All information contained in these materials, including products and product specifications,
represents information on the product at the time of publication and is subject to change by
Renesas Electronics Corp. without notice. Please review the latest information published by
Renesas Electronics Corp. through various means, including the Renesas Electronics Corp.
website (http://www.renesas.com).
www.renesas.com
Aug 2019Rev.1.30
S5D9 Microcontroller Group
Datasheet
Leading performance 120-MHz Arm® Cortex®-M4 core, up to 2-MB code flash memory, 640-KB SRAM, Graphics LCD
Controller, 2D Drawing Engine, Capacitive Touch Sensing Unit, Ethernet MAC Controller with IEEE 1588 PTP, USB 2.0
High-Speed, USB 2.0 Full-Speed, SDHI, Quad SPI, security and safety features, and advanced analog.
Features
■ Arm Cortex-M4 Core with Floating Point Unit (FPU)
Armv7E-M architecture with DSP instruction set
Maximum operating frequency: 120 MHz
Support for 4-GB address space
On-chip debugging system: JTAG, SWD, and ETM
Boundary scan and Arm Memory Protection Unit (Arm MPU)
■ Memory
Up to 2-MB code flash memory (40 MHz zero wait states)
64-KB data flash memory (125,000 erase/write cycles)
Up to 640-KB SRAM
Flash Cache (FCACHE)
Memory Protection Units (MPU)
Memory Mirror Function (MMF)
128-bit unique ID
Error Correction Code (ECC) in SRAM
SRAM parity error check
Flash area protection
ADC self-diagnosis function
Clock Frequency Accuracy Measurement Circuit (CAC)
Cyclic Redundancy Check (CRC) calculator
Data Operation Circuit (DOC)
Port Output Enable for GPT (POEG)
Independent Watchdog Timer (IWDT)
GPIO readback level detection
Register write protection
Main oscillator stop detection
Illegal memory access
■ System and Power Management
Low power modes
Realtime Clock (RTC) with calendar and VBATT support
Event Link Controller (ELC)
DMA Controller (DMAC) × 8
Data Transfer Controller (DTC)
Key Interrupt Function (KINT)
Power-on reset
Low Voltage Detection (LVD) with voltage settings
■ Security and Encryption
AES128/192/256
3DES/ARC4
SHA1/SHA224/SHA256/MD5
GHASH
RSA/DSA/ECC
True Random Number Generator (TRNG)
■ Human Machine Interface (HMI)
Graphics LCD Controller (GLCDC)
JPEG codec
2D Drawing Engine (DRW)
Capacitive Touch Sensing Unit (CTSU)
Parallel Data Capture Unit (PDC)
■ Multiple Clock Sources
Main clock oscillator (MOSC) (8 to 24 MHz)
Sub-clock oscillator (SOSC) (32.768 kHz)
High-speed on-chip oscillator (HOCO) (16/18/20 MHz)
Middle-speed on-chip oscillator (MOCO) (8 MHz)
Low-speed on-chip oscillator (LOCO) (32.768 kHz)
IWDT-dedicated on-chip oscillator (15 kHz)
Clock trim function for HOCO/MOCO/LOCO
Clock out support
■ General-Purpose I/O Ports
Up to 133 input/output pins
- Up to 9 CMOS input
- Up to 124 CMOS input/output
- Up to 21 input/output 5 V tolerant
- Up to 18 high current (20 mA)
■ Operating Voltage
VCC: 2.7 to 3.6 V
■ Operating Temperature and Packages
Ta = -40°C to +85°C
- 176-pin BGA (13 mm × 13 mm, 0.8 mm pitch)
- 145-pin LGA (7 mm × 7 mm, 0.5 mm pitch)
Ta = -40°C to +105°C
- 176-pin LQFP (24 mm × 24 mm, 0.5 mm pitch)
- 144-pin LQFP (20 mm × 20 mm, 0.5 mm pitch)
- 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch)
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S5D9 Datasheet1. Overview
1.Overview
The MCU integrates multiple series of software- and pin-compatible Arm®-based 32-bit cores that share the same set of
Renesas peripherals to facilitate design scalability and efficient platform-based product development.
