t
High Side Switch ICs 1ch
Datashee
BD2061AFJ BD2065AFJ
●General Description
Single channel high side switch IC for USB port is a
high side switch having over current protection used i n
power supply line of universal serial bus (USB).
N-channel power MOSFET of low on resistance and
low supply current are realized in this IC.
And, over current detection circuit, thermal shutdown
circuit, under voltage lockout and soft start circuit are
built in.
●Features
Low on resistance 80mΩ N-ch MOSFET Switch.
Continuous current load 1.0A
Control input logic
¾ Active-Low : BD2061AFJ
¾ Active-High: BD2065AFJ
Soft start circuit
Over current detection
Thermal shutdown
Under voltage lockout
Open drain error flag output
Reverse-current protection when power switch off
TTL Enable input
1.2ms typical rise time
●Applications
USB hub in consumer appliances, Car accessory, PC,
PC peripheral equipment, and so forth
●Ty pical A pplication Circuit
5V(typ.)
C
IN
GND
IN
IN
EN(/EN )
●Lineup
Over current threshold
Min. Typ. Max.
1.1A 1.5A 2.3A Low SOP-J8 Reel of 2500 BD2061AFJ – E2
1.1A 1.5A 2.3A High SOP-J8 Reel of 2500 BD2065AFJ – E2
●Key Specifications
Input voltage range: 2.7V to 5.5V
ON resistance : 80mΩ(Typ.)
Over current threshold: 1.1A min., 2.3A max.
Standby current: 0.01μA (Typ.)
Operating temperature range: -40℃ to +85℃
●Package W(Typ.) D(Typ.) H (Max.)
SOP-J8 4.90mm x 6.00mm x 1.65mm
OUT
Control input logic Package Orderable Part Number
OUT
OUT
/OC
+
C
L
-
SOP-J8
VBUS
D+
D-
GND
○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays
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BD2061AFJ BD2065AFJ
●Block Diagram
1.0
0.8
0.6
0.4
0.2
0.0
UVLO H YSTERE SIS VOLTAGE : VH YS[V]
-5 0 0 5 0 1 0 0
AMB IE NT TEM PER ATURE : Ta[℃]
●Pin Configurations
BD2061AFJ
GND
1
IN
2
IN
3
OUT
8
OUT
7
OUT
6
/EN
4
/OC
5
●Pin Descriptions
◎BD2061AFJ
Pin No. Symbol I / O Pin function
1 GND I Ground.
Power supply input.
2, 3 IN I
Input terminal to the power switch and power supply input terminal of the internal circuit.
When used, connect each pin outside.
Enable input.
4 /EN I
Power switch on at Low level.
High level input > 2.0V, Low level input < 0.8V.
Error flag output.
5 /OC O
Low at over current, thermal shutdown.
Open drain output.
Datasheet
BD2065AFJ
TOP VIEW
GND
1
IN
2
IN
3
EN
4
OUT
8
OUT
7
OUT
/OC
6
5
6, 7, 8 OUT O
Power switch output.
When used, connect each pin outside.
◎BD2065AFJ
Pin No. Symbol I / O Pin function
1 GND I Ground.
Power supply input.
2, 3 IN I
Input terminal to the power switch and power supply input terminal of the internal circuit.
When used, connect each pin outside.
Enable input.
4 EN I
Power switch on at High level.
High level input > 2.0V, Low level input < 0.8V
Error flag output.
5 /OC O
Low at over current, thermal shutdown.
Open drain output.
6, 7, 8 OUT O
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Power switch output.
When used, connect each pin outside.
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●Absolute Maximum Ratings
Parameter Symbol Ratings Unit
Supply voltage VIN -0.3 to 6.0 V
Enable voltage VEN, V/EN -0.3 to 6.0 V
/OC voltage V/OC -0.3 to 6.0 V
/OC current IS/OC 10 A
OUT voltage VOUT -0.3 to 6.0 V
Storage temperature TSTG -55 to 150 ℃
Power dissipation PD 560*1 mW
*1 In case Ta = 25℃ is exceeded, 4.48mW should be reduced per 1℃.
●Recommended Operating Range
Parameter Symbol
Ratings
Unit
Operating voltage VIN 2.7 to 5.5 V
Operating temperature TOPR -40 to 85 ℃
Continuous output current ILO 0 to 1.0 A
●Electrical Characteristics
◎BD2061AFJ (Unless other wise specified, V
Parameter Symbol
IN = 5.0V, Ta = 25℃)
Limits
Min. Typ. Max.
