All information contained in these materials, including products and product specifications,
represents information on the product at the time of publication and is subject to change by Renesas
Electronics Corp. without notice. Please review the latest information published by Renesas
Electronics Corp. through various means, including the Renesas Electronics Corp. website
(http://www.renesas.com).
32
RZ/A2M CPU Board
RTK7921053C00000BE
User's Manual
Renesas Microprocessor
RZ Family / RZ/A Series
User’s Manual
32
www.renesas.com
Page 2
Notice
on of
1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operati
semiconductor products and application examples. You are fully responsible for the incorporation or any other use of the circuits,
software, and i nformation i n the desi gn of your produc t or syste m. Renesa s Electr onics discla ims any and al l liabilit y for any loss es and
damages incurred by you or third parties arising from the use of these circui ts, software, or information.
2. Renesas Elec tronics hereby expressly discla ims any warranti es against and liability for infr ingement or any other claims involving patents,
copyrights, or other intellectual prop erty rights of third part ies, by or arising from the use of Renesas Electronics pr oducts or technical
information described in this document, including but not limited to, the product data, drawings, charts, programs, algorithms, and
application examples.
3. No license, expr ess, impli ed or otherwi se, is gra nted hereb y under an y patents , copyright s or other intell ectual prop erty rights of Renesas
Electronics or others.
4. You shall not alter , modify, copy, or revers e engineer any Renes as Electr onics product , whether in whole or in part. Renesas Electronics
disclaims any and all liability for any losses or damages incurred by you or third parties arising from such alteration, modification,
copying or reverse engineering.
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“Standard”: Computers; office equipment; c ommunications equipment; tes t and measurement equipment; audio and visual equipment;
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“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communication
equipment; key financial terminal systems; safety control equipment; etc.
Unless expressl y designated a s a high reli abilit y product or a product for ha rsh environ ments in a Renes as Elec tronics data sheet or ot her
Renesas Electr onic s docum ent, Ren esa s El ectr onic s pr oduc ts a re not i ntended or a uthor i z ed for us e in produc t s or systems tha t may pose a
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Renesas Electronics document.
6. When using Renesas Elect roni cs product s, r efer to t he lates t product informa tion ( data sheet s, user ’s manu als, applica tion not es, “Genera l
Notes for Handling a nd Using Semic onductor Devices ” in the relia bility handbook, etc.), and ens ure that usage c onditions are w ithin the
ranges specified by Renesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation
characterist ics, insta llation, etc. Renesa s Electr onics dis claims any and a ll liabi lity for any ma lfunct ions, fa ilure or acc ident aris ing out of
the use of Renesas Electronics products outside of such specified ranges.
7. Although Renesa s Electroni cs endeavors to imp rove the qual ity and relia bility of Renes as Electroni cs products, semiconductor products
have specific cha racteristics, such as the occurrenc e of failure at a certain rate and malf unctions under certain use conditi ons. Unless
designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas
Electronics document, Renesa s Elect ronics produc ts are not s ubject t o radiation res istance des ign. You are r esponsib le for implement ing
safety measures to gua rd aga ins t the pos sibi lity of b odil y injur y, injur y or da mage c aus ed by fir e, a nd/or d anger t o the p ublic in the e vent
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redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures.
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the final products or systems manufactured by you.
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the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics
products in compl iance with all these applicab le laws and regul ations. Renesa s Electr onics disclai ms any and all liab ility for damages or
losses occurring as a result of your nonc ompliance with applicable laws and regulations.
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or sale is pr ohibited under a ny applica ble domestic or foreign laws or regulati ons. You shall comply with an y applicabl e export contr ol
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transactions.
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document.
11. This document sha ll not be repri nted, rep roduced or dup licated i n any form, in whole or in part, wit hout prior wr itten consent of Renesa s
Electronics.
12. Please contact a Renesas Electronics sales of fi ce if you have any questions regar ding the information contained in t his document or
Renesas Electronics products .
(Note 1) “Renesa s Electronics” as used in this doc ument means Re nesas Electr onics Corpora tion and als o includes its directly or indir ectly
controlled subsidiaries.
(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
(Rev.4.0-1 November 2017)
Page 3
General Preca ut ions in the Handling of Microprocessing Unit and Microcontroller Unit Products
The following usage notes are applicab le to all Microprocessing unit and Microcontroller unit products from Renesas.
For detailed usage notes on the products covered by thi s document, refer to the relevant sections of the document as well
as any technical updates that have been issued for the products.
1. Handling of Unused Pins
Handle unused pins in accordance with the directions given under Handling of Unused Pins in the
manual.
The input pins of CMOS products are generally in the high-impedance state. In operation with an
unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity of LSI, an
associated shoot-through current flows internally, and malfunctions occur due to the false
recognition of the pin state as an input signal become possible. Unused pins should be handled as
described under Handling of Unused Pins in the manual.
2. Processing at Power-on
The state of the produc t is undef in ed at the moment when power is supplied.
The states of internal circuits in the LSI are indeterminate and the states of register settings and
pins are undefined at the moment when power is supplied.
In a finished product where the reset signal is applied to the external reset pin, the states of pins
are not guaranteed from the moment when power is supplied until the reset process is completed.
In a similar way, the states of pins in a product that is reset by an on-chip power-on reset function
are not guaranteed from the moment when power is supplied until the power reaches the level at
which resetting has been specified.
3. Prohibition of Access to Reserved Addresses
Access to reserved addresses is prohibited.
The reserved addresses are provided for the possible future expansion of functions. Do not access
these addresses; the correct operation of LSI is not guaranteed if they are accessed.
4. Clock Signals
After applying a reset, only release the reset line after the operating clock signal has become stable.
When switching the clock signal during program execution, wait until the target clock signal has
stabilized.
When the clock signal is generated with an external resonator (or from an external oscillator)
during a reset, ensure that the reset line is only released after full stabilization of the clock signal.
Moreover, when switching to a clock signal produced with an external resonator (or by an external
oscillator) while program execution is in progress, wait until the target clock signal is stable.
5. Differences between Products
Before changing from one product to another, i.e. to a product with a different part number, confirm
that the change will not lead to problems.
The characteristics of Microprocessing unit or Microcontroller unit products in the same group but
having a different part number may differ in terms of the internal memory capacity, layout pattern,
and other factors, which can affect the ranges of electrical characteristics, such as characteristic
values, operating margins, immunity to noise, and amount of radiated noise. When changing to a
product with a different part number, implement a system-evaluation test for the given product.
Page 4
WEEE Directive
Renesas development tools and products are directly covered by the European Union's Waste
Electrical and Electronic Equipment, (WEEE), Directive 2002/96/EC.
As a result, this equipment, including all accessories, must not be disposed of as household
waste but through your locally recognised recycling or disposal schemes.
As part of our commitment to environmental responsibility Renesas also offers to take back the
equipment and has implemented a Tools Product Recycling Program for customers in Europe.
This allows you to return equipment to Renesas for disposal through our approved Producer
Compliance Scheme.
To register for the program, click here "http://www.renesas.com/weee".
Page 5
How to use this manual
1. Purpose and Target Readers
This manual is designed to provide the user with an understanding of the functions and operating specifications of this
CPU board. This manual is intended for all users of this CPU board. A basic knowledge of electric circuits, logical
circuits, and MCUs is necessary in order to use this manual.
The manual comprises an overview of the product, functional specifications, and operating specifications.
Before using this CPU board, thoroughly understand the notes provided in the text of each section in this manual.
The revision history summarizes the locations of revisions and additions. It does not list all revisions. Refer to the text of
the manual for details.
The following document applies to the RZ/A2M CPU Board RTK7921053C00000BE.
Document Type
Description
Document Title
Document No.
User’s manual
Description of functional
specifications (mounted devices,
memory map, electrical
characteristics, etc.) and operating
specifications (connectors, switches,
etc.)
RZ/A2M CPU Board
RTK7921053C00000BE
User's Manual
This user’s manual
The following documents apply to the RZ/A2M group. Make sure to refer to the latest versions of these documents.
The newest versions of the documents listed may be obtained from the Renesas Electronics Web site.
document Type
Description
Document Title
Document No.
Application note
Application examples, reference
programs, etc.
Available from Renesas Electronics Web site.
RENESAS TECHNICAL
UPDATE
Prompt reports on product
specifications, documents, etc.
