Richtek RT9193-15GB, RT9193-15PB, RT9193-15PU5, RT9193-16GB, RT9193-16PB Schematic [ru]

...
®
RT9193
300mA, Ultra-Low Noise, Ultra-Fast CMOS LDO Regulator
General Description
The RT9193 is designed for portable RF and wireless applications with demanding performance and space requirements. The RT9193 performa nce is optimized f or battery-powered systems to deliver ultra low noise and low quiescent current. A noise bypa ss pin is availa ble for further reduction of output noise. Regulator ground current increa s e s only slightly in dropout, further prolonging the battery life. The RT9193 also works with low-ESR cera mic capa citors, reducing the a mount of board space necessary for power applications, critical in hand-held wireless devices. The RT9193 consumes less than 0.01
μA in
shutdown mode and ha s fa st turn-on time less than 50μs. The other features include ultra low dropout voltage, high output accura cy , current limiting protection, and high ri pple rejection ratio. Available in the SC-70-5, SOT-23-5, TSOT-23-5, W D F N-6L 2x2 a nd MSOP-8 packages.
Ordering Information
RT9193-
Package Type U5 : SC-70-5 B : SOT-23-5 J5 : TSOT-23-5 QW : WDFN-6L 2x2 (W-Type) F : MSOP-8
Lead Plating System P : Pb Free G : Green (Halogen Free and Pb Free)
Output Voltage 15 : 1.5V 16 : 1.6V : 49 : 4.9V 50 : 5.0V 1H : 1.85V 2H : 2.85V 4G : 4.75V (1.5V to 5V with 0.1V step is available)
Note : Richtek products are :
` RoHS compliant and compatible with the current require-
ments of IPC/JEDEC J-STD-020.
` Suitable for use in SnPb or Pb-free soldering processes.
Features
zz
Ultra Low Noise for RF Application
z
zz
zz
z Ultra Fast Response in Line/Load Transient
zz
zz
z Quick Start-Up (T ypically 50
zz
zz
z <0.01
zz
zz
z Low Dropout : 220mV @ 300mA
zz
zz
z Wide Operating Voltage Ranges : 2.5V to 5.5V
zz
zz
z TTL-Logic-Controlled Shutdown Input
zz
zz
z Low Temperature Coefficient
zz
zz
z Current Limiting Protection
zz
zz
z Thermal Shutdown Protection
zz
zz
z Only 1
zz
zz
z High Power Supply Rejection Ratio
zz
zz
z Custom Voltage Available
zz
zz
z RoHS Compliant and 100% Lead (Pb)-Free
zz
μμ
μA Standby Current When Shutdown
μμ
μμ
μF Output Capacitor Required for Stability
μμ
μμ
μs)
μμ
Applications
z CDMA/GSM Cellular Handsets z Battery-Powered Equipment z Laptop, Palmtops, Notebook Computers z Hand-Held Instruments z PCMCIA Cards z Portable Information Applia nces
Marking Information
Typical Application Circuit
RT9193
V
IN
1µF/X7R
Chip Enable
C
IN
VIN
GND EN
VOUT
BP
C
OUT
1µF/X7R
C
BP
22nF
(Option for low noise)
V
OUT
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RT9193
Pin Configurations
(TOP VIEW)
VOUT BP
1
5
23
VIN GND EN
4
EN
2
GND
3
WDFN-6L 2x2 MSOP-8
SC-70-5/SOT-23-5/TSOT-23-5
Functional Pin Description
Pin Name Pin Function
6
BP
5
NC
7
4
VOUTVIN
NC
VIN
NC
VOUT
8 2 3 4
NC
7
EN
6
BP
5
GND
EN
BP
Chip Enable (Active High). Note that this pin is high impedance. There should be a pull low 100kΩ resist or c onn ected to G ND wh en the control s ignal is flo at ing.
Reference Noise Bypass. This pin can be floating. For lowest noise performance, connect a 22nF capacitor between the BP and GND pins.
GND Ground. VOUT Output Voltage. VIN Power Input Voltage.
