To our customers,
Old Company Name in Catalogs and Other Documents
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology
Corporation, and Renesas Electronics Corporation took over all the business of both
companies. Therefore, although the old company name remains in this document, it is a valid
Renesas Electronics document. We appreciate your understanding.
Renesas Electronics website: http://www.renesas.com
April 1
Renesas Electronics Corporation
Issued by: Renesas Electronics Corporation (http://www.renesas.com)
st
, 2010
Send any inquiries to http://www.renesas.com/inquiry
.
Notice
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R0E33062PMSRC0
Emulation Memory Board for M16C/60 Series Compact Emulator
User's Manual
z Renesas Technology Corporation and Renesas Solutions Corporation put the maximum effort into making semiconductor products
better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to
personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with
appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention
against any malfunction or mishap.
z These materials are intended as a reference to assist our customers in the selection of the Renesas Technology product best suited
to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to
Renesas Technology Corporation, Renesas Solutions Corporation or a third party.
z Renesas Technology Corporation and Renesas Solutions Corporation assume no responsibility for any damage, or infringement of
any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application
examples contained in these materials.
z All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information
on products at the time of publication of these materials, and are subject to change by Renesas Technology Corporation and
Renesas Solutions Corporation without notice due to product improvements or other reasons. It is therefore recommended that
customers contact Renesas Technology Corporation, Renesas Solutions Corporation or an authorized Renesas Technology product
distributor for the latest product information before purchasing a product listed herein. The information described here may contain
technical inaccuracies or typographical errors. Renesas Technology Corporation and Renesas Solutions Corporation assume no
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page (http://www.renesas.com).
z When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and
algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the
information and products. Renesas Technology Corporation and Renesas Solutions Corporation assume no responsibility for any
damage, liability or other loss resulting from the information contained herein.
z Renesas Technology semiconductors are not designed or manufactured for use in a device or system that is used under
circumstances in which human life is potentially at stake. Please contact Renesas Technology Corporation, Renesas Solutions
Corporation or an authorized Renesas Technology product distributor when considering the use of a product contained herein for any
specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
z The prior written approval of Renesas Technology Corporation and Renesas Solutions Corporation is necessary to reprint or
reproduce in whole or in part these materials.
z If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from
the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport
contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
z Please contact Renesas Technology Corporation or Renesas Solutions Corporation for further details on these materials or the
products contained therein.
z This product is a development supporting unit for use in your program development and evaluation stages. In mass-producing your
program you have finished developing, be sure to make a judgment on your own risk that it can be p ut to practical use by performing
integration test, evaluation, or some experiment else.
z In no event shall Renesas Solutions Corporation be liable for any consequence arising from the use of this product.
z Renesas Solutions Corporation strives to renovate or provide a workaround for product malfunction at some charge or without charge.
However, this does not necessarily mean that Renesas Solutions Corporation guarantees the renovation or the provision under any
circumstances.
z This product has been developed by assuming its use for program development and evaluation in laboratories. Therefore, it does not
fall under the application of Electrical Appliance and Material Safety Law and protection against electromagnetic interference when
used in Japan.
WARNING
CAUTION
Renesas Tools Homepage http://www.renesas.com/en/tools
IMPORTANT
Keep safety first in your circuit designs!
Notes regarding these materials
Precautions to be taken when using this product
WARNING indicates a potentially dangerous situation that will cause
death or heavy wound unless it is avoided.
CAUTION indicates a potentially dangerous situation that will cause
a slight injury or a medium-degree injury unless it is avoided.
This is used in operation procedures or explanatory descriptions to
convey exceptional conditions or cautions to the user.
Rev.1.00
Sep. 16, 2005
REJ10J1121-0100
(1/4)
1. Outline
The R0E33062PMSRC0 is an emulation memory board for the M16C/60 Series compact emulator. The memory space can be
allocated to the emulation memory by using with the M16C/60 Series compact emulator M3062PT3-CPE etc.
2. Package Components
Table 1 Package Components
Item Quantity
R0E33062PMSRC0 emulation memory board 1
Spacers for fixing the emulation memory board 4
R0E33062PMSRC0 User’s Manual (this document)
R0E33062PMSRC0 User’s Manual (Japanese)
1
1
3. Connection Procedure
The procedure for connecting the R0E33062PMSRC0 is shown in Figure 1.
(1) Unscrew the four screws securing the emulation probe.
(2) Pull out the M3062PT2-EPBM from the compact emulator control
board (hereafter, upper board) vertically, otherwise the connectors
may be damaged.