Page 6
2. Abbreviations
Abbreviation
Full Form
ACIA
Asynchronous Communications Interface Adapter
bps
bits per second
CRC
Cyclic Redundancy Check
DMA
Direct Memory Access
DMAC
Direct Memory Access Controller
GSM
Global System for Mobile Communications
Hi-Z
High Impedance
IEBus
Inter Equipment Bus
I/O
Input/Output
IrDA
Infrared Data Association
LSB
Least Significant Bit
MSB
Most Significant Bit
NC
Non-Connect
PLL
Phase Locked Loop
PWM
Pulse Width Modulation
SFR
Special Function Register
SIM
Subscriber Identity Module
UART
Universal Asynchronous Receiver/Transmitter
VCO
Voltage Controlled Oscillator
All trademarks and registered trademarks are the property of their respective owners.
1.3 Features ............................................................................................................................................................ 1-3
2.1 Overview of Functions ..................................................................................................................................... 2-1
2.2 CPU ................................................................................................................................................................. 2-2
2.2.1 Overview of RZ/A2M ............................................................................................................................. 2-2
2.2.2 List of RZ/A2M Pin Functions ............................................................................................................... 2-2
2.4 USB Interface ................................................................................................................................................ 2-19
2.8 Reset Control ................................................................................................................................................. 2-24
2.9 Power Supply Configuration.......................................................................................................................... 2-25
RTK7921053C00000BE is a CPU board to evaluate the functions and performance of the Renesas Electronics
microprocessor RZ/A2M “R7S921053VCBG” and to develop and evaluate application software programs
The RTK7921053C00000BE CPU board has the following features.
● This CPU board contains the following external memory.
➢ Serial flash memory: 64 Mbytess x 1
➢ HyperMCP (HyperFlash: 64 Mbytes and HyperRAM: 8 Mbytes) x 1
● One of serial flash memory, HyperMCP, and NAND flash memory with built-in SD controller is selectable as
boot memory.
● A USB Type-C connector and a microSD card slot are mounted as standard as an RZ/A2M peripheral function
interface.
● A Type-C receptacle is mounted as standard as a USB connector.
● A 15-pin FPC MIPI CSI-2 connector is mounted as a high-speed serial interface for camera devices.
● Pins that nor not used in this board are connected to the SODIMM connector (J2) that can be used in connection
with the RZ/A2M SUB board (model: RTK79210XXB00000BE). Furthermore, an expansion board can be
developed in accordance with the development applications.
●This CPU board contains a CoreSight 20 connector for connection to the RZ/A2M user debug interface.
Page 10
RZ/A2M CPU Board RTK7921053C00000BE 1. Overview
R20UT4397EJ0100 Rev.1.00 1-2
2018.10.11
1.2 Configuration
Figure 1.1 shows an example of system configuration using RTK7921053C00000BE.
Figure 1.1 Example of System Configuration Using RTK7921053C00000BE
ICE
*
CoreSight
RZ/A2M SUB board
RTK79210XXB00000BE
*: Should be procured on the customer side.
Debugger
Host computer
*
Power supply through USB
(Max.500mA)
RZ/A2M
RZ/A2M CPU board
RTK7921053C00000BE
USBMIPImicroSD
Page 11
RZ/A2M CPU Board RTK7921053C00000BE 1. Overview
R20UT4397EJ0100 Rev.1.00 1-3
2018.10.11
1.3 Features
Table 1.1 shows the features of RTK7921053C00000BE.
Table 1.1 Features of RTK7921053C00000BE
item
details
CPU
RZ/A2M
• Input (XIN) clock: 24 MHz
• CPU clock (Iφ): max. 528 MHz
• Image clock (Gφ): max. 264 MHz
• Internal bus clock (Bφ): max. 132 MHz
• External bus clock (CKIO): max. 132 MHz
• Peripheral clock 1 (P1φ): max. 66 MHz
• Peripheral clock 0 (P0φ): max. 33MHz
• Internal memory
large capacity internal RAM: 4 Mbytes
Cache memory: 32 Kbytes
Data cache: 32 Kbytes (write-back type)
• Power voltage: internal: 1.2 V, I/O: 3.3 V, 1.8 V
• 324-Pin BGA 0.8 mm pitch (package code: PRBG0324GA-A)
Memory
•Serial flash memory: 64 Mbytes x 1
‐Macronix MX25L51245GXDI-08G
•HyperMCP (HyperFlash: 64 Mbytes and HyperRAM: 8 Mbytes) x 1
‐Cypress S71KS512SC0BHV000
Connector
• USB Type-C receptacle: 1
• microSD card slot (4 bits): 1
• MIPI CSI-2 connector (15 pins): 1
• User debug interface connector (CoreSight 20): 1
• SUB board connector (204 pins): 1
LED
• Power source LED: 1
• User LED: 1 (Dual)
Switch
• Reset switch: 1
• System setting DIP switch: 8 bits
Circuit board specifications
• Dimensions: 67.6 mm x 50 mm
• Mount: Double-sided mounting (8 layers)
• Configuration: Single board
Page 12
RZ/A2M CPU Board RTK7921053C00000BE 1. Overview
R20UT4397EJ0100 Rev.1.00 1-4
2018.10.11
1.4 Outside View
Figure 1.2 shows the outside view of RTK7921053C00000BE.
Figure 1.2 Outside View of RTK7921053C00000BE
Page 13
RZ/A2M CPU Board RTK7921053C00000BE 1. Overview
R20UT4397EJ0100 Rev.1.00 1-5
2018.10.11
1.5 Block Diagram
Figure 1.3 shows the block diagram of RTK7921053C00000BE.
Figure 1.3 Block Diagram of RTK7921053C00000BE
SUB board
Connector
RZ/A2M
(324BGA)
microSD card
slot
Memory
System
Bootable
UDI
RESET
90Ω
4
RSPI
VBUS
Power Switch
USB
Type-C
CoreSight 20
SDHI1
USB1
EN0
CC logicRIICx
INTC
CSI-2
MIPI Input
(FFC 15)
100Ω
GPIO
INTC
ch0
SDHI
ch0
VBUS0
ch2
RIIC
GPIO
OC0
USB
BSC
VDC6
4
RMII:4
SCIFA
ADC
24
CEU
16
ETHERC
SSIF-2
FLCTL
16
8
LVDS
100Ω
ch0
ch0
ch1
ch1
ch4
ch3
32
DRP
ch6
NMI, IRQ0
SPIBSC
4
Serial Flash
HMIF
8
HyperMCP
90Ω
Page 14
RZ/A2M CPU Board RTK7921053C00000BE 1. Overview
R20UT4397EJ0100 Rev.1.00 1-6
2018.10.11
1.6 Layout of Components
Figure 1.4 and Figure 1.5 show the layout of main components of RTK7921053C00000BE.
Figure 1.4 Layout of Components of RTK7921053C00000BE (C Side Top View)
U1:
RZ/A2M
CN1: microSD card slot
J2:
SUB board connector
CN3: USB Type-C
Receptacle
CN4: Power source
connector (Opt.)
CN2: MIPI CSI-2
connector
CN5:
CoreSight20 connector
SW2:
Reset switch
SW1: For system
settings
DIP switch
J1: MIPI CSI-2 connector
(Opt.)
U2:
Serial flash memory
U3:
HyperMCP
Page 15
RZ/A2M CPU Board RTK7921053C00000BE 1. Overview
R20UT4397EJ0100 Rev.1.00 1-7
2018.10.11
Figure 1.5 Layout of Components of RTK7921053C00000BE (S Side Top View)
U15:
Reset IC
X2: USB resonator
(48MHz)
X1: XIN resonator
(24 MHz)
X3: RTC resonator
(32.768 kHz)
U7: USB Type-C
CC logic controller
U8: 3.3 V regulator
U9: 1.8 V regulator
U10: 1.2 V regulator
Page 16
RZ/A2M CPU Board RTK7921053C00000BE 1. Overview
R20UT4397EJ0100 Rev.1.00 1-8
2018.10.11
Table 1.2 and Table 1.3 list main components mounted on RTK7921053C00000BE.
