Renesas RZ/A Series, RZ/A2M User Manual

Rev.1.00 Oct, 2018

All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by Renesas Electronics Corp. without notice. Please review the latest information published by Renesas Electronics Corp. through various means, including the Renesas Electronics Corp. website

(http://www.renesas.com).

RZ/A2M CPU Board

RTK7921053C00000BE

User's Manual

Renesas Microprocessor RZ Family / RZ/A Series

User’s Manual

www.renesas.com

Notice

on of

1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operati semiconductor products and application examples. You are fully responsible for the incorporation or any other use of the circuits, software, and i nformation i n the desi gn of your produc t or syste m. Renesa s Electr onics discla ims any and al l liabilit y for any loss es and damages incurred by you or third parties arising from the use of these circui ts, software, or information.

2. Renesas Elec tronics hereby expressly discla ims any warranti es against and liability for infr ingement or any other claims involving patents, copyrights, or other intellectual prop erty rights of third part ies, by or arising from the use of Renesas Electronics pr oducts or technical information described in this document, including but not limited to, the product data, drawings, charts, programs, algorithms, and application examples.

3. No license, expr ess, impli ed or otherwi se, is gra nted hereb y under an y patents , copyright s or other intell ectual prop erty rights of Renesas Electronics or others.

4. You shall not alter , modify, copy, or revers e engineer any Renes as Electr onics product , whether in whole or in part. Renesas Electronics disclaims any and all liability for any losses or damages incurred by you or third parties arising from such alteration, modification, copying or reverse engineering.

5. Renesas Electroni cs products are cla ssified accordi ng to the following two qua lity grades: “Sta ndard” and “High Quali ty”. The intended applications for each Renesas E lectronics product depends on the produc t’s quality grade, as indicated below. “Standard”: Computers; office equipment; c ommunications equipment; tes t and measurement equipment; audio and visual equipment;

home electronic appliances; mac hine tools; personal electronic equipment; industrial robots; etc.

“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communication

equipment; key financial terminal systems; safety control equipment; etc. Unless expressl y designated a s a high reli abilit y product or a product for ha rsh environ ments in a Renes as Elec tronics data sheet or ot her Renesas Electr onic s docum ent, Ren esa s El ectr onic s pr oduc ts a re not i ntended or a uthor i z ed for us e in produc t s or systems tha t may pose a direct threat to huma n life or bodily injury (ar tificial life supp ort devices or systems; s urgical implantations ; etc.), or may cause ser ious property damage (s pace system; unders ea repeaters ; nuclear power cont rol systems; a ircraft control systems; key pla nt systems; milit ary equipment; etc. ). Renesa s El ectroni cs dis claims a ny and al l liab ilit y for any damages or los ses i ncurred b y you or any thi rd parties arising from the use of any Renes as Electronics product that is inconsistent with any Renesa s Electronics data sheet, us er’s manual or other Renesas Electronics document.

6. When using Renesas Elect roni cs product s, r efer to t he lates t product informa tion ( data sheet s, user ’s manu als, applica tion not es, “Genera l Notes for Handling a nd Using Semic onductor Devices ” in the relia bility handbook, etc.), and ens ure that usage c onditions are w ithin the ranges specified by Renesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation characterist ics, insta llation, etc. Renesa s Electr onics dis claims any and a ll liabi lity for any ma lfunct ions, fa ilure or acc ident aris ing out of the use of Renesas Electronics products outside of such specified ranges.

7. Although Renesa s Electroni cs endeavors to imp rove the qual ity and relia bility of Renes as Electroni cs products, semiconductor products have specific cha racteristics, such as the occurrenc e of failure at a certain rate and malf unctions under certain use conditi ons. Unless designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesa s Elect ronics produc ts are not s ubject t o radiation res istance des ign. You are r esponsib le for implement ing safety measures to gua rd aga ins t the pos sibi lity of b odil y injur y, injur y or da mage c aus ed by fir e, a nd/or d anger t o the p ublic in the e vent of a failure or malf unction of Renesas Elec tronics pr oducts, s uch as safety design for hardware a nd software, including b ut not limit ed to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the e valuat ion of mic roc omputer s oft ware a lone is very dif fi cult and imp ract ical, you are res pons ibl e for eval uat ing the s afet y of the final products or systems manufactured by you.

8. Please contact a Renesas El ectronics sa les office f or details as to environmenta l matters such as the en vironmental compatibility of each Renesas Elec tronic s produc t. Y ou are r esp onsibl e for c aref ully and s uff icient ly inves ti gati ng appl icab le laws and r egulat ions that regula te the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics products in compl iance with all these applicab le laws and regul ations. Renesa s Electr onics disclai ms any and all liab ility for damages or losses occurring as a result of your nonc ompliance with applicable laws and regulations.

9. Renesas Electr oni cs pr oduc ts and t echnol ogi es s ha ll not be us ed f or or incorp or ated i nt o any pr oduc ts or s ystems whos e manuf act ur e, us e, or sale is pr ohibited under a ny applica ble domestic or foreign laws or regulati ons. You shall comply with an y applicabl e export contr ol laws and regulations promulgated and administered by the governments of any countries asserting jurisdiction over the parties or transactions.

10. It is the respons ibility of the buyer or distributor of Renesas Electronics products, or any other party who dist ributes, disposes of, or otherwise sell s or tr ansf er s the p r oduct to a thi rd pa r ty, t o noti f y such t hir d p ar ty in a dvanc e of the c ont ent s a nd condi t ions s et f orth i n t his document.

