• 4K Bytes of In-System Programmable (ISP) Flash Memory
– Endurance: 1000 Write/Erase Cycles
• 2.7V to 4.0V Operating Range
• FullyStaticOperation:0Hzto16MHz
• Three-level Program Memory Lock
• 128 x 8-bit Internal RAM
• 32 Programmable I/O Lines
• Two 16-bit Timer/Counters
• Six Interrupt Sources
• Full Duplex UART Serial Channel
• Low-power Idle and Power-down Modes
• Interrupt Recovery from Power-down Mode
• Watchdog Timer
• Dual Data Pointer
• Power-off Flag
• Flexible ISP Programming (Byte and Page Mode)
®
Products
8-bit
Low-Voltage
Microcontroller
with 4K Bytes
Description
The AT89LS51 is a low-voltage, high-performance CMOS 8-bit microcontroller with 4K
bytes of in-system programmable Flash memory. The device is manufactured using
Atmel’s high-density nonvolatile memory technology and is compatible with the industry-standard 80C51 instruction set and pinout. The on-chip Flash allows the program
memory to be reprogrammed in-system or by a conventional nonvolatile memory programmer. By combining a versatile 8-bit CPU with in-system programmable Flash on a
monolithic chip, the Atmel AT89LS51 is a powerful microcontroller which provides a
highly-flexible and cost-effective solution to many embedded control applications.
The AT89LS51 provides the following standard features: 4K bytes of Flash, 128 bytes
of RAM, 32 I/O lines, Watchdog timer, two data pointers, two 16-bit timer/counters, a
five-vector two-level interrupt architecture, a full duplex serial port, on-chip oscillator,
and clock circuitry. In addition, the AT89LS51 is designed with static logic for operation
down to zero frequency and supports two software selectable power saving modes.
The Idle Mode stops the CPU while allowing the RAM, timer/counters, serial port, and
interrupt system to continue functioning. The Power-down mode saves the RAM contents but freezes the oscillator, disabling all other chip functions until the next external
interrupt or hardware reset.
Port 0Port 0 is an 8-bit open drain bidirectional I/O port. As an output port, each pin can sink eight
TTL inputs. When 1s are written to port 0 pins, the pins can be used as high-impedance
inputs.
Port 0 can also be configured to be the multiplexed low-order address/data bus during
accesses to external program and data memory. In this mode, P0 has internal pull-ups.
Port 0 also receives the code bytes during Flash programming and outputs the code bytes
during program verification. External pull-ups are required during program verification.
Port 1Port 1 is an 8-bit bidirectional I/O port with internal pull-ups. The Port 1 output buffers can
sink/source four TTL inputs. When 1s are written to Port 1 pins, they are pulled high by the
internal pull-ups and can be used as inputs. As inputs, Port 1 pins that are externally being
pulled low will source current (I
Port 1 also receives the low-order address bytes during Flash programming and verification.
Port PinAlternate Functions
P1.5MOSI (used for In-System Programming)
) because of the internal pull-ups.
IL
P1.6MISO (used for In-System Programming)
P1.7SCK (used for In-System Programming)
Port 2Port 2 is an 8-bit bidirectional I/O port with internal pull-ups. The Port 2 output buffers can
sink/source four TTL inputs. When 1s are written to Port 2 pins, they are pulled high by the
internal pull-ups and can be used as inputs. As inputs, Port 2 pins that are externally being
pulled low will source current (I
Port 2 emits the high-order address byte during fetches from external program memory and
during accesses to external data memory that use 16-bit addresses (MOVX @ DPTR). In this
application, Port 2 uses strong internal pull-ups when emitting 1s. During accesses to external
data memory that use 8-bit addresses (MOVX @ RI), Port 2 emits the contents of the P2 Special Function Register.
Port 2 also receives the high-order address bits and some control signals during Flash programming and verification.
) because of the internal pull-ups.
IL
Port 3Port 3 is an 8-bit bidirectional I/O port with internal pull-ups. The Port 3 output buffers can
sink/source four TTL inputs. When 1s are written to Port 3 pins, they are pulled high by the
internal pull-ups and can be used as inputs. As inputs, Port 3 pins that are externally being
pulled low will source current (I
Port 3 receives some control signals for Flash programming and verification.
Port 3 also serves the functions of various special features of the AT89LS51, as shown in the
following table.
) because of the pull-ups.
IL
4
AT89LS51
3053A–8051–05/02
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Port PinAlternate Functions
P3.0RXD (serial input port)
P3.1TXD (serial output port)
AT89LS51
P3.2INT0
P3.3INT1
P3.4T0 (timer 0 external input)
P3.5T1 (timer 1 external input)
P3.6WR
P3.7RD
(external interrupt 0)
(external interrupt 1)
(external data memory write strobe)
(external data memory read strobe)
RSTReset input. A high on this pin for two machine cycles while the oscillator is running resets the
device. This pin drives High for 98 oscillator periods after the Watchdog times out. The DISRTO bit in SFR AUXR (address 8EH) can be used to disable this feature. In the default state
of bit DISRTO, the RESET HIGH out feature is enabled.