Table 1.2 Main Components on RTK7921053C00000BE (1) IC
Component
Number
Component Name
Type (Manufacturer)
Recommended Optional
Components
U1 CPU R7S921053VCBG (Renesas)
U2
Serial flash memory
MX25L51245GXDI-08G (Macronix)
U3
HyperMCP
S71KS512SC0BHV000 (Cypress)
U7 USB Type-C
CC logic controller
TUSB320LIRWBR (TI)
U8 3.3 V regulator
ISL80030AFRZ-T7A (Intersil)
5 V→3.3 V
U9 1.8 V regulator
ISL80020AIRZ-T7A (Intersil)
5 V→1.8 V
U10 1.2 V regulator
ISL80020AIRZ-T7A (Intersil)
5 V→1.2 V
U15 Reset IC
TPS3808G01DBV (TI)
X1
Crystal resonator for XIN
CX1612DB24000D0PPSCC (Kyocera)
24 MHz
X2 Crystal resonator for USB
CX1612DB48000D0PPSC1 (Kyocera)
48 MHz
X3 Crystal resonator for RTC
ST2012SB32768H5HPWAA (Kyocera)
32.768 kHz
Table 1.3 Main Components on RTK7921053C00000BE (2) Connector
Component
Number
Component Name
Type (Manufacturer)
Recommended Optional
Parts
J1 MIPI CSI-2 connector (Optional)
(15pins)
Not used
LL1013-04A-15 (LANL)
J2 SUB board connector
(SODIMM 204 pins)
CN1 microSD card slot
DM3AT-SF-PEJM5 (HRS)
CN2 MIPI CSI-2 connector (15 pins)
1-1734248-5 (TE)
CN3 USB Type-C receptacle
DX07S024XJ1 (JAE)
CN4 Power source connector (Optional)
Not used
A2-2PA-2.54DSA(71)
(HSR)
CN5 CoreSight20 connector (20 pins)
FTSH-110-01-L-DV (Samtec)
Page 17
RZ/A2M CPU Board RTK7921053C00000BE 1. Overview
R20UT4397EJ0100 Rev.1.00 1-9
2018.10.11
1.7 Memory Mapping
Figure 1.6 shows the RZ/A2M memory mapping of RTK7921053C00000BE.
Logical address
RZ/A2M Logical space
RTK7921053C00000BE
Memory mapping
H'0000 0000
CS0 space: 64 MB
-
H'0400 0000
CS1 space: 64 MB
-
H'0800 0000
CS2 space: 64 MB
-
H'0C00 0000
CS3 space: 64 MB
-
H'1000 0000
CS4 space: 64 MB
-
H'1400 0000
CS5 space: 64 MB
-
H'1800 0000
Others: 128 MB
Others: 128 MB
H'2000 0000
SPI multi I/O bus space: 256 MB
Serial flash memory (64 MB)
H’2400 0000
-
H'3000 0000
HyperFlash space: 256 MB
HyperFlash (64MB)
H’3400 0000
-
H'4000 0000
HyperRAM space: 256 MB
HyperRAM (8MB)
H'4080 0000
-
H'5000 0000
OctaFlash space: 256 MB
-
H'6000 0000
OctaRAM space: 256 MB
-
H'7000 0000
Reserved (cannot be used)
Reserved (cannot be used)
H'8000 0000
Large capacity internal RAM: 4 MB
Large capacity internal RAM: 4 MB
H'8040 0000
Others: 2044MB
Others: 2044MB
H'FFFF FFFF
Figure 1.6 RZ/A2M Memory Mapping
Page 18
RZ/A2M CPU Board RTK7921053C00000BE 1. Overview
R20UT4397EJ0100 Rev.1.00 1-10
2018.10.11
1.8 Absolute Maximum Ratings
Table 1.4 lists absolute maximum ratings of RTK7921053C00000BE.
Table 1.4 Absolute Maximum Ratings ofRTK7921053C00000BE
Symbol
Item
Rated Value
Note
D5V
5 V power voltage
-0.3 V to 6.25 V
Reference: Vss
T
opr
Operating ambient
temperature *
0 °C to 50 °C
Do not expose to condensation or corrosive gases
T
stg
Storage temperature *
-10 °C to 60 °C
Do not expose to condensation or corrosive gases
[Note] * Ambient temperature is the air temperature at a position as close to the board as possible.
1.9 Operating Conditions
Table 1.5 lists operating conditions of RTK7921053C00000BE.
Table 1.5 Operating Conditions of RTK7921053C00000BE
Symbol
Item
Rated Value
Note
D5V
5 V power voltage
4.5 V to 5.5 V
Reference: Vss
-
Maximum power
consumption
1 A
5 V, 3.3 V, 1.8 V, 1.2 V power source overall values
T
opr
Operating ambient
temperature *
0 °C to 40 °C
Do not expose to condensation or corrosive gases
[Note] * Ambient temperature is the air temperature at a position as close to the board as possible.
Page 19
RZ/A2M CPU Board RTK7921053C00000BE 2. Function specifications
R20UT4397EJ0100 Rev.1.00 2-1
2018.10.11
2. Functional Specifications
2.1 Overview of Functions
Table 2.1.1 lists function modules of RTK7921053C00000BE.
Table 2.1.1 Function Modules of RTK7921053C00000BE
Section Function
Description
2.2
CPU
•RZ/A2M
- Input (XIN) clock: 24 MHz
- CPU clock: max. 528 MHz
- Bus clock: max. 132 MHz
2.3
Memory
•On-chip memory
- Large capacity on-chip RAM: 4 Mbytes
⚫ Serial flash memory: 64 Mbytes x 1
‐ Macronix MX25L51245GXDI-08G
⚫ HyperMCP (HyperFlash: 64 Mbytes, HyperRAM: 8 Mbytes) x 1
‐ Cypress S71KS512SC0BHV000
2.4
USB Interface
Connection between
RZ/A2M USB2.0 host/function module and USB connector
2.5
MIPI CSI-2Interface
Connection between
RZ/A2M MIPI CSI-2 interface and FPC connector
2.6
I/O Ports
Connection between
RZ/A2MInput/output port and LEDs/DIP switches
2.7
ClockConfiguration
System clock configuration
2.8
Reset Control
Reset control for devices mounted on RTK7921053C00000BE
2.9
Power Supply
Configuration
System power supply configuration of
RTK7921053C00000BE
2.10
DebugInterface
Connection between RZ/A2Muser debug interface and CoreSight20 connector
2.11
SD/MMC Host
Interface (4 bits)
Connection between RZ/A2M SD/MMC host interface (SDHI) channel 0 and
microSD card slot
―
Operating specifications
Connectors, switches, and LEDs
Details are described in Chapter 3
Page 20
RZ/A2M CPU Board RTK7921053C00000BE 2. Function specifications
R20UT4397EJ0100 Rev.1.00 2-2
2018.10.11
2.2 CPU
2.2.1 Overview of RZ/A2M
RTK7921053C00000BE contains a 32 bit RISC microcomputer RZ/A2M that runs in synchronization with the CPU
clock (max. 528 MHz).
2.2.2 List of RZ/A2M Pin Functions
Table 2.2.1 to Table 2.2.14 list RZ/A2M pin functions used in RTK7921053C00000BE.
Table 2.2.1 List of Selections of RZ/A2M Pin Functions (1)
[Note] : 3.3 power source、 : 1.8V power source、 : 1.2V power source、 : 3.3V or 1.8V power
source、 : GND displayed.
Page 34
RZ/A2M CPU Board RTK7921053C00000BE 2. Function specifications
R20UT4397EJ0100 Rev.1.00 2-16
2018.10.11
2.3 Memory
In addition to the RZ/A2M on-chip RAM, serial flash memory and HyperMCP are mounted in
RTK7921053C00000BE as external memory.
Refer to the following for details.
2.3.1 RZ/A2M On-Chip RAM
The microprocessor RZ/A2M contains a 4 Mbyte large capacity RAM (sharing an area of 128 kbytes with the data
retention on-chip RAM).
Page 35
RZ/A2M CPU Board RTK7921053C00000BE 2. Function specifications
R20UT4397EJ0100 Rev.1.00 2-17
2018.10.11
2.3.2 Serial Flash Memory
RTK7921053C00000BE is equipped with standard serial flash memory x 1 shown in Table 2.3.1. Serial flash memory
is controlled by RZ/A2M on-chip SPI multi-I/O bus controller (SPIBSC). During boot (boot mode 3), data (programs)
can be read from the serial flash memory.
Moreover, jumper JP1 may be set to provide power to PVcc_SPI and serial flash memory. Be sure to set voltage to
3.3V.
Figure 2.3.1 shows serial flash memory block diagram. Moreover, Table 2.3.2 shows function settings for jumper JP1.
Table 2.3.1 Overview of Serial Flash Memory
Memory Device
Model
Operational
Voltage
Capacity
Package
Serial flash memory
MX25L51245GXDI-08G
3.3V 64MB
24 ball BGA
Figure 2.3.1 Serial Flash Memory Block Diagram
Table 2.3.2 Function Settings for Jumper JP1
Jumper
1-2 2-3
JP1
Supplies 3.3 V to PVcc_SPI and serial flash
memory. (Initial setting)
Supplies 1.8 V to PVcc_SPI and serial flash
memory. (Setting prohibited)
[Note] shows the setting function to select.
If jumper JP1 is errorneously set, the memory may be damaged. Pay full attention to the setting.
