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R&S®TS-PIO4
Digital Functional Test Module
User Manual
(;ÜOê2)
1178319202
User Manual
Version 04
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This manual describes the following R&S®TSVP module:
●
R&S®TS-PIO4 (1525.5559.02)
© 2020 Rohde & Schwarz GmbH & Co. KG
Mühldorfstr. 15, 81671 München, Germany
Phone: +49 89 41 29 - 0
Fax: +49 89 41 29 12 164
Email: info@rohde-schwarz.com
Internet: www.rohde-schwarz.com
Subject to change – Data without tolerance limits is not binding.
R&S® is a registered trademark of Rohde & Schwarz GmbH & Co. KG.
Trade names are trademarks of the owners.
1178.3192.02 | Version 04 | R&S®TS-PIO4
The following abbreviations are used in this manual: R&S®TS‑PIO4 is abbreviated to R&S TS‑PIO4.
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Basic Safety Instructions
Symbol
Meaning
Symbol
Meaning
Notice, general danger location
Observe product documentation
ON/OFF Power
Caution when handling heavy equipment
Standby indication
Danger of electric shock
Direct current (DC)
Always read through and comply with the following safety instructions!
All plants and locations of the Rohde & Schwarz group of companies make every effort to keep the safety
standards of our products up to date and to offer our customers the highest possible degree of safety. Our
products and the auxiliary equipment they require are designed, built and tested in accordance with the
safety standards that apply in each case. Compliance with these standards is continuously monitored by
our quality assurance system. The product described here has been designed, built and tested in
accordance with the EC Certificate of Conformity and has left the manufacturer’s plant in a condition fully
complying with safety standards. To maintain this condition and to ensure safe operation, you must
observe all instructions and warnings provided in this manual. If you have any questions regarding these
safety instructions, the Rohde & Schwarz group of companies will be happy to answer them.
Furthermore, it is your responsibility to use the product in an appropriate manner. This product is designed
for use solely in industrial and laboratory environments or, if expressly permitted, also in the field and must
not be used in any way that may cause personal injury or property damage. You are responsible if the
product is used for any purpose other than its designated purpose or in disregard of the manufacturer's
instructions. The manufacturer shall assume no responsibility for such use of the product.
The product is used for its designated purpose if it is used in accordance with its product documentation
and within its performance limits (see data sheet, documentation, the following safety instructions). Using
the product requires technical skills and, in some cases, a basic knowledge of English. It is therefore
essential that only skilled and specialized staff or thoroughly trained personnel with the required skills be
allowed to use the product. If personal safety gear is required for using Rohde & Schwarz products, this
will be indicated at the appropriate place in the product documentation. Keep the basic safety instructions
and the product documentation in a safe place and pass them on to the subsequent users.
Observing the safety instructions will help prevent personal injury or damage of any kind caused by
dangerous situations. Therefore, carefully read through and adhere to the following safety instructions
before and when using the product. It is also absolutely essential to observe the additional safety
instructions on personal safety, for example, that appear in relevant parts of the product documentation. In
these safety instructions, the word "product" refers to all merchandise sold and distributed by the Rohde &
Schwarz group of companies, including instruments, systems and all accessories. For product-specific
information, see the data sheet and the product documentation.
Safety labels on products
The following safety labels are used on products to warn against risks and dangers.
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Basic Safety Instructions
Symbol
Meaning
Symbol
Meaning
Caution ! Hot surface
Alternating current (AC)
Protective conductor terminal
To identify any terminal which is intended for
connection to an external conductor for
protection against electric shock in case of a
fault, or the terminal of a protective earth
Direct/alternating current (DC/AC)
Earth (Ground)
Class II Equipment
to identify equipment meeting the safety
requirements specified for Class II equipment
(device protected by double or reinforced
insulation)
Frame or chassis Ground terminal
EU labeling for batteries and accumulators
For additional information, see section "Waste
disposal/Environmental protection", item 1.
Be careful when handling electrostatic sensitive
devices
EU labeling for separate collection of electrical
and electronic devices
For additional information, see section "Waste
disposal/Environmental protection", item 2.
Warning! Laser radiation
For additional information, see section
"Operation", item 7.
Indicates a hazardous situation which, if not avoided, will result in death or
serious injury.
Indicates a hazardous situation which, if not avoided, could result in death or
serious injury.
Indicates a hazardous situation which, if not avoided, could result in minor or
moderate injury.
Indicates information considered important, but not hazard-related, e.g.
messages relating to property damage.
In the product documentation, the word ATTENTION is used synonymously.
Signal words and their meaning
The following signal words are used in the product documentation in order to warn the reader about risks
and dangers.
These signal words are in accordance with the standard definition for civil applications in the European
Economic Area. Definitions that deviate from the standard definition may also exist in other economic
areas or military applications. It is therefore essential to make sure that the signal words described here
are always used only in connection with the related product documentation and the related product. The
use of signal words in connection with unrelated products or documentation can result in misinterpretation
and in personal injury or material damage.
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Basic Safety Instructions
Operating states and operating positions
The product may be operated only under the operating conditions and in the positions specified by the
manufacturer, without the product's ventilation being obstructed. If the manufacturer's specifications are
not observed, this can result in electric shock, fire and/or serious personal injury or death. Applicable local
or national safety regulations and rules for the prevention of accidents must be observed in all work
performed.
1. Unless otherwise specified, the following requirements apply to Rohde & Schwarz products:
predefined operating position is always with the housing floor facing down, IP protection 2X, use only
indoors, max. operating altitude 2000 m above sea level, max. transport altitude 4500 m above sea
level. A tolerance of ±10 % shall apply to the nominal voltage and ±5 % to the nominal frequency,
overvoltage category 2, pollution degree 2.
2. Do not place the product on surfaces, vehicles, cabinets or tables that for reasons of weight or stability
are unsuitable for this purpose. Always follow the manufacturer's installation instructions when
installing the product and fastening it to objects or structures (e.g. walls and shelves). An installation
that is not carried out as described in the product documentation could result in personal injury or
even death.
3. Do not place the product on heat-generating devices such as radiators or fan heaters. The ambient
temperature must not exceed the maximum temperature specified in the product documentation or in
the data sheet. Product overheating can cause electric shock, fire and/or serious personal injury or
even death.
Electrical safety
If the information on electrical safety is not observed either at all or to the extent necessary, electric shock,
fire and/or serious personal injury or death may occur.
1. Prior to switching on the product, always ensure that the nominal voltage setting on the product
matches the nominal voltage of the mains-supply network. If a different voltage is to be set, the power
fuse of the product may have to be changed accordingly.
2. In the case of products of safety class I with movable power cord and connector, operation is
permitted only on sockets with a protective conductor contact and protective conductor.
3. Intentionally breaking the protective conductor either in the feed line or in the product itself is not
permitted. Doing so can result in the danger of an electric shock from the product. If extension cords
or connector strips are implemented, they must be checked on a regular basis to ensure that they are
safe to use.
4. If there is no power switch for disconnecting the product from the mains, or if the power switch is not
suitable for this purpose, use the plug of the connecting cable to disconnect the product from the
mains. In such cases, always ensure that the power plug is easily reachable and accessible at all
times. For example, if the power plug is the disconnecting device, the length of the connecting cable
must not exceed 3 m. Functional or electronic switches are not suitable for providing disconnection
from the AC supply network. If products without power switches are integrated into racks or systems,
the disconnecting device must be provided at the system level.
5. Never use the product if the power cable is damaged. Check the power cables on a regular basis to
ensure that they are in proper operating condition. By taking appropriate safety measures and
carefully laying the power cable, ensure that the cable cannot be damaged and that no one can be
hurt by, for example, tripping over the cable or suffering an electric shock.
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Basic Safety Instructions
6. The product may be operated only from TN/TT supply networks fuse-protected with max. 16 A (higher
fuse only after consulting with the Rohde & Schwarz group of companies).
7. Do not insert the plug into sockets that are dusty or dirty. Insert the plug firmly and all the way into the
socket provided for this purpose. Otherwise, sparks that result in fire and/or injuries may occur.
8. Do not overload any sockets, extension cords or connector strips; doing so can cause fire or electric
shocks.
9. For measurements in circuits with voltages V
> 30 V, suitable measures (e.g. appropriate
rms
measuring equipment, fuse protection, current limiting, electrical separation, insulation) should be
taken to avoid any hazards.
10. Ensure that the connections with information technology equipment, e.g. PCs or other industrial
computers, comply with the IEC 60950-1 / EN 60950-1 or IEC 61010-1 / EN 61010-1 standards that
apply in each case.
11. Unless expressly permitted, never remove the cover or any part of the housing while the product is in
operation. Doing so will expose circuits and components and can lead to injuries, fire or damage to the
product.
12. If a product is to be permanently installed, the connection between the protective conductor terminal
on site and the product's protective conductor must be made first before any other connection is
made. The product may be installed and connected only by a licensed electrician.
13. For permanently installed equipment without built-in fuses, circuit breakers or similar protective
devices, the supply circuit must be fuse-protected in such a way that anyone who has access to the
product, as well as the product itself, is adequately protected from injury or damage.
14. Use suitable overvoltage protection to ensure that no overvoltage (such as that caused by a bolt of
lightning) can reach the product. Otherwise, the person operating the product will be exposed to the
danger of an electric shock.
15. Any object that is not designed to be placed in the openings of the housing must not be used for this
purpose. Doing so can cause short circuits inside the product and/or electric shocks, fire or injuries.
16. Unless specified otherwise, products are not liquid-proof (see also section "Operating states and
operating positions", item 1). Therefore, the equipment must be protected against penetration by
liquids. If the necessary precautions are not taken, the user may suffer electric shock or the product
itself may be damaged, which can also lead to personal injury.
17. Never use the product under conditions in which condensation has formed or can form in or on the
product, e.g. if the product has been moved from a cold to a warm environment. Penetration by water
increases the risk of electric shock.
18. Prior to cleaning the product, disconnect it completely from the power supply (e.g. AC supply network
or battery). Use a soft, non-linting cloth to clean the product. Never use chemical cleaning agents such
as alcohol, acetone or diluents for cellulose lacquers.
Operation
1. Operating the products requires special training and intense concentration. Make sure that persons
who use the products are physically, mentally and emotionally fit enough to do so; otherwise, injuries
or material damage may occur. It is the responsibility of the employer/operator to select suitable
personnel for operating the products.
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Basic Safety Instructions
2. Before you move or transport the product, read and observe the section titled "Transport".
3. As with all industrially manufactured goods, the use of substances that induce an allergic reaction
(allergens) such as nickel cannot be generally excluded. If you develop an allergic reaction (such as a
skin rash, frequent sneezing, red eyes or respiratory difficulties) when using a Rohde & Schwarz
product, consult a physician immediately to determine the cause and to prevent health problems or
stress.
4. Before you start processing the product mechanically and/or thermally, or before you take it apart, be
sure to read and pay special attention to the section titled "Waste disposal/Environmental protection",
item 1.
5. Depending on the function, certain products such as RF radio equipment can produce an elevated
level of electromagnetic radiation. Considering that unborn babies require increased protection,
pregnant women must be protected by appropriate measures. Persons with pacemakers may also be
exposed to risks from electromagnetic radiation. The employer/operator must evaluate workplaces
where there is a special risk of exposure to radiation and, if necessary, take measures to avert the
potential danger.
6. Should a fire occur, the product may release hazardous substances (gases, fluids, etc.) that can
cause health problems. Therefore, suitable measures must be taken, e.g. protective masks and
protective clothing must be worn.
7. Laser products are given warning labels that are standardized according to their laser class. Lasers
can cause biological harm due to the properties of their radiation and due to their extremely
concentrated electromagnetic power. If a laser product (e.g. a CD/DVD drive) is integrated into a
Rohde & Schwarz product, absolutely no other settings or functions may be used as described in the
product documentation. The objective is to prevent personal injury (e.g. due to laser beams).
8. EMC classes (in line with EN 55011/CISPR 11, and analogously with EN 55022/CISPR 22,
EN 55032/CISPR 32)
Class A equipment:
Equipment suitable for use in all environments except residential environments and environments
that are directly connected to a low-voltage supply network that supplies residential buildings
Note: Class A equipment is intended for use in an industrial environment. This equipment may
cause radio disturbances in residential environments, due to possible conducted as well as
radiated disturbances. In this case, the operator may be required to take appropriate measures to
eliminate these disturbances.
Class B equipment:
Equipment suitable for use in residential environments and environments that are directly
connected to a low-voltage supply network that supplies residential buildings
Repair and service
1. The product may be opened only by authorized, specially trained personnel. Before any work is
performed on the product or before the product is opened, it must be disconnected from the AC supply
network. Otherwise, personnel will be exposed to the risk of an electric shock.
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Basic Safety Instructions
2. Adjustments, replacement of parts, maintenance and repair may be performed only by electrical
experts authorized by Rohde & Schwarz. Only original parts may be used for replacing parts relevant
to safety (e.g. power switches, power transformers, fuses). A safety test must always be performed
after parts relevant to safety have been replaced (visual inspection, protective conductor test,
insulation resistance measurement, leakage current measurement, functional test). This helps ensure
the continued safety of the product.
Batteries and rechargeable batteries/cells
If the information regarding batteries and rechargeable batteries/cells is not observed either at all or to the
extent necessary, product users may be exposed to the risk of explosions, fire and/or serious personal
injury, and, in some cases, death. Batteries and rechargeable batteries with alkaline electrolytes (e.g.
lithium cells) must be handled in accordance with the EN 62133 standard.
1. Cells must not be taken apart or crushed.
2. Cells or batteries must not be exposed to heat or fire. Storage in direct sunlight must be avoided.
Keep cells and batteries clean and dry. Clean soiled connectors using a dry, clean cloth.
3. Cells or batteries must not be short-circuited. Cells or batteries must not be stored in a box or in a
drawer where they can short-circuit each other, or where they can be short-circuited by other
conductive materials. Cells and batteries must not be removed from their original packaging until they
are ready to be used.
4. Cells and batteries must not be exposed to any mechanical shocks that are stronger than permitted.
5. If a cell develops a leak, the fluid must not be allowed to come into contact with the skin or eyes. If
contact occurs, wash the affected area with plenty of water and seek medical aid.
6. Improperly replacing or charging cells or batteries that contain alkaline electrolytes (e.g. lithium cells)
can cause explosions. Replace cells or batteries only with the matching Rohde & Schwarz type (see
parts list) in order to ensure the safety of the product.
7. Cells and batteries must be recycled and kept separate from residual waste. Rechargeable batteries
and normal batteries that contain lead, mercury or cadmium are hazardous waste. Observe the
national regulations regarding waste disposal and recycling.
8. Follow the transport stipulations of the carrier (IATA-DGR, IMDG-Code, ADR, RID) when returning
lithium batteries to Rohde & Schwarz subsidiaries.
Transport
1. The product may be very heavy. Therefore, the product must be handled with care. In some cases,
the user may require a suitable means of lifting or moving the product (e.g. with a lift-truck) to avoid
back or other physical injuries.
2. Handles on the products are designed exclusively to enable personnel to transport the product. It is
therefore not permissible to use handles to fasten the product to or on transport equipment such as
cranes, fork lifts, wagons, etc. The user is responsible for securely fastening the products to or on the
means of transport or lifting. Observe the safety regulations of the manufacturer of the means of
transport or lifting. Noncompliance can result in personal injury or material damage.
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Instrucciones de seguridad elementales
3. If you use the product in a vehicle, it is the sole responsibility of the driver to drive the vehicle safely
and properly. The manufacturer assumes no responsibility for accidents or collisions. Never use the
product in a moving vehicle if doing so could distract the driver of the vehicle. Adequately secure the
product in the vehicle to prevent injuries or other damage in the event of an accident.
Waste disposal/Environmental protection
1. Specially marked equipment has a battery or accumulator that must not be disposed of with unsorted
municipal waste, but must be collected separately. It may only be disposed of at a suitable collection
point or via a Rohde & Schwarz customer service center.
2. Waste electrical and electronic equipment must not be disposed of with unsorted municipal waste, but
must be collected separately.
Rohde & Schwarz GmbH & Co. KG has developed a disposal concept and takes full responsibility for
take-back obligations and disposal obligations for manufacturers within the EU. Contact your
Rohde & Schwarz customer service center for environmentally responsible disposal of the product.
3. If products or their components are mechanically and/or thermally processed in a manner that goes
beyond their intended use, hazardous substances (heavy-metal dust such as lead, beryllium, nickel)
may be released. For this reason, the product may only be disassembled by specially trained
personnel. Improper disassembly may be hazardous to your health. National waste disposal
regulations must be observed.
4. If handling the product releases hazardous substances or fuels that must be disposed of in a special
way, e.g. coolants or engine oils that must be replenished regularly, the safety instructions of the
manufacturer of the hazardous substances or fuels and the applicable regional waste disposal
regulations must be observed. Also observe the relevant safety instructions in the product
documentation. The improper disposal of hazardous substances or fuels can cause health problems
and lead to environmental damage.
For additional information about environmental protection, visit the Rohde & Schwarz website.
Instrucciones de seguridad elementales
¡Es imprescindible leer y cumplir las siguientes instrucciones e informaciones de seguridad!
El principio del grupo de empresas Rohde & Schwarz consiste en tener nuestros productos siempre al día
con los estándares de seguridad y de ofrecer a nuestros clientes el máximo grado de seguridad. Nuestros
productos y todos los equipos adicionales son siempre fabricados y examinados según las normas de
seguridad vigentes. Nuestro sistema de garantía de calidad controla constantemente que sean cumplidas
estas normas. El presente producto ha sido fabricado y examinado según el certificado de conformidad
de la UE y ha salido de nuestra planta en estado impecable según los estándares técnicos de seguridad.
Para poder preservar este estado y garantizar un funcionamiento libre de peligros, el usuario deberá
atenerse a todas las indicaciones, informaciones de seguridad y notas de alerta. El grupo de empresas
Rohde & Schwarz está siempre a su disposición en caso de que tengan preguntas referentes a estas
informaciones de seguridad.
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Instrucciones de seguridad elementales
Símbolo
Significado
Símbolo
Significado
Aviso: punto de peligro general
Observar la documentación del producto
Tensión de alimentación de PUESTA EN
MARCHA / PARADA
Atención en el manejo de dispositivos de peso
elevado
Indicación de estado de espera (standby)
Peligro de choque eléctrico
Corriente continua (DC)
Advertencia: superficie caliente
Corriente alterna (AC)
Conexión a conductor de protección
Corriente continua / Corriente alterna (DC/AC)
Además queda en la responsabilidad del usuario utilizar el producto en la forma debida. Este producto
está destinado exclusivamente al uso en la industria y el laboratorio o, si ha sido expresamente
autorizado, para aplicaciones de campo y de ninguna manera deberá ser utilizado de modo que alguna
persona/cosa pueda sufrir daño. El uso del producto fuera de sus fines definidos o sin tener en cuenta las
instrucciones del fabricante queda en la responsabilidad del usuario. El fabricante no se hace en ninguna
forma responsable de consecuencias a causa del mal uso del producto.
Se parte del uso correcto del producto para los fines definidos si el producto es utilizado conforme a las
indicaciones de la correspondiente documentación del producto y dentro del margen de rendimiento
definido (ver hoja de datos, documentación, informaciones de seguridad que siguen). El uso del producto
hace necesarios conocimientos técnicos y ciertos conocimientos del idioma inglés. Por eso se debe tener
en cuenta que el producto solo pueda ser operado por personal especializado o personas instruidas en
profundidad con las capacidades correspondientes. Si fuera necesaria indumentaria de seguridad para el
uso de productos de Rohde & Schwarz, encontraría la información debida en la documentación del
producto en el capítulo correspondiente. Guarde bien las informaciones de seguridad elementales, así
como la documentación del producto, y entréguelas a usuarios posteriores.
