Rainbow Electronics AT89LS51 User Manual

Page 1

Features

Compatible with MCS-51
4K Bytes of In-System Programmable (ISP) Flash Memory
– Endurance: 1000 Write/Erase Cycles
2.7V to 4.0V Operating Range
Three-level Program Memory Lock
128 x 8-bit Internal RAM
32 Programmable I/O Lines
Two 16-bit Timer/Counters
Six Interrupt Sources
Full Duplex UART Serial Channel
Low-power Idle and Power-down Modes
Interrupt Recovery from Power-down Mode
Watchdog Timer
Dual Data Pointer
Power-off Flag
Flexible ISP Programming (Byte and Page Mode)
®
Products
8-bit Low-Voltage Microcontroller with 4K Bytes

Description

The AT89LS51 is a low-voltage, high-performance CMOS 8-bit microcontroller with 4K bytes of in-system programmable Flash memory. The device is manufactured using Atmel’s high-density nonvolatile memory technology and is compatible with the indus­try-standard 80C51 instruction set and pinout. The on-chip Flash allows the program memory to be reprogrammed in-system or by a conventional nonvolatile memory pro­grammer. By combining a versatile 8-bit CPU with in-system programmable Flash on a monolithic chip, the Atmel AT89LS51 is a powerful microcontroller which provides a highly-flexible and cost-effective solution to many embedded control applications.
The AT89LS51 provides the following standard features: 4K bytes of Flash, 128 bytes of RAM, 32 I/O lines, Watchdog timer, two data pointers, two 16-bit timer/counters, a five-vector two-level interrupt architecture, a full duplex serial port, on-chip oscillator, and clock circuitry. In addition, the AT89LS51 is designed with static logic for operation down to zero frequency and supports two software selectable power saving modes. The Idle Mode stops the CPU while allowing the RAM, timer/counters, serial port, and interrupt system to continue functioning. The Power-down mode saves the RAM con­tents but freezes the oscillator, disabling all other chip functions until the next external interrupt or hardware reset.
In-System Programmable Flash
AT89LS51
Preliminary
Rev. 3053A–8051–05/0 2
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Pin Configurations

PDIP
PLCC
(MOSI) P1.5 (MISO) P1.6
(SCK) P1.7
RST
(RXD) P3.0
NC
(TXD) P3.1 (INT0) P3.2 (INT1) P3.3
(T0) P3.4 (T1) P3.5
1
P1.0
2
P1.1
3
P1.2
4
P1.3
5
P1.4
RST
XTAL2 XTAL1
GND
6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
(MOSI) P1.5 (MISO) P1.6
(SCK) P1.7
(RXD) P3.0
(TXD) P3.1 (INT0) P3.2 (INT1) P3.3
(T0) P3.4 (T1) P3.5
(WR) P3.6
(RD) P3.7
TQFP
P1.4
P1.3
P1.2
P1.1
P1.0 NCVCC
4443424140393837363534
1 2 3 4 5 6 7 8 9 10 11
1213141516171819202122
40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21
P0.0 (AD0)
VCC P0.0 (AD0) P0.1 (AD1) P0.2 (AD2) P0.3 (AD3) P0.4 (AD4) P0.5 (AD5) P0.6 (AD6) P0.7 (AD7) EA/VPP ALE/PROG PSEN P2.7 (A15) P2.6 (A14) P2.5 (A13) P2.4 (A12) P2.3 (A11) P2.2 (A10) P2.1 (A9) P2.0 (A8)
P0.1 (AD1)
P0.2 (AD2)
P0.3 (AD3)
33 32 31 30 29 28 27 26 25 24 23
P0.4 (AD4) P0.5 (AD5) P0.6 (AD6) P0.7 (AD7) EA/VPP NC ALE/PROG PSEN P2.7 (A15) P2.6 (A14) P2.5 (A13)
(MOSI) P1.5 (MISO) P1.6
(SCK) P1.7
RST
(RXD) P3.0
NC
(TXD) P3.1 (INT0) P3.2 (INT1) P3.3
(T0) P3.4 (T1) P3.5
P1.4
P1.3
P1.2
P1.1
P1.0 NCVCC
P0.0 (AD0)
65432
7 8 9 10 11 12 13 14 15 16 17
1819202122232425262728
(RD) P3.7
(WR) P3.6
XTAL2
XTAL1
GND
1
NC
4443424140
(A8) P2.0
(A9) P2.1
P0.1 (AD1)
P0.2 (AD2)
P0.3 (AD3)
39 38 37 36 35 34 33 32 31 30 29
(A10) P2.2
(A11) P2.3
(A12) P2.4
P0.4 (AD4) P0.5 (AD5) P0.6 (AD6) P0.7 (AD7) EA/VPP NC ALE/PROG PSEN P2.7 (A15) P2.6 (A14) P2.5 (A13)
GND
GND
XTAL2
XTAL1
(A8) P2.0
(RD) P3.7
(WR) P3.6
2
AT89LS51
(A9) P2.1
(A10) P2.2
(A11) P2.3
(A12) P2.4
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Block Diagram

AT89LS51
V
CC
GND
B
REGISTER
RAM ADDR.
REGISTER
P0.0 - P0.7
PORT 0 DRIVERS
RAM
ACC
TMP2 TMP1
PORT 0
LATCH
P2.0 - P2.7
PORT 2 DRIVERS
PORT 2
LATCH
STACK
POINTER
FLASH
PROGRAM
ADDRESS
REGISTER
BUFFER
PSEN
ALE/PROG
EA / V
RST
PC
ALU
INTERRUPT, SERIAL PORT,
AND TIMER BLOCKS
PSW
TIMING
AND
PP
CONTROL
OSC
INSTRUCTION
REGISTER
WATCH
DOG
PORT 3
LATCH
PORT 3 DRIVERS
P3.0 - P3.7
PORT 1
LATCH
PORT 1 DRIVERS
P1.0 - P1.7
ISP
PORT
INCREMENTER
PROGRAM
COUNTER
DUAL DPTR
PROGRAM
LOGIC
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Pin Description

VCC Supply voltage.
GND Ground.

Port 0 Port 0 is an 8-bit open drain bidirectional I/O port. As an output port, each pin can sink eight

TTL inputs. When 1s are written to port 0 pins, the pins can be used as high-impedance inputs.
Port 0 can also be configured to be the multiplexed low-order address/data bus during accesses to external program and data memory. In this mode, P0 has internal pull-ups.
Port 0 also receives the code bytes during Flash programming and outputs the code bytes during program verification. External pull-ups are required during program verification.