11. This document sha ll not be repri nted, rep roduced or dup licated i n any form, in whole or in part, wit hout prior wr itten consent of Renesa s Electronics.

12. Please contact a Renesas Electronics sales of fi ce if you have any questions regar ding the information contained in t his document or Renesas Electronics products .

(Note 1) “Renesa s Electronics” as used in this doc ument means Re nesas Electr onics Corpora tion and als o includes its directly or indir ectly

controlled subsidiaries.

(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.

(Rev.4.0-1 November 2017)

General Preca ut ions in the Handling of Microprocessing Unit and Microcontroller Unit Products

The following usage notes are applicab le to all Microprocessing unit and Microcontroller unit products from Renesas. For detailed usage notes on the products covered by thi s document, refer to the relevant sections of the document as well as any technical updates that have been issued for the products.

1. Handling of Unused Pins Handle unused pins in accordance with the directions given under Handling of Unused Pins in the

manual.  The input pins of CMOS products are generally in the high-impedance state. In operation with an

unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity of LSI, an associated shoot-through current flows internally, and malfunctions occur due to the false recognition of the pin state as an input signal become possible. Unused pins should be handled as described under Handling of Unused Pins in the manual.

2. Processing at Power-on The state of the produc t is undef in ed at the moment when power is supplied.  The states of internal circuits in the LSI are indeterminate and the states of register settings and

pins are undefined at the moment when power is supplied. In a finished product where the reset signal is applied to the external reset pin, the states of pins are not guaranteed from the moment when power is supplied until the reset process is completed. In a similar way, the states of pins in a product that is reset by an on-chip power-on reset function are not guaranteed from the moment when power is supplied until the power reaches the level at which resetting has been specified.

3. Prohibition of Access to Reserved Addresses Access to reserved addresses is prohibited.  The reserved addresses are provided for the possible future expansion of functions. Do not access

these addresses; the correct operation of LSI is not guaranteed if they are accessed.

4. Clock Signals After applying a reset, only release the reset line after the operating clock signal has become stable.

When switching the clock signal during program execution, wait until the target clock signal has stabilized.

 When the clock signal is generated with an external resonator (or from an external oscillator)

during a reset, ensure that the reset line is only released after full stabilization of the clock signal. Moreover, when switching to a clock signal produced with an external resonator (or by an external oscillator) while program execution is in progress, wait until the target clock signal is stable.

5. Differences between Products Before changing from one product to another, i.e. to a product with a different part number, confirm

that the change will not lead to problems.  The characteristics of Microprocessing unit or Microcontroller unit products in the same group but

having a different part number may differ in terms of the internal memory capacity, layout pattern, and other factors, which can affect the ranges of electrical characteristics, such as characteristic values, operating margins, immunity to noise, and amount of radiated noise. When changing to a product with a different part number, implement a system-evaluation test for the given product.

WEEE Directive

Renesas development tools and products are directly covered by the European Union's Waste Electrical and Electronic Equipment, (WEEE), Directive 2002/96/EC. As a result, this equipment, including all accessories, must not be disposed of as household waste but through your locally recognised recycling or disposal schemes. As part of our commitment to environmental responsibility Renesas also offers to take back the equipment and has implemented a Tools Product Recycling Program for customers in Europe. This allows you to return equipment to Renesas for disposal through our approved Producer Compliance Scheme. To register for the program, click here "http://www.renesas.com/weee".

How to use this manual

1. Purpose and Target Readers

This manual is designed to provide the user with an understanding of the functions and operating specifications of this CPU board. This manual is intended for all users of this CPU board. A basic knowledge of electric circuits, logical circuits, and MCUs is necessary in order to use this manual.

The manual comprises an overview of the product, functional specifications, and operating specifications.

Before using this CPU board, thoroughly understand the notes provided in the text of each section in this manual.

The revision history summarizes the locations of revisions and additions. It does not list all revisions. Refer to the text of the manual for details.

The following document applies to the RZ/A2M CPU Board RTK7921053C00000BE.

Document Type

Description

Document Title

Document No.

User’s manual

Description of functional specifications (mounted devices, memory map, electrical characteristics, etc.) and operating specifications (connectors, switches, etc.)

RZ/A2M CPU Board RTK7921053C00000BE User's Manual

This user’s manual

The following documents apply to the RZ/A2M group. Make sure to refer to the latest versions of these documents. The newest versions of the documents listed may be obtained from the Renesas Electronics Web site.

document Type

Description

Document Title

Document No.

Application note

Application examples, reference programs, etc.

Available from Renesas Electronics Web site.

RENESAS TECHNICAL UPDATE

Prompt reports on product specifications, documents, etc.

2. Abbreviations

Abbreviation

Full Form

ACIA

Asynchronous Communications Interface Adapter

bps

bits per second

CRC

Cyclic Redundancy Check

DMA

Direct Memory Access

DMAC

Direct Memory Access Controller

GSM

Global System for Mobile Communications

Hi-Z

High Impedance

IEBus

Inter Equipment Bus

I/O

Input/Output

IrDA

Infrared Data Association

LSB

Least Significant Bit

MSB

Most Significant Bit

Non-Connect

PLL

Phase Locked Loop

PWM

Pulse Width Modulation

SFR

Special Function Register

SIM

Subscriber Identity Module

UART

Universal Asynchronous Receiver/Transmitter

VCO

Voltage Controlled Oscillator

All trademarks and registered trademarks are the property of their respective owners.