ALE/PROGAddress Latch Enable (ALE) is an output pulse for latching the low byte of the address during
accesses to external memory. This pin is also the program pulse input (PROG
programming.
In normal operation, ALE is emitted at a constant rate of 1/6 the oscillator frequency and may
be used for external timing or clocking purposes. Note, however, that one ALE pulse is
skipped during each access to external data memory.
If desired, ALE operation can be disabled by setting bit 0 of SFR location 8EH. With the bit set,
ALE is active only during a MOVX or MOVC instruction. Otherwise, the pin is weakly pulled
high. Setting the ALE-disable bit has no effect if the microcontroller is in external execution
mode.
)duringFlash
PSENProgram Store Enable (PSEN) is the read strobe to external program memory.
When the AT89LS51 is executing code from external program memory, PSEN
twice each machine cycle, except that two PSEN
to external data memory.
activations are skipped during each access
is activated
EA/VPPExternal Access Enable. EA must be strapped to GND in order to enable the device to fetch
code from external program memory locations starting at 0000H up to FFFFH. Note, however,
that if lock bit 1 is programmed, EA
should be strapped to VCCfor internal program executions.
EA
This pin also receives the 12-volt programming enable voltage (V
programming.
will be internally latched on reset.
) during Flash
PP
XTAL1Input to the inverting oscillator amplifier and input to the internal clock operating circuit.
XTAL2Output from the inverting oscillator amplifier
3053A–8051–05/02
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Page 6
Special
Function
Registers
A map of the on-chip memory area called the Special Function Register (SFR) space is shown
in Table 1.
Note that not all of the addresses are occupied, and unoccupied addresses may not be implemented on the chip. Read accesses to these addresses will in general return random data,
and write accesses will have an indeterminate effect.
Table 1 . AT89LS51 SFR Map and Reset Values
0F8H0FFH
0F0H
0E8H0EFH
0E0H
0D8H0DFH
0D0H
0C8H0CFH
0C0H0C7H
0B8H
0B0H
0A8H
0A0H
98H
90H
88H
80H
B
00000000
ACC
00000000
PSW
00000000
IP
XX000000
P3
11111111
IE
0X000000
P2
11111111
SCON
00000000
P1
11111111
TCON
00000000
P0
11111111
SBUF
XXXXXXXX
TMOD
00000000
SP
00000111
AUXR1
XXXXXXX0
TL0
00000000
DP0L
00000000
TL1
00000000
DP0H
00000000
TH0
00000000
DP1L
00000000
TH1
00000000
DP1H
00000000
WDTRST
XXXXXXXX
AUX R
XXX00XX0
PCON
0XXX0000
0F7H
0E7H
0D7H
0BFH
0B7H
0AFH
0A7H
9FH
97H
8FH
87H
6
AT89LS51
3053A–8051–05/02
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AT89LS51
User software should not write 1s to these unlisted locations, since they may be used in future
products to invoke new features. In that case, the reset or inactive values of the new bits will
always be 0.
Interrupt Registers: The individual interrupt enable bits are in the IE register. Two priorities
can be set for each of the five interrupt sources in the IP register.
Table 2 . AUXR: Auxiliary Register
AUXRAddress = 8EHReset Value = XXX00XX0B
Not Bit
Addressable
–––WDIDLEDISRTO––DISALE
Bit 765 432 10
–Reserved for future expansion
DISALEDisable/Enable ALE
DISALE
Operating Mode
0ALE is emitted at a constant rate of 1/6 the oscillator frequency
1ALE is active only during a MOVX or MOVC instruction
DISRTODisable/Enable Reset out
DISRTO
0Reset pin is driven High after WDT times out
1Reset pin is input only
WDIDLEDisable/Enable WDT in IDLE mode
WDIDLE
0WDT continues to count in IDLE mode
1WDT halts counting in IDLE mode
Dual Data Pointer Registers: To facilitate accessing both internal and external data memory,
two banks of 16-bit Data Pointer Registers are provided: DP0 at SFR address locations 82H83H and DP1 at 84H-85H. Bit DPS = 0 in SFR AUXR1 selects DP0 and DPS = 1 selects DP1.
The user should always initialize the DPS bit to the appropriate value before accessing the
respective Data Pointer Register.
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Page 8
Power Off Flag: The Power Off Flag (POF) is located at bit 4 (PCON.4) in the PCON SFR.
POF is set to “1” during power up. It can be set and rest under software control and is not
affected by reset.
Table 3 . AUXR1: Auxiliary Register 1
AUXR1
Address = A2H
Reset Value = XXXXXXX0B
Not Bit
Addressable
–––– – – –DPS
Bit76543210
–Reserved for future expansion
DPSData Pointer Register Select
DPS
0Selects DPTR Registers DP0L, DP0H
1Selects DPTR Registers DP1L, DP1H
Memory
Organization
MCS-51 devices have a separate address space for Program and Data Memory. Up to 64K
bytes each of external Program and Data Memory can be addressed.
Program MemoryIf the EA pin is connected to GND, all program fetches are directed to external memory.
