Renesas RX72N User Manual

RX72N Group

RX72N Envision Kit User’s Manual

Rev.1.00 Mar. 2020

32

32-Bit MCU
RX Family/RX700 Series

User’s Manual

www.renesas.com

All information contained in these materials, including products and product specifications,
represents information on the product at the time of publication and is subject to change by
Renesas Electronics Corp. without notice. Please review the latest information published by
Renesas Electronics Corp. through various means, including the Renesas Electronics Corp.

website (http://www.renesas.com).

© 2020 Renesas Electronics Corporation. All rights reserved.

Notice

1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products
and application examples. You are fully responsible for the incorporation or any other use of the circuits, software, and information in the design of your
product or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by you or third parties arising from the use of
these circuits, software, or information.

2. Renesas Electronics hereby expressly disclaims any warranties against and liability for infringement or any other claims involving patents, copyrights, or
other intellectual property rights of third parties, by or arising from the use of Renesas Electronics products or technical information described in this
document, including but not limited to, the product data, drawings, charts, programs, algorithms, and application examples.

3. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or
others.

4. You shall not alter, modify, copy, or reverse engineer any Renesas Electronics product, whether in whole or in part. Renesas Electronics disclaims any
and all liability for any losses or damages incurred by you or third parties arising from such alteration, modification, copying or reverse engineering.

5. Renesas Electronics products are classified according to the following two quality grades: “Standard” and “High Quality”. The intended applications for
each Renesas Electronics product depends on the product’s quality grade, as indicated below.
"Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home

electronic appliances; machine tools; personal electronic equipment; industrial robots; etc.

"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communication equipment; key

financial terminal systems; safety control equipment; etc.
Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas
Electronics document, Renesas Electronics products are not intended or authorized for use in products or systems that may pose a direct threat to
human life or bodily injury (artificial life support devices or systems; surgical implantations; etc.), or may cause serious property damage (space system;
undersea repeaters; nuclear power control systems; aircraft control systems; key plant systems; military equipment; etc.). Renesas Electronics disclaims
any and all liability for any damages or losses incurred by you or any third parties arising from the use of any Renesas Electronics product that is
inconsistent with any Renesas Electronics data sheet, user’s manual or other Renesas Electronics document.

6. When using Renesas Electronics products, refer to the latest product information (data sheets, user’s manuals, application notes, “General Notes for
Handling and Using Semiconductor Devices” in the reliability handbook, etc.), and ensure that usage conditions are within the ranges specified by
Renesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation characteristics, installation, etc. Renesas
Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products outside of such
specified ranges.

7. Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products have specific
characteristics, such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Unless designated as a high reliability
product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products
are not subject to radiation resistance design. You are responsible for implementing safety measures to guard against the possibility of bodily injury,
injury or damage caused by fire, and/or danger to the public in the event of a failure or malfunction of Renesas Electronics products, such as safety
design for hardware and software, including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging
degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult and impractical, you are
responsible for evaluating the safety of the final products or systems manufactured by you.

8. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas
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applicable laws and regulations. Renesas Electronics disclaims any and all liability for damages or losses occurring as a result of your noncompliance
with applicable laws and regulations.

9. Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is
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transfers the product to a third party, to notify such third party in advance of the contents and conditions set forth in this document.

11. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics.

12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas
Electronics products.

(Note1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlled

subsidiaries.

(Note2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.

(Rev.4.0-1 November 2017)

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General Precautions in the Handling of Microprocessing Unit and Microcontroller
Unit Products

The following usage notes are applicable to all Microprocessing unit and Microcontroller unit products from Renesas. For detailed usage notes on the products
covered by this document, refer to the relevant sections of the document as well as any technical updates that have been issued for the products.

1. Precaution against Electrostatic Discharge (ESD)
A strong electrical field, when exposed to a CMOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps

must be taken to stop the generation of static electricity as much as possible, and quickly dissipate it when it occurs. Environmental control must be
adequate. When it is dry, a humidifier should be used. This is recommended to avoid using insulators that can easily build up static electricity.
Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work benches and floors must be grounded. The operator must also be grounded using a wrist strap. Semiconductor devices must not be
touched with bare hands. Similar precautions must be taken for printed circuit boards with mounted semiconductor devices.

