z Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------- 260°C
z Junction Temperature ----------------------------------------------------------------------------------------------- 150°C
z Storage Temperature Range --------------------------------------------------------------------------------------- −65°C to 150°C
z ESD Susceptibility (Note 3)
HBM (Human Body Mode) ----------------------------------------------------------------------------------------- 2kV
MM (Machine Mode) ------------------------------------------------------------------------------------------------ 200V
Recommended Operating Conditions (Note 4)
z Supply Input Voltage ------------------------------------------------------------------------------------------------ 3V to 5.5V
z Enable Input Voltage ------------------------------------------------------------------------------------------------ 0V to 5.5V
z Junction Temperature Range -------------------------------------------------------------------------------------- −40°Cto 125°C
@ TA = 25°C
D
Electrical Characteristics
(V
= V
IN
+ 0.7V, I
OUT
Parameter Symbol Test Conditions Min Typ Max Unit
Reference Voltage Tolerance V
Adjust Pin Current I
Output Voltage Range V
Quiescent Current (Note 5) IQ Enabled, I
Standby Current (Note 6) I
Current Limit I
Dropout Voltage (Note 7) V
Line Regulation ΔV
Thermal Shutdown Temperature TSD -- 170 -- °C
Thermal Shutdown Hysteresis ΔTSD -- 40 -- °C
EN Threshold
EN Current IEN V
= 10uA, C
OUT
Logic-Low Voltage VIL V
Logic-High Voltage V
= C
IN
= 1uF (Ceramic), T
OUT
1.163 1.175 1.187 V
REF
-- -- 10 nA
ADJ
1.175 -- 4.5 V
OUT
VIN = 5.5V, Shutdown -- -- 1 μA
STBY
0.5 -- -- A
LIM
DROP
V
LINE
V
IH
= 25°C unless otherwise specified)
A
I
= 10mA -- 10 --
OUT
= 300mA -- 300 -
I
OUT
+ 0.7V < VIN < 5.5V -- 0.001 -- %/V
OU T
= 3.3V, Shutdown -- -- 0.4
IN
= 3.3V, Enable 2.0 -- --
IN
= 5.5V, Enable -- -- 10 nA
IN
= 0mA -- 150 -- μA
OUT
mV
V
DS9179-11 April 2011www.richtek.com
3
RT9179
Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. θ
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. Quiescent, or ground current, is the difference between input and output currents. It is defined by I
Note 6. Standby current is the input current drawn by a regulator when the output voltage is disabled by a shutdown signal
(V
Note 7. The dropout voltage is defined as V
is measured in the natural convection at TA = 25°C on a low effective thermal conductivity test board of
JA
JEDEC 51-3 thermal measurement standard.
= IIN - I
Q
no load condition (I
= 0mA). The total current drawn from the supply is the sum of the load current plus the ground
OUT
pin current.
0.4V). It is measured with V
EN
≤
= 5.5V.
IN
IN
-V
, which is measured when V
OUT
OUT
is V
OUT(NORMAL)
− 100mV.
OUT
under
DS9179-11 April 2011www.richtek.com
4
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