ROHM BD1603NUV Technical data

VOUT

Datashee

1-Channel 190mA Charge Pump White LED Driver with 1-wire Serial Interface

BD1603NUV

●General Description The high-power (large current output) type LED driver is a white LED driver best suited for applications that require the large current. It is equipped with output voltage and oscillation frequency switch functions to flexibly cope with a wide variety of applications. Because output voltage is fixed at 4.5V or 5.0V, it is also applicable t o applications except the LED driver.

●Features

 Current consumption less than or equal to 2µA at

shut-down

 Low ripple output owing to a complementary

charge pump circuit

 Over current protection when VOUT short to GND.  Soft start function  Mounting various protection functions such as

current overload limiter and thermal shut-down circuit

●Lineup

Parameter BD1603NUV

Number of LEDs Boost magnification ×2 fixed (4.5V or 5.0VOUTput)

Interface Control via external pins Individual LED lighting Not available

(Up to maximum load current)

Up to 10 LEDs

●Key Specifications

 Operating power supply voltage range: 2.7V to 5.5V  Oscillator frequency: 238 or 642kHz(Typ.)  Operating temperature range: -30℃ to +85℃  Output Voltage: 190mA 4.5V(Typ.)

150mA 5.0V(Typ.)

●Package W(Typ.) x D(Typ.) x H(Max.) VSON010V3030 3.00mm x 3.00mm x 1.00mm

●Applications

This driver is applicable for various fields such as mobile phones, portable game machines and appliances. 5V supply for HDMI 5V supply for USB OTG

SON010V3030

3.00mm x 3.00mm x 1.00mm

●Ty pical A pplication Circuit

2.7V to 5.5V Cin

1µF

VIN

BD1603NUV

CF1-

CF2+

CF2-

CF1

Vo = 4.5V or 5.0V

CF1 1µF(10V)

1µF(10V)

CF2 1µF(10V)

OUT

FSEL

VSEL

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays www.rohm.com

GND

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Up to 10 LE

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●Absolute Maximum Ratings (Ta=25ºC) Parameter Symbol Ratings Unit Condition

Terminal input voltage VINMAX 7 V Terminal output voltage VOMAX 7 V Operating temperature range Topr -30 to +85 ºC Storage temperature range Tstg -55 to +150 ºC Allowable loss Pd 700(*1) mW

(*1)When a glass epoxy substrate (70mm × 70mm × 1.6mm) has been mounted, this loss will decrease 5.6mW/ºC if Ta is higher than or equal to 25ºC.

●Recommended Operating Rating (Ta=-30ºC to +85ºC) Parameter Symbol Ratings Unit Condition

Operating supply voltage Vin 2.7 to 5.5 V

●Electrical Characteristics  Unless otherwise specified, Ta = 25ºC and Vin = 3.6V. Parameter Symbol

Min. Typ. Max.

Limits

Unit Condition

Datasheet

- 1.4 2.0 mA Freq=238kHz, I

Circuit current

IQ2 - 3.0 4.2 mA Freq=642kHz, I

IQ3 - - 2 μA EN=0V

4.80 5.0 5.20 V VSEL=VIN, I

OUT1

Output voltage

4.275 4.5 4.725 V VSEL=0V, I

OUT2

- - 150 mA

OUT1

- - 190 mA

OUT2

Output current

- - 60 mA

OUT3

- - 120 mA

OUT4

202 238 273 kHz EN=VIN, FSEL=0V

OSC1

Oscillation frequency

513 642 770 kHz EN=VIN, FSEL=VIN

OSC2

Output short-circuit current ISC - - 600 mA V

=0mA,

OUT

=0mA

OUT

=150mA

OUT

=190mA

OUT

VSEL=V

3.2V≦ V

VSEL=0V

3.2V≦ VIN VSEL=V

2.85V≦ V

VSEL=0V

2.85V≦ V

OUT

=0V

*1)

=3.3V, V

Efficiency

- 75.0 - %

n2 - 74.5 - %

I V

OUT

=60mA, Freq=238kHz

=3.3V, V

=60mA, Freq=642kHz

OUT

[ Logic controller ] High threshold voltage VIH 1.3 - - V EN, VSEL and FSEL pins

Low threshold voltage VIL - - 0.4 V EN, VSEL and FSEL pins

‘H’ level input current IIH - - 10 μA EN, VSEL and FSEL pins

‘L’ level input current IIL - - 10 μA EN, VSEL and FSEL pins

*1) Please design a VIN condition and a load current not to exceed Pd of the LSI.

