Renesas R0E521174CSJ00 User Manual

R0E521174CSJ00

Converter Board for 20-pin 0.65-mm-pitch LSSOP

User’s Manual

* NQPACK, YQPACK, YQSOCKET, YQ-GUIDE, HQPACK, TQPACK, TQSOCKET, NSPACK, YSPACK, HSPACK and YS-GUIDE are

trademarks of Tokyo Eletech Corporation.

 Renesas Technology Corporation and Renesas Solutions Corporation put the maximum effort into making semiconductor products

better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to
personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with
appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention
against any malfunction or mishap.

 These materials are intended as a reference to assist our customers in the selection of the Renesas Technology product best suited

to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to
Renesas Technology Corporation, Renesas Solutions Corporation or a third party.

 Renesas Technology Corporation and Renesas Solutions Corporation assume no responsibility for any damage, or infringement of

any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application
examples contained in these materials.

 All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information

on products at the time of publication of these materials, and are subject to change by Renesas Technology Corporation and
Renesas Solutions Corporation without notice due to product improvements or other reasons. It is therefore recommended that
customers contact Renesas Technology Corporation, Renesas Solutions Corporation or an authorized Renesas Technology product
distributor for the latest product information before purchasing a product listed herein. The information described here may contain
technical inaccuracies or typographical errors. Renesas Technology Corporation and Renesas Solutions Corporation assume no
responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information
published by Renesas Technology Corporation and Renesas Solutions Corporation by various means, including the Renesas home
page (http://www.renesas.com).

 When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and

algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the
information and products. Renesas Technology Corporation and Renesas Solutions Corporation assume no responsibility for any
damage, liability or other loss resulting from the information contained herein.

 Renesas Technology semiconductors are not designed or manufactured for use in a device or system that is used under

circumstances in which human life is potentially at stake. Please contact Renesas Technology Corporation, Renesas Solutions
Corporation or an authorized Renesas Technology product distributor when considering the use of a product contained herein for any
specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.

 The prior written approval of Renesas Technology Corporation and Renesas Solutions Corporation is necessary to reprint or

reproduce in whole or in part these materials.

 If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from

the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport
contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.

 Please contact Renesas Technology Corporation or Renesas Solutions Corporation for further details on these materials or the

products contained therein.

 This product is a development supporting unit for use in your program development and evaluation stages. In mass-producing your

program you have finished developing, be sure to make a judgment on your own risk that it can be p ut to practical use by performing
integration test, evaluation, or some experiment else.

 In no event shall Renesas Solutions Corporation be liable for any consequence arising from the use of this product.
 Renesas Solutions Corporation strives to renovate or provide a workaround for product malfunction at some charge or without charge.

However, this does not necessarily mean that Renesas Solutions Corporation guarantees the renovation or the provision under any
circumstances.

 This product has been developed by assuming its use for program development and evaluation in laboratories. Therefore, it does not

fall under the application of Electrical Appliance and Material Safety Law and protection against electromagnetic interference when
used in Japan.

CAUTION

Renesas Tools Homepage http://www.renesas.com/en/tools

Keep safety first in your circuit designs!

Notes regarding these materials

Precautions to be taken when using this product

If the requirements shown in the "CAUTION" sentences are ignored,
the equipment may cause personal injury or damage to the products.

Rev.2.00
Apr. 01, 2006
REJ10J0847-0200

(1/4)

1. Outline

The R0E521174CSJ00 is a converter board for connecting the
emulation probe R0E521000EPB00 and the compact emulator
R0E521000CPE00 for R8C/Tiny Series to a foot pattern for
20-pin 0.65-mm-pitch LSSOP (PLSP0020JB-A, formerly
20P2F-A) of R8C/14, 15, 16, 17, 18, 19, 1A, 1B, 28 and 29
Groups.

2. Package Components (See Figure 1)

Table 1 Package Components

Item Quantity
R0E521174CSJ00
(Base board R0E521000CIF00 and 150mm

1 pc.

FFC cable included)
YSPACK20BG

(made by Tokyo Eletech Corporation)
NSPACK20BG
(made by Tokyo Eletech Corporation)
YS-GUIDE
(made by Tokyo Eletech Corporation)

1 pc.

1 pc.

2 pcs.

R0E521174CSJ00 User's Manual (This manual) 1 pc.

3. Specifications

Table 2 Specifications

Applicable package

PLSP0020JB-A, formerly 20P2F-A

(20-pin 0.65-mm-pitch LSSOP)
Between R0E521174CSJ00 and

YSPACK20BG:

100 times guaranteed Insertion/removal

iterations of

connector

Between R0E521000EPB00 or

R0E521000CPE00 and

R0E521174CSJ00:

50 times guaranteed

4. Usage (See Figure 2)

The R0E521174CSJ00 can be used for debugging and board
mounted evaluation in common by mounting the
NSPACK20BG on the user system.

(1) For debugging

Mount the NSPACK20BG and YSPACK20BG on the foot
pattern of the user system in that order. And fix them with
the YS-GUIDE’s (do not use the screws included with the
YSPACK20BG).
After connecting the R0E521000EPB00 or
R0E521000CPE00 and R0E521174CSJ00, connect the
R0E521174CSJ00 to the YSPACK20BG.

(2) For onboard evaluation

Mount an R8C/14, 15, 16, 17, 18, 19, 1A, 1B, 28 and 29
Groups MCU and HSPACK20BG (separately available)
in that order on the NSPACK20BG on the user system.
And fix them using a screw included with the

HSPACK20BG.
Before using the R0E521174CSJ00, be sure to read "7.
Precautions" on page 4 and the R0E521000EPB00 or
R0E521000CPE00 User’s Manual.

R0E521174CSJ00

YS-GUIDE(2)YSPACK20BG NSPACK20BG

Figure 1 Package components of the R0E521174CSJ00

(1) Debugging

R0E521000EPB00

or

R0E521000CPE00

YS-GUIDE(x2) *

YSPACK20BG *

NSPACK20BG *

●: No. 1 pin

*: These products are included with the R0E521174CSJ00 package.

R0E521174CSJ00

(2) On-board evaluation

HSPACK20BG

(not included)

MCU with on-chip
Flash memory etc.

20-pin 0.65-mm-pitch

(PLSP0020JB-A) foot pattern

Figure 2 Usage of the R0E521174CSJ00

(2/4)