The BA00DD0/CC0 series are low-saturation regulators available for outputs up to 2A/1A. The output voltage can be
arbitrarily configured using the external resistance. These series of LDO regulators are offered in a broad packaging lineup.
This IC has a built-in over-current protection circuit that prevents the destruction of the IC due to output short circuits and a
thermal shutdown circuit that protects the IC from thermal damage due to overloading.
●Features
1) Maximum output current: 2A (BA00DD0 series), 1A(BA00CC0 series)
2) ±1% high-precision output voltage (BA00DD0)
3) Low saturation with PNP output
4) Built-in over-current protection circuit that prevents the destruction of the IC due to output short circuits
5) Built-in thermal shutdown circuit for protecting the IC from thermal damage due to overloading
6) Built-in over- voltage protection circuit that prevents the destruction of the IC due to power supply surges
7) TO220FP andHRP5 packaging (BA00DD0), and TO220FP and TO252 packaging (BA00CC0)
●Applications
Usable in DSP power supplies for DVDs and CDs, FPDs, televisions, personal computers or any other consumer device
Operating Temperature Range Topr -40 ~ +125 ℃
Ambient Storage Temperature Tstg -55 ~ +150 ℃
Junction Temperature Tjmax +150 ℃
Output Control Terminal Voltage VCTL-0.3 ~ +Vcc V
Voltage Applied to the Tip*3 Vcc peak +50 V
*1 Must not exceed Pd
*2 HRP5 : In cases in which Ta≥25℃ when a 70mm×70mm×1.6mm glass epoxy board is used, the power is reduced by 18.4 mW/℃. TO252-5 : In cases in which Ta≥25℃ when a 70mm×70mm×1.6mm glass epoxy board is used, the power is reduced by 10.4 mW/℃. TO252FP-5 : No heat sink. When Ta≥25℃, the power is reduced by 16 mW/℃. *3 Applied voltage: 200msec or less (tr≥1msec)
C-terminal Voltage Vc 1.2001.2251.250V Io=50mA
Circuit Current at the Time of Shutdown Isd - 0 10 µA VCTL=0V
Minimum I/O Voltage Difference ΔVd - 0.3 0.5 V Vcc= 0.95×Vo
Output Current Capacity Io 1.0 - - A
Input Stability Reg.I - 20 100 mV Vcc= 6V→25 V
Load Stability Reg.L- 50 150 mV Io=5mA→1A
Output Voltage Temperature Coefficient* TCVO-±0.02- %/℃Io=5mA ,Tj=0~125℃
*Design guarantee (100% shipping inspection not performed)
OUT=5V preset, VCTL=3V, Io=0mA, R1=15kΩ, and R2=44kΩ)
8
7
6
5
4
3
2
OUTPUT VOLTAGE:VOUT[V
1
0
0 2 4 6 8 10 12 14 16 18 20 22 24
SUPPLY VOLT AGE:VCC[V]
8
7
6
5
4
3
2
OUTPUT VOLTAGE:VOUT[V
1
0
0 2 4 6 8 10 12 14 16 18 20 22 24
SUPPLY VOLT AGE:VCC[V]
Fig.15 Input Stability Fig.13 Circuit Current Fig.14 Input Stability
(Io=2A)
800
700
600
500
400
300
200
DROPOUT VOLTAGE:VDRP[V]
100
0
0.5 1.0 1.5 2.0 1.0 2.0 3.0 4.0 4.8
OUTPUT CURRENT:IOUT[A ]
Fig.17 Input/Output Voltage Difference
Iout-ΔVd Characteristics(Vcc=4.75V)
200
180
160
140
120
100
80
60
CIRCUIT CURRENT:[mA]
40
20
0
0.5 1.0 1.5 2.0
OUTPUT CURRENT:IOUT[A]
60
55
50
45
40
35
30
25
20
15
RIPPLE REJECTION:R.R[dB
10
5
0
101000100000
100
FREQU ENC Y:f[Hz]
1k
10k
Fig.18 Ripple Rejection Characteristics
(Iout=100mA)
800
700
600
500
400
300
200
CONTROL CURRENT:ICTL[μA]
100
0
0 2 4 6 8 1012141618202224
CONTROL VOLTAGE:VCTL[V]
Fig.20 Circuit Current by load Level Fig.21 CTL Voltage vs. CTL Current
(I
4
8
4
7
6
3
3
5
4
2
2
3
2
1
OUTPUT VOLTAGE:VOUT[V
1
0
0510152025303540
SUPPLY VOLT AGE:Vcc[V]
Fig.11 Overvoltage Operating
Characteristics(Io=200mA)
4/9
OUT=0mA→2A)
8
6
4
2
OUTPUT VOLTAGE:VOUT[V
0
13014015016017018 0190