Tener en cuenta las informaciones de seguridad sirve para evitar en lo posible lesiones o daños por
peligros de toda clase. Por eso es imprescindible leer detalladamente y comprender por completo las
siguientes informaciones de seguridad antes de usar el producto, y respetarlas durante el uso del
producto. Deberán tenerse en cuenta todas las demás informaciones de seguridad, como p. ej. las
referentes a la protección de personas, que encontrarán en el capítulo correspondiente de la
documentación del producto y que también son de obligado cumplimiento. En las presentes
informaciones de seguridad se recogen todos los objetos que distribuye el grupo de empresas
Rohde & Schwarz bajo la denominación de "producto", entre ellos también aparatos, instalaciones así
como toda clase de accesorios. Los datos específicos del producto figuran en la hoja de datos y en la
documentación del producto.
Señalización de seguridad de los productos
Las siguientes señales de seguridad se utilizan en los productos para advertir sobre riesgos y peligros.
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Instrucciones de seguridad elementales
Símbolo
Significado
Símbolo
Significado
Conexión a tierra
El aparato está protegido en su totalidad por un
aislamiento doble (reforzado)
Conexión a masa
Distintivo de la UE para baterías y
acumuladores
Más información en la sección
"Eliminación/protección del medio ambiente",
punto 1.
Aviso: Cuidado en el manejo de dispositivos
sensibles a la electrostática (ESD)
Distintivo de la UE para la eliminación por
separado de dispositivos eléctricos y
electrónicos
Más información en la sección
"Eliminación/protección del medio ambiente",
punto 2.
Advertencia: rayo láser
Más información en la sección
"Funcionamiento", punto 7.
Indica una situación de peligro que, si no se evita, causa lesiones
graves o incluso la muerte.
Indica una situación de peligro que, si no se evita, puede causar
lesiones graves o incluso la muerte.
Indica una situación de peligro que, si no se evita, puede causar
lesiones leves o moderadas.
Indica información que se considera importante, pero no en relación
con situaciones de peligro; p. ej., avisos sobre posibles daños
materiales.
En la documentación del producto se emplea de forma sinónima el
término CUIDADO.
Palabras de señal y su significado
En la documentación del producto se utilizan las siguientes palabras de señal con el fin de advertir contra
riesgos y peligros.
Las palabras de señal corresponden a la definición habitual para aplicaciones civiles en el área
económica europea. Pueden existir definiciones diferentes a esta definición en otras áreas económicas o
en aplicaciones militares. Por eso se deberá tener en cuenta que las palabras de señal aquí descritas
sean utilizadas siempre solamente en combinación con la correspondiente documentación del producto y
solamente en combinación con el producto correspondiente. La utilización de las palabras de señal en
combinación con productos o documentaciones que no les correspondan puede llevar a interpretaciones
equivocadas y tener por consecuencia daños en personas u objetos.
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Instrucciones de seguridad elementales
Estados operativos y posiciones de funcionamiento
El producto solamente debe ser utilizado según lo indicado por el fabricante respecto a los estados
operativos y posiciones de funcionamiento sin que se obstruya la ventilación. Si no se siguen las
indicaciones del fabricante, pueden producirse choques eléctricos, incendios y/o lesiones graves con
posible consecuencia de muerte. En todos los trabajos deberán ser tenidas en cuenta las normas
nacionales y locales de seguridad del trabajo y de prevención de accidentes.
1. Si no se convino de otra manera, es para los productos Rohde & Schwarz válido lo que sigue:
como posición de funcionamiento se define por principio la posición con el suelo de la caja para
abajo, modo de protección IP 2X, uso solamente en estancias interiores, utilización hasta 2000 m
sobre el nivel del mar, transporte hasta 4500 m sobre el nivel del mar. Se aplicará una tolerancia de
±10 % sobre el voltaje nominal y de ±5 % sobre la frecuencia nominal. Categoría de sobrecarga
eléctrica 2, índice de suciedad 2.
2. No sitúe el producto encima de superficies, vehículos, estantes o mesas, que por sus características
de peso o de estabilidad no sean aptos para él. Siga siempre las instrucciones de instalación del
fabricante cuando instale y asegure el producto en objetos o estructuras (p. ej. paredes y estantes). Si
se realiza la instalación de modo distinto al indicado en la documentación del producto, se pueden
causar lesiones o, en determinadas circunstancias, incluso la muerte.
3. No ponga el producto sobre aparatos que generen calor (p. ej. radiadores o calefactores). La
temperatura ambiente no debe superar la temperatura máxima especificada en la documentación del
producto o en la hoja de datos. En caso de sobrecalentamiento del producto, pueden producirse
choques eléctricos, incendios y/o lesiones graves con posible consecuencia de muerte.
Seguridad eléctrica
Si no se siguen (o se siguen de modo insuficiente) las indicaciones del fabricante en cuanto a seguridad
eléctrica, pueden producirse choques eléctricos, incendios y/o lesiones graves con posible consecuencia
de muerte.
1. Antes de la puesta en marcha del producto se deberá comprobar siempre que la tensión
preseleccionada en el producto coincida con la de la red de alimentación eléctrica. Si es necesario
modificar el ajuste de tensión, también se deberán cambiar en caso dado los fusibles
correspondientes del producto.
2. Los productos de la clase de protección I con alimentación móvil y enchufe individual solamente
podrán enchufarse a tomas de corriente con contacto de seguridad y con conductor de protección
conectado.
3. Queda prohibida la interrupción intencionada del conductor de protección, tanto en la toma de
corriente como en el mismo producto. La interrupción puede tener como consecuencia el riesgo de
que el producto sea fuente de choques eléctricos. Si se utilizan cables alargadores o regletas de
enchufe, deberá garantizarse la realización de un examen regular de los mismos en cuanto a su
estado técnico de seguridad.
4. Si el producto no está equipado con un interruptor para desconectarlo de la red, o bien si el
interruptor existente no resulta apropiado para la desconexión de la red, el enchufe del cable de
conexión se deberá considerar como un dispositivo de desconexión.
El dispositivo de desconexión se debe poder alcanzar fácilmente y debe estar siempre bien accesible.
Si, p. ej., el enchufe de conexión a la red es el dispositivo de desconexión, la longitud del cable de
conexión no debe superar 3 m).
Los interruptores selectores o electrónicos no son aptos para el corte de la red eléctrica. Si se
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Instrucciones de seguridad elementales
integran productos sin interruptor en bastidores o instalaciones, se deberá colocar el interruptor en el
nivel de la instalación.
5. No utilice nunca el producto si está dañado el cable de conexión a red. Compruebe regularmente el
correcto estado de los cables de conexión a red. Asegúrese, mediante las medidas de protección y
de instalación adecuadas, de que el cable de conexión a red no pueda ser dañado o de que nadie
pueda ser dañado por él, p. ej. al tropezar o por un choque eléctrico.
6. Solamente está permitido el funcionamiento en redes de alimentación TN/TT aseguradas con fusibles
de 16 A como máximo (utilización de fusibles de mayor amperaje solo previa consulta con el grupo de
empresas Rohde & Schwarz).
7. Nunca conecte el enchufe en tomas de corriente sucias o llenas de polvo. Introduzca el enchufe por
completo y fuertemente en la toma de corriente. La no observación de estas medidas puede provocar
chispas, fuego y/o lesiones.
8. No sobrecargue las tomas de corriente, los cables alargadores o las regletas de enchufe ya que esto
podría causar fuego o choques eléctricos.
9. En las mediciones en circuitos de corriente con una tensión U
> 30 V se deberán tomar las medidas
eff
apropiadas para impedir cualquier peligro (p. ej. medios de medición adecuados, seguros, limitación
de tensión, corte protector, aislamiento etc.).
10. Para la conexión con dispositivos informáticos como un PC o un ordenador industrial, debe
comprobarse que éstos cumplan los estándares IEC60950-1/EN60950-1 o IEC61010-1/EN 61010-1
válidos en cada caso.
11. A menos que esté permitido expresamente, no retire nunca la tapa ni componentes de la carcasa
mientras el producto esté en servicio. Esto pone a descubierto los cables y componentes eléctricos y
puede causar lesiones, fuego o daños en el producto.
12. Si un producto se instala en un lugar fijo, se deberá primero conectar el conductor de protección fijo
con el conductor de protección del producto antes de hacer cualquier otra conexión. La instalación y
la conexión deberán ser efectuadas por un electricista especializado.
13. En el caso de dispositivos fijos que no estén provistos de fusibles, interruptor automático ni otros
mecanismos de seguridad similares, el circuito de alimentación debe estar protegido de modo que
todas las personas que puedan acceder al producto, así como el producto mismo, estén a salvo de
posibles daños.
14. Todo producto debe estar protegido contra sobretensión (debida p. ej. a una caída del rayo) mediante
los correspondientes sistemas de protección. Si no, el personal que lo utilice quedará expuesto al
peligro de choque eléctrico.
15. No debe introducirse en los orificios de la caja del aparato ningún objeto que no esté destinado a ello.
Esto puede producir cortocircuitos en el producto y/o puede causar choques eléctricos, fuego o
lesiones.
16. Salvo indicación contraria, los productos no están impermeabilizados (ver también el capítulo
"Estados operativos y posiciones de funcionamiento", punto 1). Por eso es necesario tomar las
medidas necesarias para evitar la entrada de líquidos. En caso contrario, existe peligro de choque
eléctrico para el usuario o de daños en el producto, que también pueden redundar en peligro para las
personas.
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Instrucciones de seguridad elementales
17. No utilice el producto en condiciones en las que pueda producirse o ya se hayan producido
condensaciones sobre el producto o en el interior de éste, como p. ej. al desplazarlo de un lugar frío a
otro caliente. La entrada de agua aumenta el riesgo de choque eléctrico.
18. Antes de la limpieza, desconecte por completo el producto de la alimentación de tensión (p. ej. red de
alimentación o batería). Realice la limpieza de los aparatos con un paño suave, que no se deshilache.
No utilice bajo ningún concepto productos de limpieza químicos como alcohol, acetona o diluyentes
para lacas nitrocelulósicas.
Funcionamiento
1. El uso del producto requiere instrucciones especiales y una alta concentración durante el manejo.
Debe asegurarse que las personas que manejen el producto estén a la altura de los requerimientos
necesarios en cuanto a aptitudes físicas, psíquicas y emocionales, ya que de otra manera no se
pueden excluir lesiones o daños de objetos. El empresario u operador es responsable de seleccionar
el personal usuario apto para el manejo del producto.
2. Antes de desplazar o transportar el producto, lea y tenga en cuenta el capítulo "Transporte".
3. Como con todo producto de fabricación industrial no puede quedar excluida en general la posibilidad
de que se produzcan alergias provocadas por algunos materiales empleados ―los llamados
alérgenos (p. ej. el níquel)―. Si durante el manejo de productos Rohde & Schwarz se producen
reacciones alérgicas, como p. ej. irritaciones cutáneas, estornudos continuos, enrojecimiento de la
conjuntiva o dificultades respiratorias, debe avisarse inmediatamente a un médico para investigar las
causas y evitar cualquier molestia o daño a la salud.
4. Antes de la manipulación mecánica y/o térmica o el desmontaje del producto, debe tenerse en cuenta
imprescindiblemente el capítulo "Eliminación/protección del medio ambiente", punto 1.
5. Ciertos productos, como p. ej. las instalaciones de radiocomunicación RF, pueden a causa de su
función natural, emitir una radiación electromagnética aumentada. Deben tomarse todas las medidas
necesarias para la protección de las mujeres embarazadas. También las personas con marcapasos
pueden correr peligro a causa de la radiación electromagnética. El empresario/operador tiene la
obligación de evaluar y señalizar las áreas de trabajo en las que exista un riesgo elevado de
exposición a radiaciones.
6. Tenga en cuenta que en caso de incendio pueden desprenderse del producto sustancias tóxicas
(gases, líquidos etc.) que pueden generar daños a la salud. Por eso, en caso de incendio deben
usarse medidas adecuadas, como p. ej. máscaras antigás e indumentaria de protección.
7. Los productos con láser están provistos de indicaciones de advertencia normalizadas en función de la
clase de láser del que se trate. Los rayos láser pueden provocar daños de tipo biológico a causa de
las propiedades de su radiación y debido a su concentración extrema de potencia electromagnética.
En caso de que un producto Rohde & Schwarz contenga un producto láser (p. ej. un lector de
CD/DVD), no debe usarse ninguna otra configuración o función aparte de las descritas en la
documentación del producto, a fin de evitar lesiones (p. ej. debidas a irradiación láser).
8. Clases de compatibilidad electromagnética (conforme a EN 55011 / CISPR 11; y en analogía con EN
55022 / CISPR 22, EN 55032 / CISPR 32)
Aparato de clase A:
Aparato adecuado para su uso en todos los entornos excepto en los residenciales y en aquellos
conectados directamente a una red de distribución de baja tensión que suministra corriente a
edificios residenciales.
Nota: Los aparatos de clase A están destinados al uso en entornos industriales. Estos aparatos
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Instrucciones de seguridad elementales
pueden causar perturbaciones radioeléctricas en entornos residenciales debido a posibles
perturbaciones guiadas o radiadas. En este caso, se le podrá solicitar al operador que tome las
medidas adecuadas para eliminar estas perturbaciones.
Aparato de clase B:
Aparato adecuado para su uso en entornos residenciales, así como en aquellos conectados
directamente a una red de distribución de baja tensión que suministra corriente a edificios
residenciales.
Reparación y mantenimiento
1. El producto solamente debe ser abierto por personal especializado con autorización para ello. Antes
de manipular el producto o abrirlo, es obligatorio desconectarlo de la tensión de alimentación, para
evitar toda posibilidad de choque eléctrico.
2. El ajuste, el cambio de partes, el mantenimiento y la reparación deberán ser efectuadas solamente
por electricistas autorizados por Rohde & Schwarz. Si se reponen partes con importancia para los
aspectos de seguridad (p. ej. el enchufe, los transformadores o los fusibles), solamente podrán ser
sustituidos por partes originales. Después de cada cambio de partes relevantes para la seguridad
deberá realizarse un control de seguridad (control a primera vista, control del conductor de
protección, medición de resistencia de aislamiento, medición de la corriente de fuga, control de
funcionamiento). Con esto queda garantizada la seguridad del producto.
Baterías y acumuladores o celdas
Si no se siguen (o se siguen de modo insuficiente) las indicaciones en cuanto a las baterías y
acumuladores o celdas, pueden producirse explosiones, incendios y/o lesiones graves con posible
consecuencia de muerte. El manejo de baterías y acumuladores con electrolitos alcalinos (p. ej. celdas de
litio) debe seguir el estándar EN 62133.
1. No deben desmontarse, abrirse ni triturarse las celdas.
2. Las celdas o baterías no deben someterse a calor ni fuego. Debe evitarse el almacenamiento a la luz
directa del sol. Las celdas y baterías deben mantenerse limpias y secas. Limpiar las conexiones
sucias con un paño seco y limpio.
3. Las celdas o baterías no deben cortocircuitarse. Es peligroso almacenar las celdas o baterías en
estuches o cajones en cuyo interior puedan cortocircuitarse por contacto recíproco o por contacto con
otros materiales conductores. No deben extraerse las celdas o baterías de sus embalajes originales
hasta el momento en que vayan a utilizarse.
4. Las celdas o baterías no deben someterse a impactos mecánicos fuertes indebidos.
5. En caso de falta de estanqueidad de una celda, el líquido vertido no debe entrar en contacto con la
piel ni los ojos. Si se produce contacto, lavar con agua abundante la zona afectada y avisar a un
médico.
6. En caso de cambio o recarga inadecuados, las celdas o baterías que contienen electrolitos alcalinos
(p. ej. las celdas de litio) pueden explotar. Para garantizar la seguridad del producto, las celdas o
baterías solo deben ser sustituidas por el tipo Rohde & Schwarz correspondiente (ver lista de
recambios).
7. Las baterías y celdas deben reciclarse y no deben tirarse a la basura doméstica. Las baterías o
acumuladores que contienen plomo, mercurio o cadmio deben tratarse como residuos especiales.
Respete en esta relación las normas nacionales de eliminación y reciclaje.
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Instrucciones de seguridad elementales
8. En caso de devolver baterías de litio a las filiales de Rohde & Schwarz, debe cumplirse las
normativas sobre los modos de transporte (IATA-DGR, código IMDG, ADR, RID).
Transporte
1. El producto puede tener un peso elevado. Por eso es necesario desplazarlo o transportarlo con
precaución y, si es necesario, usando un sistema de elevación adecuado (p. ej. una carretilla
elevadora), a fin de evitar lesiones en la espalda u otros daños personales.
2. Las asas instaladas en los productos sirven solamente de ayuda para el transporte del producto por
personas. Por eso no está permitido utilizar las asas para la sujeción en o sobre medios de transporte
como p. ej. grúas, carretillas elevadoras de horquilla, carros etc. Es responsabilidad suya fijar los
productos de manera segura a los medios de transporte o elevación. Para evitar daños personales o
daños en el producto, siga las instrucciones de seguridad del fabricante del medio de transporte o
elevación utilizado.
3. Si se utiliza el producto dentro de un vehículo, recae de manera exclusiva en el conductor la
responsabilidad de conducir el vehículo de manera segura y adecuada. El fabricante no asumirá
ninguna responsabilidad por accidentes o colisiones. No utilice nunca el producto dentro de un
vehículo en movimiento si esto pudiera distraer al conductor. Asegure el producto dentro del vehículo
debidamente para evitar, en caso de un accidente, lesiones u otra clase de daños.
Eliminación/protección del medio ambiente
1. Los dispositivos marcados contienen una batería o un acumulador que no se debe desechar con los
residuos domésticos sin clasificar, sino que debe ser recogido por separado. La eliminación se debe
efectuar exclusivamente a través de un punto de recogida apropiado o del servicio de atención al
cliente de Rohde & Schwarz.
2. Los dispositivos eléctricos usados no se deben desechar con los residuos domésticos sin clasificar,
sino que deben ser recogidos por separado.
Rohde & Schwarz GmbH & Co.KG ha elaborado un concepto de eliminación de residuos y asume
plenamente los deberes de recogida y eliminación para los fabricantes dentro de la UE. Para
desechar el producto de manera respetuosa con el medio ambiente, diríjase a su servicio de atención
al cliente de Rohde & Schwarz.
3. Si se trabaja de manera mecánica y/o térmica cualquier producto o componente más allá del
funcionamiento previsto, pueden liberarse sustancias peligrosas (polvos con contenido de metales
pesados como p. ej. plomo, berilio o níquel). Por eso el producto solo debe ser desmontado por
personal especializado con formación adecuada. Un desmontaje inadecuado puede ocasionar daños
para la salud. Se deben tener en cuenta las directivas nacionales referentes a la eliminación de
residuos.
4. En caso de que durante el trato del producto se formen sustancias peligrosas o combustibles que
deban tratarse como residuos especiales (p. ej. refrigerantes o aceites de motor con intervalos de
cambio definidos), deben tenerse en cuenta las indicaciones de seguridad del fabricante de dichas
sustancias y las normas regionales de eliminación de residuos. Tenga en cuenta también en caso
necesario las indicaciones de seguridad especiales contenidas en la documentación del producto. La
eliminación incorrecta de sustancias peligrosas o combustibles puede causar daños a la salud o
daños al medio ambiente.
Se puede encontrar más información sobre la protección del medio ambiente en la página web de
Rohde & Schwarz.
