The RT9193 is designed for portable RF and wireless
applications with demanding performance and space
requirements. The RT9193 performa nce is optimized f or
battery-powered systems to deliver ultra low noise and
low quiescent current. A noise bypa ss pin is availa ble for
further reduction of output noise. Regulator ground current
increa s e s only slightly in dropout, further prolonging the
battery life. The RT9193 also works with low-ESR cera mic
capa citors, reducing the a mount of board space necessary
for power applications, critical in hand-held wireless
devices. The RT9193 consumes less than 0.01
μA in
shutdown mode and ha s fa st turn-on time less than 50μs.
The other features include ultra low dropout voltage, high
output accura cy , current limiting protection, and high ri pple
rejection ratio. Available in the SC-70-5, SOT-23-5,
TSOT-23-5, W D F N-6L 2x2 a nd MSOP-8 packages.
Ordering Information
RT9193-
Package Type
U5 : SC-70-5
B : SOT-23-5
J5 : TSOT-23-5
QW : WDFN-6L 2x2 (W-Type)
F : MSOP-8
Lead Plating System
P : Pb Free
G : Green (Halogen Free and Pb Free)
Output Voltage
15 : 1.5V
16 : 1.6V
:
49 : 4.9V
50 : 5.0V
1H : 1.85V
2H : 2.85V
4G : 4.75V
(1.5V to 5V with 0.1V step is available)
Note :
Richtek products are :
` RoHS compliant and compatible with the current require-
ments of IPC/JEDEC J-STD-020.
` Suitable for use in SnPb or Pb-free soldering processes.
Features
zz
Ultra Low Noise for RF Application
z
zz
zz
z Ultra Fast Response in Line/Load Transient
zz
zz
z Quick Start-Up (T ypically 50
zz
zz
z <0.01
zz
zz
z Low Dropout : 220mV @ 300mA
zz
zz
z Wide Operating Voltage Ranges : 2.5V to 5.5V
zz
zz
z TTL-Logic-Controlled Shutdown Input
zz
zz
z Low Temperature Coefficient
zz
zz
z Current Limiting Protection
zz
zz
z Thermal Shutdown Protection
zz
zz
z Only 1
zz
zz
z High Power Supply Rejection Ratio
zz
zz
z Custom Voltage Available
zz
zz
z RoHS Compliant and 100% Lead (Pb)-Free
zz
μμ
μA Standby Current When Shutdown
μμ
μμ
μF Output Capacitor Required for Stability
μμ
μμ
μs)
μμ
Applications
z CDMA/GSM Cellular Handsets
z Battery-Powered Equipment
z Laptop, Palmtops, Notebook Computers
z Hand-Held Instruments
z PCMCIA Cards
z Portable Information Applia nces
Marking Information
For marking information, contact our sales representative
directly or through a Richtek distributor located in your
area.
Typical Application Circuit
RT9193
V
IN
1µF/X7R
Chip Enable
C
IN
VIN
GND
EN
VOUT
BP
C
OUT
1µF/X7R
C
BP
22nF
(Option for low noise)
V
OUT
Copyright 2013 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Chip Enable (Active High). Note that this pin is high impedance. There should be a pull low 100kΩ
resist or c onn ected to G ND wh en the control s ignal is flo at ing.
Reference Noise Bypass. This pin can be floating. For lowest noise performance, connect a 22nF
capacitor between the BP and GND pins.
GND Ground.
VOUT Output Voltage.
VIN Power Input Voltage.
Function Block Diagram
EN
Quick
Start
BP
V
REF
Shutdown
and
Logic Control
+
-
Error
Amplifier
VIN
MOSFET
Driver
VOUT
Current-Limit
and
Thermal
Protection
GND
Copyright 2013 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
z Supply Input V oltage------------------------------------------------------------------------------------------------------ 6V
z Power Dissipation, P
z Junction T emperature----------------------------------------------------------------------------------------------------- 150°C
z Lead T e mperature (Soldering, 10 sec.)------------------------------------------------------------------------------- 26 0°C
z Storage T emperature Range -------------------------------------------------------------------------------------------- −65°C to 150°C
z ESD Susceptibility (Note 3)
HBM (Human Body Model)---------------------------------------------------------------------------------------------- 2kV
MM (Machine Model) ----------------------------------------------------------------------------------------------------- 200V
@ T
D
= 25°C
A
Recommended Operating Conditions (Note 4)
z Supply Input V oltage------------------------------------------------------------------------------------------------------ 2.5V to 5.5V
z EN Input V oltage----------------------------------------------------------------------------------------------------------- 0V to 5.5V
z Junction T emperature Range--------------------------------------------------------------------------------------------
z Ambient T emperature Range--------------------------------------------------------------------------------------------
Electrical Characteristics
(VIN = V
+ 1V, CIN = C
OUT
= 1μF, CBP = 22nF, T
OUT
= 25° C, unless otherwise specified)
A
Parameter Symbol Test Conditions Min Typ Max Unit
Output Voltage Accuracy ΔV
Current Limit I
Quiescent Current IQ V
D rop out Voltage ( Note 5) V
Line Regulation ΔV
Load Regulation ΔV
Standby Cu rrent I
I
OUT
R
LIM
DROP
LINE
1mA < I
LOAD
VEN = GND, Shutdo wn -- 0.0 1 1 μA
STBY
= 1mA −2 -- 2 %
OUT
= 1Ω 360 400 -- mA
LOAD
≥ 1.2V, I
EN
I
= 200mA , V
OUT
I
= 300mA , V
OUT
= (V
V
IN
I
= 1mA
OUT
+ 1V) to 5.5V,
OUT
< 300mA -- -- 0.6 %
OUT
= 0mA -- 90 130 μA
OUT
> 2.8V 170 200
OUT
> 2.8V -- 220 300
OUT
-- -- 0.3 %
−40°C to 125°C
−40°C to 85°C
mV
Copyright 2013 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Thermal Shutdown Temperature TSD -- 165 -- °C
Thermal Shutdown Temperature
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θ
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. The dropout voltage is defined as V
is measured at T
JA
= 25°C on a low effective thermal conductivity single-layer test board per JEDEC 51-3.