Function Block Diagram
EN
Quick
Start
BP
V
REF
Shutdown
and
Logic Control
+
-
Error
Amplifier
VIN
MOSFET
Driver
VOUT
Current-Limit
and
Thermal
Protection
GND
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RT9193
Absolute Maximum Ratings (Note 1)
z Supply Input V oltage------------------------------------------------------------------------------------------------------ 6V z Power Dissipation, P
SC-70-5 ---------------------------------------------------------------------------------------------------------------------- 300mW TSOT-23-5/SOT -23-5------------------------------------------------------------------------------------------------------ 400mW WDFN-6L 2x2 -------------------------------------------------------------------------------------------------------------- 606mW MSOP-8 --------------------------------------------------------------------------------------------------------------------- 625mW
z Package Thermal Resistance (Note 2)
SOT-70-5, θJA--------------------------------------------------------------------------------------------------------------- 333°C/W TSOT-23-5/SOT -23-5, θJA------------------------------------------------------------------------------------------------ 250°C/W TSOT-23-5/SOT-23-5, θJC----------------------------------------------------------------------------------------------- 25°C/W W DFN-6L 2x2, θJA--------------------------------------------------------------------------------------------------------- 165°C/W WDFN-6L 2x2, θJC-------------------------------------------------------------------------------------------------------- 20°C/W MSOP-8 θJA---------------------------------------------------------------------------------------------------------------- 160°C/W MSOP-8 θJC---------------------------------------------------------------------------------------------------------------- 55°C/W
z Junction T emperature----------------------------------------------------------------------------------------------------- 150°C z Lead T e mperature (Soldering, 10 sec.)------------------------------------------------------------------------------- 26 0°C z Storage T emperature Range -------------------------------------------------------------------------------------------- 65°C to 150°C z ESD Susceptibility (Note 3)
HBM (Human Body Model)---------------------------------------------------------------------------------------------- 2kV MM (Machine Model) ----------------------------------------------------------------------------------------------------- 200V
@ T
D
= 25°C
A
Recommended Operating Conditions (Note 4)
z Supply Input V oltage------------------------------------------------------------------------------------------------------ 2.5V to 5.5V z EN Input V oltage----------------------------------------------------------------------------------------------------------- 0V to 5.5V z Junction T emperature Range-------------------------------------------------------------------------------------------- z Ambient T emperature Range--------------------------------------------------------------------------------------------
Electrical Characteristics
(VIN = V
+ 1V, CIN = C
OUT
= 1μF, CBP = 22nF, T
OUT
= 25° C, unless otherwise specified)
A
Parameter Symbol Test Conditions Min Typ Max Unit
Output Voltage Accuracy ΔV Current Limit I Quiescent Current IQ V
D rop out Voltage ( Note 5) V
Line Regulation ΔV
Load Regulation ΔV Standby Cu rrent I
I
OUT
R
LIM
DROP
LINE
1mA < I
LOAD
VEN = GND, Shutdo wn -- 0.0 1 1 μA
STBY
= 1mA 2 -- 2 %
OUT
= 1Ω 360 400 -- mA
LOAD
≥ 1.2V, I
EN
I
= 200mA , V
OUT
I
= 300mA , V
OUT
= (V
V
IN
I
= 1mA
OUT
+ 1V) to 5.5V,
OUT
< 300mA -- -- 0.6 %
OUT
= 0mA -- 90 130 μA
OUT
> 2.8V 170 200
OUT
> 2.8V -- 220 300
OUT
-- -- 0.3 %
40°C to 125°C
40°C to 85°C
mV
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RT9193
Parameter Symbol Test Conditions Min Typ Max Unit
EN Input Bias Current I EN Threshold
Voltage
Logic-Low Logic-High
Output Noise Voltage eNO
f = 100Hz -- −70 -- Power Supply
Rej ect ion Rat e
f = 10kHz
VEN = GND or VIN -- 0 100 nA
IBSD
VIN = 3V to 5.5V, Shutdown -- -- 0.4
V
IL
VIN = 3V to 5.5V, Start-Up 1.2 -- --
V
IH
PSRR C
10Hz to 100kHz, I
= 1μF
C
OUT
= 1μF, I
OUT
OUT
= 200mA
OUT
= 10mA
-- 100 -- μV
-- 50 --
V
RMS
dB
Thermal Shutdown Temperature TSD -- 165 -- °C Thermal Shutdown Temperature
Note 1. Stresses beyond those listed Absolute Maximum Ratings may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may affect device reliability.