Port 1 Port 1 is an 8-bit bidirectional I/O port with internal pull-ups. The Port 1 output buffers can

sink/source four TTL inputs. When 1s are written to Port 1 pins, they are pulled high by the internal pull-ups and can be used as inputs. As inputs, Port 1 pins that are externally being pulled low will source current (I
Port 1 also receives the low-order address bytes during Flash programming and verification.
Port Pin Alternate Functions
P1.5 MOSI (used for In-System Programming)
) because of the internal pull-ups.
IL
P1.6 MISO (used for In-System Programming)
P1.7 SCK (used for In-System Programming)

Port 2 Port 2 is an 8-bit bidirectional I/O port with internal pull-ups. The Port 2 output buffers can

sink/source four TTL inputs. When 1s are written to Port 2 pins, they are pulled high by the internal pull-ups and can be used as inputs. As inputs, Port 2 pins that are externally being pulled low will source current (I
Port 2 emits the high-order address byte during fetches from external program memory and during accesses to external data memory that use 16-bit addresses (MOVX @ DPTR). In this application, Port 2 uses strong internal pull-ups when emitting 1s. During accesses to external data memory that use 8-bit addresses (MOVX @ RI), Port 2 emits the contents of the P2 Spe­cial Function Register.
Port 2 also receives the high-order address bits and some control signals during Flash pro­gramming and verification.
) because of the internal pull-ups.
IL

Port 3 Port 3 is an 8-bit bidirectional I/O port with internal pull-ups. The Port 3 output buffers can

sink/source four TTL inputs. When 1s are written to Port 3 pins, they are pulled high by the internal pull-ups and can be used as inputs. As inputs, Port 3 pins that are externally being pulled low will source current (I
Port 3 receives some control signals for Flash programming and verification.
Port 3 also serves the functions of various special features of the AT89LS51, as shown in the following table.
) because of the pull-ups.
IL
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AT89LS51
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Port Pin Alternate Functions
P3.0 RXD (serial input port)
P3.1 TXD (serial output port)
AT89LS51
P3.2 INT0
P3.3 INT1
P3.4 T0 (timer 0 external input)
P3.5 T1 (timer 1 external input)
P3.6 WR
P3.7 RD
(external interrupt 0)
(external interrupt 1)
(external data memory write strobe)
(external data memory read strobe)
RST Reset input. A high on this pin for two machine cycles while the oscillator is running resets the
device. This pin drives High for 98 oscillator periods after the Watchdog times out. The DIS­RTO bit in SFR AUXR (address 8EH) can be used to disable this feature. In the default state of bit DISRTO, the RESET HIGH out feature is enabled.

ALE/PROG Address Latch Enable (ALE) is an output pulse for latching the low byte of the address during

accesses to external memory. This pin is also the program pulse input (PROG programming.
In normal operation, ALE is emitted at a constant rate of 1/6 the oscillator frequency and may be used for external timing or clocking purposes. Note, however, that one ALE pulse is skipped during each access to external data memory.
If desired, ALE operation can be disabled by setting bit 0 of SFR location 8EH. With the bit set, ALE is active only during a MOVX or MOVC instruction. Otherwise, the pin is weakly pulled high. Setting the ALE-disable bit has no effect if the microcontroller is in external execution mode.
)duringFlash

PSEN Program Store Enable (PSEN) is the read strobe to external program memory.

When the AT89LS51 is executing code from external program memory, PSEN twice each machine cycle, except that two PSEN to external data memory.
activations are skipped during each access
is activated

EA/VPP External Access Enable. EA must be strapped to GND in order to enable the device to fetch

code from external program memory locations starting at 0000H up to FFFFH. Note, however, that if lock bit 1 is programmed, EA
should be strapped to VCCfor internal program executions.
EA
This pin also receives the 12-volt programming enable voltage (V programming.
will be internally latched on reset.
) during Flash
PP

XTAL1 Input to the inverting oscillator amplifier and input to the internal clock operating circuit.

XTAL2 Output from the inverting oscillator amplifier

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Special Function Registers

A map of the on-chip memory area called the Special Function Register (SFR) space is shown in Table 1.
Note that not all of the addresses are occupied, and unoccupied addresses may not be imple­mented on the chip. Read accesses to these addresses will in general return random data, and write accesses will have an indeterminate effect.
Table 1 . AT89LS51 SFR Map and Reset Values
0F8H 0FFH
0F0H
0E8H 0EFH
0E0H
0D8H 0DFH
0D0H
0C8H 0CFH
0C0H 0C7H
0B8H
0B0H
0A8H
0A0H
98H
90H
88H
80H
B
00000000
ACC
00000000
PSW
00000000
IP
XX000000
P3
11111111
IE
0X000000
P2
11111111
SCON
00000000
P1
11111111
TCON
00000000
P0
11111111
SBUF
XXXXXXXX
TMOD
00000000
SP
00000111
AUXR1
XXXXXXX0
TL0
00000000
DP0L
00000000
TL1
00000000
DP0H
00000000
TH0
00000000
DP1L
00000000
TH1
00000000
DP1H
00000000
WDTRST
XXXXXXXX
AUX R
XXX00XX0
PCON
0XXX0000
0F7H
0E7H
0D7H
0BFH
0B7H
0AFH
0A7H
9FH
97H
8FH
87H
6
AT89LS51
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AT89LS51
User software should not write 1s to these unlisted locations, since they may be used in future products to invoke new features. In that case, the reset or inactive values of the new bits will always be 0.
Interrupt Registers: The individual interrupt enable bits are in the IE register. Two priorities can be set for each of the five interrupt sources in the IP register.
Table 2 . AUXR: Auxiliary Register
AUXR Address = 8EH Reset Value = XXX00XX0B
Not Bit
Addressable
WDIDLE DISRTO DISALE
Bit 765 4 3 2 1 0
Reserved for future expansion
DISALE Disable/Enable ALE
DISALE Operating Mode
0 ALE is emitted at a constant rate of 1/6 the oscillator frequency
1 ALE is active only during a MOVX or MOVC instruction
DISRTO Disable/Enable Reset out
DISRTO
0 Reset pin is driven High after WDT times out
1 Reset pin is input only
WDIDLE Disable/Enable WDT in IDLE mode
WDIDLE
0 WDT continues to count in IDLE mode
1 WDT halts counting in IDLE mode
Dual Data Pointer Registers: To facilitate accessing both internal and external data memory, two banks of 16-bit Data Pointer Registers are provided: DP0 at SFR address locations 82H­83H and DP1 at 84H-85H. Bit DPS = 0 in SFR AUXR1 selects DP0 and DPS = 1 selects DP1. The user should always initialize the DPS bit to the appropriate value before accessing the respective Data Pointer Register.
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Power Off Flag: The Power Off Flag (POF) is located at bit 4 (PCON.4) in the PCON SFR.
POF is set to “1” during power up. It can be set and rest under software control and is not affected by reset.
Table 3 . AUXR1: Auxiliary Register 1
AUXR1
Address = A2H
Reset Value = XXXXXXX0B
Not Bit
Addressable
–––– – – – DPS
Bit 7 6 5 4 3 2 1 0
Reserved for future expansion
DPS Data Pointer Register Select
DPS
0 Selects DPTR Registers DP0L, DP0H
1 Selects DPTR Registers DP1L, DP1H

