• Three Half-bridge Outputs Formed by Three High-side and Three Low-side Drivers
• Capable to Switch all Kinds of Loads Such as DC Motors, Bulbs, Resistors, Capacitors
• No Shoot-through Current
• Outputs Short-circuit Protected
• Overtemperature Protection for Each Switch and Overtemperature Prewarning
• Undervoltage Protection
• Various Diagnostic Functions Such as Shorted Output, Open-load, Overtemperature
• Serial Data Interface, Daisy Chain Capable, up to 2 MHz Clock Frequency
• QFN18 Package
Typically 0.8Ω at 25°C, Maximum 1.8Ω at 200°C
DSon
and Inductors
and Power-supply Fail Detection
High
Temperature
Triple
Half-bridge
1.Description
The ATA6827 is a fully protected driver IC specially designed for high temperature
applications. In mechatronic solutions, for example turbo charger or exhaust gas recirculation systems, many flaps have to be controlled by DC motor driver ICs which are
located very close to the hot engine or actuator where ambient temperatures up to
150°C are usual. Due to the advantages of SOI technology junction temperatures up
to 200°C are allowed. This enables new cost effective board design possibilities to
achieve complex mechatronic solutions.
The ATA6827 is a fully protected Triple Half-Bridge to control up to 3 different loads by
a microcontroller in automotive and industrial applications. Each of the 3 high-side and
3 low-side drivers is capable to drive currents up to 1.0A. The drivers are internally
connected to form 3 half-bridges and can be controlled separately from a standard
serial data interface. Therefore, all kinds of loads such as bulbs, resistors, capacitors
and inductors can be combined. The IC design especially supports the application of
H-bridges to drive DC motors.
Protection is guaranteed regarding short-circuit conditions, overtemperature and undervoltage. Various diagnostic functions and a very low quiescent current in standby
mode opens a wide range of applications. Automotive qualification gives added value
and enhanced quality for exacting requirements of automotive applications.
Driver with
Serial Input
Control
ATA6827
Preliminary
4912C–AUTO–10/06
Figure 1-1.Block Diagram
n.u.n.
Input register
Ouput register
DI
4
CLK
5
CS
3
INH
8
DO
7
P
S
F
detector
detector
Faul t
Faul t
H
L
H
L
H
O
S
C
u.
O
S
P
C
L
D
1/2
n.u.n.
n.u.n.
n.u.n.u.n.u.n.
u.
n.u.n.
u.
Faul t
detector
Faul t
detector
OUT3
n.
u.
u.
12/13
L
S
S
3
u.
H
n.
S
u.
3
OUT2
S
S
2
2
3
Serial interface
L
H
L
S
S
S
3
2
2
Faul t
detector
Faul t
detector
15/16
S
S
S
R
1
1
R
Charge
pump
L
S
1
OUT1
T
P
Control
logic
Thermal
protection
UV
protection
Power on
reset
H
S
1
10
VS
11
VS
9
VCC
14
GND
17
GND
18
GND
6
GND
2
ATA6827 [Preliminary]
4912C–AUTO–10/06
ATA6827 [Preliminary]
2.Pin Configuration
Figure 2-1.Pinning QFN18
PGND3
PGND1
OUT1S
OUT1F
PGND2
OUT2S
CS
DI
18 17 16 151314
1
2
3
4
5
6
OUT3S
OUT3
CLK
GND
Table 2-1.Pin Description
PinSymbolFunction
1OUT3SSense OUT3, internal connected to pin 2 via lead
2OUT3Half-bridge output 3
3CS
4DI
5CLK
6GNDGround; reference potential
7DO
8INHInhibit input; 5-V logic input with internal pull down; low = standby, high = normal operation
9VCCLogic supply voltage (5 V)
10VSPower supply for output stages OUT1, OUT2 and OUT3, internal supply
11VSPower supply for output stages OUT1, OUT2 and OUT3, internal supply
12OUT2Half-bridge output 2
13
OUT2S
14PGND2Power Ground OUT2
15OUT1FHalf-bridge output 1
16OUT1SSense OUT1, internal connected to pin 15 via lead
17
18
PGND1
PGND3
PGND1
PGND3
Chip select input; 5-V CMOS logic level input with internal pull up;
low = serial communication is enabled, high = disabled
Serial data input; 5-V CMOS logic level input with internal pull down; receives serial data from the control
device; DI expects a 16-bit control word with LSB being transferred first
Serial clock input; 5-V CMOS logic level input with internal pull down;
controls serial data input interface and internal shift register (f
Serial data output; 5-V CMOS logic level tri-state output for output (status) register data; sends 16-bit
status information to the microcontroller (LSB is transferred first); output will remain tri-stated unless
device is selected by CS = low, therefore, several ICs can operate on one data output line only.
