RKC V-TIO-K Instruction Manual

A

.

Module Type Controller SRV

Temperature Control Module for DeviceNet

V-TIO-J/V-TIO-K

Instruction Manual

IMS01P10-E1

Thank you for purchasing this RKC product. In order to
achieve maximum performance and ensure proper operation
of your new instrument, carefully read all the instructions in
this manual. Please place this manual in a convenient
location for easy reference.

SYMBOLS

WARNING

CAUTION

 An external protection device must be installed if

failure of this instrument could result in damage to
the instrument, equipment or injury to personnel.

 All wiring must be completed before power is turned

on to prevent electric shock, fire or damage to
instrument and equipment.

 This instrument must be used in accordance with the

specifications to prevent fire or damage to
instrument and equipment.

 This instrument is not intended for use in locations

subject to flammable or explosive gases.

 Do not touch high-voltage connections such as

power supply terminals, etc. to avoid electric shock.

 RKC is not responsible if this instrument is repaired,

modified or disassembled by other than
factory-approved personnel. Malfunction can occur
and warranty is void under these conditions.

 This is a Class A instrument. In a domestic environment,

this instrument may cause radio interference, in which
case the user may be required to take adequate measures.

: This mark indicates precautions that must be

taken if there is danger of electric shock, fire,
etc., which could result in loss of life or injury.

: This mark indicates that if these precautions

and operating procedures are not taken,
damage to the instrument may result.

: This mark indicates that all precautions should

!

be taken for safe usage.

: This mark indicates important information on

installation, handling and operating
procedures.

: This mark indicates supplemental information

on installation, handling and operating
procedures.

: This mark indicates where additional

information may be located.

WARNING

!

CAUTION

 This instrument is protected from electric shock by

reinforced insulation. Provide reinforced insulation between
the wire for the input signal and the wires for instrument
power supply, source of power and loads.

 Be sure to provide an appropriate surge control circuit

respectively for the following:

− If input/output or signal lines within the building are
longer than 30 meters.

− If input/output or signal lines leave the building,
regardless the length.

 This instrument is designed for installation in an enclosed

instrumentation panel. All high-voltage connections such
as power supply terminals must be enclosed in the
instrumentation panel to avoid electric shock by operating
personnel.

 All precautions described in this manual should be taken to

avoid damage to the instrument or equipment.

 All wiring must be in accordance with local codes and

regulations.

 All wiring must be completed before power is turned on to

prevent electric shock, instrument failure, or incorrect
action.
The power must be turned off before repairing work for
input break and output failure including replacement of
sensor, contactor or SSR, and all wiring must be
completed before power is turned on again.

 To prevent instrument damage or failure, protect the power

line and the input/output lines from high currents with a
protection device such as fuse, circuit breaker, etc.

 Prevent metal fragments or lead wire scraps from falling

inside instrument case to avoid electric shock, fire or
malfunction.

 Tighten each terminal screw to the specified torque found

in the manual to avoid electric shock, fire or malfunction.

 For proper operation of this instrument, provide adequate

ventilation for heat dispensation.

 Do not connect wires to unused terminals as this will

interfere with proper operation of the instrument.

 Turn off the power supply before cleaning the instrument.
 Do not use a volatile solvent such as paint thinner to clean

the instrument. Deformation or discoloration will occur. Use
a soft, dry cloth to remove stains from the instrument.

 To avoid damage to instrument display, do not rub with an

abrasive material or push front panel with a hard object.

 Do not connect modular connectors to telephone line.

NOTICE

 This manual assumes that the reader has a fundamental

knowledge of the principles of electricity, process control,
computer technology and communications.

 The figures, diagrams and numeric values used in this

manual are only for purpose of illustration.

 RKC is not responsible for any damage or injury that is

caused as a result of using this instrument, instrument
failure or indirect damage.

 Periodic maintenance is required for safe and proper

operation of this instrument. Some components have a
limited service life, or characteristics that change over time.