Memory Organization

MCS-51 devices have a separate address space for Program and Data Memory. Up to 64K bytes each of external Program and Data Memory can be addressed.

Program Memory If the EA pin is connected to GND, all program fetches are directed to external memory.

On the AT89LS51, if EA FFFH are directed to internal memory and fetches to addresses 1000H through FFFFH are directed to external memory.
is connected to VCC, program fetches to addresses 0000H through

Data Memory The AT89LS51 implements 128 bytes of on-chip RAM. The 128 bytes are accessible via direct

and indirect addressing modes. Stack operations are examples of indirect addressing, so the 128 bytes of data RAM are available as stack space.

Watchdog Timer (One-time Enabled with Reset-out)

The WDT is intended as a recovery method in situations where the CPU may be subjected to software upsets. The WDT consists of a 14-bit counter and the Watchdog Timer Reset (WDTRST) SFR. The WDT is defaulted to disable from exiting reset. To enable the WDT, a user must write 01EH and 0E1H in sequence to the WDTRST register (SFR location 0A6H). When the WDT is enabled, it will increment every machine cycle while the oscillator is running. The WDT timeout period is dependent on the external clock frequency. There is no way to dis­able the WDT except through reset (either hardware reset or WDT overflow reset). When WDT overflows, it will drive an output RESET HIGH pulse at the RST pin.

Using the WDT To enable the WDT, a user must write 01EH and 0E1H in sequence to the WDTRST register

(SFR location 0A6H). When the WDT is enabled, the user needs to service it by writing 01EH and 0E1H to WDTRST to avoid a WDT overflow. The 14-bit counter overflows when it reaches 16383 (3FFFH), and this will reset the device. When the WDT is enabled, it will increment every machine cycle while the oscillator is running. This means the user must reset the WDT at least every 16383 machine cycles. To reset the WDT the user must write 01EH and 0E1H to WDTRST. WDTRST is a write-only register. The WDT counter cannot be read or written. When WDT overflows, it will generate an output RESET pulse at the RST pin. The RESET
8
AT89LS51
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AT89LS51
pulse duration is 98xTOSC, where TOSC=1/FOSC. To make the best use of the WDT, it should be serviced in those sections of code that will periodically be executed within the time required to prevent a WDT reset.

WDT During Power-down and Idle

In Power-down mode the oscillator stops, which means the WDT also stops. While in Power­down mode, the user does not need to service the WDT. There are two methods of exiting Power-down mode: by a hardware reset or via a level-activated external interrupt, which is enabled prior to entering Power-down mode. When Power-down is exited with hardware reset, servicing the WDT should occur as it normally does whenever the AT89LS51 is reset. Exiting Power-down with an interrupt is significantly different. The interrupt is held low long enough for the oscillator to stabilize. When the interrupt is brought high, the interrupt is serviced. To pre­vent the WDT from resetting the device while the interrupt pin is held low, the WDT is not started until the interrupt is pulled high. It is suggested that the WDT be reset during the inter­rupt service for the interrupt used to exit Power-down mode.
To ensure that the WDT does not overflow within a few states of exiting Power-down, it is best to reset the WDT just before entering Power-down mode.
Before going into the IDLE mode, the WDIDLE bit in SFR AUXR is used to determine whether the WDT continues to count if enabled. The WDT keeps counting during IDLE (WDIDLE bit =
0) as the default state. To prevent the WDT from resetting the AT89LS51 while in IDLE mode, the user should always set up a timer that will periodically exit IDLE, service the WDT, and reenter IDLE mode.
With WDIDLE bit enabled, the WDT will stop to count in IDLE mode and resumes the count upon exit from IDLE.

UART The UART in the AT89LS51 operates the same way as the UART in the AT89C51. For further

information on the UART operation, refer to the ATMEL Web site (http://www.atmel.com). From the home page, select ‘Products’, then ‘8051-Architecture Flash Microcontroller’, then ‘Product Overview’.

Timer 0 and 1 Timer 0 and Timer 1 in the AT89LS51 operate the same way as Timer 0 and Timer 1 in the

AT89C51. For further information on the timers’ operation, refer to the ATMEL Web site (http://www.atmel.com). From the home page, select ‘Products’, then ‘8051-Architecture Flash Microcontroller’, then ‘Product Overview’.

Interrupts The AT89LS51 has a total of five interrupt vectors: two external interrupts (INT0 and INT1),

two timer interrupts (Timers 0 and 1), and the serial port interrupt. These interrupts are all shown in Figure 1.
Each of these interrupt sources can be individually enabled or disabled by setting or clearing a bit in Special Function Register IE. IE also contains a global disable bit, EA, which disables all interrupts at once.
Note that Table 4 shows that bit position IE.6 is unimplemented. In the AT89LS51, bit position IE.5 is also unimplemented. User software should not write 1s to these bit positions, since they may be used in future AT89 products.
The Timer 0 and Timer 1 flags, TF0 and TF1, are set at S5P2 of the cycle in which the timers overflow. The values are then polled by the circuitry in the next cycle.
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.
Table 4 . Interrupt Enable (IE) Register
(MSB) (LSB)
EA ES ET1 EX1 ET0 EX0
Enable Bit = 1 enables the interrupt.
Enable Bit = 0 disables the interrupt.
Symbol Position Function
EA IE.7 Disables all interrupts. If EA = 0, no interrupt is
acknowledged. If EA = 1, each interrupt source is individually enabled or disabled by setting or clearing its enable bit.
IE.6 Reserved
IE.5 Reserved
ES IE.4 Serial Port interrupt enable bit
ET1 IE.3 Timer 1 interrupt enable bit
EX1 IE.2 External interrupt 1 enable bit
ET0 IE.1 Timer 0 interrupt enable bit
EX0 IE.0 External interrupt 0 enable bit
User software should never write 1s to reserved bits, because they may be used in future AT89 products.
Figure 1. Interrupt Sources
INT0
TF0
INT1
TF1
RI
0
1
0
1
TI
IE0
IE1
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AT89LS51

