ROHM’s spindle motor drivers incorporate the 3-phase full-wave pseudo-linear drive system(BA6859AFP-Y, BA6664FM)
and 180 ° electrifying direct PWM drive system(BD6671FM).Smooth rotation characteristic performance is ensured.
Besides, high torque is provided in a wide output range because the output stage incorporates low-saturation voltage NPN
transistors (BA6859AFP-Y, BA6664FM) and low-power consumption MOSFET (BA6671FM).
●Features
1) 3-phase full-wave pseudo-linear system (BA6859AFP-Y, BA6664FM)
2) 180° electrifying direct drive PWM system (BD6671FM)
3) Power saving, TSD (thermal shutdown) functions built in
4) Current limiting, Hall bias circuit built in
5) FG output built in
6) 3-phase component FG output built in (BA6664FM, BD6671FM)
7) Circuit direction detection function built in (BA6859AFP-Y, BA6664FM)
8) Reverse rotation prevention circuit built in
9) Short brake pin built in (BA6859AFP-Y, BA6664FM)
10) Brake mode selection pin built in (BA6859AFP-Y, BD6671FM)
11) Supports DSP 3.3 V
●Applications
Used for car, CD and DVD players incorporating changer function
●Absolute maximum ratings (Ta=25℃)
Parameter Symbol
Applied voltage VCC 7 7 7 V
Applied voltage VM 15 15 15 V
Applied voltage VG - - 20 V
Power dissipation Pd 1450*1 2200*2 2200*2 mW
Operating temperature Topr -40~+85 -40~+85 -40~+85 ℃
Storage temperature Tstg -55~+150 -55~+150 -55~+150 ℃
Output current Iout 1300 1300 2500 mA
Junction temperature Tjmax 150 150 150 ℃
*1 Reduced by 11.6 mW/℃ over 25℃, when mounted on a glass epoxy board (70 mm x 70 mm x 1.6 mm).
*2 Reduced by 17.6 mW/℃ over 25℃, when mounted on a glass epoxy board (70 mm x 70 mm x 1.6 mm).
9 H1- Hall signal input pin
10 H2+ Hall signal input pin
11 H2- Hall signal input pin
12 H3+ Hall signal input pin
13 H3- Hall signal input pin
14 VH Hall bias input pin
15 BR Brake mode selection pin
16 CNF
17 SB Short brake pin
18 FR Rotation detection pin
19 ECR Output voltage control reference pin
20 EC Output voltage control pin
21 PS Power-saving pin
22 FG FG signal output pin
23 VCC Power supply pin
24 VM Motor power supply pin
25 RNF
FIN FIN GND
Capacitor connection pin for phase
compensation
Resistance connection pin for output
current detection
Output to the motor will be opened at a chip tempe
175°C (Typ.). Do not use the IC in excess of a chip
rature of temperature of 150°C.
A3
2
A2
4
A1
7
HALL AMP
GND
8
H1+
9
-
H1
10
H2+
11
H2-
12
H3+
13
-
H3
14
Output will be open when the reverse rotation of the motor is
detected.
DRIVER
GAIN
CONTROL
CURRENT
TL
+
-
+
-
+
-
+
-
+
-
+
-
SENSE AMP
D Q
CK
TSD
GAIN
SWITCH
VCC
-+
PS
TORQUE
SENSE AMP
VCC
VCC
R
-
SHORT BRAKE
Q
BRAKE MODE
FIN
Torque limit current and I/O gain settings are made by
the RNF resistance value.
Resistance of 0.4 to 1.0Ω is recommended.
0.5Ω
RNF
28
RNF
VM
27
GSW
26
VCC
25
FG
24
PS
23
EC
22
ECR
21
FR
20
FG2
19
SB
18
CNF
17
BR
16
VH
15Hall Bias
500Ω
0.1µF
V
M
+
1µF
-
SERVO
SIGNAL
500Ω
Capacitor for noise level mitigation.
The recommended value is 0.47 µF to 10 µF.
+
1µF
-
I/O gain
Speed detection is attained by FG signal output.
The power saving mode is turned ON by low-level voltage,
and the circuit current and motor output will stop.
The motor torque current is controllable.
If the ECR voltage is set between 1.6 and 2.2V, the
maximum torque limit current will be obtained.
The detection of motor rotation direction is possible.
The short brake is operated regardless of brake mode settings.
Connect a capacitor for phase compensation.
The recommended value is 0.1µF.
Short brake and reversed brake settings are possible.
Resistor for setting Hall input level .
The recommended value is 200 Ω to 1k Ω.