 Every effort has been made to ensure accuracy of all

information contained herein. RKC makes no warranty
expressed or implied, with respect to the accuracy of the
information. The information in this manual is subject to
change without prior notice.

 No portion of this document may be reprinted, modified,

copied, transmitted, digitized, stored, processed or
retrieved through any mechanical, electronic, optical or
other means without prior written approval from RKC.

ll Rights Reserved, Copyright  2004, RKC INSTRUMENT INC

RKC INSTRUMENT INC.

®

1. OUTLINE

The temperature control module for DeviceNet V-TIO-J/V-TIO-K
can send and receive data to/from DeviceNet compatible
programmable controller (PLC) by the DeviceNet that is a
multi-vendor compatible open field network.
One V-TIO-J/V-TIO-K module enables temperature control
corresponding to two channels. It has power supply and
communication terminals in addition to temperature control input
and output terminals.
All data are set by communication.

Master

Slave

Temperature control

module for DeviceNet

V-TIO-J/V-TIO-K

Power supply

For details when dividing two or more temperature
control modules into some groups and then installed,

Programmable

controller (PLC)

Control output

Measured

(24 V DC)

input

DeviceNet

Usable modules:

•

Temperature control module
[Basic type]: V-TIO-A/V-TIO-C

•

Temperature control module
[Extension type]: V-TIO-B/V-TIO-D

(Up to 30 modules)

see the Module Type Controller SRV DeviceNet
Communication Instruction Manual (IMS01P11-E).

For details, see the Module Type Controller SRV

DeviceNet
(IMS01P11-E).

For host communication using host communication
terminals, see the Appendix B of Module Type

Communication Instruction Manual

Controller SRV DeviceNet Communication
Instruction Manual (IMS01P11-E) and the Module
Type Controller SRV Communication Instruction
Manual (IMS01P01-E).

2. PRODUCT CHECK

Before using this product, check each of the following:

• Model code

• Check that all of the accessories delivered are complete.

• Check that there are no scratch or breakage in external

appearance (case, front panel, or terminal, etc).

V–TIO–    –   N N N – N N –  – 

(1) (2) (3) (4) (5) (6) (7)

(1) Type

J: Module for DeviceNet, heat control
K: Module for DeviceNet, heat/cool control

(2) Control action (Each channel common code)

[For heat control]
F: PID action with autotuning (AT) (reverse action)
D: PID action with autotuning (AT) (direct action)
[For heat/cool control]
B: Heat/cool PID action with autotuning (AT) (air cooling)
W: Heat/cool PID action with autotuning (AT) (water cooling)

2

*

(3) Input range (Each channel common code)

[Thermocouple input]

Type Code Range Code Range

K K02 0 to 400 °C KB9 32 to 752 °F

K04 0 to 800 °C KB8 32 to 1472 °F
K16 −200 to +1372 °C KB7 −328 to +2501 °F
K09 0.0 to 400.0 °C KC2 32.0 to 752.0 °F
K35 −200.0 to +400.0 °C KC1 −328.0 to +752.0 °F

J J02 0 to 400 °C JC2 32 to 752 °F

J04 0 to 800 °C JC1 32 to 1472 °F
J15 −200 to +1200 °C JB9 −328 to +2192 °F
J09 0.0 to 400.0 °C JC4 32.0 to 752.0 °F
J27 −200.0 to +400.0 °C JC3 −328.0 to +752.0 °F

T T08 0 to 400 °C TB9 32 to 752 °F

T09 0 to 200 °C TC1 32 to 392 °F
T16 −200 to +400 °C TB8 −328 to +752 °F
T06 0.0 to 400.0 °C TC3 32.0 to 752.0 °F
T19 −200.0 to +400.0 °C TC2 −328.0 to +752.0 °F

E E01 0 to 800 °C EA8 32 to 1472 °F

E02 0 to 1000 °C EA7 32 to 1832 °F
S S05 0 to 1768 °C SA6 32 to 3214 °F
R R06 0 to 1768 °C RA6 32 to 3214 °F
N N02 0 to 1300 °C NA6 32 to 2372 °F
B B03 0 to 1800 °C BB1 32 to 3272 °F