1. Overview .................................................................................................................................................... 1-1

1.1 Overview ......................................................................................................................................................... 1-1

1.2 Configuration ................................ ................................ ................................................................ ................... 1-2

1.3 Features ............................................................................................................................................................ 1-3

1.4 Outside View ................................................................................................................................................... 1-4

1.5 Block Diagram ................................................................................................................................................. 1-5

1.6 Layout of Components ..................................................................................................................................... 1-6

1.7 Memory Mapping ............................................................................................................................................ 1-9

1.8 Absolute Maximum Ratings .......................................................................................................................... 1-10

1.9 Operating Conditions ..................................................................................................................................... 1-10

2. Functional Specifications ........................................................................................................................... 2-1

2.1 Overview of Functions ..................................................................................................................................... 2-1

2.2 CPU ................................................................................................................................................................. 2-2

2.2.1 Overview of RZ/A2M ............................................................................................................................. 2-2

2.2.2 List of RZ/A2M Pin Functions ............................................................................................................... 2-2

2.3 Memory ......................................................................................................................................................... 2-16

2.3.1 RZ/A2M On-Chip RAM ....................................................................................................................... 2-16

2.3.2 Serial Flash Memory ............................................................................................................................. 2-17

2.3.3 HyperMCP ............................................................................................................................................ 2-18

2.4 USB Interface ................................................................................................................................................ 2-19

2.5 MIPI CSI-2 Interface ..................................................................................................................................... 2-21

2.6 I/O Ports ......................................................................................................................................................... 2-22

2.7 Clock Configuration ...................................................................................................................................... 2-23

2.8 Reset Control ................................................................................................................................................. 2-24

2.9 Power Supply Configuration.......................................................................................................................... 2-25

2.10 Debug Interface ............................................................................................................................................. 2-26

2.11 SD/MMC Host Interface (4 bits) ................................................................................................................... 2-27

3. Operation Specifications ............................................................................................................................ 3-1

3.1 Overview of Connectors .................................................................................................................................. 3-1

3.1.1 microSD Card Slot (CN1) ....................................................................................................................... 3-2

3.1.2 MIPI CSI-2 Connector (CN2, J1) ........................................................................................................... 3-3

3.1.3 USB Connector (CN3) ............................................................................................................................ 3-5

3.1.4 Power Source Connector (CN4) ............................................................................................................. 3-6

3.1.5 UDI Connector (CN5) ............................................................................................................................ 3-7

3.1.6 SUB Board Connector (J2) ..................................................................................................................... 3-8

3.2 Layout of Operation Components .................................................................................................................. 3-12

3.2.1 Jumpers (JP1 - JP3)............................................................................................................................... 3-13

3.2.2 Functions of Switches and LEDs .......................................................................................................... 3-14

3.3 Dimensions .................................................................................................................................................... 3-16

Appendix 1 RTK7921053C00000BE Connection Diagram ........................................................... Appendix 1-1

Appendix 2 RTK7921053C00000BE Component Installation Diagram ......................................... Appendix 2-1

RZ/A2M CPU Board RTK7921053C00000BE 1. Overview

R20UT4397EJ0100 Rev.1.00 1-1

2018.10.11

1. Overview

1.1 Overview

RTK7921053C00000BE is a CPU board to evaluate the functions and performance of the Renesas Electronics microprocessor RZ/A2M “R7S921053VCBG” and to develop and evaluate application software programs

The RTK7921053C00000BE CPU board has the following features.

● This CPU board contains the following external memory.

➢ Serial flash memory: 64 Mbytess x 1 ➢ HyperMCP (HyperFlash: 64 Mbytes and HyperRAM: 8 Mbytes) x 1

● One of serial flash memory, HyperMCP, and NAND flash memory with built-in SD controller is selectable as

boot memory.

● A USB Type-C connector and a microSD card slot are mounted as standard as an RZ/A2M peripheral function

interface.

● A Type-C receptacle is mounted as standard as a USB connector.

● A 15-pin FPC MIPI CSI-2 connector is mounted as a high-speed serial interface for camera devices.

● Pins that nor not used in this board are connected to the SODIMM connector (J2) that can be used in connection

with the RZ/A2M SUB board (model: RTK79210XXB00000BE). Furthermore, an expansion board can be developed in accordance with the development applications.

● This CPU board contains a CoreSight 20 connector for connection to the RZ/A2M user debug interface.

RZ/A2M CPU Board RTK7921053C00000BE 1. Overview

R20UT4397EJ0100 Rev.1.00 1-2

2018.10.11

1.2 Configuration

Figure 1.1 shows an example of system configuration using RTK7921053C00000BE.

Figure 1.1 Example of System Configuration Using RTK7921053C00000BE

ICE

CoreSight

RZ/A2M SUB board

RTK79210XXB00000BE

*: Should be procured on the customer side.

Debugger

Host computer

＊

Power supply through USB

(Max.500mA)

RZ/A2M

RZ/A2M CPU board

RTK7921053C00000BE

USB MIPImicroSD

RZ/A2M CPU Board RTK7921053C00000BE 1. Overview

R20UT4397EJ0100 Rev.1.00 1-3

2018.10.11

1.3 Features

Table 1.1 shows the features of RTK7921053C00000BE.