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=5.0V

BD1603NUV

●Pin Descriptions

Pin number Pin name In/Out Function

1 VOUT Out Output pin 2 CF1+ In/Out Connection pin for flying capacitor 1 3 VIN In Input voltage 4 FSEL In Frequency switch pin(L : 238kHz, H : 642kHz) 5 VSEL In Output voltage switch pin(L : 4.5V, H : 5.0V) 6 EN In ON/OFF control pin 7 CF2- In/Out Connection pin for flying capacitor 2 8 GND - Ground pin 9 CF1- In/Out Connection pin for flying capacitor 1

10 CF2+ In/Out Connection pin for flying capacitor 2

●Block Diagram

Thermal

PAD

Heat radiation PAD of back side Connect to GND

Figure 1. Block Diagram

Datasheet

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●Typical Performance Curves

Figure 2. Quiescent Current1

Datasheet

Figure 3. Quiescent Current2

Figure 4. Quiescent Current3

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Figure 5. Line Regulation (VSEL = 0V)

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BD1603NUV

●Typical Performance Curves - continued

Figure 6. Line Regulation (VSEL = VIN)

Datasheet

Figure 7. Load Regulation (VSEL = 0V)

Figure 8. Load Regulation (VSEL = VIN)

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Figure 9. Efficiency vs. Input Voltage

(VSEL = 0V)

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●Typical Performance Curves - continued

Figure 10.Efficiency vs. Input Voltage

(VSEL = V

)

Datasheet

Figure 11. Efficiency vs. Load Current

(VSEL = 0V)

Figure 12. Efficiency vs. Load Current

(VSEL = V

)

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●Description of Operations

1. ON/OFF Control ON/OFF control takes place via the external EN pin. EN = “H” : Operation EN = “L” : Standby

2. Low Ripple Charge Pump BD1603NUV is equipped with a complementary charge pump circuit that achieves low ripple output. Because BD1603NUV uses two pairs of charge switch and pump switch alternately, it can significantly reduce the output ripple in comparison with the conventional double charge pumps.

3. Frequency Select The operating frequency of a charge pump can be changed via the F SEL pin that is set to H or L. This operating frequency must be selected consideri ng the influence on other devices and according to the allowable amount of ripple.

4. Efficiency The efficiency can be obtained from the following formula:

5. Power Consumption The power consumption can be obtained from the following formula:

PD = PIN－P

OUT

= (VIN×IIN)－(VO×IO) [w]

IN and IO must be set within an allowable loss of this LSI.

(You must set Io[mA] that it doesn't exceed Pd of this LSI.) Because the allowable loss greatly depends on the PCB layout, the PCB layout must be designed considering heat dissipation. In this PCB layout, the land pattern at the rear of this LSI must be directly connected to the ground plane.

6. Output Short-Circuit Current When the output is short-circuited to the ground, outflow current is limited for LSI protection. Once short-circuit is cleared, normal LSI operation is resumed (automatic return).

7. Thermal Shutdown When the chip setting temperature is 185ºC (typ) or more, the thermal shutdown function is activate d to turn off the charge pump circuit. When this temperature falls below to the thermal detection temperature, normal LSI operation is resume d. Accordingly, the following ON and OFF operations are repeated as thermal operations unless the primar y cause is resolve d.

Temperature

Io×V

OUT

=η

I×V

ININ

[]

%100×

VOUT : Output voltage IO : Load current

: Input voltage

IIN : Input current

Thermal detection

Figure 13.Thermal Detection Loop

Circuit OFF Temperat ure drop

Datasheet

Circuit ON

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8. Setting the LED Current The LED current is set as follows. The constant must be determined, considering variations in resistance and LED.



ILED

9. Brightness Control Brightness Control takes place in this LSI as follows. a) PWM

The EN pin is turned ON or OFF repeatedly via the PWM signal. It is recommended that the PWM frequency is 100Hz or below. This frequency must be determined, fully evaluating the linearity of brightness to the PWM duty. Brightness control must take place as shown in “b” below if the rush current causes a problem when the EN pin is ON.

Figure 15. PWM Brightness Control Figure 16. ON/OFF Pin Control Figure 17. ON/OF F Pin Control

b) Switching the LED Current

Switching the LED current takes place via the external switch. The constant must be determined, considering the ON resistance of the switch transistor.

VOUT: Output voltage of BD1603NUV

: VF in the LED to be connected

R : LED current setting resistance

PWM s ignal

F

VVOUT



BD1603NUV

Figure 14. Setting the LED Current

BD1603NUV

(4.5V, 100Hz) (5.0V, 100Hz)

OUT

BD1603NUV

Figure 18. Brightness Control via the External Transistor

Datasheet

OUT

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10. Cautions on PCB Design BD1603NUV is equipped with a double charge pump. As the load current becomes larger, the input current also becomes larger.

 Wire a substrate in a way that the wiring impedance can be minimiz ed. Special care should be taken for the input

voltage, ground, output and flying capacitor connection pin.

 Wire the ground of an output capacitor (C  Position a bypass capacitor to be inserted between VIN (input voltage) and GND near this LSI and wire it near the

VIN and GND pins of this LSI.

 Heat radiation is controlled by the wiring status to the back metal. Connect it with GND plane as much as

possible by a wide area.

 About the FSEL terminal and the VSEL terminal, process fixed logic by the PCB pattern when using it by fixed

logic.

) near the GND pin of this LSI.