PLⅡ A02 0 to 1390 °C AA6 32 to 2534 °F
W5Re/
W26Re

[RTD input]

Type Code Range Code Range

Pt100 D17 0 to 400 °C DC5 32 to 752 °F
D33 0 to 850 °C DC4 32 to 1562 °F
D16 0.0 to 400.0 °C DC7 32.0 to 752.0 °F
D28 −200.0 to +400.0 °C DC6 −328.0 to +752.0 °F

JPt100 P17 0 to 400 °C PC5 32 to 752 °F
P23 0 to 600 °C PC4 32 to 1112 °F
P16 0.0 to 400.0 °C PC7 32.0 to 752.0 °F
P28 −200.0 to +400.0 °C PC6 −328.0 to +752.0 °F

[Voltage/current input]

Voltage 201 0 to 100 mV DC 401 0 to 5 V DC
501 0 to 10 V DC 601 1 to 5 V DC

Current 701 0 to 20 mA DC 801 4 to 20 mA DC

W03 0 to 2300 °C WA9 32 to 4172 °F

Code Type Code Type

(4) Control output (CH1), (5) Control output (CH2)

M: Relay contact output V: Voltage pulse output 0/12 V DC
4: 0 to 5 V DC 5: 0 to 10 V DC 6: 1 to 5 V DC
7: 0 to 20 mA DC 8: 4 to 20 mA DC

(6) CT type (Each channel common code)

P: CTL-6-P-N (for 0 to 30 A) S: CTL-12-S56-10L-N (for 0 to 100 A)

(7) DeviceNet connector type

N: Open-style connector (Unshielded type)
1: Micro-style connector (Shield type)

For heat/cool PID control (V-TIO-K), input channel 2
becomes unused.

For heat/cool PID control (V-TIO-K), Control output
(CH1) corresponds to the heating output and
Control output (CH2) corresponds to the cooling
output.

Heater break alarm function can not be used when
control output is voltage/current output.

 Accessories

Floppy disk (EDS file)................................................. 1

End Plate.................................................................... 2

Joint connector cover ................................................. 2

Instruction Manual (IMS01P10-E1)............................ 1

If any of the products are missing, damaged, or if your
manual is incomplete, please contact RKC sales office
or the agent.

IMS01P10-E1

r

r

3. PARTS DESCRIPTION

Indication lamps 2

Node address

setting switch

DeviceNet communication

speed setting switch

DeviceNet connecto

[Open-style connector]

(COM.PORT)

FAIL/RUN

RX/TX

EVENT1

NS

EVENT2

MS

FAIL

RUN

EVENT3

EVENT4

MSD LSD DR

NODE ADDRESS

V+ CAN_H Drain CAN_L V−

COM. PORT

Joint connector
(Left side)

DeviceNet side Temperature control side

Front view of open-style connector type

FAIL/RUN

RX/TX

EVENT1

EVENT2

NET

FAIL

RUN

MOD

EVENT3

EVENT4

MSD LSD RATE

NODE ADDRESS

COM. PORT

DeviceNet connecto

[Micro-style connector]

(COM.PORT)

Front view of micro-style connector type

Indication
lamps 2

FAIL

RUN

FAIL/RUN
RX/TX
EVENT1

NS

MS

EVENT2
EVENT3
EVENT4

Temperature control sideDeviceNet side

[Indication lamps 1]
 FAIL/RUN (for temperature control)

When normally: A green lamp turns on (RUN)
When abnormally: A red lamp turns on (FAIL)

 RX/TX (for host communication using host communication

terminals)

During data send and receive: A green lamp turns on

 EVENT 1 to 4

Display various states by setting.
ON state: A green lamp turns on

Display contents:
Event 1 state, Event 2 state, Comprehensive event state, Output state,
Control state, Execution segment state, Time signal state

[Indication lamps 2]
 FAIL (for DeviceNet communication)

When abnormally: A red lamp turns on
Communication environment setting mode by the switch:
A red lamp flashes