The MCU in this series incorporates a high-performance Arm Cortex
following features:
Up to 2-MB code flash memory
640-KB SRAM
Graphics LCD Controller (GLCDC)
2D Drawing Engine (DRW)
Capacitive Touch Sensing Unit (CTSU)
Ethernet MAC Controller (ETHERC) with IEEE 1588 PTP, USBFS, USBHS, SD/MMC Host Interface
Quad Serial Peripheral Interface (QSPI)
Security and safety features
Analog peripherals.
1.1Function Outline
®
-M4 core running up to 120 MHz, with the
Table 1.1Arm core
FeatureFunctional description
Arm Cortex-M4 core Maximum operating frequency: up to 120 MHz
Arm Cortex-M4 core:
- Revision: r0p1-01rel0
- ARMv7E-M architecture profile
- Single precision floating-point unit compliant with the ANSI/IEEE Std 754-2008.
Arm Memory Protection Unit (Arm MPU):
- ARMv7 Protected Memory System Architecture
- 8 protect regions.
SysTick timer:
- Driven by SYSTICCLK (LOCO) or ICLK.
Table 1.2Memory
FeatureFunctional description
Code flash memoryMaximum 2-MB code flash memory. See section 55, Flash Memory in User’s Manual.
Data flash memory64-KB data flash memory. See section 55, Flash Memory in User’s Manual.
Memory Mirror Function (MMF)The Memory Mirror Function (MMF) can be configured to mirror the target application image
Option-setting memoryThe option-setting memory determines the state of the MCU after a reset. See section 7,
SRAMOn-chip high-speed SRAM with either parity-bit or Error Correction Code (ECC). The first
Standby SRAMOn-chip SRAM that can retain data in Deep Software Standby mode. See section 54, Standby
load address in code flash memory to the application image link address in the 23-bit unused
memory space (memory mirror space addresses). Your application code is developed and
linked to run from this MMF destination address. The application code does not need to know
the load location where it is stored in code flash memory. See section 5, Memory Mirror
Function (MMF) in User’s Manual.
Option-Setting Memory in User’s Manual.
32 KB in SRAM0 provides error correction capability using ECC. Parity check is performed for
other areas. See section 53, SRAM in User’s Manual.
SRAM in User’s Manual.
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S5D9 Datasheet1. Overview
Table 1.3System (1 of 2)
FeatureFunctional description
Operating modesTwo operating modes:
- Single-chip mode
- SCI or USB boot mode.
See section 3, Operating Modes in User’s Manual.
Resets14 resets:
RES pin reset
Power-on reset
Voltage monitor 0 reset
Voltage monitor 1 reset
Voltage monitor 2 reset
Independent watchdog timer reset
Watchdog timer reset
Deep software standby reset
SRAM parity error reset
SRAM ECC error reset
Bus master MPU error reset
Bus slave MPU error reset
Stack pointer error reset
Software reset.
See section 6, Resets in User’s Manual.
Low Voltage Detection (LVD)The Low Voltage Detection (LVD) function monitors the voltage level input to the VCC pin, and
the detection level can be selected using a software program. See section 8, Low Voltage
Detection (LVD) in User’s Manual.
Clocks Main clock oscillator (MOSC)
Clock Frequency Accuracy
Measurement Circuit (CAC)
Interrupt Controller Unit (ICU)The Interrupt Controller Unit (ICU) controls which event signals are linked to the NVIC/DTC
Key Interrupt Function (KINT)A key interrupt can be generated by setting the Key Return Mode Register (KRM) and inputting
Low power modesPower consumption can be reduced in multiple ways, such as by setting clock dividers,
Battery backup functionA battery backup function is provided for partial powering by a battery. The battery-powered
Register write protectionThe register write protection function protects important registers from being overwritten
Memory Protection Unit (MPU)Four Memory Protection Units (MPUs) and a CPU stack pointer monitor function are provided
See section 9, Clock Generation Circuit in User’s Manual.
The Clock Frequency Accuracy Measurement Circuit (CAC) counts pulses of the clock to be
measured (measurement target clock) within the time generated by the clock to be used as a
measurement reference (measurement reference clock), and determines the accuracy
depending on whether the number of pulses is within the allowable range.
When measurement is complete or the number of pulses within the time generated by the
measurement reference clock is not within the allowable range, an interrupt request is
generated.