RZ/A2M (U1)
QSPI0_SPCLK
14
D3_0
CLK_0
CS#_0
QSPI0_IO3
QSPI0_SSL
CLK_0
CS#_0
D3_0
RESET#
RPC_RESET#
RESET#
Serial Flash Memory (U2)
NC/SIO3
SCLK
CS#
RESET#VCCPVcc_SPI
ROMVcc
ROMVccROMVcc
QSPI1_SPCLK
QSPI1_IO[3:0]
QSPI1_SSL
RPC_INT#
RPC_WP#
NC
NC
NC
NC
NC
Note: Red characters indicates
functions in use.
: Unmounted.
NCNC
3.3V1.8VROMVcc
13
JP1
CS#_1
D[3:0]_1
INT#
ROMVcc
ROMVcc
D[3:0]_1
CS#_1
INT#
CLK_1CLK_1
D2_0D2_0
WP#/SIO2
D[1:0]_0D[1:0]_0
SO/SIO1, SI/SIO0
QSPI0_IO2
QSPI0_IO[1:0]
ROMVcc
Page 36
RZ/A2M CPU Board RTK7921053C00000BE 2. Function specifications
R20UT4397EJ0100 Rev.1.00 2-18
2018.10.11
2.3.3 HyperMCP
RTK7921053C00000BE is equipped with HyperMCP x 1 shown in Table 2.3.3 as a default installation. HyperMCP is
controlled by the HyperBus controller. During boot (boot mode 7), data (programs) can be read from the HyperFlash in
HyperMCP.
Moreover, jumper JP2 is set to supply power to PVcc_HO and HyperMCP. Please be sure to set voltage to 1.8V.
Supplies 3.3V to PVcc_HO and HyperMCP.
(Setting prohibited)
Supplies 1.8V to PVcc_HO and HyperMCP.
(Initial setting)
[Note] shows the setting function to select.
If jumper JP2 is errorneously set, memory may be damaged. Pay full attention to the settings.
RZ/A2M (U1)
HM_CK/OM_SCLK
DS
16
HM_RWDS/OM_DQS
HM_CS0#/OM_CS0#
CLK
CS0#
D[7:0]
HM_DQ[7:0]/OM_SIO[7:0]
PH4 / HM_INT#
INT#
D[7:0]
CLK
CS0#
DS
PH3 / HM_RSTO#
RSTO#
HyperMCP (U3)
DQ[7:0]
CK
RWDS
CS1#
RESET#
VccQ
VccINT#
RTSO#
HM_CS1#/OM_CS1#
CS1#CS1#
CS2#
RAMVcc
RAMVcc
PVcc_HO
RAMVcc
HM_RESET#/OM_RESET#
3.3V
3.3V
RESET#RESET#
RAMVcc
HM_CK#
CLK#CLK#
CK#
Note: Red characters indicate
functions in use.
:Unmounted.
INT#
RSTO#
RAMVcc
RAMVcc
3.3V1.8VRAMVcc
13
JP2
Page 37
RZ/A2M CPU Board RTK7921053C00000BE 2. Function specifications
R20UT4397EJ0100 Rev.1.00 2-19
2018.10.11
2.4 USB Interface
USB Type-C receptacle x 1 is equipped with RTK7921053C00000BE as a default installation.
When using this receptacle as a USB host, attach JP3 because the VBUS voltage is supplied to the USB connector.
When using this receptacle as a USB function, detach JP3.
Moreover, USB port setting can be changed by the CC logic controller (U7) PORT terminal settings. Initial USB port
settings are for DRP (Dual Role Port). If using as a USB host, mount R78 resistor and set USB port to DFP (Downstream
Facing Port). If using for USB function, mount R79 resistor and set USB port to UFP (Upstream Facing Port).
Figure 2.4.1 shows USB interface block diagram, Table 2.4.1 shows jumper JP3 function setting table, Table 2.4.2
shows port L function switching table, and Table 2.4.3 shows USB port function switching table.
Figure 2.4.1 USB Interface Block Diagram
RZ/A2M (U1)
DP0
10
PC_7 / OVRCUR0
DM0
DP0
DM0
VBUS0
PC_6 / VBUSEN0
DP0
DM0
48MHz
(X2)
USB_X1
USB_X2
RREF0
USBVss
P5_2 / VBUSIN0
VBUS0
EN0
OC0#
PD_4 / RIIC2SCL
SCL2
PD_5 / RIIC2SDA
SDA2
3.3V
EN0
OC0#
ID#
INT#
USB Type-C receptacle (CN3)
D+_A
VBUS_A
VBUS_B
CC1
CC2
D+_B
D-_A
D-_B
CC logic controller (U7)
SCL / OUT2
SDA / OUT1
INT# / OUT3
CC1
CC2VBUS_DET
ID
VBUS0
VBUS power source control IC (U5)
EN
IN1
OUT1
OC#
5V
INT#
ID#
3.3V
3.3V
ADDR
EN#
PORT
H=DFP, NC=DRP, L=UFP
3.3V
PL_3 / IRQ7
PL_2 / IRQ6
SCL2
SDA2
VBUS0
VBUS
MUXOE#S
4A
4B1
4B2
3A
3B1
3B2
3.3V
IRQ input
/ system settings
(U6)
USBAPVcc
USBDPVcc
3.3V
3.3V
IN2
OUT2
OUT3
2.2kΩ
150μF
+
L:A=B1, H:A=B2
Note: Red characters indicate
functions in use.
: Unmounted.
PD_0
(IRQ input # /system settings)
R78
R79
Low
PD_0
PD_0
Page 38
RZ/A2M CPU Board RTK7921053C00000BE 2. Function specifications
R20UT4397EJ0100 Rev.1.00 2-20
2018.10.11
Table 2.4.1 Function Setting for Jumper JP3
Jumper
Short
Open
JP3
Supplies power to VBUS0.
Does not supply power to VBUS0. (Initial
setting)
Table 2.4.2 Function Switching for Port L
Terminal
function
High
Low
PD_0
Uses PL_[3:0] as system setting pins.
(Initial setting)
Uses PL_[3:0] as RQ input pins.
[Note] shows the setting function to select.
Table 2.4.3 Function Switching for USB port
Terminal
function
High NC Low
PORT
(U7)
Uses the USB port as DFP.
Uses the USB port as DRP.
(Initial setting)
Uses the USB port as UFP.
Page 39
RZ/A2M CPU Board RTK7921053C00000BE 2. Function specifications
R20UT4397EJ0100 Rev.1.00 2-21
2018.10.11
2.5 MIPI CSI-2 Interface
The RZ/A2M contains MIPI CSI-2 interface that supports YCbCy422, RGB888, and RAW8 video. In
RTK7921053C00000BE, the MIPI CSI-2 interface in RZ/A2M is connected to FPC connector. RTK7921053C00000BE
also has board patterns that can mount a 1.0 mm pin header used as an expansion connector.
The MIPI CSI-2 pin is shared with the FPC connector and expansion connector. When the expansion connector is used,
the FPC connector cannot be used.
Figure 2.5.1 shows the MIPI CSI-2 interface block diagram.
Figure 2.5.1 MIPI CSI-2 Interface Block Diagram
RZ/A2M (U1)
CSI_CLKP
10
CSI_DATA0P
CSI_CLKN
CLK_P
CLK_N
D0_P
CSI_DATA0N
D0_N
CLK_N
CLK_P
MIPI CSI-2 connector
(CN2)
MIPIAVcc18
MIPIAVcc
CSI_DATA1P
D1_P
CSI_DATA1N
D1_N
PD_4 / RIIC2SCL
SCL2
PD_5 / RIIC2SDA
SDA2
PD_2
VCC
PD_3
LED
D0_N
D0_P
D1_N
D1_P
SCL2
SDA2
VCC
LED
3.3V
3.3V
3.3V
CAM1_DN0
CAM1_CN
CAM1_CP
CAM_GPIO0
SCL0
CAM1_DP0
CAM1_DN1
CAM1_DP1
CAM_GPIO1
SDA0
VCC
3.3V
3.3V
Expansion
connector
(Opt) (J1)
14
15
13
12
10
11
9
8
6
7
5
4
2
3
1
14
15
13
12
10
11
9
8
6
7
5
4
2
3
1
Note: Red characters indicate
functions in use.
: Unmounted.
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
Page 40
RZ/A2M CPU Board RTK7921053C00000BE 2. Function specifications
R20UT4397EJ0100 Rev.1.00 2-22
2018.10.11
2.6 I/O Ports
In RTK7921053C00000BE, the I/O ports of the RZ/A2M are connected to switches and LEDs.
Figure 2.6.1 shows the I/O port block diagram. Table 2.6.1 shows the function switching for the port L.