Fig.6 BA6664FM Block Diagram
BA6664FM Pin Function Table
Pin No. Pin nameFunction
1 N.C. N.C.
2 A3 Output pin
3 N.C. N.C.
4 A2 Output pin
5 N.C N.C.
6 N.C. N.C.
7 A1 Output pin
Pd[W]
8 GND GND pin
9 H1+ Hall signal input pin
10 H1- Hall signal input pin
2.2
2.0
11 H2+ Hall signal input pin
12 H2- Hall signal input pin
13 H3+ Hall signal input pin
14 H3- Hall bias input pin
15 VH Hall bias input pin
16 BR Brake mode pin
The I/O gain G
by the RNF detection resistor.
①(BA6859AFP-Y)
G
=0.35/RNF [A/V] ・・・・・(1)
EC
from the EC pin to the RNF pin (output current) is determined
EC
②(BA6664FM)
G
=0.325/RNF [A/V] (GSW=L)
ECL
=0.60/RNF [A/V] (GSW=OPEN)
G
3mV
1.65(ECR)
Fig.11
E
[V]
C
ECM
G
=1.4/RNF [A/V] (GSW=H)
ECH
③(BD6671FM)
=0.175/RNF [A/V] (GSW=L)
G
ECL
=0.35/RNF [A/V] (GSW=M)
G
ECM
G
=0.70/RNF [A/V] (GSW=H)
ECH
④The following torque limit current ITL is obtained (BA6859AFP-Y, BA6664FM)
ITL=0.35/RNF [A]・・・・・・・・・・・・・・・・・・・(2)
⑤(BD6671FM)
I
=0.2/RNF [A] (GSW=L)
TLL
=0.4/RNF [A] (GSW=M)
I
TLM
I
=0.6/RNF [A] (GSW=H)
TLH
The value will become smaller than the computed value due to the wiring
capacity and other factors, if the RNF resistance is 0.5Ω or below.
●Set-up of Motor Rotation Direction and Voltage Range of Torque Control Reference Terminal.
The motor rotation direction determined by the torque control terminal voltage EC and the torque control reference terminal
voltage ECR
Torque control input voltage Rotation direction
EC<ECR Forward torque
EC>ECR Reverse torque
Io
ITL
Forward torque
Reverse torque
0.5 3.35.0
2.5
Fig.12
EC[V]
The relation between the input gain and torque limit current expressed as (1) and (2) discussed previously is only valid
when EC and ECR are within a range from 0.5V to 3.3V. Depending on how the torque control reference terminal voltage,
ECR is specified, there may be a case when the output current for the motor does not go up to the torque limit value.
Please be aware of this voltage range when specifying the ECR voltage.
For BA6859AFP-Y, BA6664FM and BD6671FM, 1.6V~2.2V is recommended.
If above conditions are understood, the voltage input range to the EC and ECR terminals can be from 0V to VCC.
●Power Saving
The input circuit specified in I/O circuit 1) BA6859AFP-Y (1) is used for power saving input.
The power saving pin has a temperature characteristic of approximately –5 mV/℃ and also the built-in resistors has a dispersion of 30%.
Keep the input voltage range in mind.
When the motor rotates in the reverse direction, the reverse rotation
detection function will operate and the output will be in an open state.
Fig.13
EC < ECR: Forward torque (forward rotation)
EC > ECR: Deceleration (forward rotation)
The motor rotates in a reverse direction with inertial force.
Fig. 13 shows the construction of the reverse rotation detection circuit.
・Forward rotation (EC<ECR)
Stop
Fig. 9 shows the phase relation of the H2+ and H3+ Hall input signals,
in which case the reverse rotation detection circuit will not work.
・Reverse rotation (EC>ECR)
The phase relation of the H2+ and H3+ signals are opposite to that when the motor is rotating in the forward direction.
Therefore, the reverse rotation detection circuit operates, and the output is turned off and open.
●FR Signal Output (BA6859AFP-Y, BA6664FM)
FR output signal pin outputs the FR signal of low(L) or high(H) after detecting the motor rotation direction.
Motor rotation direction FR signal output
Forward “H”
Reverse “L”
●Brake Mode Change (BA6664FM, BD6671FM)
By applying high-level voltage to the BR pin, the brake mode for the following condition can be changed: EC > ECR.
EC<ECR EC>ECR
BR
L Forward rotation Reverse rotation brake
H Forward rotation Short brake
When the BR pin is set to high level and used in short-brake mode, open the SB pin.
The BR pin has a temperature characteristics of approximately -5 mV/℃. Use the BR pin within the permissible input range.
●Short Brake (BA6859AFP-Y, BA6664FM)
OFF OFF OFF
ON ON ON
When the short-brake pin is set to high level, as shown in Fig.18, the output
transistor (3-phase) on the high side will be turned off and the output transistor
(3-phase) on the low side will be turned on. The short brake pin has a
temperature characteristic of approximately -5 mV/℃. Keep the input voltage
range (see Fig12) in mind.