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R&S®TS-PIO4
1.1 General...........................................................................................................................7
1.2 Features......................................................................................................................... 7
1.3 Possible Applications...................................................................................................8
1.3.1 Digital Functional Test – Static........................................................................................ 8
1.3.2 Digital Functional Test – Dynamic................................................................................... 9
4.1 Mechanical Design......................................................................................................16
Contents
Contents
1 Applications............................................................................................7
2 View.......................................................................................................10
3 Block Diagrams.................................................................................... 11
4 Design................................................................................................... 16
4.2 Interfaces..................................................................................................................... 16
4.3 Display Elements........................................................................................................ 17
5 Functional Description........................................................................ 18
5.1 Overview...................................................................................................................... 18
5.1.1 General......................................................................................................................... 18
5.1.2 Ports..............................................................................................................................19
5.1.3 Memories...................................................................................................................... 19
5.1.3.1 Memory Management in Driver.....................................................................................19
5.1.3.2 Stimulus Memory.......................................................................................................... 20
5.1.3.3 Response Memory........................................................................................................ 21
5.1.4 Static Digital Test...........................................................................................................21
5.1.5 Dynamic Digital Test......................................................................................................21
5.2 Programming of Digital Tests.................................................................................... 22
5.2.1 Digital Tests with Device Driver Functions.................................................................... 23
5.2.1.1 Initialization................................................................................................................... 23
5.2.1.2 Auxiliary Functions........................................................................................................ 23
5.2.1.3 Error Queries.................................................................................................................23
5.2.1.4 Functions of IVI Switch Component.............................................................................. 23
5.2.1.5 Digital Test with Low‑Level Driver Functions.................................................................23
5.2.1.6 Digital Test Compliant with IVI Digital............................................................................24
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5.2.2 Digital Test with DIO Manager.......................................................................................26
5.2.2.1 File Format.................................................................................................................... 26
5.2.2.2 Configuration of DIO Manager...................................................................................... 28
5.2.2.3 Structure of a Test Program.......................................................................................... 29
5.2.2.4 Ports..............................................................................................................................29
5.2.2.5 Loading of Waveform File............................................................................................. 30
5.2.2.6 Execution of Pattern Set............................................................................................... 31
5.3 Configuration of Digital Channels............................................................................. 31
5.3.1 Setting of Voltage Range.............................................................................................. 31
5.3.2 Configuration of Stimulus Channels..............................................................................31
5.3.3 Configuration of Input Channels....................................................................................32
5.3.4 Time Settings for Data Output.......................................................................................33
5.3.5 Time Settings for Data Recording................................................................................. 33
Contents
5.3.6 Configuration of Data Width in Dynamic Mode............................................................. 33
5.3.7 Power Consumption......................................................................................................35
5.3.7.1 Estimation of Power Consumption................................................................................ 35
5.3.7.2 Safety Mechanism.........................................................................................................38
5.4 Triggering and Sequence Control............................................................................. 38
5.4.1 Trigger Units..................................................................................................................38
5.4.2 Receiving of Trigger Signals......................................................................................... 39
5.4.3 Generation of Trigger Signals....................................................................................... 40
5.5 PWM............................................................................................................................. 41
5.6 Frequency Measurement............................................................................................41
5.7 Bidirectional Channels............................................................................................... 42
5.8 External Clock Input................................................................................................... 42
5.9 Synchronization of Multiple Modules........................................................................42
5.10 AUX Channels............................................................................................................. 43
5.11 GND Relay....................................................................................................................43
6 Startup...................................................................................................44
6.1 Installation of R&S TS-PIO4 Module..........................................................................44
7 Software................................................................................................45
7.1 Driver Software............................................................................................................45
7.2 Soft Panel.....................................................................................................................45
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7.3 Programming Examples for R&S TS-PIO4................................................................46
7.3.1 Digital Test with "DIO Manager" Library........................................................................ 46
7.3.1.1 Main Function................................................................................................................47
7.3.1.2 Error Handling............................................................................................................... 48
7.3.1.3 Execution of Digital Test................................................................................................48
7.3.1.4 Evaluation of Failed Patterns........................................................................................ 49
7.3.2 Dynamic Pattern Execution with IVI Digital................................................................... 51
7.3.2.1 Main Function................................................................................................................51
7.3.2.2 Error Handling............................................................................................................... 53
7.3.2.3 Execution of Digital Test................................................................................................53
7.3.2.4 Generation of Pattern Set............................................................................................. 54
7.3.2.5 Evaluation of Failed Patterns........................................................................................ 58
7.3.3 Static Pattern Execution with IVI Digital........................................................................ 60
Contents
7.3.3.1 Main Function................................................................................................................60
7.3.3.2 Error Handling............................................................................................................... 61
7.3.3.3 Execution of Digital Test................................................................................................61
7.3.3.4 Execution of a Pattern Set............................................................................................ 62
7.3.3.5 Execution of a Single Pattern........................................................................................65
7.3.3.6 Evaluation of a Failed Pattern....................................................................................... 66
7.3.4 Static Pattern Output with Low‑Level Driver Functions.................................................67
7.3.4.1 Main Function................................................................................................................67
7.3.4.2 Error Handling............................................................................................................... 68
7.3.4.3 Execution of Digital Test................................................................................................69
7.3.4.4 Execution of a Pattern Set............................................................................................ 70
7.3.5 Dynamic Pattern Execution with Low‑Level Driver Functions.......................................70
7.3.5.1 Main Function................................................................................................................70
7.3.5.2 Error Handling............................................................................................................... 72
7.3.5.3 Execution of Digital Test................................................................................................72
7.3.5.4 Generation of a Pattern Set.......................................................................................... 74
7.3.6 Triggered Pattern Execution..........................................................................................75
7.3.6.1 Main Program................................................................................................................75
7.3.6.2 Error Handling............................................................................................................... 76
7.3.6.3 Triggered Digital Test.................................................................................................... 77
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R&S®TS-PIO4
8.1 LED Test....................................................................................................................... 80
8.2 Power‑On Test............................................................................................................. 80
8.3 TSVP Self‑Test............................................................................................................. 80
9.1 R&S TS-PIO4................................................................................................................81
9.1.1 Connector X10.............................................................................................................. 81
9.1.2 Connector X20.............................................................................................................. 82
9.1.3 Connector X30.............................................................................................................. 83
9.1.4 Connector X1 (cPCI Bus)..............................................................................................84
10 Specifications.......................................................................................85
Contents
8 Self‑Test................................................................................................ 80
9 Interface Description........................................................................... 81
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R&S®TS-PIO4
1 Applications
1.1 General
Applications
Features
This manual describes the function and operation of the ROHDE&SCHWARZ digital
functional test module R&S TS-PIO4 for use in the test system versatile platform
R&S CompactTSVP. The hardware is implemented as a CompactPCI board that occupies only one slot on the front side of the TSVP.
The R&S TS-PIO4 digital functional test module is used wherever digital circuits are
tested by flexibly programmable static or dynamic stimulation and the response is
recorded.
Deterministic, simultaneous stimulation and recording of digital signals makes it possible to simulate operating conditions in a manner that is very close to reality. A large
local memory pool and an independent sequence controller are available on the module to ensure that the precise and predictable time response can be maintained for output, recording and analysis of the bit patterns. Extensive trigger options via the PXI
trigger bus enable synchronization with additional R&S TS-PIO4 modules or other
measurement and stimulus modules. This makes it possible to increase the number of
digital channels in an application. Measurements in which signals are to be recorded
synchronously are also possible.
Output levels and input thresholds can be programmed in 8 ports each with 4 channels. This allows for optimum adaptability to the requirements of different logic families.
The effect of interference signals in the test setup can be minimized by adjusting the
hysteresis for the input thresholds.
Safety circuits to protect against short circuits, countervoltages and overvoltages contribute to the robustness of the R&S TS-PIO4 digital functional test module. Due to the
extremely space‑saving design of the I/O safety circuit and signal conditioning unit, the
R&S TS-PIO4 occupies just one CompactPCI/PXI slot. This makes it possible to set up
very high‑performance and compact measuring systems.
The R&S TS-PIO4 digital functional test module is intended for the R&S CompactTSVP test platform. The module is controlled by the CompactPCI bus.
A soft panel is available for operation of the module. An IVI‑C driver is provided to
allow the module to be used under software control.
1.2 Features
Features of the R&S TS-PIO4 digital functional test module.
●
32 digital inputs and 32 digital outputs divided into 8 ports each with 4 channels
●
Programmable output level range from ‒6 V to 10 V, output impedance 30 Ω (typ.)
●
Resolution 14 bits
●
Output current up to 150 mA per channel, 350 mA per port
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1.3 Possible Applications
Possible Applications
●
Tri‑state control in dynamic and static mode
●
Two programmable input thresholds per port for hysteresis or level monitoring
●
Inputs can be connected to outputs
●
Pattern rate up to 40 MS/s per channel x 12.5 nsec. resolution
●
Memory depth 2 Msample (32‑bit data)
●
External clock input
●
Synchronization/triggering via PXI trigger bus and via XTI (TTL)
●
Timer/counter function
●
FPGA‑based flexibility
●
Standalone self‑test capability
●
LabWindows IVI‑C driver available
●
Used in R&S CompactTSVP
Applications
The R&S TS-PIO4 digital functional test module is used for testing digital modules or
devices. This type of functional test is used to check the overall operation of a digital
circuit under conditions that are as close to reality as possible. The module does this
by applying digital input patterns, measuring the output signals and comparing them
with the nominal values.
The R&S TS-PIO4 digital functional test module can be used for tasks such as the following:
●
Digital functional test (low‑speed/high‑speed, IO control)
●
Bit pattern stimulation (low‑speed/high‑speed, digital buses)
●
Bit pattern measurement (low‑speed/high‑speed)
●
Monitoring of changes in level state (pattern trigger)
●
Digital functional test at component level (no node‑forcing or backdriving capability)
●
Downloads, e.g. for flash components, serial and parallel
A typical functional test consists of the following elements:
●
Adaptation of the pin electronics to the UUT environment (logic level and logic family)
●
Definition of the sensor strobe (timing)
●
Definition of the stimulus and measuring behavior
●
Evaluation of the test result
1.3.1 Digital Functional Test – Static
Characteristics for which correct interaction of the logic modules is more important than
the verification of time-critical limits are tested in the static digital functional test. The
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R&S®TS-PIO4
1.3.2 Digital Functional Test – Dynamic
Applications
Possible Applications
application outputs the patterns to be stimulated, reads in the UUT response via the
module inputs and compares it with the expected response. Comparison with the nominal values then results in a PASS or FAIL statement. The comparison takes place in
the application. As the time response (length of time that a pattern is available; sampling time point of the inputs) is controlled primarily by the host computer, this test cannot be used to test time‑critical or chronologically precisely defined sequences. With
the static test, the order of the sequence is deterministic, i.e. the chronological order of
the patterns as well as the read‑in procedure is predictable. How long the interval from
one pattern to the next pattern will be and how large the interval from application of a
pattern to reading in of the data will be are, however, not predictable. Here, the operating system of the host computer (task switching, etc.) influences the runtimes in a
non‑predictable way.
In the real‑time test, overall operation of the digital section of a UUT is tested under
operating conditions that are as close to reality as possible. For this purpose, digital
patterns (vectors and pattern sets) with a precisely defined, usually high clock rate and
precise time response are applied at the UUT connections and the responses recorded. Recording is also performed with a precisely defined, reproducible time response.
The basic requirement for exact, predictable timing is that the patterns for the stimulus
are stored in the memories "downstream of the drivers" and can be processed with a
defined time response and at a high speed. To enable this, the module has its own
sequence controller in the FPGA. The recorded input data is also initially stored in a
memory on the module and later retrieved by the application on the host computer and
evaluated for a PASS/FAIL decision.
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R&S®TS-PIO4
2 View
View
Figure 2-1 shows the R&S TS‑PIO4 digital functional test module (without heat sink).
Figure 2-1: View of module
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3 Block Diagrams
Block Diagrams
This section contains a functional block diagram of the R&S TS‑PIO4 module as well
as a detailed block diagram.
Figure 3-1: Functional block diagram of R&S TS‑PIO4 module
Figure 3-2: Detailed block diagram of R&S TS‑PIO4 module
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Block Diagrams
Figure 3-3: Clock switch
Figure 3-4: Trigger und timing control
Figure 3-5: Digital input comparator
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Block Diagrams
Figure 3-6: Hardware trigger configurator
Figure 3-7: Trigger logic block
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Block Diagrams
Figure 3-8: Trigger output configurator
Figure 3-9: Stimulus
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Block Diagrams
Figure 3-10: Driver and comparator
Figure 3-11: R&S TS‑PIO4 in R&S CompactTSVP
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R&S®TS-PIO4
4 Design
4.1 Mechanical Design
Design
Interfaces
The R&S TS-PIO4 module is designed as a long cPCI plug‑in module for mounting in
the front of the R&S CompactTSVP.
The height of the module's board is 3 HU (134 mm). The front panel has a locating pin
to ensure that the module is correctly inserted into the R&S CompactTSVP. The module is secured using the two fastening screws on the front panel.
The front interface X10 is used for connecting UUTs.
Connector X30 is solely intended to provide mechanical stability. The contacts of the
connector are not used.
Interfaces X20/X1 connect the R&S TS-PIO4 module to the cPCI backplane/PXI control backplane.
Figure 4-1: Arrangement of interfaces on R&S TS‑PIO4 module
4.2 Interfaces
Name Use
X1 cPCI bus backplane
X10 Unit under test (UUT)
X20 Backplane extension (PXI), rear I/O
X30 Analog bus (not used)
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4.3 Display Elements
Design
Display Elements
A detailed interface description with signal assignment to the connectors can be found
in Chapter 9, "Interface Description", on page 81.
On the front panel of the R&S TS-PIO4 are three light emitting diodes (LEDs) which
have the following meaning:
Figure 4-2: LED indicators of R&S TS-PIO4
LED Description
ERR (red) Error condition:
Lights up if, after the supply voltage is switched on,
a fault is detected on the R&S TS-PIO4 module during the power‑on test.
COM (yellow) Communication:
Lights up when data is being exchanged via the
interface.
PWR (green) Supply voltage:
Lights up when all the necessary supply voltages
are present.
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5 Functional Description
5.1 Overview
5.1.1 General
Functional Description
Overview
The R&S TS-PIO4 digital functional test module provides 8 ports each with 4 digital
input pins and output pins. For this purpose, the module has unmultiplexed digital pins,
i.e. behind each pin is a separate digital channel. Furthermore, the output voltages of
the drivers as well as the comparator thresholds of the inputs can, within certain limits,
be freely programmed on the module. This allows the appropriate logic level to be generated for practically every application. All settings as well as clock generation take
place on the module itself, which means that no additional stimulus modules are necessary.
The usable level range depends on the configuration of the driver references. The
overall level range is divided into 4 sections. The driver levels are generated from the
CPCI supply (+5 V and +3.3 V).
The application software must set an appropriate voltage range before the output voltages and comparator thresholds can be configured. Here, the device driver performs a
plausibility check and prevents invalid or damaging values from being set.
Table 5-1: Voltage ranges
Range
3 +1.5 V to +6.0 V +1.5 V to +10.0 V +1.5 V to +7.1 V
2 ‒1.8 V to +2.7 V ‒1.8 V to +10.0 V ‒1.8 V to +7.1 V
1 ‒3.5 V to +1.0 V ‒3.5 V to +10.0 V ‒3.5 V to +7.1 V
0 ‒6.0 V to ‒1.5 V ‒6.0 V to +8.0 V ‒6.0 V to +5.1 V
1
VL: Output level Low
2
VH: Output level High
3
CVL: Comparator level Low
4
CVH: Comparator level High
VL
1
VH
2
CVL3 / CVH
4
If required, all outputs (OUTx) can be connected to their corresponding input (INx) and
therefore stimulate, measure and monitor the driving of signals. All driver channels can
be set to the high‑impedance state (TRI-STATE).
Timing control of data output and reading in of response signals takes place on the
module controlled by FPGAs.
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5.1.2 Ports
Functional Description
Overview
Due to the structures in the hardware, the digital inputs and outputs are divided into
so‑called ports.
The R&S TS-PIO4 module provides 32 outputs (OUT1 to OUT32) and 32 inputs (IN1
to IN32). Each port (PORT0 to PORT7) is made up of 4 channels.
Many functions of the driver refer to this port structure.
Table 5-2: Port structure
Port Channel OUTx / INx Bit mask
0 1…4 RSPIO4_MASK_PORT0
1 5…8 RSPIO4_MASK_PORT1
2 9…12 RSPIO4_MASK_PORT2
3 13…16 RSPIO4_MASK_PORT3
4 17…20 RSPIO4_MASK_PORT4
5 21…24 RSPIO4_MASK_PORT5
6 25…28 RSPIO4_MASK_PORT6
7 29…32 RSPIO4_MASK_PORT7
5.1.3 Memories
5.1.3.1 Memory Management in Driver
If required, the digital channels can be configured in different combinations for simultaneous static and dynamic operation. Various formats (data types) are therefore available for the dynamic data records.
Stimulus data records which are to be loaded to the module using rspio4_LoadData
are first stored in the memory management. For each data record, the driver assigns
an ID using which this data record can then, if required, be identified and executed.
If access takes place using the driver functions compliant with IVI Digital, this runs in
the background and can be ignored by the user. The appropriate data formats are then
also selected automatically.
The data is interpreted in the driver according to the mode to which the module was set
beforehand by means of the rspio4_ConfigureStimMode() and
rspio4_ConfigureRespMode() functions.
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Functional Description
Overview
For reasons of backward compatibility, the attribute RSPIO4_ATTR_PORT_HANDLING
can be set to the value RSPIO4_PORT_HANDLING_PDFT using the
rspio4_ConfigurePortHandling function. In this case, the driver software emulates a module with 4 ports each with 8 channels. With this setting, the tri‑state information in the data structures is interpreted on a port‑specific basis.
The file rspio4.h provides these data types. For details, see rspio4.h as well as
the help file of the driver.
Table 5-3: Data types
Mode
(see rspio4.h)
RSPIO4_VAL_CTRL_STATIC
RSPIO4_VAL_CTRL_4BIT RSPIO4_DATA_4BIT (stim. and resp.)
RSPIO4_VAL_CTRL_8BIT RSPIO4_DATA_8BIT (stim. and resp.)
RSPIO4_VAL_CTRL_16BIT RSPIO4_DATA_16BIT (stim. and resp.)
RSPIO4_VAL_CTRL_32BIT RSPIO4_DATA_32BIT (stim. and resp.)
RSPIO4_VAL_CTRL_4BIT_TRISTATE RSPIO4_DATA_4BIT_TRISTATE (stim.)
RSPIO4_VAL_CTRL_8BIT_TRISTATE RSPIO4_DATA_8BIT_TRISTATE (stim.)
RSPIO4_VAL_CTRL_16BIT_TRISTATE RSPIO4_DATA_16BIT_TRISTATE (stim.)
RSPIO4_VAL_CTRL_32BIT_TRISTATE RSPIO4_DATA_32BIT_TRISTATE (stim.)
5.1.3.2 Stimulus Memory
Data type
(see rspio4.h)
RSPIO4_DATA_4BIT (resp.)
RSPIO4_DATA_8BIT (resp.)
RSPIO4_VAL_CTRL_16BIT (resp.)
RSPIO4_VAL_CTRL_32BIT (resp.)
2 Msample memories for stimulus data are available in the module. This means that
max. one pattern set with 2 x 1024 x 1024 data vectors plus 2 x 1024 x 1024 enable
vectors can be defined and loaded to the module.
The data records are first transferred to the stimulus memory using the
spio4_LoadData() function. This function returns an ID. This ID can then be used to
execute the data record in the stimulus memory.
Depending on the function used to execute a pattern set, this takes place automatically
or must be triggered manually (e.g. IVI Digital functions perform this sequence completely in the background).
The rspio4_DiscardData() function is used to remove the data record from the
stimulus memory.