Unit Condition
Operating Current IDD - 90 120 μA V/EN = 0V, OUT = OPEN
Standby Current ISTB - 0.01 1 μA V/EN = 5V, OUT = OPEN
V/EN 2.0 - - V High input
/EN input voltage
V/EN
- - 0.8 V Low input
- - 0.4 V Low input 2.7V≤ VIN ≤4.5V
/EN input current I/EN -1.0 0.01 1.0 μA V/EN = 0V or V/EN = 5V
/OC output LOW voltage V/OC - - 0.5 V I/OC = 5mA
/OC output leak current IL/OC - 0.01 1 μA V/OC = 5V
TD
/OC delay time
- 2.5 8 ms
/OC
ON resistance RON - 80 100 mΩ IOUT = 1.0A
Datasheet
Over-current Threshold ITH 1.1 1.5 2.3 A
Output current at short ISC 1.1 1.5 1.9 A
VIN = 5V, VOUT = 0V,
L = 100μF (RMS)
C
Output rise time TON1 - 1.2 10 ms
Output turn on time TON2 - 1.5 20 ms
Output fall time TOFF1 - 1 20 μs
R
L = 10Ω , CL = OPEN
Output turn off time TOFF2 - 3 40 μs
UVLO threshold
VTUVH 2.1 2.3 2.5 V Increasing VIN
VTUVL 2.0 2.2 2.4 V Decreasing VIN
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●Electrical Characteristics - continued
◎BD2065AFJ (Unless other wise specified, VIN = 5.0V, Ta = 25℃)
Parameter Symbol
Min. Typ. Max.
Limits
Unit Condition
Operating Current IDD - 90 120 μA VEN = 5V, OUT = OPEN
Standby Current I
- 0.01 1 μA VEN = 0V, OUT = OPEN
STB
VEN 2.0 - - V High input
EN input voltage
VEN
- - 0.8 V Low input
- - 0.4 V Low input 2.7V≤ VIN ≤4.5V
EN input current IEN -1.0 0.01 1.0 μA VEN = 0V or VEN = 5V
/OC output LOW voltage V
/OC output leak current IL
/OC delay time TD
- - 0.5 V I/OC = 5mA
/OC
- 0.01 1 μA V/OC = 5V
/OC
- 2.5 8 ms
/OC
ON resistance RON - 80 100 mΩ IOUT = 1.0A
Over-current Threshold ITH 1.1 1.5 2.3 A
IN = 5V, VOUT = 0V,
Output current at short ISC 1.1 1.5 1.9 A
Output rise time T
Output turn on time T
Output fall time T
Output turn off time T
UVLO Threshold
- 1.2 10 ms
ON1
- 1.5 20 ms
ON2
- 1 20 μs
OFF1
- 3 40 μs
OFF2
V
2.1 2.3 2.5 V Increasing VIN
TUVH
V
2.0 2.2 2.4 V Decreasing VIN
TUVL
V
L = 100μF (RMS)
C
RL = 10Ω , CL = OPEN
Datasheet
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A
/
●Measurement Circuit
V
IN
Datasheet
V
IN
1uF
VEN(V
)
/EN
GND
IN
IN
EN(/EN)
OUT
OUT
OUT
/OC
1uF
VEN(V
GND
IN
IN
EN(/EN)
)
/EN
OUT
OUT
OUT
OC
A. Operating curr ent B. EN, /EN input voltage, Output rise, fall time
1uF
C
L
VEN(V
V
IN
GND
IN
IN
EN(/EN)
)
/EN
OUT
OUT
OUT
/OC
1uF
VEN(V
V
IN
GND
IN
IN
EN(/EN)
)
/EN
OUT
OUT
OUT
/OC
10k
V
IN
I
OUT
C. ON resistance, Over current detection D. /OC output LOW voltage
Figure 1. Measurement circuit
●Timing Diagram
T
OFF1
T
ON1
T
ON1
T
R
L
V
IN
I
/OC
OFF1
C
L
V
V
OUT
/EN
90%
10%
T
ON2
50% 50%
90%
10%
T
OFF2
V
OUT
V
EN
90%
10%
T
ON2
50% 50%
Figure 2. Timing diagram (BD2061AFJ) Figure 3. Timing diagram (BD2065AFJ)
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90%
10%
T
OFF2
11.Mar.2013 Rev.001
BD2061AFJ BD2065AFJ
●Typical Performance Curves
Datasheet
120
Ta=25°C
100
80
[μA]
60
DD
I
40
OPERATING CURRENT :
20
0
23456
SUPPLY VOLTAGE : V
Figure 4. Operating current
EN,/EN Enable
[V]
IN
120
VIN=5.0V
100
80
[μA]
60
DD
I
40
OPERATING CURRENT :
20
0
23456
SUPPLY VOLTAGE : V
Figure 5. Operating current
EN,/EN Enable
[V]
IN
1.0
Ta=25°C
0.8
0.6
[μA]
STB
I
0.4
STANDBY CURRENT :
0.2
0.0
23456
SUPPLY VOLTAGE : V
Figure 6. Standby current
EN,/EN Disable
1.0
VIN=5.0V
0.8
0.6
[μA]
STB
I
0.4
0.2
STANDBY CURRENT :
0.0
-50 0 50 100
[V]
IN
AMBIENT TEMPERATURE : Ta[℃]
Figure 7. Standby current
EN,/EN Disable
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●Typical Performance Curves - continued