Figure 2.6.1 I/O Port Block Diagram
Table 2.6.1 Function Switching for Port L
Terminal
function
High
Low
PD_0
Uses PL_[3:0] as system setting pin.
(Initial setting)
Uses PL_[3:0] as RQ input pin.
[Note] shows the setting function to select.
RZ/A2M (U1)
P6_0 (LED-red)
PC_1 (LED-green)
PL_0 / MD_CLKS / IRQ4
PL_1/ MD_CLK / IRQ5
PL_2 / MD_BOOT2 / IRQ6
PL_3 / MD_BOOT1 / IRQ7
PD_0 (IRQ input)
To SUB board
To USB I/F
3.3V
PL_4 / MD_BOOT0
BSCANP
Vss1
Vss2
Note: Red characters indicate
functions in use.
: Unmounted.
LED1
For system
settings
DIP switch
(SW1)
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
1
8
CLKS
CLK
BOOT1
BOOT2
4
BOOT0
BSCANP
Vss2
Vss1
BOOT0
BSCANP
Vss2
Vss1
IRQ input /
System settings (U6)
MUXOE#S
4A
4B1
4B2
3A
3B1
3B2
2A
2B1
2B2
1A
1B1
1B2
CLKS
CLK
BOOT2
BOOT1
ON(L):A=B1, OFF(H):A=B2
4
2
2
2
3
4
5
6
7
Page 41
RZ/A2M CPU Board RTK7921053C00000BE 2. Function specifications
R20UT4397EJ0100 Rev.1.00 2-23
2018.10.11
2.7 Clock Configuration
The following three types of clock are input to the RZ/A2M in RTK7921053C00000BE.
Figure 2.7.1 shows the clock configuration. Table 2.7.1 shows the function setting for the system settings DIP switches
SW1-1 and SW1-2.
Figure 2.7.1 Clock Configuration
Table 2.7.1 Function Setting for System Settings DIP Switch SW1-1 and SW1-2
DIP switch
function
ON
OFF
SW1-1
SSCG function OFF (Initial setting)
SSCG function ON
SW1-2
Sets EXTAL input peripheral frequency range from 10 to
12MHz.
(Setting prohibited)
Sets EXTAL input peripheral frequency
range from 20 to 24MHz. (Initial setting)
[Note] shows the setting functions to select.
RZ/A2M (U1)
32.768 kHz
(X3)
RTC_X1
RTC_X2
24 MHz
(X1)
EXTAL
XTAL
48 MHz
(X2)
USB_X1
USB_X2
NC
CKIO
PJ_6 /
LCD0_CLK
SD0_CLK
SD1_CLK
PJ_7 / LCD0_EXTCLK
SCLK
microSD card slot (CN1)
PL_1 / MD_CLK
L=10 to 12MHz, H=20 to 24 MHz
PL_0 / MD_CLKS
L=SSCG:OFF, H=SSCG:ON
P6_4 / AUDIO_CLK
P7_2 / DV0_CLK
P4_6 /
TXCLKOUTP
P4_7 /
TXCLKOUTM
AUDIO_X1
AUDIO_X2
P6_1 / VIO_CLK
Note: Red characters indicate
functions in use.
: Unmounted.
DIP
SW1-2
3.3 V
DIP
SW1-1
3.3 V
OFF
MUX
MUX
9
To SUB board
Page 42
RZ/A2M CPU Board RTK7921053C00000BE 2. Function specifications
R20UT4397EJ0100 Rev.1.00 2-24
2018.10.11
2.8 Reset Control
The reset IC in RTK7921053C00000BE controls the reset signal connected to the RZ/A2M, memory devices, and
connectors.
There are two types of system reset: power-on reset and switch reset.
Figure 2.8.1 shows the reset control block diagram.
Figure 2.8.1 Reset Control Block Diagram
To SUB board
CoreSight 20 connector (CN5)
TRST#
SRST#
3.3V
3.3V
3.3V
Reset switch (SW2)
Reset IC (U15)
RESET#
CT
SENSE
3.3V
130kΩ
20kΩ
4700pF
RZ/A2M (U1)
TRST#
RES#
RESET#RPC_RESET#
RESET#HM_RESET#/OM_RESET#
3.3V
Note: Red characters indicate
functions in use.
: Unmounted.
3.3V
Serial flash memory (U2)
HyperMCP (U3)
+
U12
U13
U14
Reset IC output delay time
td=CT(nF)/175+0.5×10-3s=27.4ms
reset IC output detection voltage
0.405×(Ra+Rb)/Rb=0.405×(130kΩ+20kΩ)/20kΩ=3.04V
1000pF
Page 43
RZ/A2M CPU Board RTK7921053C00000BE 2. Function specifications
R20UT4397EJ0100 Rev.1.00 2-25
2018.10.11
2.9 Power Supply Configuration
The regulators in RTK7921053C00000BE generate voltages 3.3 V, 1.8 V, and 1.2 V from 5 V.
Figure 2.9.1 shows the power supply configuration block diagram.
Figure 2.9.1 Power Supply Configuration Block Diagram
5V to 3.3V
D1.8V
D1.2V
USB Type-C (CN3)
5V external power
source connector
(CN4)
5V to 1.8V
VBUS
PVcc
RZ/A2M (3.3V)
USBDPVcc
AVcc
LVDSAPVcc
USBAPVcc
RZ/A2M (1.8V)
MIPIAVcc18
Vcc
RZ/A2M (1.2V)
LVDSPLLVcc
PLLVcc
3.3 V peripheral device
5V to 1.2V
VBUS power
supply
Jumper (JP3)
A3.3V
USB Type-C (CN3)
JP1
D1.8VD3.3VROMVcc
RZ/A2M (1.8V/3.3V)
PVcc_HO
PVcc_SPI
JP2
D1.8VD3.3VRAMVcc
Serial flash memory (U2)
HyperMCP (U3)
RZ/A2M (1.8V/3.3V)
RZ/A2M (1.8V/3.3V)
PVcc_SD0
D3.3V D1.8V
3.3V/1.8V
Power disconnect
(U4)
PVcc_SD1
D3.3V
D5V
To SUB board
Page 44
RZ/A2M CPU Board RTK7921053C00000BE 2. Function specifications
R20UT4397EJ0100 Rev.1.00 2-26
2018.10.11
2.10 Debug Interface
RTK7921053C00000BE contains a CoreSight 20 connector (CN5) for connection to the RZ/A2M user debug interface.
Figure 2.10.1 shows the debug interface block diagram.
Figure 2.10.1 Debug Interface Block Diagram
RZ/A2M (U1)
PJ_0 / TRACECLK
JP0_4 / TRST#
RES#
3.3V
PJ_5 / TRACEDATA3
JP0_1 / TDO
JP0_0 / TDI
JP_2 / TMS
JP0_3 / TCK
CoreSight 20 connector (CN5)
3.3V
3.3V
Reset IC (U15)
Reset switch (SW2)
3.3V
3.3V
RTCK/TRACECLK
PJ_4 / TRACEDATA2
PJ_3 / TRACEDATA1
PJ_2 / TRACEDATA0
3.3V
3.3V
3.3V
DBGACK /TraceD3
DBGRQ/TraceD2
nTRST/TraceD1
SWO/TraceD0
TDO/SWO
TDI
TMS/SWDIO
TCK/SWCLK
nSRST
Note: Red characters indicate
functions in use.
: Unmounted.
U12
U13
U14
Page 45
RZ/A2M CPU Board RTK7921053C00000BE 2. Function specifications
R20UT4397EJ0100 Rev.1.00 2-27
2018.10.11
2.11 SD/MMC Host Interface (4 bits)
RTK7921053C00000BE contains a 4 bit microSD slot connected to the SD/MMC host interface in the RZ/A2M.
SD/MMC host interface ch0 terminal operational voltage can be changed via the PD_1 terminal. Set PD_1 to High for
3.3V operation and to Low for 1.8V operation.
Figure 2.11.1 shows the SD/MMC host interface block diagram. Table 2.11.1 shows the PVcc_SD0 voltage switching
table.
Figure 2.11.1 SD/MMC Host Interface Block Diagram
Table 2.11.1 PVcc_SD0 Voltage Switching Table
Terminal
function
High
Low
PD_1
Supplies 3.3V to PVcc_SD0. (Initial setting)
Supplies 1.8V to PVcc_SD0.
RZ/A2M (U1)
SD0_CLK
SD0_CMD
SD0_DAT[3:0]
7
CLK
CMD
D[3:0]
SDVcc
CLK
D[3:0]
microSD card slot (CN1)
CLK
DAT[3:0]
VDD
3.3V
CMD
SDVcc
CMD
CD
CD
P5_0 / SD0_CD
CD
0 : Card Insert
PVcc_SD0
SDVcc
3.3V
SD0_RST#
Power switch (U4)
EN
SELVINB
3.3V
1.8V
VINA
SDVcc
VOUT
0 : VOUT=VINA=1.8V
1 : VOUT=VINB=3.3V
3.3V
3.3V
PD_1 (SDVcc_SEL)
Note: Red characters indicate
functions in use.