Table 1.1 Features of RTK7921053C00000BE

item

details

CPU

RZ/A2M

• Input (XIN) clock: 24 MHz

• CPU clock (Iφ): max. 528 MHz

• Image clock (Gφ): max. 264 MHz

• Internal bus clock (Bφ): max. 132 MHz

• External bus clock (CKIO): max. 132 MHz

• Peripheral clock 1 (P1φ): max. 66 MHz

• Peripheral clock 0 (P0φ): max. 33MHz

• Internal memory

large capacity internal RAM: 4 Mbytes Cache memory: 32 Kbytes Data cache: 32 Kbytes (write-back type)

• Power voltage: internal: 1.2 V, I/O: 3.3 V, 1.8 V

• 324-Pin BGA 0.8 mm pitch (package code: PRBG0324GA-A)

Memory

• Serial flash memory: 64 Mbytes x 1

‐Macronix MX25L51245GXDI-08G

• HyperMCP (HyperFlash: 64 Mbytes and HyperRAM: 8 Mbytes) x 1

‐Cypress S71KS512SC0BHV000

Connector

• USB Type-C receptacle: 1

• microSD card slot (4 bits): 1

• MIPI CSI-2 connector (15 pins): 1

• User debug interface connector (CoreSight 20): 1

• SUB board connector (204 pins): 1

LED

• Power source LED: 1

• User LED: 1 (Dual)

Switch

• Reset switch: 1

• System setting DIP switch: 8 bits

Circuit board specifications

• Dimensions: 67.6 mm x 50 mm

• Mount: Double-sided mounting (8 layers)

• Configuration: Single board

RZ/A2M CPU Board RTK7921053C00000BE 1. Overview

R20UT4397EJ0100 Rev.1.00 1-4

2018.10.11

1.4 Outside View

Figure 1.2 shows the outside view of RTK7921053C00000BE.

Figure 1.2 Outside View of RTK7921053C00000BE

RZ/A2M CPU Board RTK7921053C00000BE 1. Overview

R20UT4397EJ0100 Rev.1.00 1-5

2018.10.11

1.5 Block Diagram

Figure 1.3 shows the block diagram of RTK7921053C00000BE.

Figure 1.3 Block Diagram of RTK7921053C00000BE

SUB board

Connector

RZ/A2M

(324BGA)

microSD card

slot

Memory

System

Bootable

UDI

RESET

90Ω

RSPI

VBUS

Power Switch

USB

Type-C

CoreSight 20

SDHI1

USB1

EN0

CC logic RIICx

INTC

CSI-2

MIPI Input

(FFC 15)

100Ω

GPIO

INTC

ch0

SDHI

ch0

VBUS0

ch2

RIIC

GPIO

OC0

USB

BSC

VDC6

RMII:4

SCIFA

ADC

CEU

ETHERC

SSIF-2

FLCTL

LVDS

100Ω

ch0

ch1

ch4

ch3

DRP

ch6

NMI, IRQ0

SPIBSC

Serial Flash

HMIF

HyperMCP

90Ω

RZ/A2M CPU Board RTK7921053C00000BE 1. Overview

R20UT4397EJ0100 Rev.1.00 1-6

2018.10.11

1.6 Layout of Components

Figure 1.4 and Figure 1.5 show the layout of main components of RTK7921053C00000BE.

Figure 1.4 Layout of Components of RTK7921053C00000BE (C Side Top View)

U1:

RZ/A2M

CN1: microSD card slot

J2:

SUB board connector

CN3: USB Type-C

Receptacle

CN4: Power source

connector (Opt.)

CN2: MIPI CSI-2

connector

CN5:

CoreSight20 connector

SW2:

Reset switch

SW1: For system

settings

DIP switch

J1: MIPI CSI-2 connector

(Opt.)

U2:

Serial flash memory

U3:

HyperMCP

RZ/A2M CPU Board RTK7921053C00000BE 1. Overview

R20UT4397EJ0100 Rev.1.00 1-7

2018.10.11

Figure 1.5 Layout of Components of RTK7921053C00000BE (S Side Top View)

U15:

Reset IC

X2: USB resonator

(48MHz)

X1: XIN resonator

(24 MHz)

X3: RTC resonator

(32.768 kHz)

U7: USB Type-C

CC logic controller

U8: 3.3 V regulator

U9: 1.8 V regulator

U10: 1.2 V regulator

RZ/A2M CPU Board RTK7921053C00000BE 1. Overview

R20UT4397EJ0100 Rev.1.00 1-8

2018.10.11

Table 1.2 and Table 1.3 list main components mounted on RTK7921053C00000BE.

Table 1.2 Main Components on RTK7921053C00000BE (1) IC

Component

Number

Component Name

Type (Manufacturer)

Recommended Optional

Components

U1 CPU R7S921053VCBG (Renesas)

Serial flash memory

MX25L51245GXDI-08G (Macronix)

HyperMCP

S71KS512SC0BHV000 (Cypress)

U7 USB Type-C CC logic controller

TUSB320LIRWBR (TI) U8 3.3 V regulator

ISL80030AFRZ-T7A (Intersil)

5 V→3.3 V

U9 1.8 V regulator

ISL80020AIRZ-T7A (Intersil)

5 V→1.8 V

U10 1.2 V regulator

ISL80020AIRZ-T7A (Intersil)

5 V→1.2 V

U15 Reset IC

TPS3808G01DBV (TI)

Crystal resonator for XIN

CX1612DB24000D0PPSCC (Kyocera)

24 MHz

X2 Crystal resonator for USB

CX1612DB48000D0PPSC1 (Kyocera)

48 MHz

X3 Crystal resonator for RTC

ST2012SB32768H5HPWAA (Kyocera)