Datasheet
2.0
Ta=25°C
1.5
[V] 0
/EN
V
EN,
V
1.0
Low to High
0.5
ENABLE INPUT VOLTAGE :
0.0
23456
SUPPLY VOLTAGE : V
Figure 8. EN,/EN input voltage
High to Low
[V]
IN
2.0
VIN=5.0V
1.5
[V]
/EN
1.0
, V
EN
V
Low to High
High to Low
0.5
ENABLE INPUT VOLTAGE :
0.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
Figure 9. EN,/EN input voltage
0.5
Ta=25°C
0.4
0.3
[V]
/OC
V
0.2
0.1
/OC OUTPUT LOW VOLTAGE :
0.0
23456
SUPPLY VOLTAGE : V
Figure 10. /OC output LOW voltage
0.5
VIN=5.0V
0.4
0.3
[V]
/OC
V
0.2
0.1
/OC OUTPUT LOW VOLTAGE :
0.0
-50 0 50 100
[V]
IN
AMBIENT TEMPERATURE : Ta[
Figure 11. /OC output LOW voltage
℃
]
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A
●Typical Performance Curves - continued
Datasheet
200
Ta=25°C
150
mΩ]
100
ON[
R
ON RESISTANCE :
50
0
23456
SUPPLY VOLTAGE : V
Figure 12. ON resistance
5.0
DD
[V]
200
VIN=5.0V
150
[mΩ]
100
ON
R
ON RE SISTANCE :
50
0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
Figure 13. ON resistance
5.0
Ta=25°C
4.0
3.0
[mS]
[mS]
2.0
/OC
TD
/OC DELAY TIME :
1.0
0.0
2 3 4 5 6
SUPPLY VOLTAGE: V
Figure 14. /OC output delay time
[V]
IN
/OC
TD
/OC DELAY TIME :
VIN=5.0V
4.0
3.0
2.0
1.0
0.0
-50 0
MBIENT TEMPERATURE: Ta[℃]
Figure 15. /OC output delay time
50
100
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●Typical Performance Curves - continued
Datasheet
[A]
S HO RT CIRCUIT CURRENT : I
SC
2.00
Ta=25°C
1.50
1.00
0.50
0.00
23456
SUPPLY VOLTAGE : V
Figure 16. Output current at
shortcircuit
[V]
IN
2.00
[A]
SC
VIN=5.0V
1.50
1.00
0.50
S HO R T CIRCUIT CURR ENT : I
0.00
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
Figure 17. Output current at
shortcircuit
ON1
RISE TIME :
5.0
Ta=25°C
4.0
3.0
[ms]
2.0
T
1.0
0.0
23456
SUPPLY VOLTAGE : V
[V]
IN
5.0
VIN=5.0V
4.0
3.0
[ms]
ON1
2.0
T
RISE TIME :
1.0
0.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[
Figure 19. Output rise time Figure 18. Output rise time
℃
]
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●Typical Performance Curves - continued
Datasheet
[ms]
ON2
T
TURN ON TIME :
5.0
Ta=25°C
4.0
3.0
2.0
1.0
0.0
23456
SUPPLY VOLTAGE : V
Figure 20. Output turn on time
[V]
IN
5.0
VIN=5.0V
4.0
3.0
[ms]
ON2
T
2.0
TURN ON TIME :
1.0
0.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[
Figure 21. Output turn on time
℃
]
[μs]
OFF1
T
FALL TIME :
5.0
Ta=25°C
4.0
3.0
2.0
1.0
0.0
23456
SUPPLY VOLTAGE : V
Figure 22. Output fall time
[V]
IN
5.0
VIN=5.0V
4.0
3.0
[μs]
OFF1
2.0
T
FALL TIME :
1.0
0.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[
Figure 23. Output fall time
℃
]
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●Typical Performance Curves - continued
Datasheet
[μs]
OFF2
T
TURN OFF TIME :
5.0
Ta=25°C
4.0
3.0
2.0
1.0
0.0
23456
SUPPLY VOLTAGE : V
Figure 24. Output turn off time
[V]
IN
5.0
VIN=5.0V
4.0
3.0
[μs]
OFF2
2.0
T
TURN OFF TIME :
1.0
0.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[
Figure 25. Output turn off time
℃
]
2.5
2.4
V
UVLOH
[V]
2.3
UVLOL
, V
UVLOH
V
2.2
V
UVLOL
2.1
UVLO THRESHOLD VOLTAGE :
2.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[
Figure 26. UVLO threshold voltage
℃
1.0
0.8
0.6
0.4
0.2
0.0
UVLO HYSTERESIS VOLTAGE : VHYS[V]
]
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
Figure 27. UVLO hysteresis voltage
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(
(
(
)
(
●Typical Wave Forms
V
/EN
V
/OC
(5V/div.)