Oscillator Characteristics

XTAL1 and XTAL2 are the input and output, respectively, of an inverting amplifier that can be configured for use as an on-chip oscillator, as shown in Figure 2. Either a quartz crystal or ceramic resonator may be used. To drive the device from an external clock source, XTAL2 should be left unconnected while XTAL1 is driven, as shown in Figure 3. There are no require­ments on the duty cycle of the external clock signal, since the input to the internal clocking circuitry is through a divide-by-two flip-flop, but minimum and maximum voltage high and low time specifications must be observed.
Figure 2. Oscillator Connections
C2
C1
Note: C1, C2 = 30 pF ± 10 pF for Crystals
=40pF± 10 pF for Ceramic Resonators
XTAL2
XTAL1
GND
Figure 3. External Clock Drive Configuration
NC
EXTERNAL
OSCILLATOR
SIGNAL
XTAL2
XTAL1
GND

Idle Mode In idle mode, the CPU puts itself to sleep while all the on-chip peripherals remain active. The

mode is invoked by software. The content of the on-chip RAM and all the special function reg­isters remain unchanged during this mode. The idle mode can be terminated by any enabled interrupt or by a hardware reset.
Note that when idle mode is terminated by a hardware reset, the device normally resumes pro­gram execution from where it left off, up to two machine cycles before the internal reset algorithm takes control. On-chip hardware inhibits access to internal RAM in this event, but access to the port pins is not inhibited. To eliminate the possibility of an unexpected write to a port pin when idle mode is terminated by a reset, the instruction following the one that invokes idle mode should not write to a port pin or to external memory.

Power-down Mode

In the Power-down mode, the oscillator is stopped, and the instruction that invokes Power­down is the last instruction executed. The on-chip RAM and Special Function Registers retain their values until the Power-down mode is terminated. Exit from Power-down mode can be ini­tiated either by a hardware reset or by activation of an enabled external interrupt (INT0 INT1)
. Reset redefines the SFRs but does not change the on-chip RAM. The reset should not
be activated before V
is restored to its normal operating level and must be held active long
CC
or
enough to allow the oscillator to restart and stabilize.
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Table 5 . Status of External Pins During Idle and Power-down Modes
Mode Program Memory ALE PSEN PORT0 PORT1 PORT2 PORT3
Idle Internal 1 1 Data Data Data Data
Idle External 1 1 Float Data Address Data
Power-down Internal 0 0 Data Data Data Data
Power-down External 0 0 Float Data Data Data

Program Memory Lock Bits

Programming the Flash – Parallel Mode

The AT89LS51 has three lock bits that can be left unprogrammed (U) or can be programmed (P) to obtain the additional features listed in the following table.
Table 6 . Lock Bit Protection Modes
Program Lock Bits
LB1 LB2 LB3 Protection Type
1 U U U No program lock features
2 P U U MOVC instructions executed from external program memory
are disabled from fetching code bytes from internal memory, EA
is sampled and latched on reset, and further
programming of the Flash memory is disabled
3 P P U Same as mode 2, but verify is also disabled
4 P P P Same as mode 3, but external execution is also disabled
When lock bit 1 is programmed, the logic level at the EA reset. If the device is powered up without a reset, the latch initializes to a random value and holds that value until reset is activated. The latched value of EA logic level at that pin in order for the device to function properly.
The AT89LS51 is shipped with the on-chip Flash memory array ready to be programmed. The programming interface needs a high-voltage (12-volt) program enable signal and is compati­ble with conventional third-party Flash or EPROM programmers.
The AT89LS51 code memory array is programmed byte-by-byte.
pin is sampled and latched during
must agree with the current
12
AT89LS51
Programming Algorithm: Before programming the AT89LS51, the address, data, and control
signals should be set up according to the Flash programming mode table and Figure 4 and Figure 5. To program the AT89LS51, take the following steps:
1. Input the desired memory location on the address lines.
2. Input the appropriate data byte on the data lines.
3. Activate the correct combination of control signals.
4. Raise EA
5. Pulse ALE/PROG write cycle is self-timed and typically takes no more than 50 µs. Repeat steps 1 through 5, changing the address and data for the entire array or until the end of the object file is reached.
Data
Polling: The AT89LS51 features Data Polling to indicate the end of a byte write cycle.
During a write cycle, an attempted read of the last byte written will result in the complement of the written data on P0.7. Once the write cycle has been completed, true data is valid on all out­puts,andthenextcyclemaybegin.Data been initiated.
/VPPto 12V.
oncetoprogramabyteintheFlasharrayorthelockbits.Thebyte-
Polling may begin any time after a write cycle has
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AT89LS51
Ready/Busy: The progress of byte programming can also be monitored by the RDY/BSY out-
put signal. P3.0 is pulled low after ALE goes high during programming to indicate BUSY is pulled high again when programming is done to indicate READY.
Program Verify: If lock bits LB1 and LB2 have not been programmed, the programmed code data can be read back via the address and data lines for verification. The status of the indi-
vidual lock bits can be verified directly by reading them back.
Reading the Signature Bytes: The signature bytes are read by the same procedure as a nor-
mal verification of locations 000H, 100H, and 200H, except that P3.6 and P3.7 must be pulled to a logic low. The values returned are as follows.
(000H) = 1EH indicates manufactured by Atmel (100H) = 61H indicates 89LS51 (200H) = 06H
Chip Erase: In the parallel programming mode, a chip erase operation is initiated by using the proper combination of control signals and by pulsing ALE/PROG 500 ns.
In the serial programming mode, a chip erase operation is initiated by issuing the Chip Erase instruction. In this mode, chip erase is self-timed and takes about 500 ms.
During chip erase, a serial read from any address location will return 00H at the data output.
low for a duration of 200 ns -
.P3.0