 RUN (for DeviceNet communication)

When normally: A green lamp turns on
Memory backup error: A green lamp flashes slowly
Module configuration error: A green lamp flashes slowly
Communication error: A green lamp flashes slowly
Data collection just after the power is turned on:
A green lamp flashes rapidly

 NS or NET (Network status)

Network is operating normally, but communications have not yet
been established: A green lamp flashes

Terminal cover

Indication lamps 1

Module address
setting switch

Joint connector
(Right side)

Terminal cover

Connectors other than the
micro-style connector are
the same as those of the
open-style connector type.
However, only the following
names are different.
(A function is the same)

Indication lamps 2

•

Open-style connector:
NS, MS
Micro-style connector:
NET, MOD

DeviceNet communication

•

speed setting switch
Open-style connector: DR
Micro-style connector: RATE

Indication
lamps 1

Network is operating normally (communications established):
A green lamp turns on
I/O connection is timeout: A red lamp flashes
A fatal communications error has occurred
Network communications are not possible:
A red lamp turns on

 MS or MOD (Module status)

When DeviceNet communication is normal:
A green lamp turns on
Module configuration error: A green lamp flashes
Memory backup error: A red lamp turns on

4. COMMUNICATION SETTING

Set communication setting before mounting and wiring of SRV.

CAUTION

Do not separate the module mainframe from the terminal
base with the power turned on. If separated, adjusted data
may be destroyed; control be stopped, and no return can be
made.

4.1 Address Setting

 Node address setting

To identify each device connected to the network, it is necessary
to set a different address to each device (node). For the
DeviceNet, as it is possible to connect up to 64 devices including
a master to the network, node address (MAC ID) from 0 to 63
can be set.

 Module address setting

Set a module address (temperature control side). For this setting,
use a small blade screwdriver.

For this setting, use a small blade screwdriver.

Node address setting switch

MSD: High-order digit setting

(Set value ×10)

LSD: Low-order digit setting

(Set value ×1)

FAIL/RUN

RX/TX

EVENT1

EVENT2

NS

MS

FAIL

RUN

EVENT3

EVENT4

MSD LSD DR

NODE ADDRESS

V+ CAN_H Drain CAN_L V−

COM. PORT

Setting range: 0 to 63
(Factory set value: 63)

The above figure is open-style connector type. The
figure of micro-style connector type is the same as a
open-style connector type.

When any number exceeding 64 is set, the node
address number becomes “63.”

FAIL/RUN

RX/TX

EVENT1

EVENT2

NS

MS

FAIL

RUN

EVENT3

EVENT4

MSD LSD DR

NODE ADDRESS

V+ CAN_H Drain CAN_L V−

COM. PORT

Module address setting switch

High-order digit setting
(set value × 10)

Low-order digit setting
(set value × 1)

Setting range: 0 to 98
(Factory set value: 0)

Do not set “99” to a module address of the
temperature control side, as the module address of
DeviceNet side is fixed in “99.” Otherwise,
malfunction may result.

IMS01P10-E1

3

Set the module address such that it is different to
the other addresses on the same line. Otherwise,
problems or malfunction may result.

The previous page figure is open-style connector type.
The figure of micro-style connector type is the same as
a open-style connector type.

4.2 DeviceNet Communication Setting

 Communication speed setting

Set the communication speed of DeviceNet. For this setting, use
a small blade screwdriver.

DeviceNet communication

speed setting switch

Setting range: 0: 125 kbps

(Factory set value: 0)

The above figure is open-style connector type. The
figure of micro-style connector type is the same as a
open-style connector type.

When any number between 3 and 9 is set, the
communication speed becomes “500 kbps.”