2. Processing at power-on
The state of the product is undefined at the time when power is supplied. The states of internal circuits in the LSI are indeterminate and the states of

register settings and pins are undefined at the time when power is supplied. In a finished product where the reset signal is applied to the external reset
pin, the states of pins are not guaranteed from the time when power is supplied until the reset process is completed. In a similar way, the states of pins in
a product that is reset by an on-chip power-on reset function are not guaranteed from the time when power is supplied until the power reaches the level
at which resetting is specified.

3. Input of signal during power-off state
Do not input signals or an I/O pull-up power supply while the device is powered off. The current injection that results from input of such a signal or I/O

pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal elements.
Follow the guideline for input signal during power-off state as described in your product documentation.

4. Handling of unused pins
Handle unused pins in accordance with the directions given under handling of unused pins in the manual. The input pins of CMOS products are

generally in the high-impedance state. In operation with an unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity of
the LSI, an associated shoot-through current flows internally, and malfunctions occur due to the false recognition of the pin state as an input signal
become possible.

5. Clock signals
After applying a reset, only release the reset line after the operating clock signal becomes stable. When switching the clock signal during program

execution, wait until the target clock signal is stabilized. When the clock signal is generated with an external resonator or from an external oscillator
during a reset, ensure that the reset line is only released after full stabilization of the clock signal. Additionally, when switching to a clock signal produced
with an external resonator or by an external oscillator while program execution is in progress, wait until the target clock signal is stable.

6. Voltage application waveform at input pin
Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between VIL (Max.)

and VIH (Min.) due to noise, for example, the device may malfunction. Take care to prevent chattering noise from entering the device when the input level
is fixed, and also in the transition period when the input level passes through the area between VIL (Max.) and VIH (Min.).

7. Prohibition of access to reserved addresses
Access to reserved addresses is prohibited. The reserved addresses are provided for possible future expansion of functions. Do not access these

addresses as the correct operation of the LSI is not guaranteed.

8. Differences between products
Before changing from one product to another, for example to a product with a different part number, confirm that the change will not lead to problems.

The characteristics of a microprocessing unit or microcontroller unit products in the same group but having a different part number might differ in terms of
internal memory capacity, layout pattern, and other factors, which can affect the ranges of electrical characteristics, such as characteristic values,
operating margins, immunity to noise, and amount of radiated noise. When changing to a product with a different part number, implement a system­evaluation test for the given product.

How to Use This Manual

1. Purpose and Target Readers

This manual is designed to provide the user with a hardware overview of the RX72N Envision Kit and an
understanding of its electrical characteristics.

Particular attention should be paid to the precautionary notes when using the manual. These notes occur within
the body of the text, at the end of each section, and in the Usage Notes section.

The revision history summarizes the locations of revisions and additions. It does not list all revisions. Refer to the
text of the manual for details.

The following documents apply to the RX72N Envision Kit. Make sure to refer to the latest versions of
these documents. The newest versions of the documents listed may be obtained from the Renesas
Electronics website (www.renesas.com/envision2).

Document Type

Description

Document Title

Document No.

User’s manual

Description of RX72N Envision Kit hardware
specifications

RX72N Envision Kit
User’s Manual

R20UT4788EJ
(this manual)

Circuit diagram

Description of RX72N Envision Kit board
circuit diagram

RX72N Envision Kit
board circuit diagram

R20UT4789EJ

Parts list

Description of RX72N Envision Kit board
parts list

RX72N Envision Kit bill
of materials

R20UT4790EJ

User’s Manual:

Hardware*1

Description of hardware specifications (pin
assignments, memory map, specifications of
peripheral functions, electrical
characteristics, and timing) and operation

RX72N Group User’s
Manual: Hardware

R01UH0824EJ
(Japanese:
R01UH0824JJ)

Note: 1. Documents related to the RX72N are available for download on the RX72N product webpage.