AMBIEN T TEMPER ATU RE:Ta[℃]
Fig.12 Thermal Shutdown
Circuit Characteristics
2011.03 - Rev.C
100k
1000k
BA00DD0WCP-V5,BA00DD0WHFP,BA00DD0WT,
cc
μ
)
cc
(
BA00CC0WT,BA00CC0WT-V5,BA00CC0WCP-V5,BA00CC0WFP
Technical Note
●Block Diagrams
[BA00CC0WFP]
[BA00DD0WHFP]
V
0.33μF
2
Vref
3
Driver
N.C.(TO252-5)
GND(HRP5)
TOP VIEW
FIN
1 2 3 4 5
TO252-5 HRP5
1 2 3 4 5
OVP
1 5
CTL
TSD
Fin
OCP
GND
Fig.25
PINNo. Symbol Function
1 CTL Output voltage ON/OFF control
2 VCC Power supply voltage input
3 N.C./GND Unconnected terminal/GND*
4 OUT Voltage output
5 C Output voltage regulation terminal
FIN
GND GND
*TO252-5 is N.C., and HRP5 is GND
C(ADJ)
R1
VOUT
4
+
22μF
R2
[BA00CC0WT] [BA00CC0CP-V5] [BA00DD0WCP-V5]
0.33
V
F
Vref
2
Driver
TOP VIEW
TOP VIEW
1 2 3 4 5 1 2 3 4 5
TO220FP-5 TO220FP-5(V5)
OVP
1 5
CTL
TSD
3
GND
OCP
C(ADJ
R1
R2
Fig.26
PINNo. Symbol Function
1 CTL Output voltage ON/OFF control
2 VCC Power supply voltage input
3 GND GND
4 OUT Voltage output
5 ADJ Output voltage regulation terminal
2 3 4 5
1
TO220CP-V5
●Input / Output Equivalent Circuit Diagrams
< BA00CC0WT/BA00CC0WFP >
CTL
25kΩ
25kΩ
10 kΩ
Vcc
VOUT
C
5.5 kΩ
10kΩ
Fig.27
Vcc
Vcc
VOUT
ADJ
500Ω
< BA00DD0WFP >
CTL
Vcc
39kΩ
Ω
2k
31kΩ
Fig.28
●Output Voltage Configuration Method
Please connect resistors R
1 and R2 (which determines the output voltage) as shown in Fig.29.
Please be aware that the offset due to the current that flows from the ADJ terminal becomes large when resistors with large
values are used. The use of resistors with R1=2kΩ to 15 kΩ is recommended.
Board size : 70×70×1.6 ㎜3 (board contains a thermal)
Board front copper foil area : 10.5×10.5 ㎜
9
①2-layer board (back surface copper foil area :15×15 ㎜
②2-layer board (back surface copper foil area :70×70 ㎜2)
8
③4-layer board (back surface copper foil area :70×70 ㎜2)
③7.3W
7
6
5
②5.5W
4
Power Dissipation:Pd(W
3
2
①2.3W
1
0
0255075100125150
Ambient temperature:Ta(℃)
2
2
)
25
(1) When using a maximum heat sick : θj-c=6.25(℃/W)
(2) When us ing an IC alone : θj-c=62.5(℃/W)
20
(1)20.0
15
10
Power Dissipation:Pd(W
5
(2)2.0
0
0255075100125150
Ambient temperature:Ta(℃)
2.0
Mounted on a Rohm standard board
Board size : 70×70×1.6 ㎜
Copper foil area :7×7 ㎜
TO252-5θja=96.2(℃/W)
1.6
1.30
1.2
0.8
Power Dissipation:Pd(W
0.4
0.0
0255 075100125150
Ambie nt te mpe rature :Ta(℃ )
Fig.30 Fig.31 Fig.32
When using at temperatures over Ta=25℃, please refer to the heat reducing characteristics shown in Fig.30 through 32.
The IC characteristics are closely related to the temperature at which the IC is used, so it is necessary to operate the IC at
temperatures less than the maximum junction temperature Tj
MAX.
Fig.31 shows the acceptable loss and heat reducing characteristics of the TO220FP package The portion shown by the
diagonal line is the acceptable loss range that can be used with the IC alone. Even when the ambient temperature Ta is a
normal temperature (25℃), the chip (junction) temperature Tj may be quite high so please operate the IC at temperatures
less than the acceptable loss Pd.
The calculation method for power consumption Pc(W) is as follows :
Pc = (Vcc-Vo)×Io+Vcc×Icca
Vcc:
Input voltage
Vo:
Output voltage
Io:
Load current
Icca:
Circuit current
Acceptable loss Pd≦Pc
Solving this for load current IO in order to operate within the acceptable loss,
Io≦
(Please refer to Figs.8 and 20 for Icca.)
