,BD2066FJ
●Functional Description
1. Switch operation
IN terminal and OUT terminal are connected to the drain and the source of switch MOSFET respectively. And the IN
terminal is used also as power source input to internal control circuit.
When the switch is turned on from EN/EN control input, IN terminal and OUT terminal are connected by a 100mΩ switch.
In on status, the switch is bidirectional. Therefore, when the potential of OUT terminal is higher than that of IN terminal,
current flows from OUT terminal to IN terminal.
Since a parasitic diode between the drain and the source of switch MOSFET is canceled, in the off status, it is possible to
prevent current from flowing reversely from OUT to IN.
2. Thermal shutdown circuit (TSD)
Thermal shut down circuit have dual thermal shutdown threshold. Since thermal shutdown works at a lower junction
temperature when an over-current occurs, only the switch of an over-current state become off and error flag is output.
Thermal shut down action has hysteresis. Therefore, when the junction temperature goes down, switch on and error flag
output automatically recover. However, until cause of junction temperature increase such as output shortcircuit is
removed or the switch is turned off, thermal shut down detection and recovery are repeated. The thermal shut down
circuit works when the switch of either OUT1 or OUT2 is on (EN,/EN signal is active).
3. Over-current detection (OCD)
The over-current detection circuit limits current (ISC) and outputs error flag (/OC) when current flowing in each switch
MOSFET exceeds a specified value. There are three types of response against over-current. The over-current detection
circuit works when the switch is on (EN,/EN signal is active).
3-1. When the switch is turned on while the output is in short-circuit status
When the switch is turned on while the output is in short-circuit status or so, the switch gets in current limit status
soon.
3-2. When the output short-circuits while the switch is on
When the output short-circuits or large capacity is connected while the switch is on, very large current flows until the
over-current limit circuit reacts. When the current detection, limit circuit works, current limitation is carried out.
3-3. When the output current increases gradually
When the output current increases gradually, current limitation does not work until the output current exceeds the
over-current detection value. When it exceeds the detection value, current limitation is carried out.
4. Under-voltage lockout (UVLO)
UVLO circuit prevents the switch from turning on until the VIN exceeds 2.3V(Typ.). If the VIN drops below 2.2V(Typ.)
while the switch turns on, then UVLO shuts off the switch. UVLO has hysteresis of a 100mV(Typ).
Under-voltage lockout circuit works when the switch of either OUT1 or OUT2 is on (EN,/EN signal is active).
Technical Note
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BD2062FJ,BD2066FJ
Technical Note
5. Error flag (/OC) output
Error flag output is N-MOS open drain output. At detection of over-current, thermal shutdown, low level is output.
Over-current detection has delay filter. This delay filter prevents instantaneous current detection such as inrush current at
switch on, hot plug from being informed to outside.
/EN
V
V
OUT
Output shortcircuit
Thermal shut down
OUT
I
/OC
V
delay
Fig.40 Over-current detection, thermal shutdown timing
(BD2062FJ)
VEN
V
OUT
Output shortcircuit
Thermal shut down
OUT
I
/OC
V
delay
Fig.41 Over-current detection, thermal shutdown timing
(BD2066FJ)
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2011.05 - Rev.B
BD2062FJ,BD2066FJ
Technical Note
●Typical Application Circuit
10k~100k
10k~100k
VBUS
D+
D-
GND
Data
OUTIN
Regulator
ON/OFF
OC
OC
ON/OFF
USB Controller
5V(Typ.)
GND
IN
CIN
/EN1
(EN1)
/EN2
(EN2)
BD2062FJ/66FJ
/OC1
OUT1
OUT2
/OC2
Ferrite
Beads
CL
Data
CL
Data
Fig.42 Typical application circuit
●Application Information
When excessive current flows owing to output shortcircuit or so, ringing occurs by inductance of power source line to IC,
and may cause bad influences upon IC actions. In order to avoid this case, connect a bypath capacitor by IN terminal and
GND terminal of IC. 1uF or higher is recommended.
Pull up /OC output by resistance 10kΩ ~ 100kΩ.
Set up value which satisfies the application as C
L and Ferrite Beads.
This system connection diagram doesn’t guarantee operating as the application.
The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account
external parts or dispersion of IC including not only static characteristics but also transient characteristics.
This system connection diagram doesn’t guarantee operating as the application.
The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account
external parts or dispersion of IC including not only static characteristics but also transient characteristics.
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BD2062FJ,BD2066FJ
●Power Dissipation Character
(SOP-J8)
●Notes for use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the
breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s
power supply terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard,
for the digital block power supply and the analog block power supply, even though these power supplies has the same
level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing
the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns.
For the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At
the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to
be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the
constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric
transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
600
500
400
300
200
POWER DISSIPATION: Pd[mW]
100
0
0 25 50 75 100 125 150
AMBIENT TEMPERATURE: Ta [℃]
Fig.43 Power dissipation curve (Pd-Ta Curve)
Technical Note
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BD2062FJ,BD2066FJ
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the
jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In
addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention
to the transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals
a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage
to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Thermal shutdown circuit (TSD)
When junction temperatures become detected temperatures or higher, the thermal shutdown circuit operates and turns a
switch OFF. The thermal shutdown circuit is aimed at isolating the LSI from thermal runaway as much as possible. Do not
continuously use the LSI with this circuit operating or use the LSI assuming its operation.
(13) Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual
states of use.
Technical Note
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© 2011 ROHM Co., Ltd. All rights reserved.
15/16
2011.05 - Rev.B
BD2062FJ,BD2066FJ
●Ordering part number
B D 2 0 6 2 F J - E 2
Part No.
Part No.
2062
2066
SOP-J8
6.0±0.3
0.545
4.9±0.2
(MAX 5.25 include BURR)
5678
3.9±0.2
234
1
+
6°
4°
−4°
0.45MIN
0.2±0.1
S
1.375±0.1
0.175
1.27
0.42±0.1
0.1
S
(Unit : mm)
Package
FJ: SOP-J8
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
2500pcs
E2
The direction is the 1pin of product is at the upper left when you hold
()
reel on the left hand and you pull out the tape on the right hand
Reel
Packaging and forming specification
E2: Embossed tape and reel
1pin
Order quantity needs to be multiple of the minimum quantity.
∗
Technical Note
Direction of feed
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16/16
2011.05 - Rev.B
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specied herein is subject to change for improvement without notice.
The content specied herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specied in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specied herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specied in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, ofce-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specied in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, re or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, re control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specied herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Notice
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© 2011 ROHM Co., Ltd. All rights reserved.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
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http://www.rohm.com/contact/
R1120
A
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