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5.1.3.3 Response Memory
5.1.4 Static Digital Test
Functional Description
Overview
The recorded response data is also stored in a 2 Msample memory. This memory
always contains the results of the high comparators and the low comparators alternately in a 32‑bit value.
The default functions evaluate these results according to the selected comparator
mode:
●
COMP window comparator
●
HYST hysteresis
To allow information with regard to an input voltage in a prohibited range to be
received, functions which evaluate and return the validity of the data of each channel
have been added to the driver. (See also Chapter 5.3.3, "Configuration of Input Chan-
nels", on page 32.)
With the static digital test, the sequence for applying patterns at the outputs as well as
for reading in the inputs is checked from the control computer. As a result, the duration
of the individual patterns as well as the sampling time point for the measurement relative to the beginning of the pattern can never be precisely predicted because the host
computer and its operating system are influencing factors here.
The static digital test is therefore suitable for checking the logical interaction of components in order to check voltage thresholds and other sequences in cases where the
verification and the precise observance of time conditions are not relevant.
With R&S TS-PIO4, the static digital test can be performed using IVI Digital functions
or the low‑level driver functions.
5.1.5 Dynamic Digital Test
In the simplest case, the pattern period is identical for output (stimulus) and recording
(response). Stimulus and response are started by the same trigger and run synchronously to each other.
Normally, the UUT response must be measured with a delay relative to the beginning
of the pattern. The delay (Response Delay) can be set between 0 s and the pattern
period. This delay is defined by the application such that stable data from the UUT is
present at the time of sampling. This value is ultimately determined by the delay times
in the UUT. If the delay is greater than the pattern period, then sampling already takes
place within the next period of the stimulus patterns. This too may be advisable in certain applications.
The test is started by software or hardware triggers. The patterns are output at a fixed
clock rate. The pattern duration is the time during which a pattern of a pattern set is
available at the outputs. The responses from the UUT are usually also recorded at the
inputs during this time.
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Functional Description
Programming of Digital Tests
The "Response Delay" is the time offset between the beginning of a pattern and sampling of the data at the inputs. The pattern rate is the reciprocal of the pattern period.
Figure 5-1: "Pattern Set Period" and "Response Delay"
A pattern set is a quantity of patterns (vectors) that are processed in a sequence after
a trigger event has been received. Processing is started by a software function or a
hardware trigger. Execution takes place in real time and is not affected by the operating system of the control computer. The software is able to query whether execution is
still in progress, to interrupt the current execution or to wait until execution has finished.
5.2 Programming of Digital Tests
TSVP is an open platform with regard to hardware and software. Typically, the software
consists of a number of drivers and libraries that are called from a test program or
sequencer created by the user.
Generally there are two ways to access TSVP modules.
●
Instrument driver
●
High‑level GTSL libraries
Device driver functions provide access to all hardware options. In contrast, symbolic
names and cross‑module functionality are not supported.
The functions in the device driver provide two interfaces for programming digital tests:
●
Digital test with low‑level functions
●
Digital test with IVI Digital functions
High‑level libraries provide a standardized programming interface and allow certain
abstractions with respect to the underlying hardware, e.g. symbolic signal names and
the handling of multiple parallel modules.
The GTSL library "DIO Manager" (DIOMGR.DLL) is provided for operation of the digital
functions of the module.
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5.2.1 Digital Tests with Device Driver Functions
5.2.1.1 Initialization
5.2.1.2 Auxiliary Functions
rspio4_init
●
rspio4_InitWithOptions
●
rspio4_close
●
rspio4_reset
●
rspio4_LockSession
●
rspio4_UnlockSession
●
rspio4_self_test
●
rspio4_revision_query
●
Functional Description
Programming of Digital Tests
5.2.1.3 Error Queries
rspio4_error_query
●
rspio4_GetErrorInfo
●
rspio4_ClearErrorInfo
●
rspio4_error_message
●
5.2.1.4 Functions of IVI Switch Component
On the R&S TS‑PIO4, there are only the two channels "GND" and "GNDNO" that can
be switched using the "IVI switch functions". The GND relay is used for this purpose.
rspio4_Connect
●
rspio4_Disconnect
●
rspio4_DisconnectAll
●
rspio4_GetPath
●
rspio4_SetPath
●
rspio4_CanConnect
●
rspio4_IsDebounced
●
rspio4_WaitForDebounce
●
5.2.1.5 Digital Test with Low‑Level Driver Functions
For optimum utilization of the board's performance, it is recommended to use the digital
test with low‑level functions.
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R&S®TS-PIO4
Functional Description
Programming of Digital Tests
Static digital test with low‑level driver functions
rspio4_SetDoutState
●
rspio4_SetDoutPort
●
rspio4_ConnectInOut
●
rspio4_GetDinState
●
rspio4_GetDinHighAndLowComp
●
Dynamic digital test with low‑level driver functions
Some of these functions are also required for configuring the default settings for
dynamic tests compliant with IVI Digital (see Chapter 7.3.4, "Static Pattern Output with
Low‑Level Driver Functions", on page 67).
rspio4_ConfigDinComparator
●
rspio4_ConfigureStimMode
●
rspio4_ConfigureRespMode
●
rspio4_ConfigureStimTiming
●
rspio4_ConfigureRespTiming
●
rspio4_LoadData
●
rspio4_LoadStimBuffer
●
rspio4_AppendStimBuffer
●
rspio4_ExecutePattern
●
rspio4_AbortExecution
●
rspio4_FetchPatternResponseData
●
rspio4_FetchPatternResponseDataFull
●
rspio4_DiscardData
●
5.2.1.6 Digital Test Compliant with IVI Digital
IVI Digital is a standard for the actuation of digital test instruments. The driver provides
calls that are compliant with IVI Digital. IVI Digital supports both the static and the
dynamic digital test.
Use of the IVI Digital functions requires an extremely high computing overhead on the
host side and is relatively inflexible with regard to the hardware because IVI Digital is a
standardization and cannot take performance‑boosting features of the hardware into
consideration. For example, splitting into static and dynamic channels is not possible.
Functions for digital test compliant with IVI Digital
rspio4_ClearPattern
●
rspio4_ConfigureChannelOpcode
●
rspio4_ConfigureMode
●
rspio4_ConfigureGroupOpcode
●
rspio4_ConfigureLargeGroupOpcode
●
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rspio4_CreatePattern
●
rspio4_GetChannelName
●
rspio4_GetChannelOpcode
●
rspio4_GetGroupOpcode
●
rspio4_ConfigureStaticResponseDelay
●
rspio4_ExecuteStaticPattern
●
rspio4_FetchStaticChannelOpcode
●
rspio4_GetStaticChannelName
●
rspio4_FetchStaticChannelListResults
●
rspio4_FetchStaticChannelResult
●
rspio4_FetchStaticChannelData
●
rspio4_FetchStaticChannelListData
●
rspio4_AbortPatternSet
●
rspio4_BeginPatternSetLoading
●
rspio4_ClearPatternSet
●
rspio4_ConfigurePatternSetMaxTime
●
rspio4_ConfigurePatternSetTiming
●
rspio4_CreatePatternSet
●
rspio4_ExecutePatternSet
●
rspio4_FetchPatternSetResult
●
rspio4_GetDynamicChannelName
●
rspio4_GetDynamicPatternCount
●
rspio4_FetchDynamicChannelOpcode
●
rspio4_GetPatternSetCount
●
rspio4_GetPatternSetExecutedPatternCount
●
rspio4_GetPatternSetLoadedPatternCount
●
rspio4_GetPatternSetName
●
rspio4_InitiatePatternSet
●
rspio4_LoadDynamicPattern
●
rspio4_WaitUntilPatternSetComplete
●
rspio4_FetchDynamicChannelListResults
●
rspio4_FetchDynamicChannelListPatternResults
●
rspio4_FetchDynamicChannelResult
●
rspio4_FetchDynamicPatternResult
●
rspio4_FetchDynamicPatternListResults
●
rspio4_FetchDynamicChannelData
●
rspio4_FetchDynamicChannelListData
●
rspio4_FetchDynamicChannelListPatternData
●
Functional Description
Programming of Digital Tests
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5.2.2 Digital Test with DIO Manager
Functional Description
Programming of Digital Tests
Static digital test compliant with IVI Digital
Here too static tests are possible, i.e. tests in which the host computer is responsible
for control and which, as a result, do not have a fully defined time response. See the
example in Chapter 7.3.3, "Static Pattern Execution with IVI Digital", on page 60.
Dynamic digital test compliant with IVI Digital
As shown in the example for the static digital test compliant with IVI Digital, a so‑called
op code is generated for each channel ("OUT1" to "OUT32", "IN1" to "IN32"). This
op code controls whether a channel is to drive high or low or whether it is to switch to
tri‑state. The pattern generated in this way is then executed immediately and is available at the outputs.
In the case of the dynamic digital test compliant with IVI Digital, the generated patterns
are saved in a pattern set.
After a timing has been defined, the complete pattern set is executed.
Each pattern set is stored in its own file. This file can be edited manually using a test
editor.
The file containing the pattern set is loaded during runtime to one or more
R&S TS‑PIO4 modules and then executed. The results can be read back using function calls. Alternatively, the results can also be stored in a file with the same format.
Differences between the expected and measured behavior can then be easily identified
by comparing the files.
See also the example in Chapter 7.3.1, "Digital Test with "DIO Manager" Library",
on page 46.
5.2.2.1 File Format
The file format was originally defined by the Altera Quartus Waveform Generator.
GROUP CREATE bus = bus[7] bus[6] bus[5] bus[4] bus[3] bus[2] bus[1] bus[0];
INPUTS N14CR0805170 E_COM E_EC1 E_EC2 E_EC3 bus;
OUTPUTS N13HCPN31500 N13HCPM31500 N13HCPO31500 N13HCPL31500;
UNIT ns;
RADIX HEX;
PATTERN
0.0> 0 0 0 0 0 00 = X X X X
1000.0> 1 0 0 0 0 01 = X X X X
2000.0> Z Z Z Z Z 02 = X X X X
3000.0> 0 0 0 0 0 03 = X X X X
4000.0> 1 0 0 0 0 04 = X X X X
5000.0> Z Z Z Z Z 05 = X X X X
6000.0> 0 0 0 0 0 06 = 1 X X X
7000.0> 0 1 0 0 0 07 = 0 X X X
8000.0> Z Z Z Z Z 08 = X X X X
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Functional Description
Programming of Digital Tests
9000.0> 0 0 0 0 0 09 = X 1 X X
10000.0> 0 0 0 0 1 0A = X 0 X X
11000.0> Z Z Z Z Z 0B = X X X X
12000.0> 0 0 0 0 0 0C = X X 1 X
13000.0> 0 0 0 1 0 0D = X X 0 X
14000.0> Z Z Z Z Z 0E = X X X X
15000.0> 0 0 0 0 0 0F = X X X 1
16000.0> 0 0 1 0 0 10 = X X X 0
17000.0> Z Z Z Z Z 11 = X X X X
18000.0> X X X X X X = X X X X
;
GROUP CREATE bus = bus[7] bus[6] bus[5] bus[4] bus[3] bus[2]
bus[1] bus[0];
This instruction is optional. It is used to group pins into buses. It is also possible to
define multiple buses.
INPUTS N14CR0805170 E_COM E_EC1 E_EC2 E_EC3 bus;
OUTPUTS N13HCPN31500 N13HCPM31500 N13HPCO31500 N13HCPL31500;
The INPUTS and OUTPUTS instructions define the channel names or group names.
Here it is important that INPUTS are inputs of the UUT and therefore correspond to
OUT1 to OUT32 of the R&S TS‑PIO4 module. OUTPUTs are UUT outputs and therefore correspond to the inputs IN1 to IN32 of the module.
UNIT ns;
Defines the unit of the timestamp used in the file.
RADIX HEX;
Defines the base for the values in the case of buses. The DIO manager supports HEX
only.
PATTERN
0.0> 0 Z Z Z Z 00 = X X X X;
……
All lines following PATTERN define this pattern set. Each line represents a pattern at a
certain time. The last line is ignored and is used only as end identification. All channels
are X. The timestamps do not have to be equidistant.
Value for INPUTS for OUTPUTS
0 drive low expect low
1 drive high expect high
Z high impedance (not used)
X (not used) don't care
A hexadecimal value is entered for groups. The special cases X and Z indicate that all
channels of the groups concerned assume this state.
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5.2.2.2 Configuration of DIO Manager
Functional Description
Programming of Digital Tests
The waveform file contains the logical name of the inputs and outputs. Assignment of
physical channels on the R&S TS‑PIO4 modules to logical names takes place in the
file application.ini.
[bench->823916]
DIODevice = device->pio4
DIOChannelTable = io_channel->823916
[io_channel->823916]
E_COM = pio4!out1
E_EC1 = pio4!out2
E_EC2 = pio4!out3
E_EC3 = pio4!out4
N14CR0805170 = pio4!out5
N13HCPL31500 = pio4!in1
N13HCPM31500 = pio4!in2
N13HCPN31500 = pio4!in3
N13HCPO31500 = pio4!in4
bus0 = pio4!out20
bus1 = pio4!out21
bus2 = pio4!out22
bus3 = pio4!out23
bus4 = pio4!out24
bus5 = pio4!out25
bus6 = pio4!out26
bus7 = pio4!out27
Like all GTSL libraries, the DIO manager is configured in an application.ini file.
The keyword DIODevice refers to the R&S TS-PIO4 module in the physical.ini. If
more than one digital module is to be used, a DIODevice2, DIODevice3, and so on is
added.
The "DIO channel table" refers to the associated table in the file.
The left side of the channel table contains the logical names and the right side the link
to the physical channels on the individual modules.
Channel names for groups (e.g. buses) do not have any brackets. Here they are called
"bus0" for example, whereas they are called "bus[0]" in the waveform file.
Channel names are not case‑sensitive.
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5.2.2.3 Structure of a Test Program
Functional Description
Programming of Digital Tests
Table 5-4: These functions must be called once at beginning of test program.
Function Comments
RESMGR_Setup
DIOMGR_Setup
DIOMGR_ConfigureStimulus
DIOMGR_ConfigureResponse
DIOMGR_LoadWaveform
DIOMGR_ConfigurePatternSetTiming
Table 5-5: These functions are typically called in a loop over multiple UUTs.
Function Comments
DIOMGR_ExecutePatternSet
Optional functions: Generally only called if the pattern set is defective
DIOMGR_SaveWaveform
DIOMGR_GetPatternSetExecutedPatternCount
DIOMGR_GetPatternSetFailedPatternCount
DIOMGR_GetPatternSetFailedChannelCount
Call of the resource manager
Call of the DIO manager and initialization of the
TS‑PDFT module
Configuration of logical levels for inputs and outputs
Loading a pattern set from a file to the memory.
Definition of the timing of a pattern set
Execution of a pattern set and return of the result
(pass/fail)
(fail)
Storage of the results as a TBL file
Reading out of the executed patterns
Reading out of the failed patterns
Reading out of the failed channels
DIOMGR_GetPatternSetFailedChannelNames
DIOMGR_GetPatternSetChannelData
DIOMGR_GetPatternSetChannelResults
Table 5-6: After all tests have been performed, these functions are used for cleaning up.
Function Comments
DIOMGR_Cleanup
RESMGR_Cleanup
5.2.2.4 Ports
The R&S TS-PIO4 module is divided into 8 ports each with 4 channels. Each port can
be set to different driver and sensor levels. If different levels are used in a program,
DIOMGR_ConfigureStimulus() and DIOMGR_ConfigureResponse() must be
called once for each "logic family" and the required level must be set.
Reading out of failed channels as a list of names
(comma‑separated)
Reading out of the current response message (measured data) for a channel
Reading out of the results for a channel (pass/fail)
Closes the DIO manager
Closes the resource manager
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5.2.2.5 Loading of Waveform File
Functional Description
Programming of Digital Tests
The waveform file defines a pattern set with specification of the timestamps. These
timestamps do not have to be equidistant. Normally, a new line is created whenever at
least one signal changes.
PATTERN
0.0> 0 0 0 0 0 00 = X X X X
1000.0> 1 0 0 0 0 01 = X X X X
1001.0> 1 1 0 0 0 01 = X X X X
1050.3> 1 1 1 0 1 01 = 1 1 1 1
2100.0> Z Z Z Z Z FF = X X X X
etc.
When the waveform is loaded to the R&S TS-PIO4 module, the timing must be converted to a fixed framework which is determined by the pattern set period of the module.
The loading function uses the "timeGrid" parameter to generate the samples of the
waveform in a fixed time grid. Each sample is then converted into a pattern and stored
in the memory of the module.
If a "timeGrid" of 500 ns is set in the example above, this would result in the following
samples:
Pattern Time Inputs Outputs
1 0 ns 0 0 0 0 0 00 X X X X
2 500 ns 0 0 0 0 0 00 X X X X
3 1000 ns 1 0 0 0 0 01 X X X X
4 1500 ns 1 1 1 0 1 01 1 1 1 1
5 2000 ns 1 1 1 0 1 01 1 1 1 1
6 2500 ns Z Z Z Z Z FF X X X X
Some patterns are repeated (1 and 2, 4 and 5) and some are not recognized as they
are too short and are between the sampling time points (e.g. patterns at the timestamp
1001.0).
The timestamp and the "timeGrid" parameter do not necessarily have to represent the
actual execution speed. The actual execution speed is set using the
rspio4_ConfigurePatternSetTiming() function. This also means that the
waveform file does not need to be modified if the test is to run at a different pattern
rate.
The following points should be observed when writing the waveform file:
●
Use equidistant timestamps
●
Timestamps are to reflect the real timing, i.e. exactly the timing that is used for the
test.
●
Use the interval between the timestamps as the value for the "timeGrid" parameter.
●
Use the interval between the timestamps as the "Pattern Set Period".
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5.2.2.6 Execution of Pattern Set
5.3 Configuration of Digital Channels
Functional Description
Configuration of Digital Channels
The pattern set can be executed synchronously or asynchronously. In the first case,
the DIOMGR_ExecutePatternSet() function does not return until execution has
been completed (or the maximum time has been exceeded). In the second case, execution is started or the trigger armed and the function returns without having to wait for
actual execution of the pattern set. The
DIOMGR_WaitUntilPatternSetComplete() function can be used to wait for the
end of execution.
The module offers a series of configurable parameters. This section describes the configuration options and lists the corresponding driver functions. For details on the driver
functions, refer to the GTSL help of the driver software.
5.3.1 Setting of Voltage Range
The application must set a range that contains the desired voltages for the high and
low levels of the outputs as well as the required comparator thresholds for the inputs.
Each port can be assigned its own voltage range.
Switchover of the voltage ranges causes long settling times on the module which have
to be taken into consideration in the device driver. When the voltage range is adjusted,
all drivers are switched to high impedance.
The voltage ranges are listed in the Voltage ranges table.
rspio4_ConfigurePortVoltageRange
●
5.3.2 Configuration of Stimulus Channels
Settings for the output voltages can be programmed for each port.
rspio4_ConfigureStimPort
●
The settings are made for one or more ports depending on the parameters in the function call. The current limit always applies to the total output currents from all 4 drivers
of a port.
When current is flowing, a voltage drop that may have to be taken into consideration
during level adjustment is caused as a result of the output impedance of the driver and
the resistors in the output safety circuits (together approx. 30 Ω).
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5.3.3 Configuration of Input Channels
Figure 5-2: Configuration of stimulus channels
rspio4_ConfigureRespPort
●
Functional Description
Configuration of Digital Channels
The measurement channel inputs have a safety circuit upstream of the comparators.
This safety circuit has the following structure:
Figure 5-3: Configuration of input channels
Each input is routed to two comparators which have an adjustable threshold. This
makes it possible to implement a hysteresis for evaluation of the signals. The thresholds can be set using the driver function rspio4_ConfigureRespPort. This allows
individual values to be set for each port.