V
OUT
(5V/div.)
V
/EN
(5V/div.)
V
/OC
5V/div.
V
OUT
Datasheet
I
OUT
(0.5A/div.)
VEN
(5V/div.)
V
/OC
(5V/div.)
VIN=5V
RL=10Ω
=100μF
C
L
TIME(1ms/div.)
Figure 28. Output rise characteristic
BD2061AFJ)
CL=220μF
CL=330μF
I
OUT
(0.5A/div.)
V
/OC
(5V/div.)
V
OUT
(5V/div.)
VIN=5V
=10Ω
R
L
=100μF
C
L
TIME(1ms/div.)
Figure 29. Output fall characteristic
BD2061AFJ)
I
OUT
(0.5A/div.)
CL=47μF
Figure 30. Inrush current response
CL=147μF
TIME (0.5ms/div.)
(BD2061AFJ)
V
IN
R
L
=5V
= 5Ω
I
OUT
(0.5A/div.)
Figure 31. Over current response
TIME (20ms/div.)
Ramped load
V
=5V
BD2061AFJ)
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(
(
(
(
)
(
)
(
)
(
(
(
)
(
)
●Typical Wave Forms - continued
V
/OC
5V/div.)
V
OUT
5V/div.)
I
OUT
(1.0A/div.)
VIN=5V
V
/EN
5V/div.
V
/OC
5V/div.
V
OUT
5V/div.
I
OUT
(1.0A/div.)
Datasheet
VIN=5V
=100μF
C
L
V
/OC
5V/div.)
V
OUT
5V/div.)
I
OUT
(1.0A/div.)
Figure 32. Over current response
TIME (2ms/div.)
Ramped load
BD2061AFJ)
VIN=5V
=100μF
C
L
V
/OC
5V/div.
V
OUT
5V/div.
I
OUT
(1.0A/div.)
Figure 33. Over current response
TIME (2ms/div.)
Enable to shortcircuit
(BD2061AFJ)
Thermal Shutdown
VIN=5V
C
L
=100μF
Figure 34. Over current response
TIME (2ms/div.)
Figure 35. Over current response
Enable to shortcircuit
(BD2061AFJ)
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TIME (0.2s/div.)
Enable to shortcircuit
(BD2061AFJ)
TSZ02201-0E3E0H300150-1-2
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BD2061AFJ BD2065AFJ
(
(
)
(
)
(
)
(
)
(
(
(
(
(
●Typical Wave Forms - continued
V
IN
5V/div.)
V
OUT
5V/div.)
I
OUT
1.0A/div.)
V
/OC
5V/div.)
RL=5Ω
=147μF
C
L
VIN
5V/div.
V
OUT
5V/div.
I
OUT
1.0A/div.
V
/OC
5V/div.
Datasheet
RL=5Ω
=147μF
C
L
TIME (10ms/div.)
Figure 36. UVLO response
Increasing V
IN
BD2061AFJ)
TIME (10ms/div.)
Figure 37. UVLO response
Decreasing V
IN
BD2061AFJ)
Regarding the output rise/fall and over current detection characteristics of BD2065AFJ, refer to the characteristic of BD2061AFJ.
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BD2061AFJ BD2065AFJ
/
(
/EN)
●Ty pical A pplication Circuit
Datasheet
5V(typ.)