Note 2. θ Note 3. Devices are ESD sensitive. Handling precaution is recommended. Note 4. The device is not guaranteed to function outside its operating conditions. Note 5. The dropout voltage is defined as V
is measured at T
JA
= 25°C on a low effective thermal conductivity single-layer test board per JEDEC 51-3.
A
ΔTSD -- 30 -- °C
IN
V
, which is measured when V
OUT
OUT
is V
OUT(NORMAL)
100mV.
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Typical Operating Characteristics
RT9193
Output Voltage vs. Temperature
1.8
RT9193-15xU5 V
= 3.3V
IN
1.7
1.6
1.5
1.4
CIN = C
= 1μF X7R
OUT
Output Voltage (V)
1.3
1.2
-50 -25 0 25 50 75 100 125
Temperature (°C)
Dropout Voltage v s. Load Current
300
RT9193-33xB CIN = C
250
200
150
100
Dropout V oltage (mV)
50
OUT
= 1μF
T
J
= 25°C
T
= 125°C
J
T
= -40°C
J
Quiescent Current vs. Temperature
95
RT9193-15xU5 V
= 3.3V
IN
90
CIN = C
85
80
75
70
= 1μF X7R
OUT
Quiescent C urrent (µ A
65
60
-50 -25 0 25 50 75 100 125
Temperature (°C)
PSRR
20
V
= 4V to 5V
IN
PSRR (dB)
CIN = C
0
-20
-40
-60
= 1μF , X7R
OUT
I
Load
= 100mA
I
Load
= 10mA
0
0 0.05 0.1 0.15 0.2 0.25 0.3
Load Current (A)
EN Pin Shutdown Threshold vs. Tem pe rature
1.75
RT9193-15xU5 V
= 3.3V
IN
CIN = C
1.50
1.25
1.00
0.75
EN Pin Shutdown Threshold (V) 1
0.50
-50 -25 0 25 50 75 100 125
= 1μF X7R
OUT
-80
10 100 1K 10K 100K 1M
0.01 0.1 1 10 100 1000
Frequency (kHz)
(Hz)
EN Pin Shutdown Response
V
= 5V
10 5
(V)
0
EN Pin Voltage
(V)
Output Voltage
2 1 0
IN
CIN = C
OUT
= 1μF
Time (500μs/Div)
RT9193-28xU5 No Load
Temperature (°C)
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RT9193
V CIN = C
100 50
(mA)
0
Load Current
20 0
-20
Output Voltage
Deviation (mV)
V
IN
C
OUT
6 5 4
Deviation (V)
Input Voltage
Load Transient Response
= 5V, V
IN
OUT
= 2.8V
OUT
= 1μF
Time (500μs/Div)
I
LOAD
Line Transient Response
= 4V to 5V
= 1μF
= 1mA to 60mA
RT9193-25xB I
= 1mA
LOAD
400 200
(mA)
0
Load Current
50 0
-50
Output Voltage
Deviation (mV)
V C
6 5
Deviation (V)
Input Voltage
4
Load Transient Response
V
= 5V, V
IN
CIN = C
OUT
OUT
= 1μF
= 2.8V
Time (500μs/Div)
Line Transient Response
= 4V to 5V
IN
= 1μF
OUT
I
= 1mA to 250mA
LOAD
RT9193-25xB I
LOAD
= 100mA
10 0
-10
Output Voltage
Deviation (mV)
V
IN
CIN = C
200 100 0
-100
Noise (μV)
-200
= 4.5V
OUT
Time (50μs/Div)
= 1μF , X7R
Time (10ms/Div)
Noise
RT9193-30xB I
= 50mA
LOAD
f = 10Hz to 100kHz
10 0
-10
Output Voltage
Deviation (mV)
V CIN = C
200 100 0
-100
Noise (μV)
-200
= 4.5V
IN
= 1μF , X7R
OUT
Time (100μs/Div)
Noise
f = 10Hz to 100kHz
Time (10ms/Div)
RT9193-15xU5 I
= 50mA
LOAD
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10 5
(V)
0
EN Pin Voltage
2 1
(V)
Output Voltage
0
V
= 5V
IN
CIN = C
OUT
Start Up
= 1μF
Time (10μs/Div)
RT9193
RT9193-28xU5 No Load
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RT9193
Applications Information
Like any low dropout regulator, the external capacitors used with the RT9193 must be carefully selected for regulator stability and performance. Using a capacitor whose value is >1μF on the RT9193 input and the a mount of capacitance can be increased without limit. The input ca pacitor must be located a dista nce of not more than 0.5 inch from the input pin of the IC and returned to a clean analog ground. Any good quality cera mic or tantalum ca n be used for this ca pacitor . The capa citor with larger value and lower ESR (equivalent series resistance) provides better PSRR and line-transient response. The output capacitor must meet both requirements for minimum amount of capacitance and ESR in all LDOs application. The RT9193 is designed specifically to work with low ESR ceramic output ca pa citor in space-saving a nd performance consideration. Using a cera mic ca pa citor whose value is at least 1μF with ESR is >1mΩ on the RT9193 output ensures stability . The R T9193 still works well with output capa citor of other types due to the wide stable ESR ra nge. Figure 1 shows the curves of allowable ESR range as a function of load current for various output ca pacitor values. Output capacitor of larger capacitance can reduce noise and improve loa d transient response, sta bility, a nd PSRR. The output capa citor should be located not more than 0.5 inch from the V