32.768 kHz

Table 1.3 Main Components on RTK7921053C00000BE (2) Connector

Component

Number

Component Name

Type (Manufacturer)

Recommended Optional

Parts

J1 MIPI CSI-2 connector (Optional) (15pins)

Not used

LL1013-04A-15 (LANL)

J2 SUB board connector (SODIMM 204 pins)

CN1 microSD card slot

DM3AT-SF-PEJM5 (HRS)

CN2 MIPI CSI-2 connector (15 pins)

1-1734248-5 (TE)

CN3 USB Type-C receptacle

DX07S024XJ1 (JAE)

CN4 Power source connector (Optional)

Not used

A2-2PA-2.54DSA(71) (HSR)

CN5 CoreSight20 connector (20 pins)

FTSH-110-01-L-DV (Samtec)

RZ/A2M CPU Board RTK7921053C00000BE 1. Overview

R20UT4397EJ0100 Rev.1.00 1-9

2018.10.11

1.7 Memory Mapping

Figure 1.6 shows the RZ/A2M memory mapping of RTK7921053C00000BE.

Logical address

RZ/A2M Logical space

RTK7921053C00000BE

Memory mapping

H'0000 0000

CS0 space: 64 MB

H'0400 0000

CS1 space: 64 MB

H'0800 0000

CS2 space: 64 MB

H'0C00 0000

CS3 space: 64 MB

H'1000 0000

CS4 space: 64 MB

H'1400 0000

CS5 space: 64 MB

H'1800 0000

Others: 128 MB

H'2000 0000

SPI multi I/O bus space: 256 MB

Serial flash memory (64 MB)

H’2400 0000

H'3000 0000

HyperFlash space: 256 MB

HyperFlash (64MB)

H’3400 0000

H'4000 0000

HyperRAM space: 256 MB

HyperRAM (8MB)

H'4080 0000

H'5000 0000

OctaFlash space: 256 MB

H'6000 0000

OctaRAM space: 256 MB

H'7000 0000

Reserved (cannot be used)

H'8000 0000

Large capacity internal RAM: 4 MB

H'8040 0000

Others: 2044MB

H'FFFF FFFF

Figure 1.6 RZ/A2M Memory Mapping

RZ/A2M CPU Board RTK7921053C00000BE 1. Overview

R20UT4397EJ0100 Rev.1.00 1-10

2018.10.11

1.8 Absolute Maximum Ratings

Table 1.4 lists absolute maximum ratings of RTK7921053C00000BE.

Table 1.4 Absolute Maximum Ratings of RTK7921053C00000BE

Symbol

Item

Rated Value

Note

D5V

5 V power voltage

－0.3 V to 6.25 V

Reference: Vss

opr

Operating ambient temperature *

0 °C to 50 °C

Do not expose to condensation or corrosive gases T

stg

Storage temperature *

－10 °C to 60 °C

Do not expose to condensation or corrosive gases

[Note] * Ambient temperature is the air temperature at a position as close to the board as possible.

1.9 Operating Conditions

Table 1.5 lists operating conditions of RTK7921053C00000BE.

Table 1.5 Operating Conditions of RTK7921053C00000BE

Symbol

Item

Rated Value

Note

D5V

5 V power voltage

4.5 V to 5.5 V

Reference: Vss

－

Maximum power consumption

1 A

5 V, 3.3 V, 1.8 V, 1.2 V power source overall values

opr

Operating ambient temperature *

0 °C to 40 °C

Do not expose to condensation or corrosive gases

[Note] * Ambient temperature is the air temperature at a position as close to the board as possible.

RZ/A2M CPU Board RTK7921053C00000BE 2. Function specifications

R20UT4397EJ0100 Rev.1.00 2-1

2018.10.11

2. Functional Specifications

2.1 Overview of Functions

Table 2.1.1 lists function modules of RTK7921053C00000BE.

Table 2.1.1 Function Modules of RTK7921053C00000BE

Section Function

Description

2.2

CPU

• RZ/A2M

- Input (XIN) clock: 24 MHz

- CPU clock: max. 528 MHz

- Bus clock: max. 132 MHz

2.3

Memory

• On-chip memory

- Large capacity on-chip RAM: 4 Mbytes

⚫ Serial flash memory: 64 Mbytes x 1

‐ Macronix MX25L51245GXDI-08G

⚫ HyperMCP (HyperFlash: 64 Mbytes, HyperRAM: 8 Mbytes) x 1

‐ Cypress S71KS512SC0BHV000

2.4

USB Interface

Connection between

RZ/A2M USB2.0 host/function module and USB connector

2.5

MIPI CSI-2 Interface

Connection between

RZ/A2M MIPI CSI-2 interface and FPC connector

2.6

I/O Ports

Connection between

RZ/A2M Input/output port and LEDs/DIP switches

2.7

Clock Configuration

System clock configuration

2.8

Reset Control

Reset control for devices mounted on RTK7921053C00000BE

2.9

Power Supply Configuration

System power supply configuration of

RTK7921053C00000BE

2.10

Debug Interface

Connection between RZ/A2M user debug interface and CoreSight20 connector

2.11

SD/MMC Host

Interface (4 bits)

Connection between RZ/A2M SD/MMC host interface (SDHI) channel 0 and microSD card slot

―

Operating specifications

Connectors, switches, and LEDs Details are described in Chapter 3

RZ/A2M CPU Board RTK7921053C00000BE 2. Function specifications

R20UT4397EJ0100 Rev.1.00 2-2

2018.10.11

2.2 CPU

2.2.1 Overview of RZ/A2M

RTK7921053C00000BE contains a 32 bit RISC microcomputer RZ/A2M that runs in synchronization with the CPU clock (max. 528 MHz).