Programming the Flash – Serial Mode

Serial Programming Algorithm

The Code memory array can be programmed using the serial ISP interface while RST is pulled to V RST is set high, the Programming Enable instruction needs to be executed first before other operations can be executed. Before a reprogramming sequence can occur, a Chip Erase operation is required.
The Chip Erase operation turns the content of every memory location in the Code array into FFH.
Either an external system clock can be supplied at pin XTAL1 or a crystal needs to be con­nected across pins XTAL1 and XTAL2. The maximum serial clock (SCK) frequency should be less than 1/16 of the crystal frequency. With a 16 MHz oscillator clock, the maximum SCK fre­quency is 1 MHz.
To program and verify the AT89LS51 in the serial programming mode, the following sequence is recommended:
1. Power-up sequence:
Apply power between VCC and GND pins.
Set RST pin to “H”.
If a crystal is not connected across pins XTAL1 and XTAL2, apply a 3 MHz to 16 MHz clock to XTAL1 pin and wait for at least 10 milliseconds.
2. Enable serial programming by sending the Programming Enable serial instruction to pin MOSI/P1.5. The frequency of the shift clock supplied at pin SCK/P1.7 needs to be less than the CPU clock at XTAL1 divided by 16.
3. The Code array is programmed one byte at a time in either the Byte or Page mode. The write cycle is self-timed and typically takes less than 1 ms at 2.7V.
4. Any memory location can be verified by using the Read instruction that returns the con­tent at the selected address at serial output MISO/P1.6.
5. At the end of a programming session, RST can be set low to commence normal device operation.
. The serial interface consists of pins SCK, MOSI (input) and MISO (output). After
CC
3053A–8051–05/02
13
Page 14
Power-off sequence (if needed):
Set XTAL1 to “L” (if a crystal is not used).
Set RST to “L”.
Turn V
Polling: The Data Polling feature is also available in the serial mode. In this mode, dur-
Data
power off.
CC
ing a write cycle an attempted read of the last byte written will result in the complement of the MSB of the serial output byte on MISO.
Serial
The Instruction Set for Serial Programming follows a 4-byte protocol and is shown in Table 8.
Programming Instruction Set

Programming Interface – Parallel Mode

Table 7 . Flash Programming Modes
Mode V
WriteCodeData 5V H L
Read Code Data 5V H L H H L L L H H D
Write Lock Bit 1 5V H L
Write Lock Bit 2 5V H L
Write Lock Bit 3 5V H L
CC
Every code byte in the Flash array can be programmed by using the appropriate combination of control signals. The write operation cycle is self-timed and once initiated, will automatically time itself to completion.
Most major worldwide programming vendors offer support for the Atmel microcontroller series. Please contact your local programming vendor for the appropriate software revision.
RST PSEN
ALE/
PROG
EA/
V
(2)
12V L HHHH DINA11-8 A7-0
(3)
12VHHHHH X X X
(3)
12V H H H L L X X X
(3)
12V H L H H L X X X
P2.6 P2.7 P3.3 P3.6 P3.7
PP
P0.7-0
Data
OUT
P2.3-0 P1.7-0
Address
A11-8 A7-0
Read Lock Bits
1, 2, 3
Chip Erase 5V H L
ReadAtmelID 5VH L H H LLLLL 1EH 000000H
ReadDeviceID5VH L H H LLLLL 61H 000100H
ReadDeviceID5VH L H H LLLLL 06H 001000H
5V H L H H H H L H L
(1)
12V H L H L L X X X
P0.2, P0.3, P0.4
XX
Notes: 1. Each PROG pulse is 200 ns - 500 ns for Chip Erase.
2. Each PROG
3. Each PROG
4. RDY/BSY
pulse is 200 ns - 500 ns for Write Code Data. pulse is 200 ns - 500 ns for Write Lock Bits.
signal is output on P3.0 during programming.
5. X = don’t care.
14
AT89LS51
3053A–8051–05/02
Page 15
Figure 4. Programming the Flash Memory (Parallel Mode)
AT89S51
P1.0-P1.7
P2.0 - P2.3
P2.6 P2.7 P3.3 P3.6
P3.7
XTAL2 EA
V
ALE
CC
P0
ADDR.
0000H/FFFH
SEE FLASH
PROGRAMMING
MODES TABLE
A0 - A7
A8 - A11
4.5V - 5.5V
PGM DATA
PROG
V/V
AT89LS51
IH PP
3 - 16 MHz
1
XTAL
GND
Figure 5. Verifying the Flash Memory (Parallel Mode)
AT89S51
ADDR.
0000H/FFFH
SEE FLASH
PROGRAMMING
MODES TABLE
3 - 16 MHz
A0 - A7
A8 - A11
P1.0-P1.7
P2.0 - P2.3
P2.6 P2.7
P3.3 P3.6 P3.7
XTAL 2 EA
XTAL1
GND
P3.0
RST
PSEN
V
ALE
RST
PSEN
CC
P0
V
4.5V - 5.5V
PGM DATA (USE 10K PULLUPS)
RDY/ BSY
IH
V
IH
V
IH
3053A–8051–05/02
15
Page 16
Flash Programming and Verification Characteristics (Parallel Mode)
TA= 20°C to 30°C, VCC= 4.5 to 5.5V
Symbol Parameter Min Max Units
V
PP
I
PP
I
CC
1/t
t
AVGL
t
GHAX
t
DVG L
t
GHDX
t
EHSH
t
SHGL
t
GHSL
t
GLGH
t
AVQ V
t
ELQV
t
EHQZ
t
GHBL
t
WC
CLCL
Programming Supply Voltage 11.5 12.5 V
Programming Supply Current 10 mA
VCCSupply Current 30 mA
Oscillator Frequency 3 16 MHz
Address Setup to PROG Low 48t
Address Hold After PROG 48t
Data Setup to PROG Low 48t
Data Hold After PROG 48t
P2.7 (ENABLE)HightoV
PP
48t
CLCL
CLCL
CLCL
CLCL
CLCL
VPPSetup to PROG Low 10 µs
VPPHold After PROG 10 µs
PROG Width 0.2 1 µs
Address to Data Valid 48t
ENABLE Low to Data Valid 48t
Data Float After ENABLE 048t
CLCL
CLCL
CLCL
PROG High to BUSY Low 1.0 µs
Byte Write Cycle Time 50 µs
Figure 6. Flash Programming and Verification Waveforms – Parallel Mode
P1.0 - P1.7 P2.0 - P2.3
PORT 0
ALE/PROG
EA/V
PP
P2.7
(ENABLE)
P3.0
(RDY/BSY)
t
AVGL
t
SHGL
PROGRAMMING
ADDRESS
DATA I N
V
t
EHSH
t
PP
DVG L
t
GLGH
t
GHBL
t
GHDX
t
t
ELQV
GHAX
t
GHSL
LOGIC 1 LOGIC 0
BUSY
t
WC
VERIFICATION
ADDRESS
t
AVQV
DATA OUT
READY
t
EHQZ
16
AT89LS51
3053A–8051–05/02
Page 17
Figure 7. Flash Memory Serial Downloading
AT89LS51
AT89LS51
V
CC
V
CC
INSTRUCTION
INPUT
DATA OUTPUT
CLOCK IN
3 - 16 MHz
P1.5/MOSI
P1.6/MISO
P1.7/SCK
XTAL2
GND
RSTXTAL1
V
IH