The result of the signal evaluation of a channel is 1 if the input level is greater than the
threshold for the high level.
The result of the signal evaluation of a channel is 0 if the input level is less than the
threshold for the low level.
If the input level is between the thresholds, "Forbidden Zone" is returned as the result.
The states of the two comparators can be read out using the low‑level driver function
rspio4_GetDinHighAndLowComp.
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5.3.4 Time Settings for Data Output
5.3.5 Time Settings for Data Recording
Functional Description
Configuration of Digital Channels
If the comparator is set to "COMP" mode, the two comparators function as window
comparators. A 1 is detected if the input level is between the thresholds, and a 0 is
detected if the input level is below the threshold for low or above the threshold for high.
This setting is required both for dynamic tests in compliance with IVI Digital and for
dynamic tests with the low‑level driver functions.
To configure the time response of the stimulus channels during output of a pattern set,
the rspio4_ConfigureStimTiming function is used to set the trigger delay, the pattern duration and the number of patterns to be output (Trigger Delay, Pattern Period,
Loop Count). The trigger delay is the wait time between the trigger event and output of
the first pattern. The pattern duration is the time during which an individual pattern is
present.
This setting is required both for dynamic tests in compliance with IVI Digital and for
dynamic tests with the low‑level driver functions.
The time parameters required for recording the input signals can be set using the
rspio4_ConfigureRespTiming function. As with data output, the trigger delay, the
pattern duration as well as the number of patterns to be read in (Response Trigger
Delay, Response Pattern Period, Loop Count) are available as parameters.
The trigger delay determines the wait time between the trigger event and initial sampling. The response trigger delay is set such that the UUT data is available at the input
in a stable condition at this point in time. In the typical case where the Stimulus Pattern
Period and Response Pattern Period are identical, a delay of 0.0 meant that in every
pattern sampling would take place directly at the beginning of the pattern; a delay
greater than the pattern period would mean sampling within the next pattern or within a
different pattern.
Example:
Stimulus pattern period: 50 ns
Response pattern period: 50 ns
Stim. trigger delay: 0.0 ns
Resp. trigger delay: 25.0 ns
The outputs are changed at time point 0. The data is sampled 25.0 ns later, i.e. at the
middle of the pattern in our example. Here, it is therefore assumed that the UUT outputs stable data after less than 25.0 ns.
5.3.6 Configuration of Data Width in Dynamic Mode
rspio4_ConfigureStimMode
●
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Functional Description
Configuration of Digital Channels
rspio4_ConfigureRespMode
●
If required, the digital channels can be configured in different combinations for simultaneous static and dynamic operation. This, for example, allows the configuration of control signals that remain at a constant level during entire test sequences. They then no
longer have to be part of the dynamic data. This also simplifies the creation of pattern
sets.
This type of configuration is only possible if programming is performed using the
low‑level driver functions. If the driver functions compliant with IVI Digital are used, the
dynamic width is always 32 bits.
The possible or selected constellations must, however, be taken into consideration during fixture wiring.
The following configurations are possible (see also rspio4.h).
Mode Configuration
RSPIO4_VAL_CTRL_STATIC
RSPIO4_VAL_CTRL_4BIT
RSPIO4_VAL_CTRL_8BIT
RSPIO4_VAL_CTRL_16BIT
RSPIO4_VAL_CTRL_32BIT
RSPIO4_VAL_CTRL_4BIT_TRISTATE
RSPIO4_VAL_CTRL_8BIT_TRISTATE
RSPIO4_VAL_CTRL_16BIT_TRISTATE
RSPIO4_VAL_CTRL_32BIT_TRISTATE
Static mode
4 dynamic DOUT or DIN: OUT 1 to 4 / IN 1 to 4
No tri‑state
8 dynamic DOUT or DIN: OUT 1 to 8 / IN 1 to 8
No tri‑state
16 dynamic DOUT or DIN: OUT 1 to 16 / IN 1 to 16
No tri‑state
32 dynamic DOUT or DIN: OUT 1 to 32 / IN 1 to 32
No tri‑state
4 dynamic DOUT or DIN: OUT 1 to 4 / IN 1 to 4
Tri‑state information in data
8 dynamic DOUT or DIN: OUT 1 to 8 / IN 1 to 8
Tri‑state information in data
16 dynamic DOUT or DIN: OUT 1 to 16 / IN 1 to 16
Tri‑state information in data
32 dynamic DOUT or DIN: OUT 1 to 32 / IN 1 to 32
Tri‑state information in data
The RSPIO4_VAL_CTRL_32BIT_TRISTATE mode is always used in IVI‑Digital‑compliant operation.
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5.3.7 Power Consumption
5.3.7.1 Estimation of Power Consumption
Functional Description
Configuration of Digital Channels
The total power consumption of the R&S TS‑PIO module should not exceed 40 W and
depends on the operating mode of the input and output channels.
The following description explains calculation of the maximum power consumption for
the operating ranges most frequently used.
VH = Output level High
VL = Output level Low
Range 3 with the settings VL = +1.5 V to +6.0 V and VH = +1.5 V to +10.0 V
Range 2 with the settings VL = ‒1.8 V to +2.7 V and VH = ‒1.8 V to +10.0 V
Range 1 with the settings VL = ‒3.5 V to +1.0 V and VH = ‒3.5 V to +10.0 V
Range 0 with the settings VL = ‒6.0 V to ‒1.5 V and VH = ‒6.0 V to +8.0 V
Output channels
Table 5-7: Maximum power consumption per group (consisting of 4 channels)
Range Power consumption in a group [W] Maximum power in a
group with four channels
3 #CH * 0.021 * f[MHz] * (0.421 + 0.233 * U_swing) < 3.9 W
2 #CH * 0.036 * f[MHz] * (0.548 + 0.172 * U_swing) < 3.9 W
1 #CH * 0.047 * f[MHz] * (0.605 + 0.143 * U_swing) < 3.9 W
0 #CH * 0.051 * f[MHz] * (0.609 + 0.137 * U_swing) < 3.9 W
#CH: Number of active channels in a group with four channels
f: IO switchover frequency (= 1/2 sample rate), duty cycle 50%, MHz
U_swing : Voltage variation of the IO signal (VH-VL), V
Example:
Four active channels in a group with a switchover frequency of 20 MHz (corresponds
to a sample rate of 40 Msamples), VL = +1.5 V and VH = +4.5 V.
●
U_swing = VH ‒ VL = 4.5 V ‒ 1.5 V = 3.0 V
●
The values for VL and VH can be used in the ranges 2 and 3
Calculation of the power consumption in a group:
●
Range 3: 4 * 0.021 * 20 * (0.421 + 0.233 * 3.0) = 1.88 W => OK (< 3.9 W)
●
Range 2: 4 * 0.036 * 20 * (0.548 + 0.172 * 3.0) = 3.06 W => OK (< 3.9 W)
Range 3 must be used on account of the limited power consumption of the group.
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Functional Description
Configuration of Digital Channels
Table 5-8: Maximum power consumption per module
Range Power consumption of active IO channels [W] Maximum power con-
sumption of a module [W]
3 #GRP * #CH * 0.021 * f[MHz] * (0.421 + 0.233 * U_swing) + ∑P_load < 25 W
2 #GRP * #CH * 0.036 * f[MHz] * (0.548 + 0.172 * U_swing) + ∑P_load < 22 W
1 #GRP * #CH * 0.047 * f[MHz] * (0.605 + 0.143 * U_swing) + ∑P_load < 20 W
0 #GRP * #CH * 0.051 * f[MHz] * (0.609 + 0.137 * U_swing) + ∑P_load < 19 W
#GRP: Number of active groups (a group consists of max. four channels), max. 8
groups
#CH: Number of active channels in a group with four channels
f: IO switchover frequency (= 1/2 sample rate), duty cycle 50%, MHz
U_swing: Voltage variation of the IO signal (VH-VL), V
Example:
Four active channels and 8 active groups with a switchover frequency of 20 MHz (corresponds to a sample rate of 40 Msamples), VL = +1.5 V and VH = +4.5 V.
●
U_swing = VH ‒ VL = 4.5 V ‒ 1.5 V = 3.0 V
●
The values for VL and VH can be used in the ranges 2 and 3
Calculation of the power consumption for one module:
●
Range 3: 8 * 4 * 0.021 * 20 * (0.421 + 0.233 * 3.0) = 15.05 W => OK (< 25 W)
●
Range 2: 8 * 4 * 0.036 * 20 * (0.548 + 0.172 * 3.0) = 24.51 W => N.OK (> 22 W)
In this case, only range 3 can be used.
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Functional Description
Configuration of Digital Channels
Figure 5-4: Max. operating range as a function of maximum power consumption
Input channels
Depending on the operating range and frequency, receive channels (comparators) are
additionally subject to dissipation loss during switchover.
The table below gives the approximate additional power consumption for the operating
ranges with the following output values:
●
Max. switchover frequency: 20 MHz
●
Voltage variation: 3.3 V
●
Number of channels: 32 input channels
Range Additional power consumption (typ.)
3 10.0 W
2 5.5 W
1 12.5 W
0 13.5 W
Total power consumption
The input and output channels must be taken into consideration when estimating the
total power consumption.
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5.3.7.2 Safety Mechanism
5.4 Triggering and Sequence Control
5.4.1 Trigger Units
Functional Description
Triggering and Sequence Control
If the maximum permissible power consumption is exceeded, the IOs are deactivated
by a safety circuit. In this case, an error will occur when a driver function is called. The
IOs can be reactivated with the rspio4_reset function.
There are two trigger units on the module. The trigger units control output of stimulus
data as well as reading in of the data at the digital inputs. Trigger unit IT1 is responsible for outputs of the stimulus data, and trigger unit IT2 is responsible for reading in of
the response data.
The trigger units can be configured for various input conditions. It is also possible to
configure which output signal they are to generate and where this signal is to be routed
to.
For the configuration of trigger units, see
●
Figure 3-4
●
Figure 3-5
●
Figure 3-6
●
Figure 3-7
●
Figure 3-8
Inputs of trigger unit:
On the input side, the rspio4_ConfigHWTriggerInput function is used to configure whether and which inputs (PXI0 to PXI7, XTI, 4 outputs of the digital inputs pattern
comparator) are to be used as a hardware trigger and with which logical state, and
which edge is used.
The rspdft_ConfigDinComparator function allows setup of the digital inputs pattern comparator.
Alternatively, the unit can also be triggered using a software trigger (e.g. the
rspio4_executePattern function starts the processing of a pattern set by means
of a software trigger by calling the rspio4_InitiateSWTrigger function).
If the trigger unit was started by an event, then as many stimulus and response patterns are processed as were set using the configuration functions
rspio4_ConfigureStimTiming and rspio4_ConfigureRespTiming in the
Loop Count parameters.
Outputs of trigger unit:
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5.4.2 Receiving of Trigger Signals
Functional Description
Triggering and Sequence Control
The output of the trigger unit is used to actuate other functions. Selection of a certain
type of output signal does not influence the internal function (output stimulus, read in
response).
This output signal (e.g. ACTIVE) can be output on the PXI0 to 7 lines as well as on
XTO in order to, for example, trigger a measurement on a different CompactPCI board.
Various trigger sources are available for starting the controllers:
Designation Remarks
SW Trigger Sequence control starts immediately after arming
(when the rspio4_InitiateSWTrigger function
is called). This is the default sequence if a pattern
set is to be processed under program control. For
configuration, see also the example for the dynamic
test with low‑level functions.
"XTI" TTL input on the front connector X10; a positive or
negative edge starts the sequence. Triggering via
XTI is configured with the
rspio4_ConfigHWTriggerInput function. It is
used to define the edge and to activate/deactivate
triggering via XTI.
PXI0 to PXI7 Positive or negative edges on these lines start the
sequence. The active edge and which trigger signal
is used are again set using the
rspio4_ConfigHWTriggerInput function. If
multiple trigger sources are selected, then this is
equivalent to an OR logic operation.
Pattern Comparator A pattern comparator which evaluates the states of
the 32 inputs (IN) can also be used as the trigger
source. This is again also configured using
rspio4_ConfigHWTriggerInput as well as
rspio4_ConfigDinComparator in order to
define the condition for the input pattern comparator.
The rspio4_ConfigHWTriggerInput function determines the trigger source. Afterwards the hardware trigger sources are armed using the rspio4_EnableHWTrigger
function and the addressed sequence controls are in the "Waiting" state. If a software
trigger has been triggered, the associated control immediately switches to the "Running" state. Otherwise the state change does not take place until the trigger event has
occurred. In this state, the number of patterns in the stimulus memory (Stim Loop
Count) is then output and the number of patterns (Resp Loop Count) in the reference
memory is recorded.
If only patterns are to be output, the rspio4_InitiateSWTrigger function has to
be called with the mask RSPIO4_IT_MASK_IT1 only. If only recording is required, the
function must be called using only RSPIO4_IT_MASK_IT2.
After the available number of patterns has been processed, the associated sequence
control switches back to the "Stopped" state.
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5.4.3 Generation of Trigger Signals
Functional Description
Triggering and Sequence Control
The current state of both sequence controls can be queried using the
rspio4_GetItStatus function. By calling the
rspio4_WaitUntilPatternSetComplete function, the sequence control can be
made to wait until the end of execution in the test program.
If sequence control is in the "Waiting" or "Running" state, some driver functions cannot
be performed. In this case, these functions return an error message. If necessary, the
rspio4_AbortExecution function can be used to switch sequence control to the
default state.
The R&S TS‑PIO4 module is able to generate trigger signals on the following lines:
Designation Remarks
XTO TTL output on the front connector
PXI0 to PXI7 PXI trigger lines on the backplane
For a change to occur on the trigger lines, an event which provokes the trigger pulse
must be assigned to the selected line.
The following signals can be routed to the output using the rspio4_ConfigXTO function:
●
Output of pattern comparator
●
Output of IT1
●
Output of IT2
The following signals can be switched to a selected PXI using the
rspio4_ConfigPxiTrigOut function:
●
Output of pattern comparator
●
Output of IT1
●
Output of IT2
●
Output of general purpose trigger generator
This function can also be used to invert the selected signal and to activate the output
driver of the PXI trigger line.
The rspio4_InitiateSWTrigger function is used to start the following function
blocks under software control:
●
Trigger logic block IT1 (sequence control for data output)
●
Trigger logic block IT2 (sequence control for data recording)
●
Sample trigger stimulus (output of a single pattern from the stimulus memory)
●
Sample trigger response (recording of a single pattern to the response memory)
●
General purpose trigger generator (generation of a single trigger pulse)
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Functional Description
Frequency Measurement
The rspio4_ConfigItTrigOut function can be used to determine which signal the
trigger logic blocks IT1 and IT2 are to output after they have been started either via
software (rspio4_InitiateSWTrigger) or by means of a configured hardware signal (rspio4_ConfigHWTriggerInput). The table below shows the options:
Designation Remarks
ITn ACTIVE Pulse while the pattern set is being output.
ITn OUT Trigger block outputs a pulse for each pattern. The
pulses are relatively short (minimum pattern rate/2).
ITn STATUS Signals the internal state of the trigger block. The
signal becomes active when the trigger event is
received. The signal does not become inactive
again until the trigger block is reset.
ITn START A pulse after the trigger condition has been detec-
ted.
See also the example in Chapter 7.3.6, "Triggered Pattern Execution", on page 75.
5.5 PWM
The module supports the output of PWM signals at any output (OUTx).
PWM is configured using the rspio4_ConfigurePWM function. The frequency is set
in Hz and the duty cycle is specified in %.
The rspio4_SetStatePWM function is used to switch PWM on/off for individual channels.
The time resolution is 12.5 ns if the internal reference clock of 80 MHz is used. Lower
frequencies are generated using a divider. With this method, there are certain limitations with regard to the choice of frequency and duty cycle.
The following examples show the correlations at the highest frequencies:
●
40 MHz: 0 %, 50 %, 100 %
●
26.7 MHz: 0 %, 33 %, 66 %, 100 %
●
20 MHz: 0 %, 25 %, 50 %, 75 %, 100 %
5.6 Frequency Measurement
The R&S TS-PIO4 module supports frequency measurement at inputs IN1 to IN32.
The rspio4_FrequencyMeasurement function is used for this purpose. A distinction
is made between two methods, depending on the passed parameters:
●
Specification of a gate time: Pulses are counted until the gate time has expired.
This allows the frequency value to be calculated. The "gateCount" parameter is set
to 0.
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5.7 Bidirectional Channels
5.8 External Clock Input
Functional Description
Synchronization of Multiple Modules
●
If a defined number of pulses (gateCounts) is specified, the module measures the
time required for a certain number of pulses to arrive. The Gate Time parameter is
considered a timeout value. If the desired number of pulses is not included into this
time, the rspio4_FrequencyMeasurement function will return an error message.
Each input can be individually connected to the associated output by means of an analog switch. This allows reading out of the outputs and reading in of a UUT response
with the outputs switched off (tri‑state). The connection is set up using the
rspio4_ConnectInOut function.
Various applications can be implemented using the external clock input (EXT_CLK).
One possibility is to generate output frequencies that cannot be achieved using an
internal frequency divider; alternatively, the measuring card can be synchronized to the
clock of a UUT. The minimum permissible input frequency is 20 MHz and the maximum
is 40 MHz. All lower frequencies can be generated using the internal divider.
The clock signal source (internal PXI 10 MHz clock or supplied via EXT_CLK) can be
selected using the rspio4_ConfigureClock function. If an external clock is
selected, the clock frequency must be specified using the parameter
ExternClockFreq. This parameter is ignored if the internal clock is selected. The
state of the clock PLL can be queried using the rspio4_GetPllLockedStatus
function. This function indicates whether the clock can be used successfully.
The changed clock changes the timebase of the card. This increases, for example, the
step size in the case of adjustable trigger delays.
5.9 Synchronization of Multiple Modules
Multiple modules can output and record data in a synchronized manner via the various
trigger inputs and outputs. The internal PXI trigger lines are not length‑compensated
which means that significant delay differences can occur. The highest level of accuracy
can be achieved by means of length‑compensated lines between the master's XTO
and the XTIs.
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5.10 AUX Channels
5.11 GND Relay
Functional Description
GND Relay
Each of the AUX1, AUX2, AUX3 and AUX4 signals are routed from the rear X20 connector directly to the front X10 connector. The current‑carrying capacity is 1 A in each
case.
The GND relay connects the GNDNO signals to GND at the front X10 connector. This
means that a UUT can optionally be connected to GND. With in‑circuit tests, the UUT
must be floating, whereas with functional tests it is often recommended to have a connection between UUT ground and system ground.
In the default state, this connection is open.
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6 Startup
6.1 Installation of R&S TS-PIO4 Module
Startup
Installation of R&S TS-PIO4 Module
To install the R&S TS-PIO4 plug-in module, proceed as follows:
Damage to backplane caused by bent pins
Bent pins can cause permanent damage to the backplane.
Check the backplane connectors for bent pins.
Any bent pins must be straightened.
When inserting the plug‑in module, guide it with both hands and carefully push it into
the backplane connectors.
1. Power down and switch off the R&S CompactTSVP.
2. Select a suitable front‑side slot.
3. Remove the corresponding section of the front panel from the TSVP chassis by
undoing the screws.
4. Push in the plug‑in module using moderate pressure.
5. The upper catch pin of the plug‑in module must be inserted into the right hole in the
TSVP chassis and the lower catch pin into the left hole.
The module is correctly located when a distinct "stop" can be felt.
6. Securely tighten the screws at the top and bottom of the front panel of the plug‑in
module.
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7 Software
7.1 Driver Software
Software
Soft Panel
A LabWindows IVI driver is available for actuation of the R&S TS-PIO4 digital functional test module. All additional functions of the hardware are controlled using specific
extensions of the driver. The driver is part of the ROHDE & SCHWARZ GTSL software.