See section 10, Clock Frequency Accuracy Measurement Circuit (CAC) in User’s Manual.
module and DMAC module. The ICU also controls NMI interrupts. See section 14, Interrupt
Controller Unit (ICU).
a rising or falling edge to the key interrupt input pins. See section 21, Key Interrupt Function
(KINT) in User’s Manual.
controlling EBCLK output, controlling SDCLK output, stopping modules, selecting power
control mode in normal operation, and transitioning to low power modes. See section 11, LowPower Modes in User’s Manual.
area includes the RTC, SOSC, backup memory, and switch between
section 12, Battery Backup Function in User’s Manual.
because of software errors. See section 13, Register Write Protection in User’s Manual.
for memory protection. See section 16, Memory Protection Unit (MPU) in User’s Manual.
VCC and VBATT. See
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S5D9 Datasheet1. Overview
Table 1.3System (2 of 2)
FeatureFunctional description
Watchdog Timer (WDT)The Watchdog Timer (WDT) is a 14-bit down-counter that can be used to reset the MCU when
the counter underflows because the system has run out of control and is unable to refresh the
WDT. In addition, a non-maskable interrupt or interrupt can be generated by an underflow.
A refresh-permitted period can be set to refresh the counter and be used as the condition for
detecting when the system runs out of control. See section 27, Watchdog Timer (WDT) in
User’s Manual.
Independent Watchdog Timer (IWDT) The Independent Watchdog Timer (IWDT) consists of a 14-bit down-counter that must be
serviced periodically to prevent counter underflow. It can be used to reset the MCU or to
generate a non-maskable interrupt or interrupt for a timer underflow. Because the timer
operates with an independent, dedicated clock source, it is particularly useful in returning the
MCU to a known state as a fail safe mechanism when the system runs out of control. The
IWDT can be triggered automatically on a reset, underflow, refresh error, or by a refresh of the
count value in the registers. See section 28, Independent Watchdog Timer (IWDT) in User’s
Manual.
Table 1.4Event link
FeatureFunctional description
Event Link Controller (ELC)The Event Link Controller (ELC) uses the interrupt requests generated by various peripheral
modules as event signals to connect them to different modules, enabling direct interaction
between the modules without CPU intervention. See section 19, Event Link Controller (ELC)
in User’s Manual.
Table 1.5Direct memory access
FeatureFunctional description
Data Transfer Controller (DTC)A Data Transfer Controller (DTC) module is provided for transferring data when activated by an
DMA Controller (DMAC)An 8-channel DMA Controller (DMAC) module is provided for transferring data without the
interrupt request. See section 18, Data Transfer Controller (DTC) in User’s Manual.
CPU. When a DMA transfer request is generated, the DMAC transfers data stored at the
transfer source address to the transfer destination address. See section 17, DMA Controller
(DMAC) in User’s Manual.
Table 1.6External bus interface
FeatureFunctional description
External buses CS area (EXBIU): Connected to the external devices (external memory interface)
SDRAM area (EXBIU): Connected to the SDRAM (external memory interface)
QSPI area (EXBIUT2): Connected to the QSPI (external device interface).
Table 1.7Timers (1 of 2)
FeatureFunctional description
General PWM Timer (GPT)The General PWM Timer (GPT) is a 32-bit timer with 14 channels. PWM waveforms can be
Port Output Enable for GPT (POEG)Use the Port Output Enable for GPT (POEG) function to place the General PWM Timer (GPT)
Asynchronous General-Purpose
Timer (AGT)
generated by controlling the up-counter, down-counter, or the up- and down-counter. In
addition, PWM waveforms can be generated for controlling brushless DC motors. The GPT
can also be used as a general-purpose timer. See section 23, General PWM Timer (GPT) in
User’s Manual.
output pins in the output disable state. See section 22, Port Output Enable for GPT (POEG) in
User’s Manual.
The Asynchronous General-Purpose Timer (AGT) is a 16-bit timer that can be used for pulse
output, external pulse width or period measurement, and counting of external events.
This 16-bit timer consists of a reload register and a down-counter. The reload register and the
down-counter are allocated to the same address, and can be accessed with the AGT register.
See section 25, Asynchronous General-Purpose Timer (AGT) in User’s Manual.
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S5D9 Datasheet1. Overview
Table 1.7Timers (2 of 2)
FeatureFunctional description
Realtime Clock (RTC)The Realtime Clock (RTC) has two counting modes, calendar count mode and binary count
mode, that are controlled by the register settings.