VBUS
IN
Regulator
D+
OUT
D-
GND
GND
IN
USB
Controller
10k to
10 0kΩ
CIN
EN
●Application Information
When excessive current flows due to output short-circuit or so, ringing occurs because of inductance between power source
lines to IC, and may cause bad influences on IC operations. In order to avoid this case, connect a bypass capacitor across
IN terminal and GND terminal of IC. 1μF or higher is recommended.
Pull up /OC output by resistance 10kΩ to 100kΩ.
Set up value which satisfies the application as C
This application circuit does not guarantee its operation.
When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external
components including AC/DC characteristics as well as dispersion of the IC.
●Functional Description
1. Switch operation
IN terminal and OUT terminal are connected to the drain and the source of switch MOSFET respectively. And the IN
terminal is used also as power source input to internal control circuit.
When the switch is turned on from EN/EN control input, IN terminal and OUT terminal are connected by an 80mΩ switch.
In on status, the switch is bidirectional. Therefore, when the potential of OUT terminal is higher than that of IN terminal,
current flows from OUT terminal to IN terminal.
Since a parasitic diode between the drain and the source of s witch MOSFET is not present in the off status, it is possible
to prevent current from flowing reversely from OUT to IN.
2. Thermal shutdown circuit (TSD)
If over current would continue, the temperature of the IC would increase drastically. If the junction temperature were
beyond 140℃ (typ.) in the condition of over current detection, thermal shutdown circuit operates and makes power
switch turn off and outputs error flag (/OC). Then, when the junction temperature decreases lower than 120℃ (typ.),
power switch is turned on and error flag (/OC) is cancelled. Unless the fact of the increasing chips temperature is
removed or the output of power switch is turned off, this operation repeats.
The thermal shutdown circuit operates when the switch is on (EN,/EN signal is active).
3. Over current detection (OCD)
The over current detection circuit limits current (I
MOSFET exceeds a specified value. There are three types of response against over current. The over current detection
circuit works when the switch is on (EN,/EN signal is active).
L.
) and outputs an error flag (/OC) when current flowing in each switch
SC
OUT
OUTIN
OUT
OC
+
C
L
-
VBUS
+
-
GND
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Datasheet
3-1. When the switch is turned on while the output is in short-circuit status, the switch goes into current limit status
immediately.
3-2. When the output short-circuits or high-current load is connected while the switch is on, very large current flows until
the over current limit circuit reacts. When the current detection limit circuit works, current limitation is carried out.
3-3. When the output current increases gradually, current limitation does not work until the output current exceeds the
over current detection value. When it exceeds the detection value, current limitation is carried out.
4. Under voltage lockout (UVLO)
UVLO circuit prevents the switch from turning on until the VIN exceeds 2.3V(Typ.). If the VIN drops below 2.2V(Typ.) while
the switch turns on, then UVLO shuts off the power switch. UVLO has hysteresis of 100mV(Typ).
Under voltage lockout circuit works when the switch is on (EN,/EN signal is active).
5. Error flag (/OC) output
Error flag output is N-MOS open drain output. At detection of over current or thermal shutdown, the output level is low.
Over current detection has delay filter. This delay filter prevents instantaneous current detection such as inrush current at
switch on, hot plug from being informed to outside.
/EN
V
V
OUT
Output shortcircuit
Thermal shut down
OUT
I
/OC
V
delay
Figure 38. Over current detection, thermal shutdown timing
(BD2061FJ)
VEN
V
OUT
Output shortcircuit
Thermal shut down
OUT
I
/OC
V
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delay
Figure 39. Over current detection, thermal shutdown timing
(BD2065AFJ)
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●Power Dissipation
(SOP-J8)
●I/O Equivalence Circuit
600
500
400
300
200
PO WER DISSIP A TION: Pd[mW ]
100
0
0 25 50 75 100 125 150
Symbol Pin No Equivalence circuit
Datasheet
A MBIENT TEM PERATURE: Ta [℃]
Figure 40. Power dissipation curve (Pd-Ta Curve)
EN(/EN) 4
/OC 5
OUT 6,7,8
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Datasheet
●Operational Notes
(1) Absolute maximum ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such as
adding a fuse, in case the IC is operated over the absolute maximum ratings.
(2) Recommended operating conditions
These conditions represent a range within which the expected characte ristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
terminals.
(4) Power supply lines
Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply lines
of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the
analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature
and aging on the capacitance value when using electrolytic capacitors.
(5) Ground Voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no
pins are at a voltage below the ground pin at any time, even during transient condition.