All the functions of the driver are described fully in the online help and in the LabWindows/CVI function panels. The following software modules are installed during driver
installation:
Module Path Remarks
rspio4.dll <GTSL directory>\Bin
rspio4.chm <GTSL directory>\Bin
rspio4.fp <GTSL directory>\Bin
rspio4.sub <GTSL directory>\Bin
rspio4.lib <GTSL directory>\Bin
rspio4.h <GTSL directory>\Include
The IVI and VISA libraries from National Instruments are needed to run the driver.
7.2 Soft Panel
The software package of the R&S TS-PIO4 module includes a soft panel (see Fig-
ure 7-1). The soft panel is based on the IVI driver and enables interactive operation of
the module.
Driver
Help file
LabWindows/CVI function panel
file, function panels for CVI development environment
LabWindows/CVI attribute file.
This file is required by some
"function panels".
Import library
Header file for driver
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Software
Programming Examples for R&S TS-PIO4
Figure 7-1: Soft panel of R&S TS-PIO4
Operation of the soft panels is described in Software Description for R&S GTSL.
In the R&S TS-PIO4 soft panel, it is possible to set static and dynamic bit patterns at
the outputs and to read in input states.
The voltage ranges, the high and low driver levels as well as threshold voltages of the
input comparators can be set in subsequent dialogs which are opened from the Configure menu.
Furthermore, it is also possible to configure the stimulus and response trigger units as
well as to provoke trigger events and to make PWM settings.
7.3 Programming Examples for R&S TS-PIO4
7.3.1 Digital Test with "DIO Manager" Library
This example shows the execution of a digital test using the GTSL library "DIO Manager" (DIOMGR). The input file (823916.tbl) and the associated configuration file
(pio4Application.ini) are described in Chapter 5.2.2, "Digital Test with DIO Man-
ager", on page 26. Additional information on the structure of the configuration files
(physical layer configuration file and application layer configuration file) and on the
function of the resource manager (RESMGR) can be found in the manual Soft-
ware Description R&S GTSL.
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7.3.1.1 Main Function
Software
Programming Examples for R&S TS-PIO4
/* Programming example with DIOMGR */
#include <ansi_c.h>
#include "resmgr.h"
#include "diomgr.h"
static short errorOccurred;
static long errorCode;
static char errorMessage[GTSL_ERROR_BUFFER_SIZE];
static long residDiomgr;
static char benchName[] = "bench->823916";
static char fileName[] = "823916.tbl";
static char fileNameResult[] = "823916result.tbl";
/* list of stimulus channels */
static char stimChannels[] = "N14CR0805170,E_COM,E_EC1,E_EC2,E_EC3";
static char respChannels[] = "N13HCPN31500,N13HCPM31500,"
"N13HCPO31500,N13HCPL31500";
/* prototypes */
static void cs ( char * funcName );
static void runTest ( void );
static void diagnosis ( void );
/* FUNCTION *******************************************************************/
/* loads the libraries and runs the test
*******************************************************************************/
int main (int argc, char *argv[])
{
printf("Example using DIOMGR functions for dynamic pattern execution\n\n");
/* setup libraries */
RESMGR_Setup (0, "physical.ini", "pio4Application.ini",
&errorOccurred, &errorCode, errorMessage);
cs("RESMGR_Setup");
if ( ! errorOccurred )
{
DIOMGR_Setup (0, benchName, &residDiomgr,
&errorOccurred, &errorCode, errorMessage);
cs("DIOMGR_Setup");
}
if ( ! errorOccurred )
{
runTest ( );
}
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/* cleanup libraries */
DIOMGR_Cleanup (0, residDiomgr, &errorOccurred, &errorCode, errorMessage);
cs("DIOMGR_Cleanup");
RESMGR_Cleanup ( 0, &errorOccurred, &errorCode, errorMessage);
cs("RESMGR_Cleanup");
printf("\nPress 'Enter' to terminate\n");
getchar();
return 0;
}
This function checks the return values of a function from the GTSL libraries (RESMGR,
DIOMGR). A message is issued if there is an error.
/* FUNCTION *******************************************************************/
/* checks the return status of a library call
*******************************************************************************/
static void cs ( char * funcName )
{
if ( errorOccurred )
{
printf ("%s returned 0x%08X\n%s\n\n", funcName, errorCode, errorMessage);
}
}
7.3.1.3 Execution of Digital Test
/* FUNCTION *******************************************************************/
/* Configures the module for digital test, loads the test and executes it.
The results are uploaded from the module and stored as a result TBL file.
*******************************************************************************/
static void runTest ( void )
{
long numPatterns;
long patternSetResult;
char usedChannels[512];
/* configure voltage ranges */
strcpy(usedChannels, stimChannels);
strcat(usedChannels, ",");
strcat(usedChannels, respChannels);
DIOMGR_ConfigureVoltageRange (0, residDiomgr, usedChannels, "VOLTAGE_RANGE_2",
&errorOccurred, &errorCode, errorMessage);
cs("DIOMGR_ConfigureVoltageRange");
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/* configure stimulus and response levels */
DIOMGR_ConfigureStimulus (0, residDiomgr, stimChannels, "TTL", 3.3, 0.1,
&errorOccurred, &errorCode, errorMessage);
cs("DIOMGR_ConfigureStimulus");
DIOMGR_ConfigureResponse (0, residDiomgr, respChannels, "HYSTERESIS",
0.8, 2.0, &errorOccurred, &errorCode, errorMessage);
cs("DIOMGR_ConfigureResponse");
/* load the waveform. Pattern set name = file name */
DIOMGR_LoadWaveform (0, residDiomgr, fileName, "TBL", 1.0e-6, fileName,
&numPatterns, &errorOccurred, &errorCode, errorMessage);
cs("DIOMGR_LoadWaveform");
/* configure the timing */
DIOMGR_ConfigurePatternSetTiming (0, residDiomgr, fileName, 1.0e-6,
0.5e-6, 1.0, &errorOccurred, &errorCode, errorMessage);
cs("DIOMGR_ConfigurePatternSetTiming");
/* run the test */
DIOMGR_ExecutePatternSet (0, residDiomgr, fileName, "SYNCHRONOUS",
&patternSetResult, &errorOccurred, &errorCode, errorMessage);
cs("DIOMGR_ExecutePatternSet");
if ( DIOMGR_VAL_RESULT_FAILED == patternSetResult )
{
printf ( "Pattern set failed\n" );
diagnosis ();
}
else
{
printf ( "Pattern set passed\n" );
}
DIOMGR_SaveWaveform (0, residDiomgr, fileName, fileNameResult, "TBL",
&errorOccurred, &errorCode, errorMessage);
cs("DIOMGR_SaveWaveform");
DIOMGR_UnloadWaveform (0, residDiomgr, fileName,
&errorOccurred, &errorCode, errorMessage);
cs("DIOMGR_UnloadWaveform");
}
7.3.1.4 Evaluation of Failed Patterns
/* FUNCTION *******************************************************************/
/* reads information about pattern set failures and prints it to stdout
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*******************************************************************************/
static void diagnosis ( void )
{
long executedPatternCount;
long failedPatternCount;
long failedChannelCount;
char failedChannelNames[1024];
long bufferSize;
char * pData = NULL;
char * pResults = NULL;
char * token = NULL;
int i;
int numFail;
/* read results about pattern set failure */
DIOMGR_GetPatternSetExecutedPatternCount (0, residDiomgr, fileName,
&executedPatternCount, &errorOccurred, &errorCode, errorMessage );
cs("DIOMGR_GetPatternSetExecutedPatternCount");
printf ( "%d patterns executed\n", executedPatternCount );
DIOMGR_GetPatternSetFailedPatternCount (0, residDiomgr, fileName,
&failedPatternCount, &errorOccurred, &errorCode, errorMessage );
cs("DIOMGR_GetPatternSetFailedPatternCount");
printf ( "%d patterns failed\n", failedPatternCount );
DIOMGR_GetPatternSetFailedChannelCount (0, residDiomgr, fileName,
&failedChannelCount, &errorOccurred, &errorCode, errorMessage );
cs("DIOMGR_GetPatternSetFailedChannelCount");
printf ( "%d channels failed:\n", failedChannelCount );
DIOMGR_GetPatternSetFailedChannelNames (0, residDiomgr, fileName,
sizeof(failedChannelNames), failedChannelNames,
&errorOccurred, &errorCode, errorMessage );
cs("DIOMGR_GetPatternSetFailedChannelNames");
printf ( " %s\n", failedChannelNames );
/* allocate memory for data and pass/fail */
bufferSize = executedPatternCount + 1;
pData = malloc ( bufferSize );
pResults = malloc ( bufferSize );
/* cycle thru the channel names, output data and mark errors */
token = strtok (failedChannelNames, ",");
while ( token )
{
/* "token" contains a failed channel name */
DIOMGR_GetPatternSetChannelData ( 0, residDiomgr, fileName, token,
bufferSize, pData, &errorOccurred, &errorCode, errorMessage );
cs("DIOMGR_GetPatternSetChannelData");
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DIOMGR_GetPatternSetChannelResults ( 0, residDiomgr, fileName, token,
bufferSize, pResults, &errorOccurred, &errorCode, errorMessage );
cs("DIOMGR_GetPatternSetChannelResults");
/* 1=passed, 0=failed. Replace "failed" by an X and "passed" by a space */
numFail = 0;
for ( i=0; i<bufferSize; i++ )
{
switch ( pResults[i] )
{
case '0':
pResults[i] = 'X';
numFail++;
break;
case '1':
pResults[i] = ' ';
break;
default:
break;
}
}
printf ( "\n%s : %d fails\n", token, numFail );
printf ( "- Data : %s\n", pData );
printf ( "- Results : %s\n", pResults );
/* get next channel name */
token = strtok ( NULL, "," );
}
free ( pData );
free ( pResults );
}
7.3.2 Dynamic Pattern Execution with IVI Digital
7.3.2.1 Main Function
The return value of a device driver call is stored in the module‑global variable sta. The
status code is checked using the chk() function.
/* Example using IVI functions for dynamic pattern execution */
#include <ansi_c.h>
#include "rspio4.h"
/* adapt the resource descriptor to your test system! */
static char resDesc[] = "PXI5::11::INSTR";
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static char patternSetName[] = "823916";
/* channel names */
static char o1[] = "OUT1";
static char o2[] = "OUT2";
static char o3[] = "OUT3";
static char o4[] = "OUT4";
static char o5[] = "OUT5";
static char bus[] = "OUT20-OUT27";
static char out[] = "OUT1-OUT31";
static char i1[] = "IN1";
static char i2[] = "IN2";
static char i3[] = "IN3";
static char i4[] = "IN4";
static char in[] = "IN1-IN32";
static ViStatus sta;
static ViSession vi;
/* prototypes */
static void chk ( char * funcName );
static void runTest ( void );
static void createPatternSet ( void );
static void diagnosis ( void );
/* FUNCTION *******************************************************************/
/* loads the driver and runs the test
*******************************************************************************/
int main (int argc, char *argv[])
{
printf("Example using IVI functions for dynamic pattern execution\n\n");
/* open driver */
sta = rspio4_InitWithOptions(resDesc, VI_TRUE, VI_TRUE, "Simulate=0", &vi);
/* check return value */
chk ("rspio4_InitWithOptions");
if ( VI_SUCCESS == sta )
{
runTest();
/* close driver */
sta = rspio4_close(vi);
chk ("rspio4_close");
}
printf("\nPress 'Enter' to terminate\n");
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getchar();
return 0;
}
This function checks the return values of a driver call. An error message is issued if
there is an error.
/* FUNCTION *******************************************************************/
/* checks the return status of a driver call
*******************************************************************************/
static void chk ( char * funcName )
{
if ( sta != VI_SUCCESS )
{
char errorMessage[256];
rspio4_error_message(vi, sta, errorMessage);
printf ("%s returned 0x%08X; %s\n", funcName, sta, errorMessage);
}
}
7.3.2.3 Execution of Digital Test
/* FUNCTION *******************************************************************/
/* configures the digital test, loads the test and executes it.
*******************************************************************************/
static void runTest ( void )
{
ViInt32 patternSetResult;
/* configure stimulus and response levels */
sta = rspio4_ConfigurePortVoltageRange(vi,
RSPIO4_MASK_PORT_ALL, RSPIO4_PORT_VOLTAGE_RANGE_2);
chk ("rspio4_ConfigurePortVoltageRange");
sta = rspio4_ConfigureStimPort(vi, RSPIO4_MASK_PORT_ALL,
RSPIO4_STIM_MODE_TTL, 3.3, 0.0, 0.1);
chk ("rspio4_ConfigureStimPort");
sta = rspio4_ConfigureRespPort(vi, RSPIO4_MASK_PORT_ALL,
RSPIO4_RESP_MODE_HYST, 2.0, 0.8);
chk ("rspio4_ConfigureRespPort");
/* configure module for dynamic test and result collection */
sta = rspio4_ConfigureMode(vi, RSPIO4_VAL_EXECUTE_DYNAMIC,
RSPIO4_VAL_COLLECT_ALL);
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chk ("rspio4_ConfigureMode");
/* create and load the pattern set */
createPatternSet();
/* configure the timing */
sta = rspio4_ConfigurePatternSetTiming(vi, patternSetName, 1.0e-6, 0.5e-6);
chk ("rspio4_ConfigurePatternSetTiming");
/* run the test */
sta = rspio4_ExecutePatternSet(vi, patternSetName, 1000);
chk ("rspio4_ExecutePatternSet");
/* fetch pass/fail result */
sta = rspio4_FetchPatternSetResult(vi, patternSetName, &patternSetResult);
chk ("rspio4_FetchPatternSetResult");
if ( RSPIO4_VAL_RESULT_FAIL == patternSetResult )
{
printf("Pattern set failed\n");
diagnosis ();
}
else
{
printf("Pattern set passed\n");
}
/* clear pattern set */
sta = rspio4_ClearPatternSet(vi, patternSetName);
chk ("rspio4_ClearPatternSet");
}
7.3.2.4 Generation of Pattern Set
/* FUNCTION *******************************************************************/
/* creates and loads a pattern set
channel assignment:
E_COM = out1
E_EC1 = out2
E_EC2 = out3
E_EC3 = out4
N14CR0805170 = out5
bus = out20 - out27
N13HCPL31500 = in1
N13HCPM31500 = in2
N13HCPN31500 = in3
N13HCPO31500 = in4
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*******************************************************************************/
static void createPatternSet ( void )
{
ViInt32 ph;
/* create a pattern set */
sta = rspio4_CreatePatternSet(vi, patternSetName);
chk ("rspio4_CreatePatternSet");
/* create a pattern */
sta = rspio4_CreatePattern(vi, &ph);
chk ("rspio4_CreatePattern");
/* start loading */
sta = rspio4_BeginPatternSetLoading(vi, patternSetName);
chk ("rspio4_BeginPatternSetLoading");
/*** 1. pattern : stim all zero, resp don't care */
sta = rspio4_ConfigureChannelOpcode(vi, ph, o1, RSPIO4_VAL_OPCODE_IL);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o2, RSPIO4_VAL_OPCODE_IL);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o3, RSPIO4_VAL_OPCODE_IL);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o4, RSPIO4_VAL_OPCODE_IL);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o5, RSPIO4_VAL_OPCODE_IL);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureGroupOpcode(vi, ph, bus, RSPIO4_VAL_GROUP_INPUT, 0x0);
chk ("rspio4_ConfigureGroupOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, i1, RSPIO4_VAL_OPCODE_IOX);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, i2, RSPIO4_VAL_OPCODE_IOX);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, i3, RSPIO4_VAL_OPCODE_IOX);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, i4, RSPIO4_VAL_OPCODE_IOX);
chk ("rspio4_ConfigureChannelOpcode");
/* load pattern */
sta = rspio4_LoadDynamicPattern(vi, patternSetName, ph);
chk ("rspio4_LoadDynamicPattern");
// NOTE : previously assigned channels keep their channel opcode in
// the following pattern. Therefore only the changes have to be
// programmed
/*** 2. pattern: N14CR0805170 = 1, bus = 01 */
sta = rspio4_ConfigureChannelOpcode(vi, ph, o5, RSPIO4_VAL_OPCODE_IH);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureGroupOpcode(vi, ph, bus, RSPIO4_VAL_GROUP_INPUT, 0x01);
chk ("rspio4_ConfigureGroupOpcode");
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/* load pattern */
sta = rspio4_LoadDynamicPattern(vi, patternSetName, ph);
chk ("rspio4_LoadDynamicPattern");
/*** 3. pattern: all stim tristate, bus = 02 */
sta = rspio4_ConfigureChannelOpcode(vi, ph, o1, RSPIO4_VAL_OPCODE_IOX);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o2, RSPIO4_VAL_OPCODE_IOX);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o3, RSPIO4_VAL_OPCODE_IOX);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o4, RSPIO4_VAL_OPCODE_IOX);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o5, RSPIO4_VAL_OPCODE_IOX);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureGroupOpcode(vi, ph, bus, RSPIO4_VAL_GROUP_INPUT, 0x02);
chk ("rspio4_ConfigureGroupOpcode");
/* load pattern */
sta = rspio4_LoadDynamicPattern(vi, patternSetName, ph);
chk ("rspio4_LoadDynamicPattern");
/*** 4. pattern: all stim = 0, bus = 03 */
sta = rspio4_ConfigureChannelOpcode(vi, ph, o1, RSPIO4_VAL_OPCODE_IL);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o2, RSPIO4_VAL_OPCODE_IL);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o3, RSPIO4_VAL_OPCODE_IL);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o4, RSPIO4_VAL_OPCODE_IL);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o5, RSPIO4_VAL_OPCODE_IL);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureGroupOpcode(vi, ph, bus, RSPIO4_VAL_GROUP_INPUT, 0x03);
chk ("rspio4_ConfigureGroupOpcode");
/* load pattern */
sta = rspio4_LoadDynamicPattern(vi, patternSetName, ph);
chk ("rspio4_LoadDynamicPattern");
/*** 5. pattern: N14CR0805170 = 1, bus = 04 */
sta = rspio4_ConfigureChannelOpcode(vi, ph, o5, RSPIO4_VAL_OPCODE_IH);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureGroupOpcode(vi, ph, bus, RSPIO4_VAL_GROUP_INPUT, 0x04);
chk ("rspio4_ConfigureGroupOpcode");
/* load pattern */
sta = rspio4_LoadDynamicPattern(vi, patternSetName, ph);
chk ("rspio4_LoadDynamicPattern");
