Richtek RT9297GQW Schematic [ru]

®
3A High Performance Step-Up DC/DC Converter
RT9297
General Description
The RT9297 includes a high performance step-up DC/DC
converter that provides a regulated supply voltage for active-
matrix thin-film transistor (TFT) liquid-crystal displays
(LCDs).
The Boost Converter incorporates current mode, fixed-
frequency, pulse-width modulation (PWM) circuitry with
a built-in N-Channel power MOSFET to achieve high
efficiency and fast transient response.
The RT9297 is available in a WDFN -10L 3x3 package.
Ordering Information
RT9297
Package Type QW : WDFN-10L 3x3 (W-Type)
Lead Plating System G : Green (Halogen Free and Pb Free)
Note :
Richtek products are :
` RoHS compliant and compatible with the current require-
ments of IPC/JEDEC J-STD-020.
` Suitable for use in SnPb or Pb-free soldering processes.
Features
zz
High Efficiency Up to 90%
z
zz
zz
z Adjustable Output Voltage : V
zz
zz
z Wide Input Supply Voltage : 2.6V to 5.5V
zz
zz
z Input Under Voltage Lockout
zz
zz
z Pin-Programmable Switching Frequency 640kHz/
zz
to 24V
DD
1.2MHz
zz
z Programmable Soft-Start
zz
zz
z Small 10-Lead WDFN Package
zz
zz
z RoHS Compliant and Halogen Free
zz
Applications
z Notebook Computer Displays
z LCD Monitor Panels
z LCD TV Panels
Pin Configurations
(TOP VIEW)
COMP
FB
EN
GND GND
1
2 3
4
5
10
SS
9
FREQ
8
VDD
GND
7
LX
11
6
LX
Marking Information
EZ= : Product Code
EZ=YM
YMDNN : Date Code
DNN
Typical Application Circuit
RT9297
VDD
FREQ EN
COMP
L1
LX
FB
SS
GND
4, 5, 11 (Exposed Pad)
V
2.6V to 5.5V
Copyright 2012 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
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DD
C3
C1
R3
8
9
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DS9297-02 June 2012 www.richtek.com
6, 7
2
10
D1
R1
C
SS
R2
C2
V
AVDD
1
RT9297
Function Block Diagram
EN
COMP
FB
1.24V
FREQ
Oscillator
4µA
Functional Pin Description
Pin No. Pin Name Pin Function
1 COMP
2 FB
Compensation Pin for Error Amplifier. Connect a series RC fr om CO MP to ground.
Feedback. The feedback regulation voltage is 1.24V nominal. Connect an external resistive voltage-divider between the step-up regulator’s output (V and GND, with the center tap connected to FB. Place the divider close to the IC and minimize the trace area to reduce noise coupling.
LX
V
IN
V
FB
Error Amplifier
-
+
Slope
Compen-
sation
Protection
Summing Comparator
Clock
4µA
Soft­Start
-
+
Control
and
Driver
Logic
Current
Sense
VDD
SS
LX
GND
AVDD
)
3 EN Enable Control Input. Drive EN low to turn off the Boost Converter.
4, 5
11 (Exposed Pad)
6, 7 LX
8 VDD Supply Pin. Bypass VDD with a minimum 1μF ceramic capacitor directly to GND.
9 FREQ
10 SS
GND
Ground. The exposed pad must be soldered to a large PCB and connected to
GND for maximum power dissipation.
Switch. LX is the drain of the internal MOSFET. Connect the inductor/rectifier diode junction to LX and minimize the trace area for lower EMI.
Frequency-Select Input. When FREQ is low, the oscillator frequency will be set to 640kHz. When FREQ is high, the frequency will be set to 1.2MHz. This input has a 6μA pull-down current.
Soft-Start Control. Connect a soft-start capacitor (C
) to this pin. A 4μA
SS
constant current charges the soft-start capacitor. When EN connected to GND, the soft-start capacitor is discharged. When EN connected to V soft-start capacitor is charged to V
. Leave floating for not using soft-start.