For calendar count mode, the RTC has a 100-year calendar from 2000 to 2099 and
automatically adjusts dates for leap years.
For binary count mode, the RTC counts seconds and retains the information as a serial value.
Binary count mode can be used for calendars other than the Gregorian (Western) calendar.
See section 26, Realtime Clock (RTC) in User’s Manual.
Table 1.8Communication interfaces (1 of 2)
FeatureFunctional description
Serial Communications Interface
(SCI)
IrDA interfaceThe IrDA interface sends and receives IrDA data communication waveforms in cooperation
2
I
C bus interface (IIC)The 3-channel I2C bus interface (IIC) conforms with and provides a subset of the NXP I2C
Serial Peripheral Interface (SPI)Two independent Serial Peripheral Interface (SPI) channels are capable of high-speed, full-
Serial Sound Interface Enhanced
(SSIE)
Quad Serial Peripheral Interface
(QSPI)
Controller Area Network (CAN)
module
USB 2.0 Full-Speed (USBFS) module The USB 2.0 Full-Speed (USBFS) module can operate as a host controller or device controller.
The Serial Communications Interface (SCI) is configurable to five asynchronous and
synchronous serial interfaces:
Asynchronous interfaces (UART and Asynchronous Communications Interface Adapter
The smart card interface complies with the ISO/IEC 7816-3 standard for electronic signals and
transmission protocol.
Each SCI has FIFO buffers to enable continuous and full-duplex communication, and the data
transfer speed can be configured independently using an on-chip baud rate generator.
See section 34, Serial Communications Interface (SCI) in User’s Manual.
with the SCI1 based on the IrDA (Infrared Data Association) standard 1.0. See section 35,
IrDA Interface in User’s Manual.
(Inter-Integrated Circuit) bus interface functions. See section 36, I2C Bus Interface (IIC) in
User’s Manual.
duplex synchronous serial communications with multiple processors and peripheral devices.
See section 38, Serial Peripheral Interface (SPI) in User’s Manual.
The Serial Sound Interface Enhanced (SSIE) peripheral provides functionality to interface with
digital audio devices for transmitting I
audio data over a serial bus. The SSIE supports an audio clock frequency of up to 50 MHz,
and can be operated as a slave or master receiver, transmitter, or transceiver to suit various
applications. The SSIE includes 32-stage FIFO buffers in the receiver and transmitter, and
supports interrupts and DMA-driven data reception and transmission. See section 41, Serial
Sound Interface Enhanced (SSIE) in User’s Manual.
The Quad Serial Peripheral Interface (QSPI) is a memory controller for connecting a serial
ROM (nonvolatile memory such as a serial flash memory, serial EEPROM, or serial FeRAM)
that has an SPI-compatible interface. See section 39, Quad Serial Peripheral Interface (QSPI)
in User’s Manual.
The Controller Area Network (CAN) module provides functionality to receive and transmit data
using a message-based protocol between multiple slaves and masters in electromagneticallynoisy applications.
The CAN module complies with the ISO 11898-1 (CAN 2.0A/CAN 2.0B) standard and supports
up to 32 mailboxes, which can be configured for transmission or reception in normal mailbox
and FIFO modes. Both standard (11-bit) and extended (29-bit) messaging formats are
supported. See section 37, Controller Area Network (CAN) Module in User’s Manual.
The module supports full-speed and low-speed (host controller only) transfer as defined in
Universal Serial Bus Specification 2.0. The module has an internal USB transceiver and
supports all of the transfer types defined in the Universal Serial Bus Specification 2.0.
The USB has buffer memory for data transfer, providing a maximum of 10 pipes. Pipes 1 to 9
can be assigned any endpoint number based on the peripheral devices used for
communication or based on your system. See section 32, USB 2.0 Full-Speed Module
(USBFS) in User’s Manual.