2. List of Abbreviations and Acronyms

Abbreviation

Full Form

CPU

Central Processing Unit

DIP

Dual In-line Package

DNF

Do Not Fit

IDE

Integrated Development Environment

IRQ

Interrupt Request

HOCO

High-Speed On-Chip Oscillator

LOCO

Low-Speed On-Chip Oscillator

LED

Light Emitting Diode

MCU

Micro-controller Unit

n/a (NA)

Not Applicable

n/c (NC)

Not Connected

PC

Personal Computer

Pmod™

Pmod™ is a trademark of Digilent Inc. The Pmod™ Interface Specification is the property of

Digilent Inc. For more information on Pmod™, refer to the Digilent Inc. Pmod™ License

Agreement page.

QSPI

Quad Serial Peripheral Interface

QVGA

Quarter Video Graphics Array

RAM

Random Access Memory

RFP

Renesas Flash Programmer

RMII

Reduced Media Independent Interface

ROM

Read Only Memory

SD Card

Secure Digital Card

SDHI

Secure Digital Host Interface

SPI

Serial Peripheral Interface

TFT

Thin Film Transistor

USB

Universal Serial Bus

WQVGA

Wide Quarter Video Graphics Array

Table of Contents

1. Overview .......................................................................................................................... 1

1.1 Package Contents ...................................................................................................................................... 1

1.2 Purpose ...................................................................................................................................................... 1

1.3 Features ..................................................................................................................................................... 1

1.4 Preparation ................................................................................................................................................ 1

1.5 RX72N Envision Kit Specifications ............................................................................................................ 2

1.6 Block Diagram ............................................................................................................................................ 3

2. External View ................................................................................................................... 4

3. Component Layout Diagram ............................................................................................ 6

4. Operating Environment .................................................................................................... 7

5. User Circuits .................................................................................................................... 8

5.1 Power Supply Circuit .................................................................................................................................. 8

5.1.1 ECN1: USB Connector for On-Board Emulator ............................................................................... 8

5.1.2 CN7: External Power Supply Connector .......................................................................................... 8

5.1.3 3.3 V Power supply .......................................................................................................................... 9

5.1.4 LCD Backlight Power Supply Circuit ................................................................................................ 9

5.2 Reset Circuit ............................................................................................................................................ 10

5.3 Clock Circuit ............................................................................................................................................. 10

5.4 Evaluation MCU ....................................................................................................................................... 10

5.5 Emulator ................................................................................................................................................... 10

5.6 DIP Switches ............................................................................................................................................ 11

5.7 USB Serial Interface ................................................................................................................................ 12

5.8 Pmod™ Connectors ................................................................................................................................. 13

5.9 User Switch .............................................................................................................................................. 14

5.10 Wi-Fi/BLE Interface .................................................................................................................................. 14

5.10.1 Module Programming Settings ....................................................................................................... 14

5.11 Ethernet Interface .................................................................................................................................... 15

5.12 microSD Slot ............................................................................................................................................ 16

5.12.1 SDHI Power Supply Control ........................................................................................................... 16

5.13 USB Host Interface .................................................................................................................................. 17

5.13.1 USB Power Control ........................................................................................................................ 17

5.14 Serial Flash .............................................................................................................................................. 18

5.15 D2Audio Processor and Amplifier for Active Speaker ............................................................................. 19

5.15.1 Speakers Suitable for Connection.................................................................................................. 19

5.15.2 Clock Supply .................................................................................................................................. 19

5.15.3 DAE-4–Related Documents ........................................................................................................... 19

5.15.4 DAE-4 Development Tools ............................................................................................................. 19

5.15.5 DAE-4 Settings ............................................................................................................................... 19

5.16 MEMS Microphones ................................................................................................................................. 21

5.17 Light Sensor ............................................................................................................................................. 22

5.18 LEDs ........................................................................................................................................................ 23

6. Usage Precautions ........................................................................................................ 24

6.1 Additional Load ........................................................................................................................................ 24

6.2 Modifying the Board ................................................................................................................................. 24

6.3 Limitation on Number of Envision Kits Connected .................................................................................. 24

7. Developing Code ........................................................................................................... 25

7.1 Using e2 studio ......................................................................................................................................... 25

7.2 Using CS+ ................................................................................................................................................ 26

8. Additional Information .................................................................................................... 27

R20UT4788EJ0100 Rev.1.00 Page 1 of 27
Mar.27.20

1. Overview

1.1 Package Contents

Thank you for purchasing the RX72N Envision Kit evaluation tool from Renesas (the product). The contents of
the product package are as follows:

RX72N Envision Kit (RTK5RX72N0C00000BJ)
Note: USB cable not included.