Flash Programming and Verification Waveforms – Serial Mode

Figure 8. Serial Programming Waveforms
3053A–8051–05/02
7654 32 1 0
17
Page 18
Table 8 . Serial Programming Instruction Set
Instruction Format
Instruction
OperationByte 1 Byte 2 Byte 3 Byte 4
Programming Enable 1010 1100 0101 0011 xxxx xxxx xxxx xxxx
0110 1001 (Output on MISO)
Chip Erase 1010 1100 100x xxxx xxxx xxxx xxxx xxxx Chip Erase Flash memory
Read Program Memory (Byte Mode)
Write Program Memory (Byte Mode)
Write Lock Bits
Read Lock Bits 0010 0100 xxxx xxxx xxxx xxxx xxx xx Read back current status of
Read Signature Bytes 0010 1000 xxxx xxx xxx0 Signature Byte Read Signature Byte
Read Program Memory (Page Mode)
Write Program Memory (Page Mode)
Note: 1. B1 = 0, B2 = 0 Mode 1, no lock protection
(1)
B1 = 0, B2 = 1 B1 = 1, B2 = 0 B1 = 1, B1 = 1
0010 0000 xxxx Read data from Program
0100 0000 xxxx Write data to Program
1010 1100 1110 00 xxxx xxxx xxxx xxxx Write Lock bits
0011 0000 xxxx Byte 0 Byte 1...
0101 0000 xxxx Byte 0 Byte 1...
Mode 2, lock bit 1 activatedMode 3, lock bit 2 activatedMode 4, lock bit 3 activated
A11
A10
A11
A10
A11
A11
A10
A11
A10
A9
A8
A9
A8
B2
B1
A10A9A8
A8
A9
A9
A8
A7
}
A7
A6A5A4A3A2A1A0
A6A5A4A3A2A1A0
A7
Each of the lock bit modes needs to be activated sequentially before Mode 4 can be executed.
D7
D6
D5
D4
D7
D6
D5D4D3
LB3
Byte 255
Byte 255
D3D2D1
D2
LB1
LB2
D1
Enable Serial Programming while RST is high
array
D0
memory in the byte mode
D0
memory in the byte mode
thelockbits(aprogrammed lock bit reads back as a “1”)
Read data from Program memory in the Page Mode (256 bytes)
Write data to Program memory in the Page Mode (256 bytes)
18
After Reset signal is high, SCK should be low for at least 64 system clocks before it goes high to clock in the enable data
bytes. No pulsing of Reset signal is necessary. SCK should be no faster than 1/16 of the system clock at XTAL1.
For Page Read/Write, the data always starts from byte 0 to 255. After the command byte and upper address byte are latched, each byte thereafter is treated as data until all 256 bytes are shifted in/out. Then the next instruction will be ready to be decoded.
AT89LS51
3053A–8051–05/02
Page 19

Serial Programming Characteristics

Figure 9. Serial Programming Timing
MOSI
t
OVSH
t
SHOX
t
SLSH
AT89LS51
SCK
t
SHSL
MISO
t
SLIV
Table 9. Serial Programming Characteristics, TA=-40°Cto85°C, VCC= 2.7V - 4.0V (Unless Otherwise Noted)
Symbol Parameter Min Typ Max Units
1/t
CLCL
t
CLCL
t
SHSL
t
SLSH
t
OVSH
t
SHOX
t
SLIV
t
ERASE
t
SWC
Oscillator Frequency 0 16 MHz
Oscillator Period 62.5 ns
SCK Pulse Width High 8 t
SCK Pulse Width Low 8 t
MOSI Setup to SCK High t
MOSI Hold after SCK High 2 t
SCK Low to MISO Valid 10 16 32 ns
Chip Erase Instruction Cycle Time 500 ms
SerialByteWriteCycleTime 64t
CLCL
CLCL
CLCL
CLCL
+ 400 µs
CLCL
ns
ns
ns
ns
3053A–8051–05/02
19
Page 20

Absolute Maximum Ratings*

Operating Temperature .................................. -55°C to +125°C
Storage Temperature ..................................... -65°C to +150°C
Voltage on Any Pin
with Respect to Ground ..................................... -1.0V to +7.0V
Maximum Operating Voltage ............................................ 6.6V
DC Output Current ...................................................... 15.0 mA
*NOTICE: Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent dam­age to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

DC Characteristics

The values shown in this table are valid for TA= -40°C to 85°C and VCC= 2.7V to 4.0V, unless otherwise noted.
Symbol Parameter Condition Min Max Units
V
IL
V
IL1
V
IH
V
IH1
V
OL
V
OL1
V
OH
V
OH1
I
IL
I
TL
I
LI
RRST Reset Pulldown Resistor 50 300 K
C
IO
I
CC
Notes: 1. Under steady state (non-transient) conditions, IOLmust be externally limited as follows:
2. Minimum V
Input Low Voltage (Except EA)-0.50.7V
Input Low Voltage (EA)-0.50.2V
-0.3 V
CC
Input High Voltage (Except XTAL1, RST) 0.2 VCC+0.9 VCC+0.5 V
Input High Voltage (XTAL1, RST) 0.7 V
Output Low Voltage 1,2,3) I
Output Low Voltage (Port 0, ALE, PSEN)I
Output High Voltage (Ports 1,2,3, ALE, PSEN
Output High Voltage (Port 0 in External Bus Mode)
(1)
(1)
(Ports
)
=0.8mA
OL
=1.6mA
OL
I
= -60 µA 2.4 V
OH
= -25 µA 0.75 V
I
OH
I
= -10 µA 0.9 V
OH
I
= -800 µA 2.4 V
OH
= -300 µA 0.75 V
I
OH
I
= -80 µA 0.9 V
OH
Logical 0 Input Current (Ports 1,2,3) V
=0.45V
IN
Logical 1 to 0 Transition Current (Ports 1,2,3) V
IN
=2V
Input Leakage Current (Port 0, EA
)0.45<V
IN<VCC
CC
CC
CC
CC
CC
VCC+0.5 V
0.45 V
0.45 V
-50 µA
-650 µA
±10 µA
Pin Capacitance Test Freq. = 1 MHz, TA=25°C 10 pF
Active Mode, 12 MHz 25 mA
Power Supply Current
Power-down Mode
Maximum I Maximum I
perportpin:10mA
OL
per 8-bit port:
OL
(2)
Idle Mode, 12 MHz 6.5 mA
VCC=4.0V 30 µA
Port0:26mA Ports1,2,3:15mA Maximum total I If I
exceeds the test condition, VOLmay exceed the related specification. Pins are not guaranteed to sink current greater
OL
for all output pins: 71 mA
OL
than the listed test conditions.
for Power-down is 2V.
CC
V
V
V
V
20
AT89LS51
3053A–8051–05/02
Page 21
AT89LS51