2
S 2ch, 4ch, 6ch, 8ch, WS Continue/Monaural/TDM
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S5D9 Datasheet1. Overview
Table 1.8Communication interfaces (2 of 2)
FeatureFunctional description
USB 2.0 High-Speed (USBHS)
module
Ethernet MAC with IEEE 1588 PTP
(ETHERC)
SD/MMC Host Interface (SDHI)The SDHI and MultiMediaCard (MMC) interface module provides the functionality required to
The USB 2.0 High-Speed (USBHS) module can operate as a host controller or a device
controller. As a host controller, the USBHS supports high-speed transfer, full-speed transfer,
and low-speed transfer as defined in the Universal Serial Bus Specification 2.0. As a device
controller, the USBHS supports high-speed transfer and full-speed transfer as defined in the
Universal Serial Bus Specification 2.0. The USBHS has an internal USB transceiver and
supports all of the transfer types defined in the Universal Serial Bus Specification 2.0.
The USBHS has FIFO buffers for data transfer, providing a maximum of 10 pipes. Any
endpoint number can be assigned to pipes 1 to 9, based on the peripheral devices or your
system for communication. See section 33, USB 2.0 High-Speed Module (USBHS) in User’s
Manual.
One-channel Ethernet MAC Controller (ETHERC) compliant with the Ethernet/IEEE802.3
Media Access Control (MAC) layer protocol. An ETHERC channel provides one channel of the
MAC layer interface, connecting the MCU to the physical layer LSI (PHY-LSI) that allows
transmission and reception of frames compliant with the Ethernet and IEEE802.3 standards.
The ETHERC is connected to the Ethernet DMA Controller (EDMAC) so data can be
transferred without using the CPU.
To handle timing and synchronization between devices, an on-chip Precision Time Protocol
(PTP) module for the Ethernet PTP Controller (EPTPC) applies the PTP defined in the IEEE
1588-2008 version 2.0 standard.
The EPTPC is composed of:
Synchronization Frame Processing unit (SYNFP0)
A Statistical Time Correction Algorithm unit (STCA).
Use the EPTPC in combination with the on-chip Ethernet MAC Controller (ETHERC) and the
DMA Controller for the PTP Ethernet Controller (PTPEDMAC). See section 29, Ethernet MAC
Controller (ETHERC) in User’s Manual.
connect a variety of external memory cards to the MCU. The SDHI supports both 1-bit and 4bit buses for connecting memory cards that support SD, SDHC, and SDXC formats. When
developing host devices that are compliant with the SD Specifications, you must comply with
the SD Host/Ancillary Product License Agreement (SD HALA).
The MMC interface supports 1-bit, 4-bit, and 8-bit MMC buses that provide eMMC 4.51
(JEDEC Standard JESD 84-B451) device access. This interface also provides backward
compatibility and supports high-speed SDR transfer modes. See section 43, SD/MMC Host
Interface (SDHI) in User’s Manual.
Table 1.9Analog
FeatureFunctional description
12-bit A/D Converter (ADC12)Up to two successive approximation 12-bit A/D Converters (ADC12) are provided. In unit 0, up
to 13 analog input channels are selectable. In unit 1, up to 11 analog input channels, the
temperature sensor output, and an internal reference voltage are selectable for conversion.
The A/D conversion accuracy is selectable from 12-bit, 10-bit, and 8-bit conversion, making it
possible to optimize the tradeoff between speed and resolution in generating a digital value.
See section 47, 12-Bit A/D Converter (ADC12) in User’s Manual.
12-bit D/A Converter (DAC12)The 12-bit D/A Converter (DAC12) converts data and includes an output amplifier. See section
Temperature Sensor (TSN)The on-chip Temperature Sensor (TSN) determines and monitors the die temperature for
High-Speed Analog Comparator
(ACMPHS)
48, 12-Bit D/A Converter (DAC12) in User’s Manual.
reliable operation of the device. The sensor outputs a voltage directly proportional to the die
temperature, and the relationship between the die temperature and the output voltage is linear.
The output voltage is provided to the ADC12 for conversion and can also be used by the end
application. See section 49, Temperature Sensor (TSN) in User’s Manual.
The High-Speed Analog Comparator (ACMPHS) compares a test voltage with a reference
voltage and provides a digital output based on the conversion result.
Both the test and reference voltages can be provided to the comparator from internal sources
such as the DAC12 output and internal reference voltage, and an external source with or
without an internal PGA.
Such flexibility is useful in applications that require go/no-go comparisons to be performed
between analog signals without necessarily requiring A/D conversion. See section 50, HighSpeed Analog Comparator (ACMPHS) in User’s Manual.