A
ΔTSD -- 30 -- °C
IN
− V
, which is measured when V
OUT
OUT
is V
OUT(NORMAL)
− 100mV.
Copyright 2013 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Like any low dropout regulator, the external capacitors
used with the RT9193 must be carefully selected for
regulator stability and performance. Using a capacitor
whose value is >1μF on the RT9193 input and the a mount
of capacitance can be increased without limit. The input
ca pacitor must be located a dista nce of not more than 0.5
inch from the input pin of the IC and returned to a clean
analog ground. Any good quality cera mic or tantalum ca n
be used for this ca pacitor . The capa citor with larger value
and lower ESR (equivalent series resistance) provides
better PSRR and line-transient response. The output
capacitor must meet both requirements for minimum
amount of capacitance and ESR in all LDOs application.
The RT9193 is designed specifically to work with low ESR
ceramic output ca pa citor in space-saving a nd performance
consideration. Using a cera mic ca pa citor whose value is
at least 1μF with ESR is >1mΩ on the RT9193 output
ensures stability . The R T9193 still works well with output
capa citor of other types due to the wide stable ESR ra nge.
Figure 1 shows the curves of allowable ESR range as a
function of load current for various output ca pacitor values.
Output capacitor of larger capacitance can reduce noise
and improve loa d transient response, sta bility, a nd PSRR.
The output capa citor should be located not more than 0.5
inch from the V
pin of the RT9193 and returned to a
OUT
clean a nalog ground.
Region of Stable C
100
10
ESR vs. Load Current
OUT
Instable
Bypass Capacitor and Low Noise
Connecting a 22nF between the BP pin and GND pin
significantly reduces noise on the regulator output, it is
critical that the cap acitor conne ction between the BP pin
and GND pin be direct and PCB tra ces should be a s short
a s possible. There is a relationship between the bypass
capacitor value and the LDO regulator turn on time. DC
leakage on this pin can affect the LDO regulator output
noise and voltage regulation performa nce.
Enable Function
The RT9193 features an LDO regulator enable/disable
function. To assure the LDO regulator will switch on, the
EN turn on control level must be greater than 1.2 volts.
The LDO regulator will go into the shutdown mode when
the voltage on the EN pin falls below 0.4 volts. For to
protecting the system, the RT9193 have a quick-discharge
function. If the enable function is not needed in a specific
application, it may be tied to VIN to keep the LDO regulator
in a continuously on state.
Thermal Considerations
Thermal protection limits power dissipation in RT9193.
When the operation junction temperature exceeds 165°C,
the OTP circuit starts the thermal shutdown function turn
the pass element off. The pass element turn on again
after the junction temperature cools by 30°C.
For continue operation, do not exceed absolute maximum
operation junction temperature 125°C. The power
dissipation definition in device is :
Ω
ESR ( )
OUT
C
1
Stable
0.1
0.01
0.001
050100150200250300
Load Current (mA)
RT9193-15xU5
CIN = C
= 1μF , X7R
OUT
PD = (V
The maximum power dissipation depends on the thermal
resistance of IC package, PCB layout, the rate of
surroundings airflow and temperature difference between
junction to ambient. The maximum power dissipation ca n
be calculated by following formula :
P
D(MAX)
Where T
− V
IN
= ( T
J(MAX)
OUT
J(MAX)
) x I
+ VIN x I
OUT
− TA ) /θ
Q
JA
is the maximum operation junction
temperature 125°C, TA is the ambient temperature and
Figure 1
Copyright 2013 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
For recommended operating conditions specification of
RT9193, where T
is the maximum junction
J(MAX)
temperature of the die (125°C) and TA is the maximum
ambient temperature. The junction to ambient thermal
resistance (θJA is layout dependent) for TSOT-23-5/
SOT-23-5 package is 250°C/W, SC-70-5 package is
333°C/W, W D FN-6L 2x2 package is 165°C/W and MSOP8 package is 160°C/W on sta ndard JEDEC 51-3 thermal
test board. The maximum power dissipation at TA = 25°C
can be calculated by following f ormula :
RT9193
P
= (125°C − 25°C) / 333 = 300mW for
D(MAX)
SC-70-5
P
= (125°C − 25°C) / 250 = 400mW for
D(MAX)
TSOT-23-5/SOT -23-5
P
= (125°C − 25°C) / 165 = 606mW for
D(MAX)
W DFN-6L 2x2
P
= (125°C −25°C) / 160 = 625mW for
D(MAX)
MSOP-8
The maximum power dissipation depends on operating
ambient temperature for fixed T
and thermal
J(MAX)
resistance θJA. For RT9193 packages, the Figure 2 of
derating curves allows the designer to see the effect of
rising ambient temperature on the maximum power
allowed.
700
600
500
400
300
MSOP-8
TSOT-23-5/
SOT-23-5
SC 70-5
WDFN-6L 2x2
200
Power Dissipati on (mW)
100
0
0255075100125
Ambient Tem peratu re (°C)
Figure 2. Derating Curve f or Packages
Copyright 2013 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot
assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be
accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.
DS9193-16 January 2013www.richtek.com
14
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