2.2.2 List of RZ/A2M Pin Functions

Table 2.2.1 to Table 2.2.14 list RZ/A2M pin functions used in RTK7921053C00000BE.

Table 2.2.1 List of Selections of RZ/A2M Pin Functions (1)

U1 Pin

Pin Name

Pin Function

Description

J2 Pin

Note

Vcc

QSPI1_IO3

Connected to the serial flash memory (U2)

― A3

QSPI1_SPCLK

Connected to the serial flash memory (U2)

― A4

RPC_WP#

Open

― A5

QSPI0_IO3

Connected to the serial flash memory (U2)

―

PVcc_SPI

3.3V JP1: 1-2

Vss

PVcc

PF_4 / RxD2 / DV0_DATA19 / LCD0_DATA4 / MTIOC6A / SSIBCK0 / IRQ1

DV0_DATA19

Used on the SUB board

113

LCD0_DATA4

A10

PE_6 / ET0_MDIO / VIO_D2 / SSIRxD0 / MTIOC0D / CC2_RD1

ET0_MDIO

Used on the SUB board

107

VIO_D2

A11

PL_2 / MD_BOOT2 / IRQ6

MD_BOOT2

Connected to the DIP switch (SW1)

―

PD_0: High SW1-3

IRQ6

Connected to the CC logic controller for USB (U7)

PD_0: Low

A12

PE_5 / ET0_MDC / VIO_D3 / SSITxD0 / MTIOC0C / CC1_RD1

ET0_MDC

Used on the SUB board

103

VIO_D3

A13

P8_4 / A4 / DRP20 / DV0_DATA13 / SSL00 / SSIRxD3

Used on the SUB board

101

DRP20

SSL00

A14

P8_6 / A6 / DRP18 / DV0_DATA11 / MOSI0 / SSIFS3

Used on the SUB board

DRP18

MOSI0

A15

PE_4 / ET0_CRS/RMII0_CRSDV / VIO_D4 / SSIFS0 / MTIOC0B

ET0_CRS/RMII0_CRS DV

Used on the SUB board

VIO_D4

A16

P9_1 / A9 / DRP15 / DV0_DATA8 / RxD4 / SSIFS2

Used on the SUB board

DRP15

RxD4

A17

PVcc

A18

Vss

[Note] : 3.3V power source, : 1.8V power source, : 1.2V power source, : 3.3V or 1.8V power source,

: GND displayed.

RZ/A2M CPU Board RTK7921053C00000BE 2. Function specifications

R20UT4397EJ0100 Rev.1.00 2-3

2018.10.11

Table 2.2.2 List of Selections of RZ/A2M Pin Functions (2)

U1 Pin

Pin name

Pin Function

Description

J2 pin

Note

A19

PE_1 / ET0_RXD0/RMII0_RXD0 / VIO_D7 / RxD2 / POE8 / VBUSIN1 / IRQ1

ET0_RXD0/RMII0_RXD0

Used on the SUB board

VIO_D7

A20

PA_4 / A20 / DV0_DATA9 / LCD0_DATA14 / SCI_TXD0 / MTIOC0C

DV0_DATA9

Used on the SUB board

LCD0_DATA14

A21

CKIO

Used on the SUB board

54 A22

Vss

PK_1 / ET1_TXD0/RMII1_TXD0 / NAF4 / CC1_RA0 / CAN_CLK / SSIDATA2

ET1_TXD0/RMII1_TXD0

Used on the SUB board

137

NAF4

Vcc

QSPI1_IO1

Connected to the serial flash memory (U2)

― B4

QSPI1_IO0

Connected to the serial flash memory (U2)

― B5

RPC_RESET#

Connected to the serial flash memory (U2)

― B6

QSPI0_IO1

Connected to the serial flash memory (U2)

― B7

QSPI0_SPCLK

Connected to the serial flash memory (U2)

―

PF_5 / TxD2 / DV0_DATA20 / LCD0_DATA3 / MTIOC6B / SSIFS0

DV0_DATA20

Used on the SUB board

115

LCD0_DATA3

P6_3 / ET0_TXD1/RMII0_TXD1 / VIO_HD / TxD3 / POE0

ET0_TXD1/RMII0_TXD1

Used on the SUB board

111

VIO_HD

B10

PH_0 / AUDIO_CLK / VIO_D1 / GTIOC4A / MTIOC1A / CC1_RD0 / IRQ3

VIO_D1

Used on the SUB board

105

B11

PL_3 / MD_BOOT1 / IRQ7

MD_BOOT1

Connected to the DIP switch (SW1)

―

PD_0: High SW1-4

IRQ7

Connected to the USB CC logic controller (U7)

PD_0: Low

B12

PL_1 / MD_CLK / IRQ5 MD_CLK

Connected to the DIP switch (SW1)

48 PD_0: High SW1-2

IRQ5

Used on the SUB board

PD_0: Low

B13

P8_3 / A3 / DRP21 / DV0_DATA14 / MTIOC6A / GTIOC3A

Used on the SUB board

97 DRP21

B14

PF_2 / TxD3 / DV0_DATA17 / LCD0_DATA6 / MTIOC7C / MISO1

DV0_DATA17

Used on the SUB board

93 LCD0_DATA6

B15

P8_7 / A7 / DRP17 / DV0_DATA10 / RSPCK0 / SSIBCK3

Used on the SUB board

DRP17

RSPCK0

[Note] : 3.3V power source, : 1.8V power source, : 1.2V power source, : 3.3V or 1.8V power source,

: GND displayed.

