This Software Package has the best solution for Human Machine Interface (HMI) application development.
The Software Package sh ows how easy it is to creat e a profess ional, us er-f riendl y and platfor m-independent
user interface for your pr oduct. The entire applic ation sour ce code is incl uded in the wor kspace en abling the
Software Package to be ported to the platform of your choice.
The following sample applications are available.
GUI sample application:
This is an example for inte roperation between RZ/A1H peripherals / ‘Renesas Starter Kit+ for RZ/A1H’ onboard peripherals using the C++ HMI framework ‘Guiliani’ by TES Electron ics Solutions. ‘Guiliani’ and the
RZ/A1H Software Package facilitate the rapid implementation of smooth, intuitive and high-performance GUIs
that can interact with the extensive RZ/A1H peripheral suite free-of-charge.
Supports camera input, LCD output, and simple image adjustment. If you use the e
Development Environment, this sample program can be linked with the development support tool QE for Display / Camera. QE for Display / Camera is an e
panel / camera, image correction, and set up the camera module via a simple GUI.
Supports detection of touch events and retrieves the touch c oordinates. After touch detec tion, this sample
application will draw a large arrow at the coordinates of the event. Also when the arrow is drawn, JPEG codec
processing is done using JPEG Codec Unit (JCU).
This Software Package has a touch abstraction layer which is the Touch Panel Utility. You can implement each
touch panel driver easily without modifying the application interface.
USB Mass Storage sample application:
2
studio IDE plugin which can adjust the timing of the LCD
2
studio Integrated
This sample demonstrates the access and control of FAT formatted Mass Storage Devices (USB memory stick,
hard drive, etc).
Web Server sample application:
The Web Engine demonstration provides an example of Ethernet connectivity and a sample web server
application that can co ntrol peripherals on the target board. C functio ns may be called fro m the web server
output processor, allowing dynamic data to be displayed on web pages.
R01AN5093EJ0100 Rev.1.00 Page 1 of 6
Dec.25.19
RZ/A1H Group RZ/A1H Software Package V1.00 Release Note
Other sample applications:
This package includes other sample programs as follows.
Sound / USER Switch / ADC / PMOD (use RSPI) / USBH HID / USBH CDC / USBF HID / USBF CDC /
RZ/A1H Group RZ/A1H Software Package V1.00 Release Note
3. Related Documents
Summaries of the related documents are shown as follow.
• RZ/A1H Group, RZ/A1M Group User's Manual: Hardware (R01UH0403)
This document describes the hardware specifications for RZ/A1H.
• RZ/A1H Group Renesas Starter Kit+ User's Manual For e2studio (R20UT3007)
This document describes the development kit of Renesas Starter Kit+ for RZ/A1H.
4. How to use this package
Regarding how to use, refer to ‘RZ/A1H Group RZ/A1H Software Package Quick Start Guide (R01QS0039)’.
5. Restrictions
The RSK+ board contains two QSPI devices supporting a total of 128MBytes of flash storage. The Boot loader
(r01an2141eg) provided supports directly access to the first 64MB of this flash storage. Accessing the second
block cannot be completed while running code from the QSPI devices. If the additional bank needs to be used
please ensure that the swap is completed by code runn ing from a different me mory area such as RAM. A
future sample may be provided to demonstrate accessing the second bank of flash. Please check the web site
for updates.
6. Known Issues
None.
7. Precautions
None.
R01AN5093EJ0100 Rev.1.00 Page 5 of 6
Dec.25.19
RZ/A1H Group RZ/A1H Software Package V1.00 Release Note
Rev.
Date
Revised Contents
No
Type
Description
Remark
1.00
Dec. 25, 19
- First Edition issued
-
Revision History
R01AN5093EJ0100 Rev.1.00 Page 6 of 6
Dec.25.19
General Precautions in the Handling of Microprocessing Unit and Microcontrolle r
Unit Products
The following usage notes are applicable to all Microprocessing unit and Microcontroller unit products from Renesas. For detailed usa ge no tes on th e
products covered by this document, refer to the relevant sections of the document as well as any technical updates that have been issued for the products.
1. Precaution against Electrostatic Discharge (ESD)
A strong electrical field, when exposed to a CMOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps
must be taken to stop the generation of static electricity as much as possible, and quickly dissipate it when it occurs. Environmental control must be
adequate. When it is dry, a humidifier should be used. This is recommended to avoid using insulators that can easily build up static electricity.
Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and
measurement tools including work benches and floors must be grounded. The operator must also be grounded using a wrist strap. Semiconductor
devices must not be touched with bare hands. Similar precautions must be taken for printed circuit boards with mounted semiconductor devices.
2. Processing at power-on
The state of the product is undefined at the time when power is supplied. The states of internal circuits in the LSI are indeterminate and the states of
register settings and pins are undefined at the time when power is supplied. In a finished product where the reset signal is applied to the external reset
pin, the states of pins are not guaranteed from the time when power is supplied until the reset process is completed. In a similar way, the states of pins
in a product that is reset by an on-chip power-on reset function are not guaranteed from the time when power is supplied until the power reaches the
level at which resetting is specified.
3. Input of signal during power-off state
Do not input signals or an I/O pull-up power supply while the device is powered off. The current injection that results from input of such a signal or I/O
pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal
elements. Follow the guideline for input signal during power-off state as described in your product documentation.
4. Handling of unused pins
Handle unused pins in accordance with the directions given under handling of unused pins in the manual. The input pins of CMOS products are
generally in the high-impedance state. In operation with an unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity of
the LSI, an associated shoot -through current flows internally, and malfunctions occur due to the false recognition of the pin state as an input signal
become possible.
5. Clock signals
After applying a reset, only release the reset line after the operating clock signal becomes stable. When switching the clock signal during program
execution, wait until the target clock signal is stabilized. When the clock signal is generated with an external resonator or from an ext ern al os cil lat or
during a reset, ensure that the reset line is only released after full stabilization of the clock signal. Additionally, when switching to a clock signal
produced with an external resonator or by an external oscillator while program execution is in progress, wait until the target clock signal is stable.
6. Voltage application waveform at input pin
Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between V
(Max.) and V
input level is fixed, and also in the transition period when the input level passes through the area between V
7. Prohibition of access to reserved addresses
Access to reserved addresses is prohibited. The reserved addresses are provided for possible future expansion of functions. Do not access these
addresses as the correct ope ration of the LSI is not guarantee d.
8. Differences between products
Before changing from one product to another, for example to a product with a different part number, confirm that the change will not lead to problems.
The characteristics of a microprocessing unit or microcontroller unit products in the same group but having a different part number might differ in terms
of internal memory capacity, layout pattern, and other factors, which can affect the ranges of electrical characteristics, such as characteristic values,
operating margins, immunity to noise, and amount of radiated noise. When changing to a product with a different part number, implement a systemevaluation test for the given product.
(Min.) due to noise, for example, the device may malfunction. Take care to prevent chattering noise from entering the device when the
IH
(Max.) and VIH (Min.).
IL
IL
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