MOTOR
Fig.14
●Hall Input
The Hall element allows both serial and parallel connections.
VCC
VCC
Set the Hall input voltage between 1.0 and 4.0 V. Compute the
resistance between the VH and VCC pins in consideration of the
The FG signal output/FG2 signal output terminals are for detecting the motor rotation speed. The output frequency of FG2
signal is three times higher than the FG frequency signal output. So, it is suitable for the slow speed rotation detection.
However, due to the Hall device variation and other reasons, the duty cycle may not reach 50% in some instances.
H1+
H1-
H2+
H2-
H3+
H3-
H1
+
-
H2
+
-
H3
+
-
FG2
FG
Fig. 16
H1 waveform
waveform
H
2
waveform
H
3
FG waveform
FG2 waveform
●Notes for use
Fig. 17
(1) Absolute maximum ratings
This product is subject to a strict quality management regime during its manufacture. However, damage may result if
absolute maximum ratings such as applied voltage and operating temperature range are exceeded. Assumptions should
not be made regarding the state of the IC (short mode or open mode) when such damage is suffered. A physical safety
measure such as a fuse should be implemented when use of the IC in a special mode where the absolute maximum
ratings may be exceeded is anticipated.
(2) Connecting the power supply connector backward
Connecting the power supply connector backwards may result in damage to the IC. Insert external diodes between the
power supply and the IC's power supply pins as well as the motor coil to protect against damage from backward
connections.
(3) Power supply lines
As return of current regenerated by back electromotive force of motor happens, take steps such as putting capacitor
between power source and GND as an electric pathway for the regenerated current. Be sure that there is no problem with
each property such as emptied capacity at lower temperature regarding electrolytic capacitor to decide capacity value. If
the connected power supply does not have sufficient current absorption capacity, regenerative current will cause the
voltage on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the
absolute maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a voltage
clamp diode between the power supply and GND pins.
(4) GND potential
Ensure a minimum GND pin potential in all operating conditions.
(5) Setting of heat
Take the power dissipation Pd) into account for practical application and make thermal design with sufficiently margined.
(6) Pin short and mistake fitting
Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result
in damage to the IC. Shorts between output pins or between output pins and the power supply and GND pins caused by
the presence of a foreign object may result in damage to the IC.
(7) Actions in strong magnetic field
Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction.
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
(9) Thermal shutdown circuit (TSD)
This IC incorporates a TSD circuit. If the chip becomes the following temperature, coil output to the motor will be open.
The TSD circuit is designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect the
IC or guarantee its operation. Do not continue to use the IC after operating this circuit or use the IC in an environment
where the operation of the TSD circuit is assumed.
TSD ON temperature [℃] (typ.) Hysteresis temperature [℃] (typ.)
BA6859AFP-Y 175 25
BA6664FM 175 15
BD6671FM 170 25
(10) Regarding input pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
P/N junctions are formed at the intersection of these P layers with the N layers of other elements to create a variety of
parasitic elements.
For example, when the resistors and transistors are connected to the pins as shown in Fig. 18,
○the P/N junction functions as a parasitic diode
when GND > (Pin A) for the resistor or GND > (Pin B) for the transistor (NPN).
○Similarly, when GND > (Pin B) for the transistor (NPN), the parasitic diode described above combines
with the N layer of other adjacent elements to operate as a parasitic NPN transistor.
The formation of parasitic elements as a result of the relationships of the potentials of different pins is an inevitable result
of the IC's architecture. The operation of parasitic elements can cause interference with circuit operation as well as IC
malfunction and damage. For these reasons, it is necessary to use caution so that the IC is not used in a way that will
trigger the operation of parasitic elements, such as by the application of voltages lower than the GND (P substrate)
voltage to input pins.
Pin A
+
P
P
N
P
GND
Resistor Transistor (NPN)
+
N N
P substrate
Pin A
aras
element
Pin B
+
P
N
c
Parasitic element
B
C
E
N
GND
P
P
P substrate
Pin B
+
N
GND
B C
E
GND
Other adjacent
elements
Fig.18 Example of IC structure
(11) Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
Always discharge capacitors after each process or step. Ground the IC during assembly steps as an antistatic measure,
and use similar caution when transporting or storing the IC. Always turn the IC's power supply off before connecting it to
or removing it from a jig or fixture during the inspection process.
(12) Ground Wiring Pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change
the GND wiring pattern of any external parts, either.
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consent of ROHM Co.,Ltd.
The content specied herein is subject to change for improvement without notice.
The content specied herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specied in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specied herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
Notice
The Products specied in this document are intended to be used with general-use electronic
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The Products specied in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
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