 Number of communication data items when

conducting polling I/O communication and host
communication protocol setting

With the DIP switch 1 which there is on the left side of module,
set the number of communication data items when conducting
DeviceNet polling I/O communication, host communication

and internal communication mode.

protocol

Factory set value: 38400 bps

Factory set value: 8 words

Factory set value: Modbus

Left side view (DeviceNet side)

1 2 Host communication (RS-485) speed

OFF OFF 2400 bps

ON OFF 9600 bps

OFF ON 19200 bps

ON ON 38400 bps

4 5 Number of communication data items when

conducting polling I/O communication

OFF OFF 8 words

ON OFF 26 words

OFF ON 46 words

ON ON 100 words

6 Host communication protocol selection

OFF RKC communication

ON Modbus

(DR or RATE)

1: 250 kbps
2: 500 kbps

Terminal base

Module mainframe

FAIL/RUN

RX/TX

EVENT1

NS

EVENT2

MS

FAIL

RUN

EVENT3

EVENT4

MSD LSD DR

NODE ADDRESS

CAN_H Drain CAN_L V

+

V

COM. PORT

−

DIP switch 1

ON

ON

1 2 3 4 5 6 7 8

1 2 3 4 5 6 7 8

ON

OFF

7 Internal communication mode selection

OFF DeviceNet communication mode

ON Host communication (RS-485) mode

Factory set value: DeviceNet communication mode

Switch No. 3: OFF fixed (Don’t change this one)
Switch No. 8: OFF fixed (Don’t change this one)

Switch No. 1, 2, 6 and 7 are used for the setting
related to host communication on the DeviceNet
side. When used only for DeviceNet communication,
do not change the factory set values.

For the host communication of DeviceNet side, see the
Appendix B of Module Type Controller SRV
DeviceNet Communication Instruction Manual
(IMS01P11-E).

4.3 Host Communication Setting
(temperature control side)

With the DIP switch 2 which there is on the right side of module,

the communication speed, data bit configuration, protocol, and

set
termination resistor of internal data bus
temperature control side.

Terminal base

Module mainframe

Right side view (Temperature control side)

1 2 Host communication (RS-485) speed

OFF OFF 2400 bps

ON OFF 9600 bps

OFF ON 19200 bps

ON ON 38400 bps

Factory set value: 38400 bps

3 4 5 Data bit configuration

ON OFF OFF Data 8-bit, without parity, Stop 1-bit

Factory set value: Data 8-bit, without parity, Stop 1-bit

6 Host communication protocol selection

OFF RKC communication

ON Modbus

Factory set value: Modbus

Switch No. 7: OFF fixed (Don’t change this one)
Switch No. 8: OFF fixed (Don’t change this one)

When connecting two or more modules (V-TIO-A,
V-TIO-B, V-TIO-C or V-TIO-D) to the module (V-TIO-J
or V-TIO-K), match all of the switch No. 1 to 6
settings with the internal settings of the module
(V-TIO-J or V-TIO-K).

When no host communication terminals are used, it
is not necessary to set the DIP switch 2.

For host communication using host communication
terminals, see the Appendix B of Module Type

Controller SRV DeviceNet Communication
Instruction Manual (IMS01P11-E) and the Module
Type Controller SRV Communication Instruction
Manual (IMS01P01-E).

for host communication of

DIP switch 2

ON

ON

1 2 3 4 5 6 7 8

1 2 3 4 5 6 7 8

ON

OFF

4

IMS01P10-E1

5. MOUNTING

To prevent electric shock or instrument failure,
always turn off the power before mounting or
removing the instrument.

5.1 Mounting Cautions

(1) This instrument is intended to be used under the following

environmental conditions. (IEC61010-1)
[OVERVOLTAGE CATEGORY II, POLLUTION DEGREE 2]

(2) Use this instrument within the following ambient temperature

and ambient humidity.

• Allowable ambient temperature: −10 to +50 °C

• Allowable ambient humidity: 5 to 95 % RH

(Absolute humidity: MAX.W.C 29 g/m

(3) Avoid the following when selecting the mounting location.

• Rapid changes in ambient temperature, which may cause
condensation.

• Corrosive or inflammable gases.

• Direct vibration or shock to the mainframe.

• Water, oil, chemicals, vapor or steam splashes.

• Excessive dust, salt or iron particles.

• Excessive induction noise, static electricity, magnetic fields or

noise.