RZ/A2M CPU Board RTK7921053C00000BE 2. Function specifications

R20UT4397EJ0100 Rev.1.00 2-4

2018.10.11

Table 2.2.3 List of Selections of RZ/A2M Pin Functions (3)

Pin Name

Pin Function

Description

J2 Pin

Note

B16

PE_3 / ET0_RXER/RMII0_RXER / VIO_D5 / SSIBCK0 / MTIOC0A

ET0_RXER/RMII0_RXER

Used on the SUB board

79 VIO_D5

B17

PA_0 / A16 / DV0_DATA13 / LCD0_DATA10 / SCI_TXD1 / MTIOC8C

DV0_DATA13

Used on the SUB board

77 LCD0_DATA10

B18

PA_3 / A19 / DV0_DATA10 / LCD0_DATA13 / SCI_CTS0/RTS0 / MTIOC0D

DV0_DATA10

Used on the SUB board

68 LCD0_DATA13

B19

PA_5 / A21 / DV0_DATA8 / LCD0_DATA15 / SCI_RXD0 / MTIOC0B / IRQ5

DV0_DATA8

Used on the SUB board

71 LCD0_DATA15

B20

PA_6 / A22 / DV0_DATA7 / LCD0_DATA16 / SCI_SCK0 / MTIOC0A

DV0_DATA7

Used on the SUB board

67 LCD0_DATA16

B21

Vss Connected to the DIP switch (SW1)

―

SW1-8: ON

B22

PVcc

PH_2 / CTS2 / DV0_DATA22 / LCD0_DATA1 / MTIOC6D / SSIRxD0

DV0_DATA22

Used on the SUB board

143

LCD0_DATA1

P8_2 / A2 / DRP22 / DV0_DATA15 / GTIOC5A / IRQ2

Used on the SUB board

141

DRP22

Vcc

QSPI1_SSL

Connected to a serial flash memory (U2)

―

RPC_INT#

Connect to the serial flash memory (U2)

― C6

QSPI0_SSL

Connected to the serial flash memory (U2)

― C7

QSPI0_IO0

Connected to the serial flash memory (U2)

―

P6_1 / ET0_TXEN/RMII0_TXDEN / VIO_CLK / SCK3 / MTIOC2A

ET0_TXEN/RMII0_TXDEN

Used on the SUB board

119

VIO_CLK

P6_2 / ET0_TXD0/RMII0_TXD0 / VIO_VD / RxD3 / MTIOC2B / OTG_EXICEN1 / IRQ0

ET0_TXD0/RMII0_TXD0

Used on the SUB board

106

VIO_VD

C10

PH_1 / AUDIO_XOUT / VIO_D0 / GTIOC4B / MTIOC1B / CC2_RD0 / IRQ2

VIO_D0

Used on the SUB board

126

C11

PL_4 / MD_BOOT0 / IRQ0

MD_BOOT0

Connect with DIP switch (SW1)

―

SW1-5

C12

PL_0 / MD_CLKS / IRQ4

IRQ4

Used on the SUB board

PD_0: Low

MD_CLKS

Connected to the DIP switch (SW1)

―

PD_0: High SW1-1

[Note] : 3.3V power source, : 1.8V power source, : 1.2V power source, : 3.3V or 1.8V power source,

: GND displayed.

RZ/A2M CPU Board RTK7921053C00000BE 2. Function specifications

R20UT4397EJ0100 Rev.1.00 2-5

2018.10.11

Table 2.2.4 List of Selections of RZ/A2M Pin Functions (4)

U1 Pin

Pin Name

Pin Function

Description

J2 Pin

Note

C13

P8_5 / A5 / DRP19 / DV0_DATA12 / MISO0 / SSITxD3

Used on the SUB board

92 DRP19

C14

PF_1 / RxD3 / DV0_DATA16 / LCD0_DATA7 / MTIOC7B / MOSI1 / IRQ4

DV0_DATA16

Used on the SUB board

88 LCD0_DATA7

C15

P9_0 / A8 / DRP16 / DV0_DATA9 / TxD4 / SSIDATA2

Used on the SUB board

DRP16

TxD4

C16

PE_2 / ET0_RXD1/RMII0_RXD1 / VIO_D6 / TxD2 / POE10

ET0_RXD1/RMII0_RXD1

Used on the SUB board

78 VIO_D6

C17

PA_2 / A18 / DV0_DATA11 / LCD0_DATA12 / SCI_SCK1 / MTIOC8A

DV0_DATA11

Used on the SUB board

74 LCD0_DATA12

C18

PG_0 / ET0_TXCLK / VIO_D8 / RSPCK0 / MTIOC3A / HM_RSTO#

VIO_D8

Used on the SUB board

72 C19

PB_0 / A24 / DV0_DATA5 / LCD0_DATA18 / SSITxD1 / POE8

DV0_DATA5

Used on the SUB board

64 LCD0_DATA18

C20

Vss Connected to the DIP switch (SW1)

―

SW1-7: ON

C21

PD_7 / RIIC3SDA / IRQ7

RIIC3SDA

Used on the SUB board

C22

PD_3 / RIIC1SDA / IRQ3 / MTCLKD / GTETRGD

PD_3

Connected to the MIPI CSI-2 connector (CN2, J1)