OUT

BD1603NUV

GND

Figure 19. How to Ground in PCB Design

OUT

Datasheet

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●Operational Notes

(1) Absolute Maximum Ratings

An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consi derati on sh ould be g iven to take ph ys ical s afet y measures including the use of fuses, etc.

(2) Operating Conditions

These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter.

(3) Reverse Connection of Power Supply Connector

The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal.

(4) Power Supply Line

Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.

(5) GND Voltage

Make setting of the potential of the GND terminal so that it will be maintained at the mi nimum in any operating state. Furthermore, check to be sure no terminals are at a potential low er than the GND voltage in cluding an actual electric tran sient.

(6) Short Circuit between Terminals and Erroneous Mounting

In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering bet ween terminals or between the terminal and the power supply or the GND terminal, the ICs can break down.

(7) Operation in Strong Electromagnetic Field

Be noted that using ICs in the strong electromagnetic field can malfunction them.

(8) Inspection with Set PCB

On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismo unt it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB.

(9) Input Terminals

In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then break down of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a vo ltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guarantee d value of electrical characteristics.

(10) Ground Wiring Pattern

In terms of GND wiring, the recommended writing is to make single-point grounding at a reference point on the set PCB. As for GND of external parts as well, please hold PCB design so that impedance may lower fully.

(11) External Capacitor

In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.

(12) Thermal Shutdown Circuit (TSD)

When a junction temperature rises above the setting value, the thermal shutdown circuit is activated to turn off the switch. The purpose of the thermal shutdown circuit is to block LSI when an uncontrolled operation takes place for a temperature above the setting value. The thermal shutdown circuit has not been engineered to pr otect or assure LSI. For this reason, don’t use this circuit to enable continuous use or operation of LSI.

(13) Thermal Design

hermal design must have enough margins, considering an allowable loss (Pd) in actual usage.

(14) About the Rush Current

For ICs with more than one power supply, it is possible that rush current may flow instantaneously due to the internal powering sequence and delays. Therefore, give special consideration to po wer coupling capacitance, power wiring, width of ground wiring, and routing of wiring.

Datasheet

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BD1603NUV

●Ordering Information

B D 1 6 0 3 N U V - E 2

Datasheet

Part Number Package

NUV: VSON010V3030

●Marking Diagram

VSON010V3030 (TOP VIEW)

Part Number Marking

BD1

LOT Number

603

1PIN MARK

●Physical Dimension Tape and Reel Information

VSON010V3030

3.0±0.1

0.08

1.0MAX

2.0±0.1

C0.25

0.4±0.1

0.5

1PIN MARK

0.5

610

0.25

3.0±0.1

0.02

+0.03

0.02

1.2±0.1

+0.05

0.04

(0.22)

(Unit : mm)

Embossed carrier tapeTape

Quantity

Direction of feed

3000pcs E2

The direction is the 1pin of product is at the upper left when you hold

()

reel on the left hand and you pull out the tape on the right hand

Reel

1pin

Packaging and forming specification E2: Embossed tape and reel

Direction of feed

Order quantity needs to be multiple of the minimum quantity.

∗

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BD1603NUV

●Revision History Date Revision Changes

17.Dec.2012 001 New Release

Datasheet

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Datasheet

Notice

●General Precaution

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●Precaution on using ROHM Products

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2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any propert y, which a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

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2S, NH3, SO2, and NO2

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flux is recommended); or Washing our Products by using water or water-solub le cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

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5) Please verify and confirm characteristics of the final or mounted products in using the Products.

6) In particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-board mounting is strongly recomm ended. Avoid applying power exceeding normal rated power; exceeding the power ratin g under steady-state loading condition may negatively affect product performance and reliability.

7) De-rate Po wer Dissipation (P d) dependi ng on Ambient temperature (T a). When used i n sealed area, confirm the actual ambient temperature.

8) Confirm that operation temperature is within the specified range described in the prod uct specification.

9) ROHM shall not be in any way responsible or liable for failure induced under dev iant condition from what is defined in this document.

Notice - Rev.004

Datasheet

●Precaution for Mounting / Circuit board design

1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability.

2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

●Precautions Regarding Application Examples and External Circuits

1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics.

2) You agree that application no tes, reference designs, and associated data and information contained in this docum ent are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgmen t in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information.

●Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dr y condition (e.g. Gro unding of human bod y / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

●Precaution for Storage / Transportation

1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic

2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderabilit y before using Products of which storage time is exceeding the recommended storage time period.

3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton.

4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period.

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QR code printed on ROHM Products label is for ROHM’s internal use only.

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When disposing Products please dispose them properly using an authorized industry waste company.

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Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export.

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1) All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe an y intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.:

No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

2) third parties with respect to the information contained in this document.

Datasheet

Notice - Rev.004

Datasheet

●Other Precaution

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5) The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties.

Datasheet

Notice - Rev.004

ROHM BD1603NUV Technical data

Specifications and Main Features

Frequently Asked Questions

User Manual