Sense OUT2, internal connected to pin 12 via bond; OUT2 controlled loads have to be connected to pin
12 OUT2F
Power Ground OUT1 and OUT3
Power Ground OUT1 and OUT3
12
11
10
OUT2
VS
VS
VCC
9
INH
8
DO
7
= 2 MHz)
max
4912C–AUTO–10/06
3
3.Functional Description
3.1Serial Interface
Data transfer starts with the falling edge of the CS signal. Data must appear at DI synchronized
to CLK and are accepted on the falling edge of the CLK signal. LSB (bit 0, SRR) has to be transferred first. Execution of new input data is enabled on the rising edge of the CS signal. When CS
is high, pin DO is in tri-state condition. This output is enabled on the falling edge of CS. Output
data will change their state with the rising edge of CLK and stay stable until the next rising edge
of CLK appears. LSB (bit 0, TP) is transferred first.
In case of undervoltage at pin VS, the Power-Supply Fail bit (PSF) in the output register is set
and all outputs are disabled. To detect an undervoltage, its duration has to be longer than the
undervoltage detection delay time t
age recovers to a normal operating value. The PSF bit stays high until it is reset by the SRR
(Status Register Reset) bit in the input register.
3.3Open-load Detection
If the current through a high-side or low-side switch in the ON-state stays below the open-load
detection threshold, the open-load detection bit (OPL) in the output register is set.
The OPL bit stays high until it is reset by the SRR bit in the input register. To detect an open
load, its duration has to be longer than the open-load detection delay time t
3.4Overtemperature Protection
If the junction temperature of one or more output stages exceeds the thermal prewarning threshold, T
temperature falls below the thermal prewarning threshold, T
bit can be read without transferring a complete 16-bit data word. The status of TP is available at
pin DO with the falling edge of CS. After the microcontroller has read this information, CS is set
high and the data transfer is interrupted without affecting the status of input and output registers.
If the junction temperature of one or more output stages exceeds the thermal shutdown threshold, T
j switch off
low. The outputs can be enabled again when the temperature falls below the thermal shutdown
threshold, T
warning and shutdown threshold avoids oscillations.
, the temperature prewarning bit (TP) in the output register is set. When the
jPW set
, all outputs are disabled and the corresponding bits in the output register are set to
jswitch on
. The outputs are enabled immediately when supply volt-
dUV
.
dSd
jPW reset
, the bit TP is reset. The TP
and the SRR bit in the input register is set to high. Hysteresis of thermal pre-
3.5Short-circuit Protection
The output currents are limited by a current regulator. Overcurrent detection is activated by writing a high to the OCS (Overcurrent Shutdown) bit in the input register. When the current in an
output stage exceeds the overcurrent limitation and shutdown threshold, it is switched off after a
delay time (t
the output register is set to low. For OCS = low the overcurrent shutdown is inactive. The SCD
bit is also set if the current exceeds the overcurrent limitation and shutdown threshold, but the
outputs are not affected. By writing a high to the SRR bit in the input register the SCD bit is reset
and the disabled outputs are enabled.
3.6Inhibit
Applying 0V to pin 8 (INH) inhibits the ATA6827.
All output switches are then turned off and switched to tri-state. The data in the output register is
deleted. The output switches can be activated again by switching pin 8 (INH) to 5V which initiates an internal power-on reset.
). The short-circuit detection bit (SCD) is set and the corresponding status bit in
dSd
6
ATA6827 [Preliminary]
4912C–AUTO–10/06
ATA6827 [Preliminary]
4.Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
1.1Quiescent current VS VVS < 20V, INH = low10, 11I
1.2Quiescent current VCC
1.3Supply current VS
1.4Supply current VCC
1.5Discharge current VS
1.6Discharge current VS
2Undervoltage Detection, Power-on Reset
Power-on reset
2.1
threshold
Power-on reset
2.2
delay time
Undervoltage-detection
2.3
threshold
Undervoltage-detection
2.4
hysteresis
Undervoltage-detection
2.5
delay time
3Thermal Prewarning and Shutdown
3.1Thermal prewarning setT
Thermal prewarning
3.2
reset
Thermal prewarning
3.3
hysteresis
3.4Thermal shutdown offT
3.5Thermal shutdown onT
*) Type means: A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Note:1. Delay time between rising edge of the input signal at pin CS after data transmission and switch on output stages to 90% of
final level. Device not in standby for t > 1 ms
< 5.25 V; INH = High; –40°C ≤ Tj≤ 200°C; Ta≤ 150°C; unless otherwise specified, all values refer to
*) Type means: A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Note:1. Delay time between rising edge of the input signal at pin CS after data transmission and switch on output stages to 90% of
final level. Device not in standby for t > 1 ms
< 5.25 V; INH = High; –40°C ≤ Tj≤ 200°C; Ta≤ 150°C; unless otherwise specified, all values refer to
*) Type means: A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Note:1. Delay time between rising edge of the input signal at pin CS after data transmission and switch on output stages to 90% of
final level. Device not in standby for t > 1 ms
< 5.25 V; INH = High; –40°C ≤ Tj≤ 200°C; Ta≤ 150°C; unless otherwise specified, all values refer to
VCC
VVS = 13V
R
= 30Ω
Load
VVS = 13V
= 30Ω
R
Load
VVS = 13V
R
= 30Ω
Load
VVS = 13V
R
= 30Ω
Load
VVS = 13V
R
= 30Ω
Load
3, 4, 5,
8
3, 4, 5,
8
3, 4, 5,
8
VDI, V
CLK, VINH
= V
CC
4, 5, 8I
VCS= 0V3I
= 2 mA7V
DOL
I
= –2 mA7V
DOL
V
= V
CS
0V < V
CC
DO
< V
VCC
7I
t
don
t
don
t
doff
t
doff
t
don
– t
V
V
∆V
DOH
t
dINH
doff
IL
IH
I
PD
PU
DOL
DO
1µsA
0.3 ×
V
VCC
50700mVB
570µAA
–70–5µAA
V
VCC
–0.7V
–15+15µAA
20µsA
20µsA
20µsA
3µsA
VA
0.7 ×
V
VCC
VA
0.4VA
VA
100µsA
10
ATA6827 [Preliminary]
4912C–AUTO–10/06
ATA6827 [Preliminary]
9.Serial Interface – Timing
No.ParametersTest ConditionsPinTiming Chart No.