pin of the RT9193 and returned to a
OUT
clean a nalog ground.
Region of Stable C
100
10
ESR vs. Load Current
OUT
Instable
Bypass Capacitor and Low Noise
Connecting a 22nF between the BP pin and GND pin significantly reduces noise on the regulator output, it is critical that the cap acitor conne ction between the BP pin and GND pin be direct and PCB tra ces should be a s short a s possible. There is a relationship between the bypass capacitor value and the LDO regulator turn on time. DC leakage on this pin can affect the LDO regulator output noise and voltage regulation performa nce.
Enable Function
The RT9193 features an LDO regulator enable/disable function. To assure the LDO regulator will switch on, the EN turn on control level must be greater than 1.2 volts. The LDO regulator will go into the shutdown mode when the voltage on the EN pin falls below 0.4 volts. For to protecting the system, the RT9193 have a quick-discharge function. If the enable function is not needed in a specific application, it may be tied to VIN to keep the LDO regulator in a continuously on state.
Thermal Considerations
Thermal protection limits power dissipation in RT9193. When the operation junction temperature exceeds 165°C, the OTP circuit starts the thermal shutdown function turn the pass element off. The pass element turn on again after the junction temperature cools by 30°C.
For continue operation, do not exceed absolute maximum operation junction temperature 125°C. The power dissipation definition in device is :
Ω
ESR ( )
OUT
C
1
Stable
0.1
0.01
0.001 0 50 100 150 200 250 300
Load Current (mA)
RT9193-15xU5 CIN = C
= 1μF , X7R
OUT
PD = (V The maximum power dissipation depends on the thermal
resistance of IC package, PCB layout, the rate of surroundings airflow and temperature difference between junction to ambient. The maximum power dissipation ca n be calculated by following formula :
P
D(MAX)
Where T
V
IN
= ( T
J(MAX)
OUT
J(MAX)
) x I
+ VIN x I
OUT
TA ) /θ
Q
JA
is the maximum operation junction
temperature 125°C, TA is the ambient temperature and
Figure 1
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the θ
is the junction to ambient thermal resistance.
JA
DS9193-16 January 2013www.richtek.com
For recommended operating conditions specification of RT9193, where T
is the maximum junction
J(MAX)
temperature of the die (125°C) and TA is the maximum ambient temperature. The junction to ambient thermal resistance (θJA is layout dependent) for TSOT-23-5/ SOT-23-5 package is 250°C/W, SC-70-5 package is 333°C/W, W D FN-6L 2x2 package is 165°C/W and MSOP­8 package is 160°C/W on sta ndard JEDEC 51-3 thermal test board. The maximum power dissipation at TA = 25°C can be calculated by following f ormula :
RT9193
P
= (125°C − 25°C) / 333 = 300mW for
D(MAX)
SC-70-5 P
= (125°C − 25°C) / 250 = 400mW for
D(MAX)
TSOT-23-5/SOT -23-5 P
= (125°C − 25°C) / 165 = 606mW for
D(MAX)
W DFN-6L 2x2 P
= (125°C −25°C) / 160 = 625mW for
D(MAX)
MSOP-8 The maximum power dissipation depends on operating
ambient temperature for fixed T
and thermal
J(MAX)
resistance θJA. For RT9193 packages, the Figure 2 of derating curves allows the designer to see the effect of rising ambient temperature on the maximum power allowed.