AC Characteristics

Under operating conditions, load capacitance for Port 0, ALE/PROG, and PSEN = 100 pF; load capacitance for all other outputs = 80 pF.

External Program and Data Memory Characteristics

16 MHz Oscillator Variable Oscillator
Symbol Parameter
UnitsMin Max Min Max
1/t
t
LHLL
t
AVLL
t
LLAX
t
LLIV
t
LLPL
t
PLPH
t
PLIV
t
PXIX
t
PXIZ
t
PXAV
t
AVI V
t
PLAZ
t
RLRH
t
WLWH
t
RLDV
t
RHDX
t
RHDZ
t
LLDV
t
AVDV
t
LLWL
t
AVWL
t
QVWX
t
QVWH
t
WHQX
t
RLAZ
t
WHLH
CLCL
Oscillator Frequency 0 16 MHz
ALE Pulse Width 85 2t
Address Valid to ALE Low 22 t
Address Hold After ALE Low 32 t
ALE Low to Valid Instruction In 150 4t
ALE Low to PSEN Low 32 t
PSEN Pulse Width 142 3t
PSEN Low to Valid Instruction In 82 3t
-40 ns
CLCL
-40 ns
CLCL
-30 ns
CLCL
-100 ns
CLCL
-30 ns
CLCL
-45 ns
CLCL
-105 ns
CLCL
Input Instruction Hold After PSEN 00ns
Input Instruction Float After PSEN 37 t
PSEN to Address Valid 75 t
-8 ns
CLCL
Address to Valid Instruction In 207 5t
-25 ns
CLCL
-105 ns
CLCL
PSEN Low to Address Float 10 10 ns
RD Pulse Width 275 6t
WR Pulse Width 275 6t
RD Low to Valid Data In 147 5t
-100 ns
CLCL
-100 ns
CLCL
-165 ns
CLCL
Data Hold After RD 00ns
Data Float After RD 65 2t
ALE Low to Valid Data In 350 8t
Address to Valid Data In 397 9t
ALE Low to RD or WR Low 137 239 3t
Address to RD or WR Low 122 4t
Data Valid to WR Transition 13 t
Data Valid to WR High 287 7t
Data Hold After WR 13 t
-50 3t
CLCL
-130 ns
CLCL
-50 ns
CLCL
-150 ns
CLCL
-50 ns
CLCL
-60 ns
CLCL
-150 ns
CLCL
-165 ns
CLCL
+50 ns
CLCL
RD Low to Address Float 0 0 ns
RD or WR High to ALE High 23 103 t
-40 t
CLCL
+40 ns
CLCL
3053A–8051–05/02
21
Page 22

External Program Memory Read Cycle

t
LHLL
ALE
t
AVLL
t
LLPL
PSEN
t
LLAX
PORT 0
A0 - A7 A0 - A7
t
AVIV
PORT 2

External Data Memory Read Cycle

t
LHLL
ALE
t
PLAZ
A8 - A15
t
LLIV
t
PLIV
t
PXIZ
t
PXIX
INSTR IN
t
PLPH
t
PXAV
t
A8 - A15
WHLH
PSEN
RD
PORT 0
PORT 2
t
LLDV
t
LLWL
t
LLAX
t
AVLL
A0 - A7 FROM RI OR DPL
t
AVWL
P2.0 - P2.7 OR A8 - A15 FROM DPH
t
AVDV
t
RLAZ
t
RLRH
t
RLDV
DATA IN INSTR IN
t
RHDZ
t
RHDX
A0 - A7 FROM PCL
A8 - A15 FROM PCH
22
AT89LS51
3053A–8051–05/02
Page 23

External Data Memory Write Cycle

t
LHLL
ALE
PSEN
t
LLWL
t
WLWH
t
WHLH
AT89LS51
WR
t
AVLL
PORT 0
PORT 2
A0 - A7 FROM RI OR DPL
t
AVWL
P2.0 - P2.7 OR A8 - A15 FROM DPH

External Clock Drive Waveforms

t
0.7 V
CC
CHCX
CC
0.45V
V - 0.5V
CC
0.2 V - 0.1V

External Clock Drive

t
LLAX
t
QVWX
t
t
QVWH
DATA OUT INSTR IN
t
CLCH
t
CLCX
WHQX
A0 - A7 FROM PCL
A8 - A15 FROM PCH
t
CHCX
t
CLCL
t
CHCL
Symbol Parameter Min Max Units
1/t
CLCL
t
CLCL
t
CHCX
t
CLCX
t
CLCH
t
CHCL
3053A–8051–05/02
Oscillator Frequency 0 16 MHz
Clock Period 62.5 ns
High Time 20 ns
Low Time 20 ns
Rise Time 20 ns
Fall Time 20 ns
23
Page 24

Serial Port Timing: Shift Register Mode Test Conditions

The values in this table are valid for VCC= 2.7V to 4.0V and Load Capacitance = 80 pF.
12 MHz Osc Variable Oscillator
Symbol Parameter
t
XLXL
t
QVXH
t
XHQX
t
XHDX
t
XHDV
Serial Port Clock Cycle Time 1.0 12t
Output Data Setup to Clock Rising Edge 700 10t
Output Data Hold After Clock Rising Edge 50 2t
Input Data Hold After Clock Rising Edge 0 0 ns
Clock Rising Edge to Input Data Valid 700 10t