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S5D9 Datasheet1. Overview
Table 1.10Human machine interfaces
FeatureFunctional description
Capacitive Touch Sensing Unit
(CTSU)
Table 1.11Graphics
FeatureFunctional description
Graphics LCD Controller (GLCDC)The Graphics LCD Controller (GLCDC) provides multiple functions and supports various data
2D Drawing Engine (DRW)The 2D Drawing Engine (DRW) provides flexible functions that can support almost any object
JPEG codecThe JPEG incorporates a JPEG codec that conforms to the JPEG baseline compression and
Parallel Data Capture (PDC) unitOne Parallel Data Capture (PDC) unit is provided for communicating with external I/O devices,
The Capacitive Touch Sensing Unit (CTSU) measures the electrostatic capacitance of the
touch sensor. Changes in the electrostatic capacitance are determined by software, which
enables the CTSU to detect whether a finger is in contact with the touch sensor. The electrode
surface of the touch sensor is usually enclosed with an electrical insulator so that fingers do
not come into direct contact with the electrodes. See section 51, Capacitive Touch Sensing
Unit (CTSU) in User’s Manual.
formats and panels. Key GLCDC features include:
GPX bus master function for accessing graphics data
Superimposition of three planes (single-color background plane, graphic 1-plane, and
graphic 2-plane)
Support for many types of 32-bit or 16-bit per pixel graphics data and 8-bit, 4-bit, or 1-bit LUT
data format
Digital interface signal output supporting a video image size of WVGA or greater.
See section 58, Graphics LCD Controller (GLCDC) in User’s Manual.
geometry rather than being bound to only a few specific geometries such as lines, triangles, or
circles. The edges of every object can be independently blurred or antialiased.
Rasterization is executed at one pixel per clock on the bounding box of the object from left to
right and top to bottom. The DRW can also raster from bottom to top to optimize the
performance in certain cases. In addition, optimization methods are available to avoid
rasterization of many empty pixels of the bounding box.
The distances to the edges of the object are calculated by a set of edge equations for every
pixel of the bounding box. These edge equations can be combined to describe the entire
object.
If a pixel is inside the object, it is selected for rendering. If it is outside, it is discarded. If it is on
the edge, an alpha value can be chosen proportional to the distance of the pixel to the nearest
edge for antialiasing.
Every pixel that is selected for rendering can be textured. The resulting aRGB quadruple can
be modified by a general raster operation approach independently for each of the four
channels. The aRGB quadruples can then be blended with one of the multiple blend modes of
the DRW.
The DRW provides two inputs (texture read and framebuffer read), and one output
(framebuffer write).
The internal color format is always aRGB (8888). The color formats from the inputs are
converted to the internal format on read and a conversion back is made on write.
See section 56, 2D Drawing Engine (DRW) in User’s Manual.
decompression standard. This provides high-speed compression of image data and highspeed decoding of JPEG data. See section 57, JPEG Codec (JPEG) in User’s Manual.
including image sensors, and transferring parallel data, such as an image output from the
external I/O device through the DTC or DMAC to the on-chip SRAM and external address
spaces (the CS and SDRAM areas). See section 44, Parallel Data Capture Unit (PDC) in
User’s Manual.
Table 1.12Data processing (1 of 2)
FeatureFunctional description
Cyclic Redundancy Check (CRC)
calculator
The Cyclic Redundancy Check (CRC) calculator generates CRC codes to detect errors in the
data. The bit order of CRC calculation results can be switched for LSB-first or MSB-first
communication. Additionally, various CRC-generating polynomials are available. The snoop
function allows monitoring reads from and writes to specific addresses. This function is useful
in applications that require CRC code to be generated automatically in certain events, such as
monitoring writes to the serial transmit buffer and reads from the serial receive buffer. See
section 40, Cyclic Redundancy Check (CRC) Calculator in User’s Manual.
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S5D9 Datasheet1. Overview
Table 1.12Data processing (2 of 2)
FeatureFunctional description
Data Operation Circuit (DOC)The Data Operation Circuit (DOC) compares, adds, and subtracts 16-bit data. See section 52,
Data Operation Circuit (DOC) in User’s Manual.
Sampling Rate Converter (SRC)The Sampling Rate Converter (SRC) converts the sampling rate of data produced by various
audio decoders, such as the WMA, MP3, and AAC. Both 16-bit stereo and monaural data are
supported. See section 42, Sampling Rate Converter (SRC) in User’s Manual.