DD
high, the
DD
Copyright 2012 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
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DS9297-02 June 2012www.richtek.com
RT9297
Absolute Maximum Ratings (Note 1)
z LX to GND --------------------------------------------------------------------------------------------------------------- 0.3V to 26V z Other Pins to GND ---------------------------------------------------------------------------------------------------- 0.3V to 6V
z Power Dissipation, P
WDFN-10L 3x3 --------------------------------------------------------------------------------------------------------- 1.667W
z Package Thermal Resistance (Note 2)
WDFN-10L 3x3, θJA--------------------------------------------------------------------------------------------------- 60°C/W
WDFN-10L 3x3, θJC--------------------------------------------------------------------------------------------------- 8.2°C/W
z Lead Temperature (Soldering, 10 sec.)--------------------------------------------------------------------------- 260°C
z Junction Temperature ------------------------------------------------------------------------------------------------- 150°C z Storage Temperature Range ---------------------------------------------------------------------------------------- 65°C to 150°C
z ESD Susceptibility (Note 3)
HBM (Human Body Model)------------------------------------------------------------------------------------------ 2kV
MM (Machine Model) ------------------------------------------------------------------------------------------------- 200V
Recommended Operating Conditions (Note 4)
z Supply Input Voltage, VDD ------------------------------------------------------------------------------------------ 2.6V to 5.5V z Junction Temperature Range ---------------------------------------------------------------------------------------- 40°C to 125°C z Ambient Temperature Range ---------------------------------------------------------------------------------------- 40°C to 85°C
@ T
D
= 25°C
A
Electrical Characteristics
(VDD = 3.3V, T
Supply Current
Input Voltage Range VDD
Output Voltage Range V
Under-Voltage Lockout
Threshold
Quiescent Current IQ
Shutdown Current I
Oscillator
Oscillator Frequency f
Maximum Duty Cycle -- 90 -- %
Error Amplifier
Feedback Regulation Voltage VFB 1.22 1.24 1.26 V
Feedback Input Bias Current I
= 25°C, unless otherwise specified)
A
Parameter Symbol Test Conditions Min Typ Max Unit
V
< 18V 2.6 -- 5.5
AVDD
18V < V
VDD -- 24 V
AVDD
V
VDD Rising -- 2.4 -- V
UVLO
< 24V 4 -- 5.5
AVD D
V
Hysteresis -- 50 -- mV
V
= 1.3V, LX Not Switching -- 0.5 --
FB
V
= 1V, LX Switching -- 4 --
FB
EN = GND -- 0.1 10 μA
SHDN
mA
FREQ = GND 500 640 750
OSC
-- 125 250 nA
FB
FREQ = V
1000 1240 1500
lN
kHz
Copyright 2012 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
DS9297-02 June 2012 www.richtek.com
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RT9297
Parameter Symbol Test Conditions Min Typ Max Unit
Feedback Line Regulation -- 0.05 0.2 %/V Transconductance gm ΔI = ±2.5μA at COMP = 1V -- 135 -- μA/V
Voltage Gain Av FB to COMP -- 700 -- V/V
N- MOSFET
Current Limit I
On-Resistance R
Leakage Current I
LIM
DS(ON)
LEAK
Current-Sense Transresistance RCS -- 0.25 -- V/A
Soft-Start
Charge Current ISS -- 4 -- μA
Control Inputs
EN, FREQ Input Low Voltage VIL -- -- 0.3 x VDD V
EN, FREQ Input High Voltage VIH 0.7 x VDD -- -- V
EN, FREQ Input Hysteresis -- 0.1 x VDD -- V FREQ Pull-down Current -- 6 -- μA
EN Input Current IEN EN = GND -- 0.001 1 μA
3 3.8 5 A
-- 125 250 mΩ
VLX = 24V -- 30 45 μA
Note 1. Stresses beyond those listed Absolute Maximum Ratings may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θ
Note 3. Devices are ESD sensitive. Handling precaution is recommended. Note 4. The device is not guaranteed to function outside its operating conditions.
is measured at T
JA
measured at the exposed pad of the package.
= 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC is
A
Copyright 2012 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
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