DO enable after CS
8.1
falling edge
DO disable after CS
8.2
rising edge
= 100 pF71t
C
DO
= 100 pF72t
C
DO
8.3DO fall timeCDO = 100 pF7-t
8.4DO rise timeC
8.5DO valid timeC
= 100 pF7-t
DO
= 100 pF710t
DO
8.6CS setup time34t
8.7CS setup time38t
8.8CS high time39t
8.9CLK high time55t
8.10 CLK low time56t
8.11 CLK period time5-t
8.12 CLK setup time57t
8.13 CLK setup time53t
8.14 DI setup time411t
8.15 DI hold time412t
*) Type means: A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Note:1. Serial Interface Timing with Chart Numbers
Figure 9-1.Serial Interface Timing with Chart Numbers
CS
CLK
1
2
CS
DO
9
4
5
3
68
7
DI
11
CLK
1012
DO
Inputs DI, CLK, CS: High level = 0.7 × VCC, low level = 0.3 × V
Output DO: High level = 0.8 × VCC, low level = 0.2 × V
CC
CC
12
ATA6827 [Preliminary]
4912C–AUTO–10/06
10. Application Circuit
Figure 10-1. Application Circuit
V
CC
Reset
V
Enable
Trigger
DI
4
CLK
5
CS
3
INH
8
DO
7
CC
U5021M
Watchdog
Micro-
controller
O
S
n.u.n.
C
u.
Input register
Ouput register
O
S
P
P
C
S
L
D
F
Fault
detector
Fault
detector
n.u.n.
n.u.n.
2
n.u.n.u.n.u.n.
u.
n.u.n.
u.
Fault
detector
Fault
detector
OUT3
ATA6827 [Preliminary]
V
VS
VS
VCC
GND
GND
GND
GND
S
BYT41D
+
V
Batt
13V
V
CC
V
CC
5V
+
H
L
H
L
H
L
S
S
3
u.
H
n.
n.
S
u.
u.
u.
3
12
OUT2
S
S
2
2
3
Serial interface
H
L
L
S
S
S
2
2
3
Fault
detector
Fault
detector
S
S
S
R
1
1
R
Charge
pump
H
L
T
S
S
P
1
1
UV
protection
Control
logic
Thermal
protection
15
OUT1
Power on
reset
10
11
9
14
17
18
6
11. Application Notes
It is strongly recommended to connect the blocking capacitors at VCC and VS as close as possible to the power supply and GND pins.
Recommended value for capacitors at V
Electrolytic capacitor C > 22 µF in parallel with a ceramic capacitor C = 100 nF. The value for
electrolytic capacitor depends on external loads, conducted interferences and reverse conducting current I
Recommended value for capacitors at V
Electrolytic capacitor C > 10 µF in parallel with a ceramic capacitor C = 100 nF.
To reduce thermal resistance it is recommended to place cooling areas on the PCB as close as
possible to the GND pins and to the die pad.
4912C–AUTO–10/06
MM
:
S
(see Section 4. ”Absolute Maximum Ratings” on page 7).
Out1,2,3
:
CC
13
12. Ordering Information
Extended Type NumberPackageRemarks
ATA6827-PIQWQFN18, 4 mm × 4 mmTaped and reeled, Pb-free
13. Package Information
Package: VQFN_4 x 4_18L
Exposed pad 2.5 x 3.125
Dimensions in mm
Avenue de Rochepleine
BP 123
38521 Saint-Egreve Cedex, France
Tel: (33) 4-76-58-30-00
Fax: (33) 4-76-58-34-80
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