1.2 Purpose

The product is an evaluation tool for Renesas MCUs. This manual describes the technical elements of the
product’s hardware.

1.3 Features

The product includes the following features:

• Simplified evaluation and development using RX72N MCU

• Support for new functions of the RX72N: LCD controller, 2D rendering engine, dual-bank flash memory,

etc.

• Encryption key management functions of Trusted Secure IP, which incorporates encryption accelerators

for multiple encryption standards

• 4.3-inch WQVGA TFT panel with capacitive touch functionality

• Wi-Fi/BLE, Ethernet, and USB interfaces

• SD card, on-board memory, and USB Host storage class as standard storage options

• Sound interface and light sensor

• On-board emulator circuit

• Sample application including firmware update function*

1

Note: 1. Available for download on the following webpage:

https://www.renesas.com/envision2

1.4 Preparation

Install on the host PC the integrated development environment (IDE) and other necessary software, which are
available on the following webpage:

https://www.renesas.com/development-tools

RX72N Envision Kit User's Manual 1. Overview

R20UT4788EJ0100 Rev.1.00 Page 2 of 27
Mar.27.20

1.5 RX72N Envision Kit Specifications

Table 1-1 lists the specifications of the product.

Table 1-1. RX72N Envision Kit Specifications

Item

Specification

Evaluation MCU

Model number: R5F572NNHDFB

Package: 144-pin LQFP

On-chip memory: ROM 4 MB + 64 KB, RAM 1 MB

Board size
Dimensions: 130.0 mm × 70.0 mm

Thickness: 1.6 mm

Power supply

USB connector: 5 V input

Power IC: 5 V input, 3.3 V output

External power supply jack: 5.0 V input (2.1 mm diameter)

Main clock

16 MHz (crystal oscillator)

Subclock

Not implemented

Audio clock

24.576 MHz (5X35023 clock generator)

Wi-Fi/BLE combo

EPS32-WROOM2-32D

Ethernet

RJ45 connector  1, support for MII mode only

SDHI*1

microSD slot  1

USB Host

USB Type-A connector  1

UART-USB conversion

USB Micro-B connector  1

LCD interface

0.5 mm pitch, 40-pin  1 (TFT)

LCD touch panel interface

0.5 mm pitch, 6-pin  1 (I2C)

On-board memory

QSPI serial flash (Macronix, 32 Mbit)

Audio output

Audio DSP: D2Audio, stereo mini jack  1

Audio input

MEMS microphone  2 (LR stereo)

Light sensor

ISL29034

Pushbutton

User switch  1

LED

Power: (green)  1

User: (blue)  1

ACT LED: (green)  1

Emulator interface

E2 Lite on-board emulator circuit, USB Micro-B connector  1

Pmod™ connector

Connector: Right angle, 12-pin  2

Note: 1. It is necessary to enter into an SD Host/Ancillary Product License Agreement (SD HALA) in order to develop

host devices conforming to the SD standard.

RX72N Envision Kit User's Manual 1. Overview

R20UT4788EJ0100 Rev.1.00 Page 3 of 27
Mar.27.20

1.6 Block Diagram

Figure 1-1 is a block diagram of the product.

Figure 1-1. Block Diagram

RX72N Envision Kit User's Manual 2. External View

R20UT4788EJ0100 Rev.1.00 Page 4 of 27
Mar.27.20

2. External View

Figure 2-1 is an external view of the LCD side of the product, Figure 2-2 is an external view of the component
side (as shipped from the factory), and Figure 2-3 is an external view of the component side (without LCD).

Figure 2-1. External View of LCD Side

Figure 2-2. External View of Component Side (as Shipped from the Factory)

RX72N Envision Kit User's Manual 2. External View

R20UT4788EJ0100 Rev.1.00 Page 5 of 27
Mar.27.20

Figure 2-3. External View of Component Side (without LCD)