/*** 6. pattern: all stim tristate, bus = 05 */
sta = rspio4_ConfigureChannelOpcode(vi, ph, o1, RSPIO4_VAL_OPCODE_IOX);
chk ("rspio4_ConfigureChannelOpcode");
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sta = rspio4_ConfigureChannelOpcode(vi, ph, o2, RSPIO4_VAL_OPCODE_IOX);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o3, RSPIO4_VAL_OPCODE_IOX);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o4, RSPIO4_VAL_OPCODE_IOX);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o5, RSPIO4_VAL_OPCODE_IOX);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureGroupOpcode(vi, ph, bus, RSPIO4_VAL_GROUP_INPUT, 0x05);
chk ("rspio4_ConfigureGroupOpcode");
/* load pattern */
sta = rspio4_LoadDynamicPattern(vi, patternSetName, ph);
chk ("rspio4_LoadDynamicPattern");
/*** 7. pattern: all stim = 0, bus = 06, resp N13HCPN31500 = 1 */
sta = rspio4_ConfigureChannelOpcode(vi, ph, o1, RSPIO4_VAL_OPCODE_IL);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o2, RSPIO4_VAL_OPCODE_IL);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o3, RSPIO4_VAL_OPCODE_IL);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o4, RSPIO4_VAL_OPCODE_IL);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o5, RSPIO4_VAL_OPCODE_IL);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureGroupOpcode(vi, ph, bus, RSPIO4_VAL_GROUP_INPUT, 0x06);
chk ("rspio4_ConfigureGroupOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, i3, RSPIO4_VAL_OPCODE_OH);
chk ("rspio4_ConfigureChannelOpcode");
/* load pattern */
sta = rspio4_LoadDynamicPattern(vi, patternSetName, ph);
chk ("rspio4_LoadDynamicPattern");
/* ... etc ... */
/* last pattern : all tristate / don't care */
sta = rspio4_ConfigureGroupOpcode(vi, ph, out, RSPIO4_VAL_GROUP_IGNORE, 0x0);
chk ("rspio4_ConfigureGroupOpcode");
sta = rspio4_ConfigureGroupOpcode(vi, ph, in, RSPIO4_VAL_GROUP_IGNORE, 0x0);
chk ("rspio4_ConfigureGroupOpcode");
/* load pattern */
sta = rspio4_LoadDynamicPattern(vi, patternSetName, ph);
chk ("rspio4_LoadDynamicPattern");
/* loading finished */
sta = rspio4_EndPatternSetLoading(vi, patternSetName);
chk ("rspio4_EndPatternSetLoading");
/* pattern is no longer used */
sta = rspio4_ClearPattern(vi, ph);
chk ("rspio4_ClearPattern");
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}
/* FUNCTION *******************************************************************/
/* reads information about pattern set failures and prints it to stdout
*******************************************************************************/
static void diagnosis ( void )
{
ViInt32 executedPatternCount;
ViInt32 numChannels = 4; /* in1 - in4 */
ViInt32 * pResults;
ViInt32 * pData;
ViInt32 * pPatterns;
ViInt32 actualSize;
int pattern;
int channel;
int idx;
int failedPatterns;
sta = rspio4_GetPatternSetExecutedPatternCount (vi, patternSetName,
&executedPatternCount);
chk ("rspio4_GetPatternSetExecutedPatternCount");
printf("%d patterns executed\n", executedPatternCount);
pResults = calloc(numChannels * executedPatternCount, sizeof(ViInt32));
pData = calloc(numChannels * executedPatternCount, sizeof(ViInt32));
pPatterns = calloc(executedPatternCount, sizeof(ViInt32));
/* upload pattern results */
sta = rspio4_FetchDynamicPatternListResults (vi, patternSetName,
0, executedPatternCount, executedPatternCount, pPatterns, &actualSize);
chk ("rspio4_FetchDynamicPatternListResults");
/* calculate number of failed patterns */
failedPatterns = 0;
for ( pattern = 0; pattern < executedPatternCount; pattern++ )
{
if ( RSPIO4_VAL_RESULT_FAIL == pPatterns[pattern] )
{
failedPatterns++;
}
}
printf("%d patterns failed\n", failedPatterns);
/* upload data and results for in1 - in4 */
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sta = rspio4_FetchDynamicChannelListPatternData(vi, patternSetName,
0, executedPatternCount, "in1,in2,in3,in4",
numChannels * executedPatternCount, pData, &actualSize);
chk ("rspio4_FetchDynamicChannelListPatternData");
sta = rspio4_FetchDynamicChannelListPatternResults (vi, patternSetName,
0, executedPatternCount, "in1,in2,in3,in4",
numChannels * executedPatternCount, pResults, &actualSize);
chk ("rspio4_FetchDynamicChannelListPatternResults");
for ( channel = 0; channel < numChannels; channel ++ )
{
printf("\nin%d :\n", channel+1);
/* data */
printf("- Data : ");
for ( pattern = 0; pattern < executedPatternCount; pattern++ )
{
idx = pattern * numChannels + channel;
switch ( pData[idx] )
{
case RSPIO4_VAL_DATA_HIGH:
printf("1");
break;
case RSPIO4_VAL_DATA_LOW:
printf("0");
break;
default:
printf("?");
break;
}
}
printf("\n");
/* results */
printf("- Results : ");
for ( pattern = 0; pattern < executedPatternCount; pattern++ )
{
idx = pattern * numChannels + channel;
switch ( pResults[idx] )
{
case RSPIO4_VAL_RESULT_PASS:
printf(" ");
break;
case RSPIO4_VAL_RESULT_FAIL:
printf("X");
break;
default:
printf("?");
break;
}
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7.3.3.1 Main Function
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Programming Examples for R&S TS-PIO4
}
printf("\n");
}
free(pResults);
free(pData);
free(pPatterns);
}
/* Example using IVI functions for static pattern execution */
#include <ansi_c.h>
#include "rspio4.h"
/* adapt the resource descriptor to your test system! */
static char resDesc[] = "PXI5::11::INSTR";
/* channel names */
static char o1[] = "OUT1";
static char o2[] = "OUT2";
static char o3[] = "OUT3";
static char o4[] = "OUT4";
static char o5[] = "OUT5";
static char bus[] = "OUT20-OUT27";
static char out[] = "OUT1-OUT31";
static char i1[] = "IN1";
static char i2[] = "IN2";
static char i3[] = "IN3";
static char i4[] = "IN4";
static char in[] = "IN1-IN32";
static ViStatus sta;
static ViSession vi;
/* prototypes */
static void chk ( char * funcName );
static void runTest ( void );
static void executePatternSet ( void );
static void executePattern ( ViInt32 patternHandle, ViInt32 patternIdx );
static void diagnosis ( void );
/* FUNCTION *******************************************************************/
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/* loads the driver and runs the test
*******************************************************************************/
int main (int argc, char *argv[])
{
printf("Example using IVI functions for static pattern execution\n\n");
/* open driver */
sta = rspio4_InitWithOptions(resDesc, VI_TRUE, VI_TRUE, "Simulate=0", &vi);
/* check return value */
chk ("rspio4_InitWithOptions");
if ( VI_SUCCESS == sta )
{
runTest();
/* close driver */
sta = rspio4_close(vi);
chk ("rspio4_close");
}
printf("\nPress 'Enter' to terminate\n");
getchar();
return 0;
}
7.3.3.2 Error Handling
This function checks the return values of a driver call. An error message is issued if
there is an error.
/* FUNCTION *******************************************************************/
/* checks the return status of a driver call
*******************************************************************************/
static void chk ( char * funcName )
{
if ( sta != VI_SUCCESS )
{
char errorMessage[256];
rspio4_error_message(vi, sta, errorMessage);
printf ("%s returned 0x%08X; %s\n", funcName, sta, errorMessage);
}
}
7.3.3.3 Execution of Digital Test
/* FUNCTION *******************************************************************/
/* configures the digital test, loads the test and executes it.
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*******************************************************************************/
static void runTest ( void )
{
/* configure stimulus and response levels */
sta = rspio4_ConfigurePortVoltageRange(vi,
RSPIO4_MASK_PORT_ALL, RSPIO4_PORT_VOLTAGE_RANGE_2);
chk ("rspio4_ConfigurePortVoltageRange");
sta = rspio4_ConfigureStimPort(vi, RSPIO4_MASK_PORT_ALL,
RSPIO4_STIM_MODE_TTL, 3.3, 0.0, 0.1);
chk ("rspio4_ConfigureStimPort");
sta = rspio4_ConfigureRespPort(vi, RSPIO4_MASK_PORT_ALL,
RSPIO4_RESP_MODE_HYST, 2.0, 0.8);
chk ("rspio4_ConfigureRespPort");
/* configure module for static test and result collection */
sta = rspio4_ConfigureMode(vi, RSPIO4_VAL_EXECUTE_STATIC,
RSPIO4_VAL_COLLECT_ALL);
chk ("rspio4_ConfigureMode");
/* configure the timing */
sta = rspio4_ConfigureStaticResponseDelay (vi, 0.5e-6);
chk ("rspio4_ConfigureStaticResponseDelay");
/* execute the pattern set */
executePatternSet();
}
7.3.3.4 Execution of a Pattern Set
/* FUNCTION *******************************************************************/
/* creates and executes a pattern set
channel assignment:
E_COM = out1
E_EC1 = out2
E_EC2 = out3
E_EC3 = out4
N14CR0805170 = out5
bus = out20 - out27
N13HCPL31500 = in1
N13HCPM31500 = in2
N13HCPN31500 = in3
N13HCPO31500 = in4
*******************************************************************************/
static void executePatternSet ( void )
{
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ViInt32 ph;
ViInt32 patternIdx = 1;
/* create a pattern */
sta = rspio4_CreatePattern(vi, &ph);
chk ("rspio4_CreatePattern");
/*** 1. pattern : stim all zero, resp don't care */
sta = rspio4_ConfigureChannelOpcode(vi, ph, o1, RSPIO4_VAL_OPCODE_IL);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o2, RSPIO4_VAL_OPCODE_IL);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o3, RSPIO4_VAL_OPCODE_IL);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o4, RSPIO4_VAL_OPCODE_IL);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o5, RSPIO4_VAL_OPCODE_IL);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureGroupOpcode(vi, ph, bus, RSPIO4_VAL_GROUP_INPUT, 0x0);
chk ("rspio4_ConfigureGroupOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, i1, RSPIO4_VAL_OPCODE_IOX);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, i2, RSPIO4_VAL_OPCODE_IOX);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, i3, RSPIO4_VAL_OPCODE_IOX);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, i4, RSPIO4_VAL_OPCODE_IOX);
chk ("rspio4_ConfigureChannelOpcode");
executePattern(ph, patternIdx++);
// NOTE : previously assigned channels keep their channel opcode in
// the following pattern. Therefore only the changes have to be
// programmed
/*** 2. pattern: N14CR0805170 = 1, bus = 01 */
sta = rspio4_ConfigureChannelOpcode(vi, ph, o5, RSPIO4_VAL_OPCODE_IH);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureGroupOpcode(vi, ph, bus, RSPIO4_VAL_GROUP_INPUT, 0x01);
chk ("rspio4_ConfigureGroupOpcode");
executePattern(ph, patternIdx++);
/*** 3. pattern: all stim tristate, bus = 02 */
sta = rspio4_ConfigureChannelOpcode(vi, ph, o1, RSPIO4_VAL_OPCODE_IOX);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o2, RSPIO4_VAL_OPCODE_IOX);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o3, RSPIO4_VAL_OPCODE_IOX);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o4, RSPIO4_VAL_OPCODE_IOX);
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chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o5, RSPIO4_VAL_OPCODE_IOX);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureGroupOpcode(vi, ph, bus, RSPIO4_VAL_GROUP_INPUT, 0x02);
chk ("rspio4_ConfigureGroupOpcode");
executePattern(ph, patternIdx++);
/*** 4. pattern: all stim = 0, bus = 03 */
sta = rspio4_ConfigureChannelOpcode(vi, ph, o1, RSPIO4_VAL_OPCODE_IL);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o2, RSPIO4_VAL_OPCODE_IL);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o3, RSPIO4_VAL_OPCODE_IL);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o4, RSPIO4_VAL_OPCODE_IL);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o5, RSPIO4_VAL_OPCODE_IL);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureGroupOpcode(vi, ph, bus, RSPIO4_VAL_GROUP_INPUT, 0x03);
chk ("rspio4_ConfigureGroupOpcode");
executePattern(ph, patternIdx++);
/*** 5. pattern: N14CR0805170 = 1, bus = 04 */
sta = rspio4_ConfigureChannelOpcode(vi, ph, o5, RSPIO4_VAL_OPCODE_IH);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureGroupOpcode(vi, ph, bus, RSPIO4_VAL_GROUP_INPUT, 0x04);
chk ("rspio4_ConfigureGroupOpcode");
executePattern(ph, patternIdx++);
/*** 6. pattern: all stim tristate, bus = 05 */
sta = rspio4_ConfigureChannelOpcode(vi, ph, o1, RSPIO4_VAL_OPCODE_IOX);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o2, RSPIO4_VAL_OPCODE_IOX);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o3, RSPIO4_VAL_OPCODE_IOX);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o4, RSPIO4_VAL_OPCODE_IOX);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o5, RSPIO4_VAL_OPCODE_IOX);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureGroupOpcode(vi, ph, bus, RSPIO4_VAL_GROUP_INPUT, 0x05);
chk ("rspio4_ConfigureGroupOpcode");
executePattern(ph, patternIdx++);
/*** 7. pattern: all stim = 0, bus = 06, resp N13HCPN31500 = 1 */
sta = rspio4_ConfigureChannelOpcode(vi, ph, o1, RSPIO4_VAL_OPCODE_IL);
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chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o2, RSPIO4_VAL_OPCODE_IL);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o3, RSPIO4_VAL_OPCODE_IL);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o4, RSPIO4_VAL_OPCODE_IL);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, o5, RSPIO4_VAL_OPCODE_IL);
chk ("rspio4_ConfigureChannelOpcode");
sta = rspio4_ConfigureGroupOpcode(vi, ph, bus, RSPIO4_VAL_GROUP_INPUT, 0x06);
chk ("rspio4_ConfigureGroupOpcode");
sta = rspio4_ConfigureChannelOpcode(vi, ph, i3, RSPIO4_VAL_OPCODE_OH);
chk ("rspio4_ConfigureChannelOpcode");
executePattern(ph, patternIdx++);
/* ... etc ... */
/* last pattern : all tristate / don't care */
sta = rspio4_ConfigureGroupOpcode(vi, ph, out, RSPIO4_VAL_GROUP_IGNORE, 0x0);
chk ("rspio4_ConfigureGroupOpcode");
sta = rspio4_ConfigureGroupOpcode(vi, ph, in, RSPIO4_VAL_GROUP_IGNORE, 0x0);
chk ("rspio4_ConfigureGroupOpcode");
executePattern(ph, patternIdx++);
/* pattern is no longer used */
sta = rspio4_ClearPattern(vi, ph);
chk ("rspio4_ClearPattern");
}
7.3.3.5 Execution of a Single Pattern
/* FUNCTION *******************************************************************/
/* executes a single pattern
*******************************************************************************/
static void executePattern ( ViInt32 patternHandle, ViInt32 patternIdx )
{
ViInt32 patternResult;
sta = rspio4_ExecuteStaticPattern(vi, patternHandle);
chk ("rspio4_ExecuteStaticPattern");
sta = rspio4_FetchStaticPatternResult (vi, &patternResult);
chk ("rspio4_FetchStaticPatternResult");
if ( RSPIO4_VAL_RESULT_FAIL == patternResult )
{
printf("Pattern %d failed\n", patternIdx);
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diagnosis ();
}
else
{
printf("Pattern %d passed\n", patternIdx);
}
}
/* FUNCTION *******************************************************************/
/* reads information about pattern failures and prints it to stdout
*******************************************************************************/
static void diagnosis ( void )
{
ViInt32 numChannels = 4; /* in1 - in4 */
ViInt32 results[4];
ViInt32 data[4];
ViInt32 actualSize;
int channel;
/* upload data and results for in1 - in4 */
sta = rspio4_FetchStaticChannelListData(vi, "in1,in2,in3,in4",
numChannels, data, &actualSize);
chk ("rspio4_FetchStaticChannelListData");
sta = rspio4_FetchStaticChannelListResults(vi, "in1,in2,in3,in4",
numChannels, results, &actualSize);
chk ("rspio4_FetchStaticChannelListResults");
for ( channel = 0; channel < numChannels; channel ++ )
{
printf(" in%d ", channel+1);
switch ( data[channel] )
{
case RSPIO4_VAL_DATA_HIGH:
printf("high ");
break;
case RSPIO4_VAL_DATA_LOW:
printf("low ");
break;
default:
printf("? ");
break;
}
switch ( results[channel] )
{
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case RSPIO4_VAL_RESULT_PASS:
printf("pass");
break;
case RSPIO4_VAL_RESULT_FAIL:
printf("fail");
break;
default:
printf("not available");
break;
}
printf("\n");
}
}
7.3.4.1 Main Function
/* Example using low level driver functions for static pattern execution */
#include <utility.h>
#include <ansi_c.h>
#include "rspio4.h"
#define PATTERN_COUNT 8
/* adapt the resource descriptor to your test system! */
static char resDesc[] = "PXI7::12::INSTR";
static ViUInt32 stimData[PATTERN_COUNT] = {
0x00000000,
0x00000010,
0x0000001F, /* OUT1 to OUT4 tri state */
0x00000000,
0x00000010,
0x0000001F, /* OUT1 to OUT4 tri state */
0x00000000,
/* etc. */
0xFFFFFFFF /* all channels tri state */
};
static ViUInt32 enableData[PATTERN_COUNT] = {
0xFFFFFFFF,
0xFFFFFFFF,
0xFFFFFFF0, /* OUT1 to OUT4 tri state */
0xFFFFFFFF,
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0xFFFFFFFF,
0xFFFFFFF0, /* OUT1 to OUT4 tri state */
0xFFFFFFFF,
/* etc. */
0x00000000 /* all channels tri state */
};
static ViStatus sta;
static ViSession vi;
/* prototypes */
static void chk ( char * funcName );
static void runTest ( void );
static void executePatternSet( void );
/* FUNCTION *******************************************************************/
/* loads the driver and runs the test
*******************************************************************************/
int main(int argc, char *argv[])
{
printf("Use of low level driver functions for static pattern execution\n\n");
/* open a session to the device driver */
sta = rspio4_InitWithOptions(resDesc, VI_TRUE, VI_TRUE, "Simulate=0", & vi);
chk ("rspio4_InitWithOptions");
if (VI_SUCCESS == sta)
{
runTest();
/* close the driver */
sta = rspio4_close(vi);
chk ("rsphdt_close");
}
printf("\nPress 'Enter' to terminate\n");
getchar();
return 0;
}
7.3.4.2 Error Handling
This function checks the return values of a driver call. A message is issued if there is
an error.