• Direct air flow from an air conditioner.

• Exposure to direct sunlight.

• Excessive heat accumulation.

(4) Mounting consideration

• Install the module 200 mm away from the main power line.

• Ensure at least 50 mm space on top and bottom of the control

unit for maintenance and environmental reasons.

5.2 Dimensions

125

110

!

WARNING

78

3

dry air at 101.3 kPa)

(Unit: mm)

6.8

40.5

5.3 DIN rail Mounting

 Mounting procedures

1. Pull down the mounting bracket at the bottom of the module
(A). Attach the hooks on the top of the module to the DIN rail
and push the lower section into place on the DIN rail (B).

DIN rail

(B) Push

Mounting

bracket

2. Slide the mounting bracket up to secure the module to the
DIN rail.



End Plate mounting

Hold tight both ends of the modules jointed together with the end
plates and then fix the end plates with screws. Even if only one
V-TIO-J/V-TIO-K module is used, also hold tight both ends of the
module with the end plates.

End Plate

(A) Pull down

Locked

V-TIO-J/V-TIO-K module

End Plate

5

The above figure is open-style connector type. The
figure of micro-style connector type is the same as a
open-style connector type.

 Depth in connector mounting

Conduct installation in consideration of the sizes of the
connector and cable when connector-connected.

[Usage example of micro-style connector] (Unit: mm)

110

Approx. 100 *

* For open-style

connector:
Approx. 50 mm

IMS01P10-E1

Joint connector cover *

* For the conservation of the contact of connector, install a joint

connector cover in module of both ends.



Removing procedures

Pull down a mounting bracket with a blade screwdriver (A). Lift
the module from bottom, and take it off (B).

(B) Lift and take off

(A) Pull down

5

r

)

(A)

−

A

−

−

A

3

e

5.4 Panel Mounting

 Mounting procedures

1. Pull down the mounting bracket (A) until locked and that a
mounting hole appears.

2. Prepare one mounting bracket per module (B) sold
separately (KSRX-55) and then insert it in the rear of the
terminal board at top of the module until locked but a
mounting hole does not disappear.

3. Mount each module directly on the panel with screws which
are inserted in the mounting holes of the top and bottom
mounting brackets.

Recommended tightening torque: 0.3 N⋅m (3 kgf⋅cm)

The customer needs to provide the M3 size screws.
Select the screw length that matches the mounting
panel.

(B) Insert

Mounting

Mounting bracket
(Sold separately)

(A) Pull down

[KSRX-55]

30 ± 0.2

Mounting

holes

(Unit: mm)

dimensions

35.25 ± 0.2

0.2

±

M3

Module of 40.5 mm wide Module of 30 mm wide

130.5

5.5 Jointing Each Module

Up to 30 modules (V-TIO-A, V-TIO-B, V-TIO-C or /V-TIO-D) can
be connected to one module (V-TIO-J or V-TIO-K).
modules according to the following procedure.

 Jointing procedures

1. Mount the modules on the DIN rail and then joint these
modules together with the joint connector while sliding the
relevant module.

2. Lift each of the joint tabs located at the top and bottom of the
module and then insert it in the slot of the adjacent module to
fix these two modules.

For panel mounting, first joint each module and then
mount it on the panel.

Joint connecto

Joint tab

There is one joint tab at each
of the top and bottom of on
module. Therefore, fix two
adjacent modules with these
two joint tabs.

6

Joint these

When viewed
from top

Joint tab
insertion slot

6. WIRING

To prevent electric shock or instrument failure, do not
turn on the power until all the wiring is completed.

6.1 Wiring Cautions

 For thermocouple input, use the appropriate compensation

wire.

 For RTD input, use low resistance lead wire with no

difference in resistance between the three lead wires.

 To avoid noise induction, keep input signal wire away from

instrument power line, load lines and power lines of other
electric equipment.

 If there is electrical noise in the vicinity of the instrument that

could affect operation, use a noise filter.

− Shorten the distance between the twisted power supply wire

pitches to achieve the most effective noise reduction.