700
600
500
400
300
MSOP-8
TSOT-23-5/ SOT-23-5
SC 70-5
WDFN-6L 2x2
200
Power Dissipati on (mW)
100
0
0 25 50 75 100 125
Ambient Tem peratu re (°C)
Figure 2. Derating Curve f or Packages
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RT9193
Outline Dimension
H
D
L
C
b
A
e
Dimensions In Millimeters Dimensions In Inches
Symbol
Min Max Min Max
A 0.800 1.100 0.031 0.044
A1 0.000 0.100 0.000 0.004
B 1.150 1.350 0.045 0.054 b 0.150 0.400 0.006 0.016 C 1.800 2.450 0.071 0.096 D 1.800 2.250 0.071 0.089
B
A1
e 0.650 0.026 H 0.080 0.260 0.003 0.010 L 0.210 0.460 0.008 0.018
SC-70-5 Surface Mount Package
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RT9193
H
D
L
C
b
A
e
B
A1
Dimensions In Millimeters Dimensions In Inches
Symbol
Min Max Min Max
A 0.700 1.000 0.028 0.039
A1 0.000 0.100 0.000 0.004
B 1.397 1.803 0.055 0.071
b 0.300 0.559 0.012 0.022 C 2.591 3.000 0.102 0.118 D 2.692 3.099 0.106 0.122
e 0.838 1.041 0.033 0.041 H 0.080 0.254 0.003 0.010
L 0.300 0.610 0.012 0.024
TSOT-23-5 Surface Mount Package
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RT9193
H
D
L
C
b
A
e
Dimensions In Millimeters Dimensions In Inches
Symbol
Min Max Min Max
A 0.889 1.295 0.035 0.051
A1 0.000 0.152 0.000 0.006
B 1.397 1.803 0.055 0.071
b 0.356 0.559 0.014 0.022 C 2.591 2.997 0.102 0.118 D 2.692 3.099 0.106 0.122
B
A1
e 0.838 1.041 0.033 0.041 H 0.080 0.254 0.003 0.010
L 0.300 0.610 0.012 0.024
SOT-23-5 Surface Mount Package
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RT9193
D
E
A
A3
A1
D2
L
E2
SEE DETAIL A
1
e
b
2
1
1
2
DETAIL A
Pin #1 ID a nd T ie Bar Mark Option s
Note : The configuration of the Pin #1 identifier is optional, but must be located within the zone indicated.
Dimensions In Millimeters Dimensions In Inches
Symbol
Min Max Min Max
A 0.700 0.800 0.028 0.031 A1 0.000 0.050 0.000 0.002 A3 0.175 0.250
0.007 0.010
b 0.200 0.350 0.008 0.014
D 1.950 2.050 0.077 0.081
D2 1.000 1.450 0.039 0.057
E 1.950 2.050 0.077 0.081 E2 0.500 0.850 0.020 0.033
e 0.650 0.026
L 0.300 0.400
W-Type 6L DFN 2x2 Package
0.012 0.016
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RT9193
D
L
E
A
b
E1
e
A2
A1
Dimensions In Millimeters Dimensions In Inches
Symbol
Min Max Min Max
A 0.810 1.100 0.032 0.043 A1 0.000 0.150 0.000 0.006 A2 0.750 0.950 0.030 0.037
b 0.220 0.380 0.009 0.015
D 2.900 3.100 0.114 0.122
e 0.650 0.026
E 4.800 5.000 0.189 0.197 E1 2.900 3.100 0.114 0.122
L 0.400 0.800
0.016 0.031
8-Lead MSOP Plastic Package
Richtek Technology Corporation
5F, No. 20, Taiyuen Street, Chupei City Hsinchu, Taiwan, R.O.C. Tel: (8863)5526789
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.
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