It is then possible to find the maximum load current Io
Pd – Vcc×Icca
Vcc-Vo
MAX with respect to the applied voltage Vcc at the time of thermal design.
Calculation Example
Example 1) When Ta=85℃, Vcc=8.3V, Vo=3.3V, BA33DD0WT
Io≦ With the IC alone : θja=62.5℃/W → -16mW/℃
Io≦200mA (Icca : 2mA) 25℃=2000mW → 85℃=1040mW
1.04-8.3×Icca 5
Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating
temperature ranges. The power consumption Pc of the IC when there is a short circuit (short between Vo and GND) is :
Pc=Vcc×(Icca+Ishort) Ishort : Short circuit current
●Terminal Vicinity Settings and Cautions
・Vcc Terminal
Please attach a capacitor (greater than 0.33μF) between the Vcc and GND.
The capacitance values differ depending on the application, so please chose a capacitor with sufficient margin and verify
the operation on an actual board.
・CTL Terminal
The CTL terminal is turned ON at 2.0V and higher and OFF at 0.8V and lower within the operating power supply voltage range.
The power supply and the CTL terminal may be started up and shut down in any order without problems.
●Vo Terminal
Please attach an anti-oscillation capacitor between VOUT and GND. The capacitance of the capacitor may significantly
change due to factors such as temperature changes, which may cause oscillations. Please use a tantalum capacitor or
aluminum electrolytic capacitor with favorable characteristics and small external series resistance (ESR) even at low
temperatures. The output oscillates regardless of whether the ESR is large or small. Please use the IC within the stable
operating region while referring to the ESR characteristics reference data shown in Figs.33 through 35. In cases where there
are sudden load fluctuations, the a large capacitor is recommended.
EFFECTIVE SERIES RESISTANCE:ESR [Ω]
0.1
100
10
Unstable operating region
Stable operating region
1
Unstable operating region
100
1
10
OUTPUT CURRENT:lo(mA)
1000
OUTPUT CURRENT:lo(mA)
IC
OUT
22μF
C(ADJ)
100
10
1
0.1
0
EFFECTIVE SERIES RESISTANCE:ESR [Ω]
Fig.33:Output equivalent circuit Fig.34:Io vs. ESR characteristics Fig.35: Io vs. ESR characteristics
A built-in overcurrent protection circuit corresponding to the current capacity prevents the destruction of the IC when there
are load shorts. This protection circuit is a “7”-shaped current control circuit that is designed such that the current is
restricted and does not latch even when a large current momentarily flows through the system with a high-capacitance
capacitor. However, while this protection circuit is effective for the prevention of destruction due to unexpected accidents, it
is not suitable for continuous operation or transient use. Please be aware when creating thermal designs that the overcurrent
protection circuit has negative current capacity characteristics with regard to temperature (Refer to Figs.4 and 16).
Thermal Shutdown Circuit (Thermal Protection)
This system has a built-in temperature protection circuit for the purpose of protecting the IC from thermal damage. As
shown above, this must be used within the range of acceptable loss, but if the acceptable loss happens to be continuously
exceeded, the chip temperature Tj increases, causing the temperature protection circuit to operate.
When the thermal shutdown circuit operates, the operation of the circuit is suspended. The circuit resumes operation
immediately after the chip temperature Tj decreases, so the output repeats the ON and OFF states (Please refer to
Figs.12 and 24 for the temperatures at which the temperature protection circuit operates).
There are cases in which the IC is destroyed due to thermal runaway when it is left in the overloaded state. Be sure to
avoid leaving the IC in the overloaded state.
Reverse Current
In order to prevent the destruction of the IC when a reverse current flows through the IC, it is recommended that a diode
be placed between the Vcc and Vo and a pathway be created so that the current can escape (Refer to Fig.36).
2) This IC is bipolar IC that has a P-board (substrate) and P+ isolation layer
between each devise, as shown in Fig.37. A P-N junction is formed between
Reverse current
this P-layer and the N-layer of each device, and the P-N junction operates as a
parasitic diode when the electric potential relationship is GND> Terminal A,
GND> Terminal B, while it operates as a parasitic transistor when the electric
potential relationship is Terminal B GND> Terminal A. Parasitic devices are
Vcc
CTL
OUT
GND
intrinsic to the IC. The operation of parasitic devices induces mutual
interference between circuits, causing malfunctions and eventually the
destruction of the IC itself. It is necessary to be careful not to use the IC in ways
that would cause parasitic elements to operate. For example, applying a
voltage that is lower than the GND (P-board) to the input terminal.
NPN)
B
E
(Pin A)
Resistor
(Pin B)
(Pin B)
Transistor
O
P+
GND
N
P+
N
P
N
P+
P
Parasitic element
GND
N
ig. 37: Example of the basic structure of a bipolar IC
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