− Always install the noise filter on a grounded panel.

Minimize the wiring distance between the noise filter output
and the instrument power supply terminals to achieve the
most effective noise reduction.

− Do not connect fuses or switches to the noise filter output

wiring as this will reduce the effectiveness of the noise filter.

 Power supply wiring must be twisted and have a low voltage

drop.

 For an instrument with 24 V power supply, supply power from

a SELV circuit.

6.2 Terminal Configuration

Internal communicat ion

or

Host communication

RS-485

T/R

T/R(B

15

16

SG

17

Power supply

Ground

18

20

DC

+

FG

24 V

5.9 mm or less

.2 mm or mor

Recommended tightening torque:

0.4 N

⋅m (4 kgf⋅cm)

For heat/cool PID control (V-TIO-K), input channel 2
becomes unused.

For heat/cool PID control (V-TIO-K), Control output
(CH1) corresponds to the heating output and
Control output (CH2) corresponds to the cooling
output.

WARNING

!

CT input Control output 1 Control output 2

CT1

19

Voltage pulse/

Current/
Voltage

CT2

3

OUT1

+ −

2

67

16 15 3 2 1

17 7 6 5 4

18 11 10 9 8

20 19 14 13 12

Input channel 1

10

B

14 13

RTD1

RTD

B

Relay contact

5

10

TC1

+

Thermocouple

10

+

IN1

Voltage/

Voltage/
Current

Current

OUT1

NO

2

5

Upper-side terminal

Lower-side terminal

9

13

−

+

Thermocouple

9

13

+

−

Voltage/
Current

Voltage pulse/

Current/
Voltage

OUT2

−

+

1

4

Input channel 2

9

B

12

TC2

12

IN2

Relay contact

OUT2

1

12

B

RTD2

RTD

IMS01P10-E1

NO

4

8

Heater break alarm function can not be used when
control output is voltage/current output.

Terminal No. 11 is not used.

Use the solderless terminal appropriate to the screw
size (M3).

7. SPECIFICATIONS

6.3 Pin Layout of Connector

 Open-style connector

DeviceNet connector

Open-style connector

(COM. PORT)

1: V−

2: CAN_L

3: Drain

4: CAN_H

5: V+

Pin No. Signal name Symbol Cable color

1

Power supply, minus (−) V−

Black
2 Communication data, low CAN_L Blue
3 Shield Drain


4 Communication data, high CAN_H White
5

Power supply, plus (+) V+

Red

• Connection plugs
SRXDN-01 (Sold separately)
MSTB2.5/5-STF-5.08AUM (PHOENIX CONTACT, Inc.) or
equal

Multi-drop type (recommended models)

TMSTBP2.5/5-STF-5.08AUM
(PHOENIX CONTACT, Inc.)

 Micro-style connector

DeviceNet connector

Micro-style connector

(COM. PORT)

3: V−

2: V+

5: CAN_L

1: Drain

4: CAN_H

Pin No. Signal name Symbol Cable color

1 Shield Drain
2

Power supply, plus (+) V+

3

Power supply, minus (−) V−



Red

Black
4 Communication data, high CAN_H White
5 Communication data, low CAN_L Blue

• Connection socket
Recommended models: SACC-M12FS-5CON-PG 9-M
(PHOENIX CONTACT, Inc.)
(This socket is a type to use thin cable.)

Use the communication cable (thick cable or thin cable)
that matched specification of DeviceNet.
By thickness of a cable to use and connection method,
usable connection connector type is different.

 Inputs

Number of inputs: 2 points

Input type:

Sampling cycle: 500 ms
PV bias: −Input span to +Input span
CT input: 2 points



Number of outputs: 2 points

Output type:



Number of controls: 2 points
Control method: Brilliant PID control

Additional function: Autotuning function

 Events

Number of events: 2 points/channel
Event type: Temperature event:



Number of HBA: 2 points
Setting range: 0.0 to 100.0 A (0.0 A: OFF)
Additional function: Number of event delay times:

For cable specifications, connection method and vendor,
see the home page of ODVA (Open DeviceNet Vender
Association).