Packaging, Terminal material (Pb-free)
#AA: T ray/Sn ( Tin) only
#AC: Tray/others
Production identification code
1.3Part Numbering
Figure 1.2Part numbering scheme
Table 1.14Product list
Product part numberOrderable part numberPackage code
R7FS5D97E2A01CBGR7FS5D97E2A01CBG#AC0PLBG0176GE-A2 MB64 KB640 KB-40 to +85°C
R7FS5D97E3A01CFCR7FS5D97E3A01CFC#AA0PLQP0176KB-A-40 to +105°C
R7FS5D97E2A01CLKR7FS5D97E2A01CLK#AC0PTLG0145KA-A-40 to +85°C
R7FS5D97E3A01CFBR7FS5D97E3A01CFB#AA0PLQP0144KA-B-40 to +105°C
R7FS5D97E3A01CFPR7FS5D97E3A01CFP#AA0PLQP0100KB-B-40 to +105°C
R7FS5D97C2A01CBGR7FS5D97C2A01CBG#AC0PLBG0176GE-A1 MB-40 to +85°C
R7FS5D97C3A01CFCR7FS5D97C3A01CFC#AA0PLQP0176KB-A-40 to +105°C
R7FS5D97C2A01CLKR7FS5D97C2A01CLK#AC0PTLG0145KA-A-40 to +85°C
R7FS5D97C3A01CFBR7FS5D97C3A01CFB#AA0PLQP0144KA-B-40 to +105°C
R7FS5D97C3A01CFPR7FS5D97C3A01CFP#AA0PLQP0100KB-B-40 to +105°C
Code
flash
Data
flashSRAM
Operating
temperature
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S5D9 Datasheet1. Overview
1.4Function Comparison
Table 1.15Functional comparison (Graphics)
Part numbers
Function
Pin count176176145144100
Package BGALQFPLGALQFPLQFP
Code flash memory2/1 MB
Data flash memory64 KB
SRAM640 KB
Parity608 KB
ECC32 KB
Standby SRAM8 KB
SystemCPU clock120 MHz
Backup
registers
ICUYes
KINT8
Event linkELCYes
DMADTCYes
DMAC8
BUSExternal bus16-bit bus8-bit bus
SDRAMYesNo
TimersGPT32EH44444
GPT32E44444
GPT3266665
AGT22222
RTCYes
WDT/IWDTYes
CommunicationSCI10
IIC32
SPI2
SSIE21
QSPI1
SDHI2
CAN2
USBFSYes
USBHSYesNo
ETHERC1
AnalogADC12242219
DAC122
ACMPHS6
TSNYes
HMICTSU131812
Graphics GLCDCRGB888
DRWYes
JPEGYes
PDCYes
Data processingCRCYes
DOCYes
SRCYes
SecuritySCE7
R7FS5D97E2XXXCBG/
R7FS5D97C2XXXCBG
R7FS5D97E3XXXCFC/
R7FS5D97C3XXXCFC
R7FS5D97E2XXXCLK/
R7FS5D97C2XXXCLK
512 B
R7FS5D97E3XXXCFB/
R7FS5D97C3XXXCFB
R7FS5D97E3XXXCFP/
R7FS5D97C3XXXCFP
R01DS0303EU0130 Rev.1.30Page 12 of 116
Aug 30, 2019
S5D9 Datasheet1. Overview
1.5Pin Functions
Table 1.16Pin functions (1 of 5)
FunctionSignalI/ODescription
Power supplyVCCInputDigital voltage supply pin. This is used as the digital power supply for the
respective modules and internal voltage regulator, and used to monitor the
voltage of the POR/LVD. Connect to the system power supply. Connect to
VSS through a 0.1-μF smoothing capacitor close to each VCC pin.
VCL0-Connect to VSS through a 0.1-μF smoothing capacitor close to each VCL
VCL-
VSSInputGround pin. Connect to the system power supply (0 V).