―

PVcc

BSCANP

Connected to the DIP switch (SW1)

―

SW1-6

P8_1 / A1 / DRP23 / DV0_DATA16 / GTIOC5B / IRQ3

Used on the SUB board

128

DRP23

Vcc

QSPI1_IO2

Connected to the serial flash memory (U2)

―

Vss

QSPI0_IO2

Connected to the serial flash memory (U2)

―

PK_0 / ET1_TXEN/RMII1_TXDEN / NAF3 / CC1_RD0 / MTIOC1B / SSIBCK2

ET1_TXEN/RMII1_TXDEN

Used on the SUB board

110

NAF3

PF_6 / RTS2 / DV0_DATA21 / LCD0_DATA2 / MTIOC6C / SSITxD0

DV0_DATA21

Used on the SUB board

108

LCD0_DATA2

D10

PE_0 / ET0_RXCLK/REF50CK0 / VIO_FLD / SCK2 / POE4

ET0_RXCLK/REF50CK0

Used on the SUB board

102

VIO_FLD

[Note] : 3.3V power source, : 1.8V power source, : 1.2V power source, : 3.3V or 1.8V power source,

: GND displayed.

RZ/A2M CPU Board RTK7921053C00000BE 2. Function specifications

R20UT4397EJ0100 Rev.1.00 2-6

2018.10.11

Table 2.2.5 List of Selections of RZ/A2M Pin Functions (5)

U1 Pin

Pin Name

Pin Function

Description

J2 Pin

Note

D11

PF_3 / SCK2 / DV0_DATA18 / LCD0_DATA5 / MTIOC7D / SSL10

DV0_DATA18

Used on the SUB board

124

LCD0_DATA5

D12

PVcc

D13

Vss

D14

PF_0 / SCK3 / DV0_DATA15 / LCD0_DATA8 / MTIOC7A / RSPCK1

DV0_DATA15

Used on the SUB board

90 LCD_DATA8

D15

P8_0 / A0 / DV0_DATA14 / LCD0_DATA9 / SCI_CTS1/RTS1 / MTIOC8D

DV0_DATA14

Used on the SUB board

86 LCD0_DATA9

D16

PA_1 / A17 / DV0_DATA12 / LCD0_DATA11 / SCI_RXD1 / MTIOC8B / IRQ6

DV0_DATA12

Used on the SUB board

80 LCD0_DATA11

D17

PA_7 / A23 / DV0_DATA6 / LCD0_DATA17 / SSIRxD1 / POE10

DV0_DATA6

Used on the SUB board

76 LCD0_DATA17

D18

PVcc

D19

Vss

D20

PD_6 / RIIC3SCL / IRQ6

RIIC3SCL

Used on the SUB board

D21

PD_4 / RIIC2SCL / IRQ4

RIIC2SCL

Connected to the MIPI CSI-2 connector (CN2, J1) or USB CC logic controller (U7)

―

D22

PD_1 / RIIC0SDA / IRQ1 / MTCLKB / GTETRGB

PD_1

Controlling power supply to PVcc_SD0

―

0：1.8V 1：3.3V

Vss

PH_3 / HM_RSTO# / RTS2 / GTIOC6A / MTIOC2A / SD0_CD / IRQ3

HM_RSTO#

Connected to the HyperMCP (U3)

―

PK_3 / ET1_RXCLK/REF50CK1 / NAF6 / CC2_RD0 / CAN0RX_DATARATE_EN / MOSI0

ET1_RXCLK/REF50CK1

Used on the SUB board

132

NAF6

PK_2 / ET1_TXD1/RMII1_TXD1 / NAF5 / VBUSEN1 / CAN0RX / RSPCK0 / IRQ5

ET1_TXD1/RMII1_TXD1

Used on the SUB board

133

NAF5

E19

PD_5 / RIIC2SDA / IRQ5

RIIC2SDA

Connected to the MIPI CSI-2 connector (CN2, J1) or USB CC logic controller (U7)

―

E20

PD_2 / RIIC1SCL / IRQ2 / MTCLKC / GTETRGC

PD_2

Connected to the MIPI CSI-2 connector (CN2, J1)

―

E21

JP0_3 / TCK

TCK

Connected to the UDI connector (CN5)

― E22

JP0_0 / TDI

TDI

Connected to the UDI connector (CN5)

―

PVcc_HO

1.8V JP2: 2-3

HM_CS0#/OM_CS0#

HM_CS0#

Connected to the HyperMCP (U3)

― F3

HM_CK/OM_SCLK

HM_CK

Connected to the HyperMCP (U3)

―

[Note] : 3.3V power source, : 1.8V power source, : 1.2V power source, : 3.3V or 1.8V power source,

: GND displayed.

+ 54 hidden pages

Renesas RZ/A Series, RZ/A2M User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Notice

General Preca ut ions in the Handling of Microprocessing Unit and Microcontroller Unit Products

WEEE Directive

How to use this manual

CONTENTS

RZ/A2M CPU Board RTK7921053C00000BE 1. Overview

1.1 Overview

1.2 Configuration

1.3 Features

1.4 Outside View

1.5 Block Diagram

1.6 Layout of Components

1.7 Memory Mapping

1.8 Absolute Maximum Ratings

1.9 Operating Conditions

2. Functional Specifications

2.1 Overview of Functions

2.2 CPU

2.2.1 Overview of RZ/A2M

2.2.2 List of RZ/A2M Pin Functions