(6) Short between pins and mounting errors
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong orientation
or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.
(7) Operation under strong electromagnetic field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
(8) Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always
be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent
damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage.
(9) Regarding input pins of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode
or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND v oltage to an input pin (and thus to the P substrate) should be
avoided.
Pin A
+
N
P
P
Parasitic element
GND
Resistor Transistor (NPN)
P
P substrate
Pin B
Pin A
+
N N
Figure 41. Example of monolithic IC structure
Parasitic
element
N
+
P
Parasitic element
B
C
N
E
P
P substrate
GND
+
P
N
GND
Pin B
B C
E
GND
Other adjacent elements
Parasitic
element
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BD2061AFJ BD2065AFJ
(10) GND wiring pattern
When using both small-signal and large-current GND traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on th e
GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance.
(11) External Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
(12) Thermal shutdown circuit (TSD)
The IC incorporates a built-in thermal shutdown circuit, which is designed to turn off the IC when the internal temperature
of the IC reaches a specified value. Do not continue to operate the IC after this function is activated. Do not use the IC in
conditions where this function will always be activated.
(13) Thermal consideration
Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd) in
actual operating conditions. Consider Pc that does not exceed Pd in actual operating conditions (Pc≥Pd).
Package Power dissipation : Pd (W)=(Tjmax－Ta)/θja
Power dissipation : Pc (W )=(Vcc－Vo)×Io+Vcc×Ib
Tjmax : Maximum junction temperature=150℃, Ta : Peripheral temperature[℃] ,
θja : Thermal resistance of package-ambience[℃/W], Pd : Package Power dissipation [W],
Pc : Power dissipation [W], Vcc : Input Voltage, Vo : Output Voltage, Io : Load, Ib : Bias Current
Datasheet
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11.Mar.2013 Rev.001
BD2061AFJ BD2065AFJ
●Ordering Information
B D 2 0 6 1 A F J - E 2
Part Number
Package
FJ: SOP-J8
Packaging and forming specification
E2: Embossed tape and reel
B D 2 0 6 5 A F J - E 2
Part Number
●Marking Diagram
SOP-J8 (TOP VIEW)
Part Number Part Number Marking
Part Number Marking
LOT Number
1PIN MARK
Package
FJ: SOP-J8
Packaging and forming specification
E2: Embossed tape and reel
Datasheet
BD2061AFJ D061A
BD2065AFJ D065A
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BD2061AFJ BD2065AFJ
●Physical Dimension, Tape and Reel Information
Package Name SOP-J8
Datasheet
<Tape and Reel information>
Quantity
Direction
of feed
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Embossed carrier tapeTape
2500pcs
E2
The direction is the 1pin of product is at the upper left when you hold
()
reel on the left hand and you pull out the tape on the right hand
Direction of feed
TSZ02201-0E3E0H300150-1-2
11.Mar.2013 Rev.001
Reel
1pin
Order quantity needs to be multiple of the minimum quantity.
∗
21/22
BD2061AFJ BD2065AFJ
●Revision History
Date Revision Changes
11.Mar.2013 001 New Release
Datasheet
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Datasheet
Datasheet
Notice
●General Precaution
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subjec t to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for applicat io n in ordinar y electronic eq uip ments (such as AV equipment ,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way respons ible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any propert y, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3) Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl
H
2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-solub le cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4) The Products are not subject to radiation-proof design.
5) Please verify and confirm characteristics of the final or mounted products i n usin g the Products.
6) In particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recomm ended. Avoid applying power
exceeding normal rated power; exceeding the power ratin g under steady-state loading condition may negatively affect
product performance and reliability.
7) De-rate Power Dissipation (Pd) depe nding on Ambient temperature (T a). When us ed in sealed area, confirm the actual
ambient temperature.
8) Confirm that o peration temperature is within the specified range described in the product specification.
9) ROHM shall not be in any way responsible or liable for failure in duced under deviant condition from what is defined in
this document.
2,
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
Datasheet
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromin e, etc.) flux is used, the residue of flux may negativel y affect product
performance and reliability.
2) In princip le, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2) You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgmen t in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dr y condition (e.g. Gro unding of human bod y / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are expos ed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are expos ed to high Electrostatic
2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderabilit y before using Products of which storage time is
exceeding the recommended storage time period.
3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4) Use Pro ducts within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
●Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
●Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe an y intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
2)
third parties with respect to the information contained in this document.
Datasheet
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
Datasheet
●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3) T he Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5) T he proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Datasheet
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
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