: Unmounted.
SD0_DAT[7:4]
P5_1 / SD0_WP
SDVcc
3.3V
TP1
Page 46
RZ/A2M CPU Board RTK7921053C00000BE 2. Function specifications
R20UT4397EJ0100 Rev.1.00 2-28
2018.10.11
Page 47
RZ/A2M CPU Board RTK7921053C00000BE 3. Operation specifications
R20UT4397EJ0100 Rev.1.00 3-1
2018.10.11
3. Operation Specifications
3.1 Overview of Connectors
Figure 3.1.1 illustrates the layout of connectors of RTK7921053C00000BE.
Figure 3.1.1 Layout of Connectors of RTK7921053C00000BE (C Side Top View)
CN1: microSD card slot
J2:
SUB board connector
CN3: USB Type-C
receptacle
CN4: Power source
connector (Opt)
CN2: MIPI CSI-2
connector
CN5:
CoreSight20 connector
J1: MIPI CSI-2
connector (Opt)
Page 48
RZ/A2M CPU Board RTK7921053C00000BE 3. Operation specifications
R20UT4397EJ0100 Rev.1.00 3-2
2018.10.11
3.1.1 microSD Card Slot (CN1)
RTK7921053C00000BE contains a microSD card slot (CN1).
Figure 3.1.2 illustrates the layout of microSD card slot pins. Table 3.1.1 shows the assignment of microSD card slot pins.
Figure 3.1.2 Layout of microSD Card Slot Pins
Table 3.1.1 Assignment of microSD Card Slot (CN1) Pins
Pin
Signal Name
1 DAT2 (SD0_DAT2)
2 CD/DAT3 (SD0_DAT3)
3 CMD (SD0_CMD)
4 +3.3V
5 CLK (SD0_CLK)
6 VSS (Vss)
7 DAT0 (SD0_DAT0)
8 DAT1 (SD0_DAT1)
9 COMMON (Vss)
10 Card_Detect (SD0_CD)
[Note] Red characters indicate functions in use.
CN1
123457
8
9
6
C side top view
10
Page 49
RZ/A2M CPU Board RTK7921053C00000BE 3. Operation specifications
R20UT4397EJ0100 Rev.1.00 3-3
2018.10.11
3.1.2 MIPI CSI-2 Connector (CN2, J1)
RTK7921053C00000BE contains an MIPI CSI-2 connector (CN2). Moreover, this pattern allows to mount a connector
(J1).
Pins 30 to 16 of the connector (NC2) are connected to pins 1 to 15. Pins 1 to 15 of the connector (J1) are connected to
pins 30 to 16 of the connector (CN2).
When using a device that cannot be connected to the connector (CN2), it is possible to create a conversion connector
via the connector (J1) to connect the device to the connector (CN2).
Figure 3.1.3 illustrates the layout of MIPI CSI-2 connector pins. Table 3.1.2 and Table 3.1.3 show the assignment of
MIPI CSI-2 connector pins.
If connector (J1) is used, be careful for keeping the direction of the number 1 pin.
Figure 3.1.3 Layout of MIPI CSI-2 Connector Pins
C side top view
115
1630
CN2
J1
115
Page 50
RZ/A2M CPU Board RTK7921053C00000BE 3. Operation specifications
R20UT4397EJ0100 Rev.1.00 3-4
2018.10.11
Table 3.1.2 Assignment of MIPI CSI-2 Connector Pins (CN2)
Pin
Signal name
1, 30
GND (Vss)
2, 29
CAM1_DN0 (CSI_DATA0N)
3, 28
CAM1_DP0 (CSI_DATA0P)
4, 27
GND (Vss)
5, 26
CAM1_DN1 (CSI_DATA1N)
6, 25
CAM1_DP1 (CSI_DATA1P)
7, 24
GND (Vss)
8, 23
CAM1_CN (CSI_CLKN)
9, 22
CAM1_CP (CSI_CLKP)
10, 21
GND (Vss)
11, 20
CAM_GPIO0 (PD_2)
12, 19
CAM_GPIO1 (PD_3)
13, 18
SCL0 (PD_4 / RIIC2SCL)
14, 17
SDA0 (PD_5 / RIIC2SDA)
15, 16
+3.3V
[Note] Red characters indicate functions in use.
Table 3.1.3 Assignment of MIPI CSI-2 Connector Pins (J1)
Pin
Signal name
note
1 Vss
Connected to pin
30
of CN2
2 CSI_DATA0N
Connected to pin
29
of CN2
3 CSI_DATA0P
Connected to pin
28
of CN2
4 Vss
Connected to pin
27
of CN2
5 CSI_DATA1N
Connected to pin
26
of CN2
6 CSI_DATA1P
Connected to pin
25
of CN2
7 Vss
Connected to pin
24
of CN2
8 CSI_CLKN
Connected to pin
23
of CN2
9 CSI_CLKP
Connected to pin
22
of CN2
10 Vss
Connected to pin
21
of CN2
11 PD_2
Connected to pin
20
of CN2
12 PD_3
Connected to pin
19
of CN2
13 PD_4 / RIIC2SCL
Connected to pin
18
of CN2
14 PD_5 / RIIC2SDA
Connected to pin
17
of CN2
15 +3.3V
Connected to pin
16
of CN2
[Note] Red characters indicate functions in use.
Page 51
RZ/A2M CPU Board RTK7921053C00000BE 3. Operation specifications
R20UT4397EJ0100 Rev.1.00 3-5
2018.10.11
3.1.3 USB Connector (CN3)
RTK7921053C00000BE contains a USB Type-C receptacle (CN3).
Figure 3.1.4 illustrates the layout of USB Type-C receptacle pins. Table 3.1.4 shows the assignment of USB Type-C
receptacle pins.
Figure 3.1.4 Layout of USB Type-C Receptacle Pins
Table 3.1.4 Assignment of USB Type-C Receptacle (CN3) Pins
Pin
Signal Name
Pin
Signal Name
A1 GND (Vss)
B12
GND (Vss)
A2 TX1+(NC)
B11
RX1+(NC)
A3 TX1-(NC)
B10
RX1-(NC)
A4 VBUS (P5_2 / VBUSIN0)
B9 VBUS (P5_2 / VBUSIN0)
A5 CC1 (CC1)
B8 SBU2 (NC)
A6 D+ (DP0)
B7 D-(DM0)
A7
D-(DM0)
B6
D+ (DP0)
A8 SBU1 (NC)
B5 CC2 (CC2)
A9 VBUS (P5_2 / VBUSIN0)
B4 VBUS (P5_2 / VBUSIN0)
A10
RX2-(NC)
B3 TX2-(NC)
A11
RX2+(NC)
B2 TX2+(NC)
A12
GND (Vss)
B1 GND (Vss)
[Note] Red characters indicate functions in use.
C side top view
A1A12
B1
B12
CN3
Page 52
RZ/A2M CPU Board RTK7921053C00000BE 3. Operation specifications
R20UT4397EJ0100 Rev.1.00 3-6
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3.1.4 Power Source Connector (CN4)
RTK7921053C00000BE allows to mount the power source connector (CN4).
Figure 3.1.5 shows the layout of power source connector pins. Table 3.1.5 shows the assignment of power source
connector pins.
If connector (CN4) is used, be careful for keeping the direction of number 1 pin.
Figure 3.1.5 Layout of Power Source Connector Pins
Table 3.1.5 Assignment of Power Source Connector (CN4) Pins
Pin
Signal Name
1 +5V 2 GND (Vss)
C side top view
1
2
CN4
Page 53
RZ/A2M CPU Board RTK7921053C00000BE 3. Operation specifications
R20UT4397EJ0100 Rev.1.00 3-7
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3.1.5 UDI Connector (CN5)
RTK7921053C00000BE contains a1.27 mm pitch CoreSight20 connector (CN5).
Figure 3.1.6 illustrates the layout of UDI connector pins. Table 3.1.6 shows the assignment of UDI connector pins.