Shift Register Mode Timing Waveforms

INSTRUCTION
ALE
CLOCK
WRITE TO SBUF
OUTPUT DATA
CLEAR RI
INPUT DATA
AC Testing Input/Output Waveforms
0
t
QVXH
1
t
XHDV
2
t
XLXL
t
XHQX
0
VALID VALIDVALID VALIDVALID VALIDVALID VALID
1
(1)
UnitsMin Max Min Max
CLCL
-133 ns
CLCL
-80 ns
CLCL
-133 ns
CLCL
3
2
t
XHDX
4
5
3
6
4
7
5
8
6
7
SET TI
SET RI
µs
V - 0.5V
CC
0.45V
0.2 V + 0.9V
CC
TEST POINTS
0.2 V - 0.1V
CC
Note: 1. AC Inputs during testing are driven at VCC- 0.5V for a logic 1 and 0.45V for a logic 0. Timing measurements are made at V
min. for a logic 1 and VILmax. for a logic 0.
Float Waveforms
(1)
V
LOAD
V
V
LOAD
LOAD
+ 0.1V
- 0.1V
Timing Reference
Points
- 0.1V
V
OL
+ 0.1V
V
OL
Note: 1. For timing purposes, a port pin is no longer floating when a 100 mV change from load voltage occurs. A port pin begins to
float when a 100 mV change from the loaded V
OH/VOL
level occurs.
IH
24
AT89LS51
3053A–8051–05/02
Page 25

Ordering Information

Speed
(MHz)
16 2.7V to 4.0V AT89LS51-16AC
Power
Supply Ordering Code Package Operation Range
AT89LS51-16JC AT89LS51-16PC
AT89LS51-16AI AT89LS51-16JI
AT89LS51-16PI
44A
44J 40P6
44A 44J
40P6
AT89LS51
Commercial
(0°Cto70°C)
Industrial
(-40°Cto85°C)
Package Type
44A 44-lead, Thin Plastic Gull Wing Quad Flatpack (TQFP)
44J 44-lead, Plastic J-leaded Chip Carrier (PLCC)
40P6 40-pin, 0.600" Wide, Plastic Dual Inline Package (PDIP)
3053A–8051–05/02
25
Page 26

Packaging Information

44A – TQFP

PIN 1
B
PIN 1 IDENTIFIER
e
E1 E
D1
D
C
0˚~7˚
A1
L
Notes: 1. This package conforms to JEDEC reference MS-026, Variation ACB.
2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum plastic body size dimensions including mold mismatch.
3. Lead coplanarity is 0.10 mm maximum.
A2 A
SYMBOL
COMMON DIMENSIONS
(Unit of Measure = mm)
MIN
A 1.20
A1 0.05 0.15
A2 0.95 1.00 1.05
D 11.75 12.00 12.25
D1 9.90 10.00 10.10 Note 2
E 11.75 12.00 12.25
E1 9.90 10.00 10.10 Note 2
B 0.30 0.45
C 0.09 0.20
L 0.45 0.75
e 0.80 TYP
NOM
MAX
NOTE
26
2325 Orchard Parkway
R
San Jose, CA 95131
AT89LS51
TITLE
44A, 44-lead, 10 x 10 mm Body Size, 1.0 mm Body Thickness,
0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP)
10/5/2001
DRAWING NO.
44A
3053A–8051–05/02
REV.
B
Page 27

44J–PLCC

AT89LS51
1.14(0.045) X 45˚
B
e
0.51(0.020)MAX
45˚ MAX (3X)
Notes: 1. This package conforms to JEDEC reference MS-018, Variation AC.
2. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is .010"(0.254 mm) per side. Dimension D1 and E1 include mold mismatch and are measured at the extreme material condition at the upper or lower parting line.
3. Lead coplanarity is 0.004" (0.102 mm) maximum.
PIN NO. 1
IDENTIFIER
D1
D
1.14(0.045) X 45˚
E1 E
0.318(0.0125)
0.191(0.0075)
NOM
D2/E2
MAX
B1
A2
A1
A
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
A 4.191 4.572
A1 2.286 3.048
A2 0.508 ––
D 17.399 17.653
D1 16.510 16.662 Note 2
E 17.399 17.653
E1 16.510 16.662 Note 2
D2/E2 14.986 16.002
B 0.660 0.813
B1 0.330 0.533
e 1.270 TYP
MIN
NOTE
2325 Orchard Parkway
R
San Jose, CA 95131
3053A–8051–05/02
TITLE
44J, 44-lead, Plastic J-leaded Chip Carrier (PLCC)
DRAWING NO.
44J
10/04/01
REV.
B
27
Page 28

40P6 – PDIP

PIN
1
E1
A1
B
REF
E
B1
C
L
SEATING PLANE
A
D
e
0º ~ 15º
eB
Notes: 1. This package conforms to JEDEC reference MS-011, Variation AC.
2. Dimensions D and E1 do not include mold Flash or Protrusion. Mold Flash or Protrusion shall not exceed 0.25 mm (0.010").
TITLE
2325 Orchard Parkway
R
San Jose, CA 95131
40P6, 40-lead (0.600"/15.24 mm Wide) Plastic Dual Inline Package (PDIP)
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
A ––4.826
A1 0.381 ––
D 52.070 52.578 Note 2
E 15.240 15.875
E1 13.462 13.970 Note 2
B 0.356 0.559
B1 1.041 1.651
L 3.048 3.556
C 0.203 0.381
eB 15.494 17.526
e 2.540 TYP
MIN
NOM
MAX
DRAWING NO.
40P6
NOTE
09/28/01
REV.
B
28
AT89LS51
3053A–8051–05/02
Page 29
Atmel Headquarters Atmel Operations
Corporate Headquarters
2325 Orchard Parkway San Jose, CA 95131 TEL 1(408) 441-0311 FAX 1(408) 487-2600
Europe
Atmel Sarl Route des Arsenaux 41 Case Postale 80 CH-1705 Fribourg Switzerland TEL (41) 26-426-5555 FAX (41) 26-426-5500
Asia
Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimhatsui East Kowloon Hong Kong TEL (852) 2721-9778 FAX (852) 2722-1369
Japan
9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan TEL (81) 3-3523-3551 FAX (81) 3-3523-7581
Memory
2325 Orchard Parkway San Jose, CA 95131 TEL 1(408) 441-0311 FAX 1(408) 436-4314
Microcontrollers
2325 Orchard Parkway San Jose, CA 95131 TEL 1(408) 441-0311 FAX 1(408) 436-4314
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ASIC/ASSP/Smart Cards
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