/* FUNCTION *******************************************************************/
/* checks the return status of a driver call
*******************************************************************************/
static void chk ( char * funcName )
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{
if ( sta != VI_SUCCESS )
{
char errorMessage[256];
rspio4_error_message(vi, sta, errorMessage);
printf ("%s returned 0x%08X; %s\n", funcName, sta, errorMessage);
}
}
/* FUNCTION *******************************************************************/
/* configures the digital test and executes it
*******************************************************************************/
static void runTest ( void )
{
ViReal64 voltageHigh = 3.3;
ViReal64 voltageLow = 0.0;
ViReal64 currentLimit = 0.1;
ViReal64 thresholdHigh = 2.0;
ViReal64 thresholdLow = 0.8;
/* configure voltage range */
sta = rspio4_ConfigurePortVoltageRange(vi,
RSPIO4_MASK_PORT_ALL, RSPIO4_PORT_VOLTAGE_RANGE_2);
chk ("rspio4_ConfigurePortVoltageRange");
/* configure driver voltage levels */
sta = rspio4_ConfigureStimPort(vi, RSPIO4_MASK_PORT_ALL,
RSPIO4_STIM_MODE_TTL, voltageHigh, voltageLow, currentLimit);
chk ("rspio4_ConfigureStimPort");
/* use hysteresis comparator mode for all sensors */
sta = rspio4_ConfigureRespPort(vi, RSPIO4_MASK_PORT_ALL,
RSPIO4_RESP_MODE_HYST, thresholdHigh, thresholdLow);
chk ("rspio4_ConfigureRespPort");
/* configure module for static test and result collection */
sta = rspio4_ConfigureMode(vi, RSPIO4_VAL_EXECUTE_STATIC,
RSPIO4_VAL_COLLECT_ALL);
chk ("rspio4_ConfigureMode");
/* configure 32 bit static operation */
sta = rspio4_ConfigureStimMode (vi, RSPIO4_VAL_CTRL_STATIC);
chk ("rspio4_ConfigureStimMode");
sta = rspio4_ConfigureRespMode(vi, RSPIO4_VAL_CTRL_STATIC);
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chk ("rspio4_ConfigureRespMode");
/* executes the pattern set */
executePatternSet();
}
/* FUNCTION *******************************************************************/
/* executes the pattern set
*******************************************************************************/
static void executePatternSet( void )
{
int loopIdx;
ViUInt32 response;
ViUInt32 enableMask = 0xFFFFFFFF;
ViReal64 uutResponseDelay = 0.001;
printf("Idx | Stimulus | Enable | Response \n");
printf("----+------------+------------+-----------\n");
for (loopIdx = 0; loopIdx < PATTERN_COUNT; loopIdx++)
{
sta = rspio4_SetDoutPort(vi, enableMask,
stimData[loopIdx], enableMask, enableData[loopIdx]);
chk ("rspio4_SetDoutPort");
Delay(uutResponseDelay);
sta = rspio4_GetDinState(vi, &response);
chk ("rspio4_GetDinState");
printf("%3d | 0x%08X | 0x%08X | 0x%08X\n", loopIdx,
stimData[loopIdx], enableData[loopIdx], response);
}
}
7.3.5 Dynamic Pattern Execution with Low‑Level Driver Functions
7.3.5.1 Main Function
/* Example using low level driver functions for dynamic pattern execution */
#include <ansi_c.h>
#include "rspio4.h"
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#define PATTERN_COUNT 8
#define PATTERN_PERIOD 1.0e-6
#define FETCH_TIMEOUT 0.1
/* adapt the resource descriptor to your test system! */
static char resDesc[] = "PXI5::11::INSTR";
static ViUInt32 stimData[PATTERN_COUNT] = {
0x00000000,
0x00000010,
0x0000001F, /* tri state */
0x00000000,
0x00000010,
0x0000001F, /* tri state */
0x00000000,
/* etc. */
0xFFFFFFFF
};
static ViUInt32 stimTristate[PATTERN_COUNT] = {
0x00000000,
0x00000000,
0x00000003, /* port 0 and port 1 tri state (OUT1 to OUT8) */
0x00000000,
0x00000000,
0x00000003, /* port 0 and port 1 tri state (OUT1 to OUT8) */
0x00000000,
/* etc. */
0x000000FF /* port 0 to port 7 tri state (OUT1 to OUT32) */
};
static ViStatus sta;
static ViSession vi;
static ViUInt16 memId;
/* data buffer */
static RSPIO4_DATA_32BIT_TRISTATE stimulus[PATTERN_COUNT];
static RSPIO4_DATA_32BIT response[PATTERN_COUNT];
/* prototypes */
static void chk ( char * funcName );
static void runTest ( void );
static void createPatternSet ( void );
/* FUNCTION *******************************************************************/
/* loads the driver and runs the test
*******************************************************************************/
int main(int argc, char *argv[])
{
printf("Use of low level driver functions for dynamic pattern execution\n\n");
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/* open a session to the device driver */
sta = rspio4_InitWithOptions(resDesc, VI_TRUE, VI_TRUE, "Simulate=0", & vi);
/* check return value */
chk ("rspio4_InitWithOptions");
if (VI_SUCCESS == sta)
{
runTest();
/* close the driver */
sta = rspio4_close(vi);
chk ("rspio4_close");
}
printf("\nPress 'Enter' to terminate\n");
getchar();
return 0;
}
7.3.5.2 Error Handling
This function checks the return values of a driver call. A message is issued if there is
an error.
/* FUNCTION *******************************************************************/
/* checks the return status of a driver call
*******************************************************************************/
static void chk ( char * funcName )
{
if ( sta != VI_SUCCESS )
{
char errorMessage[256];
rspio4_error_message(vi, sta, errorMessage);
printf ("%s returned 0x%08X; %s\n", funcName, sta, errorMessage);
}
}
7.3.5.3 Execution of Digital Test
/* FUNCTION *******************************************************************/
/* configures the digital test, loads the test and executes it.
*******************************************************************************/
static void runTest ( void )
{
ViUInt32 respByteCount;
ViInt32 loopIdx;
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ViReal64 voltageHigh = 3.3;
ViReal64 voltageLow = 0.0;
ViReal64 currentLimit = 0.1;
ViReal64 thresholdHigh = 2.0;
ViReal64 thresholdLow = 0.8;
ViReal64 triggerDelayStim = 0.0;
ViReal64 triggerDelayResp = PATTERN_PERIOD / 2.0;
/* set voltage range; */
sta = rspio4_ConfigurePortVoltageRange(vi,
RSPIO4_MASK_PORT_ALL, RSPIO4_PORT_VOLTAGE_RANGE_2);
chk ("rspio4_ConfigurePortVoltageRange");
/* configure driver voltage levels */
sta = rspio4_ConfigureStimPort(vi, RSPIO4_MASK_PORT_ALL,
RSPIO4_STIM_MODE_TTL, voltageHigh, voltageLow, currentLimit);
chk ("rspio4_ConfigureStimPort");
/* configure sensor: set all ports, use hysteresis comparator mode */
sta = rspio4_ConfigureRespPort(vi, RSPIO4_MASK_PORT_ALL,
RSPIO4_RESP_MODE_HYST, thresholdHigh, thresholdLow);
chk ("rspio4_ConfigureRespPort");
/* configure 32 bit wide dynamic operation: OUT1 to OUT32 will be operated
dynamically; no static channels */
sta = rspio4_ConfigureStimMode (vi, RSPIO4_VAL_CTRL_32BIT_TRISTATE);
chk ("rspio4_ConfigureStimMode");
/* configure 32 bit wide dynamic operation */
sta = rspio4_ConfigureRespMode(vi, RSPIO4_VAL_CTRL_32BIT);
chk ("rspio4_ConfigureRespMode");
/* configure stimulus timing */
sta = rspio4_ConfigureStimTiming(vi, triggerDelayStim,
PATTERN_PERIOD, PATTERN_COUNT);
chk ("rspio4_ConfigureStimTiming");
/* configure response timing */
sta = rspio4_ConfigureRespTiming(vi, triggerDelayResp,
PATTERN_PERIOD, PATTERN_COUNT);
chk ("rspio4_ConfigureRespTiming");
/* create and load the pattern set */
createPatternSet();
/* start pattern execution */
sta = rspio4_ExecutePattern(vi, memId);
chk ("rspio4_ExecutePattern");
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/* read the response data */
sta = rspio4_FetchPatternResponseData(vi, sizeof(response),
(ViAddr *)response, FETCH_TIMEOUT, & respByteCount);
chk ("rspio4_FetchPatternResponseData");
/* evaluate response data */
printf("Response data:\n");
for (loopIdx = 0; loopIdx < PATTERN_COUNT; loopIdx++)
{
printf("%2d 0x%08X\n", loopIdx, response[loopIdx].data);
}
/* free stimulus memory */
sta = rspio4_DiscardData(vi, memId);
chk ("rspio4_DiscardData");
}
7.3.5.4 Generation of a Pattern Set
/* FUNCTION *******************************************************************/
/* creates and loads a pattern set
*******************************************************************************/
static void createPatternSet ( void )
{
int loopIdx, portIdx;
ViUInt32 portMask;
ViChar triStateInfo[9];
/* generate stimulus data */
printf("Stimulus data:\n");
for (loopIdx = 0; loopIdx < PATTERN_COUNT; loopIdx++)
{
/* add index information to OUT20 to OUT27 */
stimulus[loopIdx].data = stimData[loopIdx] | (loopIdx << 19);
stimulus[loopIdx].tristate = stimTristate[loopIdx];
portMask = RSPIO4_MASK_PORT0;
for (portIdx = 7; portIdx >= 0; portIdx--)
{
if (stimulus[loopIdx].tristate & portMask)
{
triStateInfo[portIdx] = 'F';
}
else
{
triStateInfo[portIdx] = '0';
}
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7.3.6 Triggered Pattern Execution
Software
Programming Examples for R&S TS-PIO4
portMask = portMask << 1;
}
printf("%2d 0x%08X\n", loopIdx, stimulus[loopIdx].data);
printf(" 0x%s\n", triStateInfo);
}
/* load data to stimulus RAM */
sta = rspio4_LoadData (vi, (ViAddr)s_stimData, sizeof(s_stimData),
RSPIO4_VAL_DATA_TYPE_STIM, & memId);
chk ("rspio4_LoadData");
}
In this example, a pulse on trigger line PXI0 of the TSVP backplane triggers output of
the pattern. The trigger pulse is generated by the R&S TS-PIO4 module itself. Other
measurement modules in the TSVP frame can also use this signal to perform a triggered measurement. It is, of course, also possible to start other R&S TS-PIO4 modules
in the system using this signal. In the example, the stimulus logic and response logic
(IT1 and IT2) are started by the same signal (PXI0). In addition, the output clock of the
stimulus logic (internal trigger logic block 1 or IT1) is routed to pin XTO of the front connector.
7.3.6.1 Main Program
/* Example using low level driver functions for triggered execution */
#include <ansi_c.h>
#include "rspio4.h"
#define PATTERN_COUNT 8
#define PATTERN_PERIOD 1.0e-6
/* adapt the resource descriptor to your test system! */
static char resDesc[] = "PXI5::11::INSTR";
/* data buffer */
static RSPIO4_DATA_32BIT response[PATTERN_COUNT];
static RSPIO4_DATA_32BIT stimulus[PATTERN_COUNT] = {
0x00000000,
0x00000001,
0x00000002,
0x00000003,
0x00000004,
0x00000005,
0x00000006,
0x00000007
};
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Programming Examples for R&S TS-PIO4
static ViStatus sta;
static ViSession vi;
static ViUInt16 memId;
/* prototypes */
static void chk ( char * funcName );
static void runTest ( void );
/* FUNCTION *******************************************************************/
/* loads the driver and runs the test
*******************************************************************************/
int main(int argc, char *argv[])
{
printf("Use of low level driver functions for triggered execution\n\n");
/* open a session to the device driver */
sta = rspio4_InitWithOptions(resDesc, VI_TRUE, VI_TRUE, "Simulate=0", & vi);
/* check return value */
chk ("rspio4_InitWithOptions");
if (VI_SUCCESS == sta)
{
runTest();
/* close the driver */
sta = rspio4_close(vi);
chk ("rspio4_close");
}
printf("\nPress 'Enter' to terminate\n");
getchar();
return 0;
}
7.3.6.2 Error Handling
/* FUNCTION *******************************************************************/
/* checks the return status of a driver call
*******************************************************************************/
static void chk ( char * funcName )
{
if ( sta != VI_SUCCESS )
{
char errorMessage[256];
rspio4_error_message(vi, sta, errorMessage);
printf ("%s returned 0x%08X; %s\n", funcName, sta, errorMessage);
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7.3.6.3 Triggered Digital Test
Software
Programming Examples for R&S TS-PIO4
}
}
/* FUNCTION *******************************************************************/
/* configures the digital test, loads the test and executes it.
*******************************************************************************/
static void runTest ( void )
{
ViUInt32 respByteCount;
ViInt32 loopIdx;
/* set voltage range; */
sta = rspio4_ConfigurePortVoltageRange(vi,
RSPIO4_MASK_PORT_ALL, RSPIO4_PORT_VOLTAGE_RANGE_2);
chk ("rspio4_ConfigurePortVoltageRange");
/* configure driver voltage levels */
sta = rspio4_ConfigureStimPort(vi, RSPIO4_MASK_PORT_ALL,
RSPIO4_STIM_MODE_TTL, 3.3, 0.0, 0.1);
chk ("rspio4_ConfigureStimPort");
/* configure sensor: set all ports, use hysteresis comparator mode */
sta = rspio4_ConfigureRespPort(vi, RSPIO4_MASK_PORT_ALL,
RSPIO4_RESP_MODE_HYST, 2.0, 0.8);
chk ("rspio4_ConfigureRespPort");
/* configure module for dynamic test and result collection */
sta = rspio4_ConfigureMode(vi, RSPIO4_VAL_EXECUTE_DYNAMIC,
RSPIO4_VAL_COLLECT_ALL);
chk ("rspio4_ConfigureMode");
/* configure 32 bit wide dynamic operation */
sta = rspio4_ConfigureStimMode(vi, RSPIO4_VAL_CTRL_32BIT);
chk ("rspio4_ConfigureStimMode");
sta = rspio4_ConfigureRespMode(vi, RSPIO4_VAL_CTRL_32BIT);
chk ("rspio4_ConfigureRespMode");
/* configure stimulus timing */
sta = rspio4_ConfigureStimTiming(vi, 0.0, PATTERN_PERIOD, PATTERN_COUNT);
chk ("rspio4_ConfigureStimTiming");
/* configure response timing */
sta = rspio4_ConfigureRespTiming(vi, PATTERN_PERIOD / 2.0,
PATTERN_PERIOD, PATTERN_COUNT);
chk ("rspio4_ConfigureRespTiming");
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Programming Examples for R&S TS-PIO4
/* load data to stimulus RAM */
sta = rspio4_LoadData (vi, (ViAddr)stimulus, sizeof(stimulus),
RSPIO4_VAL_DATA_TYPE_STIM, & memId);
chk ("rspio4_LoadData");
/* connect all outputs to inputs */
sta = rspio4_ConnectInOut (vi, RSPIO4_MASK_PORT_ALL, RSPIO4_MASK_PORT_ALL);
chk ("rspio4_ConnectInOut");
/* configure trigger logic blocks to output the clock pulses */
sta = rspio4_ConfigItTrigOut(vi, RSPIO4_IT_MASK_IT1 | RSPIO4_IT_MASK_IT2,
RSPIO4_VAL_TRIG_IT_OUT);
chk ("rspio4_ConfigItTrigOut");
/* configure XTO to output the signal of trigger logic block 1 (stimulus) */
sta = rspio4_ConfigXTO(vi, RSPIO4_VAL_TRIG_IT1);
chk ("rspio4_ConfigXTO");
/* general purpose trigger should output a pulse at PXI0 */
sta = rspio4_ConfigPxiTrigOut(vi, RSPIO4_TRIG_MASK_PXI0, RSPIO4_VAL_TRIG_GP,
RSPIO4_TRIG_MASK_PXI0, RSPIO4_TRIG_MASK_PXI0);
chk ("rspio4_ConfigPxiTrigOut");
/* stimmulus and response should be triggert by PXI0 */
sta = rspio4_ConfigHWTriggerInput(vi, RSPIO4_IT_MASK_IT1 | RSPIO4_IT_MASK_IT2,
RSPIO4_TRIG_MASK_PXI0, RSPIO4_TRIG_MASK_PXI0,
RSPIO4_VAL_FALLING_EDGE);
chk ("rspio4_ConfigHWTriggerInput");
/* load the stimulus buffer for triggered pattern generation */
sta = rspio4_LoadStimBuffer (vi, memId);
chk ("rspio4_LoadStimBuffer");
/* arm trigger logic blocks */
sta = rspio4_EnableHWTrigger(vi, RSPIO4_IT_MASK_IT1 | RSPIO4_IT_MASK_IT2,
RSPIO4_IT_MASK_IT1 | RSPIO4_IT_MASK_IT2);
chk ("rspio4_EnableHWTrigger");
/* wait until all pending hardware configurations have settled */
sta = rspio4_WaitForDebounce(vi, 100);
chk ("rspio4_WaitForDebounce");
/* generate the general purpose trigger pulse at PXI0 */
sta = rspio4_InitiateSWTrigger(vi, RSPIO4_IT_MASK_GP);
chk ("rspio4_InitiateSWTrigger");
/* wait until the pattern execution has finished; read the response data */
sta = rspio4_FetchPatternResponseData(vi, sizeof(response),
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(ViAddr *)response, 0.1, & respByteCount);
chk ("rspio4_FetchPatternResponseData");
/* evaluate response data */
printf("Idx | Stimulus | Response \n");
printf("-----------------------------\n");
for (loopIdx = 0; loopIdx < PATTERN_COUNT; loopIdx++)
{
printf("% 3d | 0x%08X | 0x%08X\n",
loopIdx, stimulus[loopIdx].data, response[loopIdx].data);
}
/* free stimulus memory */
sta = rspio4_DiscardData(vi, memId);
chk ("rspio4_DiscardData");
}
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R&S®TS-PIO4
Self‑Test
8 Self‑Test
The R&S TS-PIO4 digital functional test module has built‑in self‑test capability. The following tests are implemented:
●
LED test
●
Power‑on test
●
TSVP self‑test
8.1 LED Test
When the device is switched on, all three LEDs light up for approx. one second. This
indicates that the 5 V supply voltage is present and all LEDs are OK. The following
statements can be made regarding the different LED states:
LED Description
One LED does not light up Hardware problem on the module; LED defective
TSVP Self
‑Test
No LEDs light up No +5 V supply voltage
8.2 Power‑On Test
The power‑on test runs at the same time as the LED test. The following statements
can be made regarding the different display states of the LEDs:
LED Description
PWR LED (green) on All supply voltages are present
PWR LED (green) off At least one supply voltage is missing
ERR LED (red) off No errors have been detected
ERR LED (red) on FPGA loading has failed
8.3 TSVP Self‑Test
The TSVP self‑test runs an in‑depth test on the R&S TS-PIO4 module and generates a
detailed log. This is done using the "Self-Test Support Library".
The R&S TS‑PSAM analog stimulus and measurement module is used as a measurement unit in the TSVP self‑test in order to check trigger line PXI_TRIG[0‑7].
Information on starting the self‑test and on the sequence of the necessary steps as
well as a detailed description of the checked parameters and operations can be found
in the R&S CompactTSVP / R&S PowerTSVP Service Manual.
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9 Interface Description
9.1 R&S TS-PIO4
9.1.1 Connector X10
Interface Description
R&S TS-PIO4
Figure 9-1: Connector X10 (mating side)
Table 9-1: Pin assignment of R&S TS-PIO4 connector X10
1
2
3
4
5 OUT1 OUT2 OUT3
6 IN1 IN2 IN3
7 OUT4 OUT5 OUT6
8 IN4 IN5 IN6
9 OUT7 OUT8 GNDNO
10 IN7 IN8 GND
11 OUT9 OUT10 OUT11
12 IN9 IN10 IN11
13 OUT12 OUT13 OUT14
A B C
AUX1 EXT_CLK
AUX2
AUX3
AUX4
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Interface Description
R&S TS-PIO4
14 IN12 IN13 IN14
15 OUT15 OUT16 GNDNO
16 IN15 IN16 GND
17 OUT17 OUT18 OUT19
18 IN17 IN18 IN19
19 OUT20 OUT21 OUT22
20 IN20 IN21 IN22
21 OUT23 OUT24 GNDNO
22 IN23 IN24 GND
23 OUT25 OUT26 OUT27
24 IN25 IN26 IN27
25 OUT28 OUT29 OUT30
26 IN28 IN29 IN30
27 OUT31 OUT32 GNDNO
28 IN31 IN32 GND
A B C
29 XTO
30 XTI
31
32
9.1.2 Connector X20
Figure 9-2: Connector X20 (mating side)
GND
CHA‑GND
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Interface Description
R&S TS-PIO4
Figure 9-3: Pin assignment of connector X20
9.1.3 Connector X30
Table 9-2: Assignment of R&S TS
7
6
5
4
3
2
1
E E C B A
‑
PIO4 connector X30
GND
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R&S®TS-PIO4
9.1.4 Connector X1 (cPCI Bus)
Interface Description
R&S TS-PIO4
Figure 9-4: Connector X1 (mating side)
Figure 9-5: Pin assignment of connector X1
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R&S®TS-PIO4
10 Specifications
Specifications
The specifications for the R&S TS-PIO4 module are given in the corresponding data
sheets.
If discrepancies exist between the data given in this manual and the values in the data
sheet, the values in the data sheet take precedence.
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