Screws
M3062PT2-EPBM
(3) Attach connectors J1 and J2 of the new R0E33062PMSRC0 to
(4) Tighten the spacers (included) in an even, crisscross pattern to
Spacers
R0E33062PMSRC0
(5) Attach connectors J1 and J2 of the M3062PT2-EPBM to connectors
(6) Tighten the four screws (which are unscrewed in the procedure 1) in
Screws
R0E33062PMSRC0
M3062PT2-EPBM
(7) After replacing the board, perform the self-check to make sure that
Figure 1 Connecting procedure of the emulation memory board
CAUTION
Cautions to Be Taken for This Product:
z Before you replace the emulation memory board, shut off the power, otherwise internal circuits may be damaged.
z Insert or pull out the connectors vertically, otherwise the connectors may be damaged.
connectors J3 and J4 of the upper board, respectively.
secure the R0E33062PMSRC0 with such as box wrench.
J3 and J4 of the R0E33062PMSRC0, respectively.
an even, crisscross pattern to secure the M3062PT2-EPBM with a
screwdriver.
the R0E33062PMSRC0 has been installed properly.
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4. Usage (Emulator Debugger)
The required operating environmental is described below.
- Integrated development environment: High-performance Embedded Workshop
- Emulator debugger: M16C R8C Compact emulator debugger Ver.1.01 Release 00 or later
Set the emulation memory in the MCU setting dialog box of the emulator debugger.
(1) MCU tab
Specifying the processor mode
Select the appropriate processor mode that suits
your system.
Specifying the bus width
When specifying memory expansion mode or
microprocessor mode, select “16-bit” or “8-bit”
for “External Data Bus Width”.
Using or not using the memory space
expansion function
Specifies whether or not to use the memory
space expansion function when selecting
memory expansion mode or microprocessor
mode. When using the memory space expansion
function, select “4MB Mode”. When not, select
“Normal Mode”
Using or not using the internal
reserved area expansion
Specifies whether or not to expand the internal
reserved area. Check the box if the internal
reserved area expansion bit (PM13) is “1”.
PM13=Set to 0:
Internal RAM area: 00400h--03FFFh
Internal ROM area: D0000h--FFFFFh
PM13=Set to 1:
Internal RAM area: 00400h--07FFFh
Internal ROM area: 80000h--FFFFFh
Specifying the PM10 (bit 0 of the
address 0005h)
When using the CS2 Area Switch Bit (PM10) as
“1”, check this box. Specify the processor mode
according to the user system.
IMPORTANT
Notes on Selecting a Processor Mode:
z When setting memory expansion mode, the level of pin CNVSS of the MCU status should be "L". The MCU status
shows the pin level of the user system.
z When setting microprocessor mode, the level of pin CNVSS of the MCU status should be "H".
z When setting memory expansion mode or microprocessor mode, pins RDY* and HOLD* of the user system should
be "H".
(2) MAP tab
Specifying the emulation memory
allocation
Sets the memory area assigned to the emulation
memory by 4KB. Up to four areas can be set.
An area set to [INTERNAL] will be allocated to
the emulation memory. An unchecked area or an
unset area will be allocated to external area.
The MAP setting is effective only in the CS3*,
CS2*, CS1* and CS0*. The maps of SFR,
internal ROM and RAM are set automatically.
* MAP tab is displayed only when connecting the emulation memory board.
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5. Specifications of the Emulation Memory Board
Applicable compact emulator M3062PT3-CPE
Applicable MCU mode Memory expansion mode (NORMAL, 4MB)
Microprocessor mode (NORMAL, 4MB)
Applicable power supply 2.7 -- 5.5 V
Maximum operating frequency - Maximum operating frequency (at 5.0 V) 0 wait: 7 MHz
1 wait: 20 MHz
2 wait and 3 wait: 24 MHz
- Maximum operating frequency (at 3.0 V) 0 wait: 6 MHz
1 wait: 17 MHz
2 wait and 3 wait: 24 MHz
6. Precautions
WARNING
Warnings to Be Taken for This Product:
z Do not disassemble or modify this product. Personal injury due to electric shock may occur if this product is
disassembled and modified. Disassembling and modifying the product will void your warranty.
Warning for Installation:
z Do not set this product in water or areas of high humidity. Make sure that the product does not get wet. Spilling
water or some other liquid into the product may cause unrepairable damage.
Warning for Use Environment:
z This equipment is to be used in an environment with a maximum ambient temperature of 35°C. Care should be taken
that this temperature is not exceeded.
CAUTION
Cautions to Be Taken for This Product:
z Use caution when handling this product. Be careful not to apply a mechanical shock.
z Do not touch the connector pins of this product directly. Static electricity may damage the internal circuits.
Caution to Be Taken for System Malfunctions:
z If the emulator malfunctions because of interference like external noise, do the following to remedy the trouble.
(1) Press the RESET button on the emulator upper panel.
(2) If normal operation is not restored after step (1), shut OFF the emulator once and then reactivate it.
7. Inquiries
For the technical question about this product, fill in the text file which is downloaded from the following page, then send the
information to your local distributor.
http://tool-support.renesas.com/eng/toolnews/registration/support.txt
(4/4)
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