URL: http://www.odva.org

Isolated between each channel:

Thermocouple input, Voltage (low) input

Not isolated between each channel:

RTD input, Voltage (high) input,
Current input

• Thermocouple K, J, T, S, R, E, B, N (JIS-C1602-1995)
PLII (NBS)
W5Re/W26Re (ASTM-E988-96)

• RTD: Pt100 (JIS-C1604-1997)
JPt100 (JIS-C1604-1989, Pt100 of
JIS-C1604-1981)

• Voltage (low): 0 to 100 mV

• Voltage (high): 0 to 5 V, 0 to 10 V, 1 to 5 V

• Current: 0 to 20 mA, 4 to 20 mA

(Input impedance: 250 Ω)

0.0 to 30.0 A (CTL-6P-N) or

0.0 to 100.0 A (CTL-12-S56-10L-N)

Outputs

(Isolated between input and output, and
between output and power supply)

•Relay contact: 250 V AC, 3 A (Resistive load)
1a contact
Electrical life: 300,000 times or more
(Rated load)

•Voltage pulse: 0/12 V DC
(Load resistance 600 Ω or more)

•Current: 0 to 20 mA DC, 4 to 20 mA DC
(Load resistance 600 Ω or less)

•Voltage: 0 to 5 V DC, 0 to 10 V DC, 1 to 5 V DC
(Load resistance 1 kΩ or more)

Control action

Reverse action or direct action is
selectable (Specify when ordering)
Heat/cool control is selectable
(Specify when ordering)

Deviation high, Deviation low,
Deviation high/low, Band,
Process high, Process low
Heater break alarm,
Control loop break alarm,
Burnout, Temperature rise completion

Heater break alarm (HBA) function

1 to 255 times

Continued on the next page.

IMS01P10-E1

7

]

Continued from the previous page.



Control loop break alarm (LBA) function

Number of LBA: 2 points
LBA time: 1 to 7200 seconds
LBA deadband (LBD) setting:

0 to Input span

 DeviceNet communication

Protocol: DeviceNet
Connection method: Multi-drop connection,

T-branch connection
(Terminating resistor [121Ω, 1/4 W] is
necessary)

Communication speed: 125 kbps, 250 kbps, or 500 kbps
Error control: CRC error, Node address (MAC ID)

duplication check

Maximum number of connection nodes:
64 (including master)

 Host communication

(using host communication terminals)

Communication interface: Based on RS-485, EIA standard
Communication protocol: RKC communication

(ANSI X3.28 subcategory 2.5, A4)
or Modbus

Maximum connections: 32 instruments * maximum including

a host computer

As each of the DeviceNet board and

*

temperature control board incorporated in the

V-TIO-J/V-TIO-K module is handled as one unit,

one V-TIO-J/V-TIO-K module corresponds two

Others



modules.

Power supply voltage: 24 V DC
Power supply voltage range:

21.6 V DC to 26.4 V DC
Current consumption: 170 mA max./module
Allowable ambient temperature:

−10 to +50 °C
Allowable ambient humidity:

5 to 95 %RH
Absolute humidity:
MAX.W.C 29 g/m

Weight: Open-style connector type:

Approx. 250 g
Micro-style connector type:
Approx. 270 g

3

dry air at 101.3 kPa

 DeviceNet is a registered trademark of Open DeviceNet Vender Association, Inc.
 Modbus is a registered trademark of Schneider Electric.
 Company names and product names used in this manual are the trademarks or registered trademarks of the respective companies.
 This product has been self-tested by RKC found to comply with ODVA Conformance Test Software V17.

The first edition: AUG. 2004[IMQ00

HEADQUARTERS: 16-6, KUGAHARA 5-CHOME, OHTA-KU TOKYO 146-8515 JAPAN

RKC INSTRUMENT INC.

®

AUG. 2004 IMS01P10-E1

PHONE: [phone] ([phone]) E-mail: [e-mail]

FAX: [phone] ([phone])