Figure 3.1.6 Layout of UDI Connector Pins
Table 3.1.6 Assignment of CoreSight 20 Connector (CN5) Pins
Pin
Signal name
Pin
Signal name
1 +3.3V 2 TMS/SWDIO (JP_2 / TMS)
3 GND (Vss)
4 TCK/SWCLK (JP0_3 / TCK)
5 GND (Vss)
6 TDO/SWO (JP0_1 / TDO)
7 KEY (NC)
8 TDI (JP0_0 / TDI)
9 GND (Vss)
10
nSRST 11
NC 12
RTCK/TraceCLK (PJ_0 / TRACECLK)
13
NC 14
SWO/TraceD0 (PJ_2 / TRACEDATA0)
15
GND (Vss)
16
nTRST/TraceD1 (PJ_3 / TRACEDATA1)
17
GND (Vss)
18
DBGRQ/TraceD2 (PJ_4 / TRACEDATA2)
19
GND (Vss)
20
DBGACK/TaceD3 (PJ_5 / TRACEDATA3)
[Note] Red characters indicate functions in use.
12
1920
C side top view
CN5
Page 54
RZ/A2M CPU Board RTK7921053C00000BE 3. Operation specifications
R20UT4397EJ0100 Rev.1.00 3-8
2018.10.11
3.1.6 SUB Board Connector (J2)
RTK7921053C00000BE can be connected to an external expansion board through the SUB board connecting
connector (J2).
Figure 3.1.7 illustrates the layout of SUB board connecting connector pins. Table 3.1.7 to Table 3.1.9 show the
assignment of SUB board connecting connector pins.
Figure 3.1.7 Layout of SUB Board Connecting Connector Pins
J2: SUB board connector
Page 55
RZ/A2M CPU Board RTK7921053C00000BE 3. Operation specifications
R20UT4397EJ0100 Rev.1.00 3-9
2018.10.11
Table 3.1.7 Assignment of SUB Board Connecting Connector (J2) Pins (1)
[Note] : 5V power source, : 3.3V power source, : GND
Page 56
RZ/A2M CPU Board RTK7921053C00000BE 3. Operation specifications
R20UT4397EJ0100 Rev.1.00 3-10
2018.10.11
Table 3.1.8 Assignment of SUB Board Connecting Connector (J2) Pins (2)
Pin
Signal Name
Pin
Signal Name
73 PE_1 / ET0_RXD0/RMII0_RXD0 / VIO_D7
74 PA_2 / DV0_DATA11 / LCD0_DATA12
75 Vss 76 PA_7 / DV0_DATA6 / LCD0_DATA17
77 PA_0 / DV0_DATA13 / LCD0_DATA10
78 PE_2 / ET0_RXD1/RMII0_RXD1 / VIO_D6
79 PE_3 / ET0_RXER/RMII0_RXER / VIO_D5
80 PA_1 / DV0_DATA12 / LCD0_DATA11
81 Vss 82 Vss 83 P9_1 / A9 / DRP15 / RxD4
84 P9_0 / A8 / DRP16 / TxD4
85 Vss 86 P8_0 / DV0_DATA14 / LCD0_DATA9
87 P8_7 / A7 / DRP17 / RSPCK0
88 PF_1 / DV0_DATA16 / LCD0_DATA7
89 Vss 90 PF_0 / DV0_DATA15 / LCD0_DATA8
91 PE_4 / ET0_CRS/RMII0_CRSDV / VIO_D4
92 P8_5 / A5 / DRP19 / MISO0
93 PF_2 / DV0_DATA17 / LCD0_DATA6
94 Vss 95 P8_6 / A6 / DRP18 / MOSI0
96 DP1 97 P8_3 / A3 / DRP21
98 DM1 99 Vss 100
Vss 101 P8_4 / A4 / DRP20 / SSL00
102
PE_0 / ET0_RXCLK/REF50CK0 / VIO_FLD
103 PE_5 / ET0_MDC / VIO_D3
104
Vss 105 PH_0 / VIO_D1
106
P6_2 / ET0_TXD0/RMII0_TXD0 / VIO_VD
107 PE_6 / ET0_MDIO / VIO_D2
108
PF_6 / DV0_DATA21 / LCD0_DATA2
109 Vss 110
PK_0 / ET1_TXEN/RMII1_TXDEN / NAF3
111 P6_3 / ET0_TXD1/RMII0_TXD1 / VIO_HD
112
P9_4 / A12 / DRP12 / SSITxD0
113 PF_4 / DV0_DATA19 / LCD0_DATA4
114
Vss 115 PF_5 / DV0_DATA20 / LCD0_DATA3
116
PG_1 / VIO_D9
117 Vss 118
P9_7 / A15 / DRP09
119 P6_1 / ET0_TXEN/RMII0_TXDEN / VIO_CLK
120
P7_4 / CAS / DRP07 / RTS1
121 Vss 122
Vss 123 P7_1 / RD/WR / DRP05 / RxD1
124
PF_3 / DV0_DATA18 / LCD0_DATA5
125 P6_0 126
PH_1 / VIO_D0
127 P6_6 / DRP02
128
P8_1 / A1 / DRP23
129 PG_3 / VIO_D11
130
Vss 131 Vss 132
PK_3 / ET1_RXCLK/REF50CK1 / NAF6
133 PK_2 / ET1_TXD1/RMII1_TXD1 / NAF5
134
Vss 135 P6_5 / CS3 / DRP01
136
PF_7 / DV0_DATA23 / LCD0_DATA0
137 PK_1 / ET1_TXD0/RMII1_TXD0 / NAF4
138
Vss 139 Vss 140
PJ_7 / NAF0 / LCD0_EXTCLK
141 P8_2 / A2 / DRP22
142
Vss 143 PH_2 / DV0_DATA22 / LCD0_DATA1
144
P0_0 / D0 / DRP24
145 Vss 146
P0_4 / D4 / DRP28
147 PJ_6 / FCE / LCD0_CLK
148
P0_3 / D3 / DRP27
149 Vss 150
P0_6 / D6 / DRP30
151 P0_1 / D1 / DRP25
152
Vss 153 P0_5 / D5 / DRP29
154
P3_2 / ET1_CRS/RMII1_CRSDV / FRE
155 P0_2 / D2 / DRP26
156
P3_5 / ET1_RXD1/RMII1_RXD1 / FCLE
[Note] : 5V power source, : 3.3V power source, : GND
Page 57
RZ/A2M CPU Board RTK7921053C00000BE 3. Operation specifications
R20UT4397EJ0100 Rev.1.00 3-11
2018.10.11
Table 3.1.9 Assignment of SUB Board Connecting Connector (J2) Pins (3)
Pin
Signal Name
Pin
Signal Name
157
Vss 158
Vss 159
PJ_1 / IRQ0
160
P1_0 / D7 / DRP31
161 PH_5 / NAF2 / ET1_EXOUT
162 Vss 163
PH_6 / ET1_WOL
164
PK_4 / ET1_RXD0/RMII1_RXD0 / NAF7
165
Vss 166
P3_1 / ET1_RXER/RMII1_RXER / FALE
167
PK_5 / NAF1
168
Vss 169
PG_4 / VIO_D15
170
P4_0 / TXOUT0P
171
PG_6 / VIO_D13
172
P4_1 / TXOUT0M
173
P1_4 / D11
174
Vss 175
Vss 176
P4_4 / TXOUT2P
177
P3_3 / ET1_MDC / FWE
178
P4_5 / TXOUT2M
179
P1_1 / D8
180
Vss 181
PG_7 / VIO_D12
182
P4_2 / TXOUT1P
183
PG_5 / VIO_D14
184
P4_3 / TXOUT1M
185
Vss 186
Vss 187
P3_4 / ET1_MDIO / FRB
188
P4_6 / TXCLKOUTP
189
P1_3 / D10
190
P4_7 / TXCLKOUTM
191
P3_0 / ET1_LINKSTA
192
Vss 193
P2_1 / D13
194
PC_0 / VBUSIN1
195
Vss 196
P1_2 / D9
197
PC_1 198
P2_2 / D14
199
P2_3 / D15
200
P2_0 / D12
201
Vss 202
PC_2
203
NMI 204
Vss
[Note] : 5V power source, : 3.3V power source, : GND
Page 58
RZ/A2M CPU Board RTK7921053C00000BE 3. Operation specifications
R20UT4397EJ0100 Rev.1.00 3-12
2018.10.11
3.2 Layout of Operation Components
Figure 3.2.1 illustrates the layout of operation components of RTK7921053C00000BE.
Figure 3.2.1 Layout of Operation Components of RTK7921053C00000BE
JP1: ROMVcc
selection jumper
JP2: RAMVcc
selection jumper
JP3: VBUS power
supply jumper
SW1: DIP switch for
system settings
SW2:
Reset switch
LED1: User LED
LED2:
Power LED
Page 59
RZ/A2M CPU Board RTK7921053C00000BE 3. Operation specifications
R20UT4397EJ0100 Rev.1.00 3-13
2018.10.11
3.2.1 Jumpers (JP1 - JP3)
RTK7921053C00000BE contains three system setting jumpers.