VBATTInputBackup power pin
ClockXTALOutputPins for a crystal resonator. An external clock signal can be input through the
EXTALInput
XCINInputInput/output pins for the sub-clock oscillator. Connect a crystal resonator
XCOUTOutput
EBCLKOutputOutputs the external bus clock for external devices
SDCLKOutputOutputs the SDRAM-dedicated clock
CLKOUTOutputClock output pin
Operating mode
control
System controlRESInputReset signal input pin. The MCU enters the reset state when this signal goes
Figure 2.1Input or output timing measurement conditions
The measurement conditions of timing specification in each peripherals are recommended for the best peripheral
operation, however make sure to adjust driving abilities of each pins to meet your conditions.
2.1Absolute Maximum Ratings
Table 2.1Absolute maximum ratings
ParameterSymbolValueUnit
Power supply voltageVCC, VCC_USB *
VBATT power supply voltageVBATT-0.3 to +4.0V
1
Input voltage (except for 5V-tolerant ports*
1
Input voltage (5V-tolerant ports*
Reference power supply voltageVREFH/VREFH0-0.3 to AVCC0 + 0.3V
Analog power supply voltageAVCC0 *
USBHS power supply voltageVCC_USBHS-0.3 to +4.0V
USBHS analog power supply voltageAVCC_USBHS-0.3 to +4.0V
Analog input voltage (except for P000 to P007)V
Analog input voltage (P000 to P007) when PGA
differential input is disabled
Analog input voltage (P000 to P002, P004 to P006)
when PGA differential input is enabled
Analog input voltage (P003, P007) when PGA
differential input is enabled
Operating temperature*
Storage temperatureT
3,*4,*5
)Vin-0.3 to + VCC + 4.0 (max 5.8)V
)V
in
2
AN
V
AN
V
AN
V
AN
T
opr
stg
2
-0.3 to +4.0V
-0.3 to VCC + 0.3V
-0.3 to +4.0V
-0.3 to AVCC0 + 0.3V
-0.3 to AVCC0 + 0.3V
-1.3 to AVCC0 + 0.3V
-0.8 to AVCC0 + 0.3V
-40 to +85
-40 to +105
-55 to +125°C
°C
R01DS0303EU0130 Rev.1.30Page 28 of 116
Aug 30, 2019
S5D9 Datasheet2. Electrical Characteristics
Caution:Permanent damage to the MCU might result if absolute maximum ratings are exceeded.
Note 1. Ports P205, P206, P400, P401, P407 to P415, P511, P512, P708 to P713, and PB01 are 5V-tolerant.
Note 2. Connect AVCC0 and VCC_USB to VCC.
Note 3. See section 2.2.1, T
Note 4. Contact a Renesas Electronics sales office for information on derating operation when T
systematic reduction of load for improved reliability.
Note 5. The upper limit of operating temperature is 85°C or 105°C, depending on the product. For details, see section 1.3, Part
Numbering.
Table 2.2Recommended operating conditions
ParameterSymbolValueMinTypMaxUnit
Power supply voltagesVCCWhen USB/SDRAM is not used 2.7-3.6V
Note 1. Connect AVCC0 to VCC. When neither the A/D converter nor the D/A converter nor the comparator is in use, do not leave the
AVCC0, VREFH/VREFH0, AVSS0, and VREFL/VREFL0 pins open. Connect the AVCC0 and VREFH/VREFH0 pins to VCC,
and the AVSS0 and VREFL/VREFL0 pins to VSS, respectively.
2.2DC Characteristics
2.2.1Tj/Ta Definition
Table 2.3DC characteristics
Conditions: Products with operating temperature (Ta) -40 to +105°C
ParameterSymbolTypMaxUnitTest conditions
Permissible junction temperatureT
Note:Make sure that Tj = Ta + θja × total power consumption (W), where total power consumption = (VCC - VOH) × ΣIOH + VOL × ΣIOL
max × VCC.
+ I
Note 1. The upper limit of operating temperature is 85°C or 105°C, depending on the product. For details, see section 1.3, Part
CC
Numbering. If the part number shows the operation temperature to 85°C, then Tj max is 105°C, otherwise, 125°C.
j
-125°CHigh-speed mode
1
105*
Low-speed mode
Subosc-speed mode
R01DS0303EU0130 Rev.1.30Page 29 of 116
Aug 30, 2019
S5D9 Datasheet2. Electrical Characteristics
2.2.2I/O VIH, V
Table 2.4I/O VIH, V
IL
IL
ParameterSymbol MinTypMaxUnit
Input voltage
(except for
Schmitt trigger
input pins)