Figure 3.2.2 illustrates the layout of these jumpers. Table 3.2.1 and Table 3.2.2 lists jumper settings.
Figure 3.2.2 Layout of Jumpers of RTK7921053C00000BE
Table 3.2.1 Setting for Power Source Selection Jumpers (JP1, JP2)
Jumper
Setting
Function
JP1
ROMVcc selection
1-2
Supplies 3.3 V to PVcc_SPI and serial flash memory of
RZ/A2M.
2-3
Supplies 1.8 V to PVcc_SPI and serial flash memory of
RZ/A2M
. (Setting prohibited)
JP2
RAMVcc selection
1-2
Supplies 3.3 V to PVcc_HO and HyperMCP of
RZ/A2M
. (Setting prohibited)
2-3
Supplies 1.8 V to PVcc_HO and HyperMCP of
RZ/A2M.
[Note] : Initial setting
Before changing jumper settings, be sure to turn off the board.
If the jumper JP1 or JP2 are erroneously set, the memory may be damaged. Please confirm the pin number
closely when changing the settings.
Table 3.2.2 Settings for VBUS Power Supply Jumper (JP3)
Jumper
Setting
Function
JP3
For USB ch0
Short
Uses USB ch0 as host mode (with VBUS voltage supplied).
Open
Uses USB ch0 as function mode (with no VBUS voltage supplied).
[Note] : Initial setting.
Before changing jumper settings, be sure to turn off the board.
C side top view
JP3
2
1
3
JP2
3
1
JP1
1
Page 60
RZ/A2M CPU Board RTK7921053C00000BE 3. Operation specifications
R20UT4397EJ0100 Rev.1.00 3-14
2018.10.11
3.2.2 Functions of Switches and LEDs
RTK7921053C00000BE contains two switches and two LEDs.
Figure 3.2.3 illustrates the layout of switches and LEDs. Table 3.2.3 lists mounted switches. Table 3.2.4 provides
functions of the DIP switch. Table 3.2.5 lists mounted LEDs.
Figure 3.2.3 Layout of Switches and LEDs Mounted on RTK7921053C00000BE
ON
1 2 3 4 5 6 7 8
SW1
C side top view
LED1
(Dual)
SW2
LED2
Page 61
RZ/A2M CPU Board RTK7921053C00000BE 3. Operation specifications
R20UT4397EJ0100 Rev.1.00 3-15
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Table 3.2.3 Switches Mounted on RTK7921053C00000BE
No.
Function
Note
SW1
System setting DIP switch
For details, see
Table 3.2.4.
SW2
Reset switch
For details, see section 2.8.
Table 3.2.4 Functions of System Setting DIP Switch (SW1)
No.
Setting
Function
SW1-1
MD_CLKS
OFF
MD_CLKS=”H”
Activates SSCG.
ON
MD_CLKS=”L”
Deactivates SSCG.
SW1-2
MD_CLK
OFF
MD_CLK=”H”
Sets the EXTAL input frequency to 20 to 24 MHz.
ON
MD_CLK=”L”
Sets the EXTAL input frequency to 10 to 12 MHz (Setting prohibited).
SW1-3
MD_BOOT2
OFF
MD_BOOT2=”H”
Boot Mode
MD_BOOT[2:0]
Boot Device
0 (B'000)
Memory connected to the CS0 space (Bus width:
16 bits)
(Setting prohibited)
1 (B'001)
eSD 2 (B'010)
eMMC (Setting prohibited)
3 (B'011)
Serial flash memory connected
to the SPIBSC
space (3.3V)
4 (B'100)
OctaFlash
connected to the
SPIBSC space
(1.8V)
5 (B'101)
HyperFlash
connected to the
SPIBSC space
(1.8V)
6 (B'110)
OctaFlash
connected to the
OctaFlash space
(1.8V)
7 (B'111)
HyperFlash
connected to the
HyperFlash space
(1.8V)
ON
MD_BOOT2=”L”
SW1-4
MD_BOOT1
OFF
MD_BOOT1=”H”
ON
MD_BOOT1=”L”
SW1-5
MD_BOOT0
OFF
MD_BOOT0=”H”
ON
MD_BOOT0=”L”
SW1-6
BSCANP
OFF
BSCANP=”H”
Boundary scan mode
ON
BSCANP=”L”
Normal operation (CoreSight debug mode)
SW1-7
Vss1
OFF
Vss1=”H”
3.3V applied (Setting prohibited)
ON
Vss1=”L”
GND connection
SW1-8
Vss2
OFF
Vss2=”H”
3.3V applied (Setting prohibited)
ON
Vss2=”L”
GND connection
[Note] : Initial setting
Before changing DIP switch settings, be sure to turn off the board.
Table 3.2.5 LEDs Mounted on RTK7921053C00000BE
No.
Color
Function
LED1
Red
User LED (Lit while P6_0 output is “H”)
Green
User LED (Lit while PC_1 output is “H”)
LED2
Blue
Power LED (Lit while 5V is supplied)
Page 62
RZ/A2M CPU Board RTK7921053C00000BE 3. Operation specifications
R20UT4397EJ0100 Rev.1.00 3-16
2018.10.11
3.3 Dimensions
Figure 3.3.1 shows the dimensions of RTK7921053C00000BE (C side top view).
<C side top view> Unit: mm
Figure 3.3.1 Dimensions of RTK7921053C00000BE (C Side Top View)
Page 63
RZ/A2M CPU Board RTK7921053C00000BE Appendix 1
R20UT4397EJ0100 Rev.1.00 Appendix 1-1
2018.10.11
Appendix 1 RTK7921053C00000BE Connection Diagram
Page 64
RZ/A2M CPU Board RTK7921053C00000BE Appendix 1
R20UT4397EJ0100 Rev.1.00 Appendix 1-2
2018.10.11
Page 65
1
2
3
4
5
RZ/A2M CPU board RTK7921053C00000BE SCHEMATICS (BGA324)
AA
TITLE
Index
RZ/A2M(Dedicate), RAM, ROM, USB, MIPI,
PAGE
1
2
microSD, Clock, Dip-SW
BB
RZ/A2M(Multi purpose, Power)
Mating
Power
POR, UDI
3
4
5
6
Note:
Digital GND (GND)
Analog GND (AVss)
USB GND (UVss)
Not mounted
D5V = Digital 5V (System Power)
D3.3V = Digital 3.3V
A3.3V = Analog 3.3V
PVcc = 3.3V for RZ/A2M I/O
Vcc = 1.2V for RZ/A2M Core
AVcc = Analog 3.3V for RZ/A2M
PLLVcc = Analog 1.2V for RZ/A2M PLL
CC
USBAPVcc = Analog 3.3V for RZ/A2M USB
USBDPVcc = Digital 3.3V for RZ/A2M USB
LVDSAPVcc = Analog 3.3V for RZ/A2M LVDS
R = Fixed Resistors
RA = Resistor Array
C = Ceramic Caps
CE = Tantalum Electrolytic Caps
CP = Decoupling Caps
Room 1709 Quantum Plaza, No.27 ZhichunLu, Haidian District, Beijing, 100191 P. R. China
Tel: +86-10-8235-1155, Fax: +86-10-8235-7679
Renesas Electronics (Shanghai) Co., Ltd.
Unit 301, Tower A, Central Towers, 555 Langao Road, Putuo District, Shanghai, 200333 P. R. China
Tel: +86-21-2226-0888, Fax: +86-21-2226-0999
Renesas Electronics Hong Kong Limited
Unit 1601-1611, 16/F., Tower 2, Grand Century Place, 193 Prince Edward Road West, Mongkok, Kowloon, Hong Kong
Tel: +852-2265-6688, Fax: +852 2886-9022
Renesas Electronics Taiwan Co., Ltd.
13F, No. 363, Fu Shing North Road, Taipei 10543, Taiwan
Tel: +886-2-8175-9600, Fax: +886 2-8175-9670
Renesas Electronics Singapore Pte. Ltd.
80 Bendemeer Road, Unit #06-02 Hyflux Innovation Centre, Singapore 339949
Tel: +65-6213-0200, Fax: +65-6213-0300
Renesas Electronics Malaysia Sdn.Bhd.
Unit 1207, Block B, Menara Amcorp, Amcorp Trade Centre, No. 18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: +60-3-7955-9390, Fax: +60-3-7955-9510
Renesas Electronics India Pvt. Ltd.
No.777C, 100 Feet Road, HAL 2nd Stage, Indiranagar, Bangalore 560 038, India
Tel: +91-80-67208700, Fax: +91-80-67208777