On the AT89LS51, if EA
FFFH are directed to internal memory and fetches to addresses 1000H through FFFFH are
directed to external memory.
is connected to VCC, program fetches to addresses 0000H through
Data MemoryThe AT89LS51 implements 128 bytes of on-chip RAM. The 128 bytes are accessible via direct
and indirect addressing modes. Stack operations are examples of indirect addressing, so the
128 bytes of data RAM are available as stack space.
Watchdog
Timer
(One-time
Enabled with
Reset-out)
The WDT is intended as a recovery method in situations where the CPU may be subjected to
software upsets. The WDT consists of a 14-bit counter and the Watchdog Timer Reset
(WDTRST) SFR. The WDT is defaulted to disable from exiting reset. To enable the WDT, a
user must write 01EH and 0E1H in sequence to the WDTRST register (SFR location 0A6H).
When the WDT is enabled, it will increment every machine cycle while the oscillator is running.
The WDT timeout period is dependent on the external clock frequency. There is no way to disable the WDT except through reset (either hardware reset or WDT overflow reset). When
WDT overflows, it will drive an output RESET HIGH pulse at the RST pin.
Using the WDTTo enable the WDT, a user must write 01EH and 0E1H in sequence to the WDTRST register
(SFR location 0A6H). When the WDT is enabled, the user needs to service it by writing 01EH
and 0E1H to WDTRST to avoid a WDT overflow. The 14-bit counter overflows when it reaches
16383 (3FFFH), and this will reset the device. When the WDT is enabled, it will increment
every machine cycle while the oscillator is running. This means the user must reset the WDT
at least every 16383 machine cycles. To reset the WDT the user must write 01EH and 0E1H
to WDTRST. WDTRST is a write-only register. The WDT counter cannot be read or written.
When WDT overflows, it will generate an output RESET pulse at the RST pin. The RESET
8
AT89LS51
3053A–8051–05/02
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AT89LS51
pulse duration is 98xTOSC, where TOSC=1/FOSC. To make the best use of the WDT, it
should be serviced in those sections of code that will periodically be executed within the time
required to prevent a WDT reset.
WDT During
Power-down
and Idle
In Power-down mode the oscillator stops, which means the WDT also stops. While in Powerdown mode, the user does not need to service the WDT. There are two methods of exiting
Power-down mode: by a hardware reset or via a level-activated external interrupt, which is
enabled prior to entering Power-down mode. When Power-down is exited with hardware reset,
servicing the WDT should occur as it normally does whenever the AT89LS51 is reset. Exiting
Power-down with an interrupt is significantly different. The interrupt is held low long enough for
the oscillator to stabilize. When the interrupt is brought high, the interrupt is serviced. To prevent the WDT from resetting the device while the interrupt pin is held low, the WDT is not
started until the interrupt is pulled high. It is suggested that the WDT be reset during the interrupt service for the interrupt used to exit Power-down mode.
To ensure that the WDT does not overflow within a few states of exiting Power-down, it is best
to reset the WDT just before entering Power-down mode.
Before going into the IDLE mode, the WDIDLE bit in SFR AUXR is used to determine whether
the WDT continues to count if enabled. The WDT keeps counting during IDLE (WDIDLE bit =
0) as the default state. To prevent the WDT from resetting the AT89LS51 while in IDLE mode,
the user should always set up a timer that will periodically exit IDLE, service the WDT, and
reenter IDLE mode.
With WDIDLE bit enabled, the WDT will stop to count in IDLE mode and resumes the count
upon exit from IDLE.
UARTThe UART in the AT89LS51 operates the same way as the UART in the AT89C51. For further
information on the UART operation, refer to the ATMEL Web site (http://www.atmel.com).
From the home page, select ‘Products’, then ‘8051-Architecture Flash Microcontroller’, then
‘Product Overview’.
Timer 0 and 1Timer 0 and Timer 1 in the AT89LS51 operate the same way as Timer 0 and Timer 1 in the
AT89C51. For further information on the timers’ operation, refer to the ATMEL Web site
(http://www.atmel.com). From the home page, select ‘Products’, then ‘8051-Architecture Flash
Microcontroller’, then ‘Product Overview’.
InterruptsThe AT89LS51 has a total of five interrupt vectors: two external interrupts (INT0 and INT1),
two timer interrupts (Timers 0 and 1), and the serial port interrupt. These interrupts are all
shown in Figure 1.
Each of these interrupt sources can be individually enabled or disabled by setting or clearing a
bit in Special Function Register IE. IE also contains a global disable bit, EA, which disables all
interrupts at once.
Note that Table 4 shows that bit position IE.6 is unimplemented. In the AT89LS51, bit position
IE.5 is also unimplemented. User software should not write 1s to these bit positions, since they
may be used in future AT89 products.
The Timer 0 and Timer 1 flags, TF0 and TF1, are set at S5P2 of the cycle in which the timers
overflow. The values are then polled by the circuitry in the next cycle.
3053A–8051–05/02
9
Page 10
.
Table 4 . Interrupt Enable (IE) Register
(MSB)(LSB)
EA––ESET1EX1ET0EX0
Enable Bit = 1 enables the interrupt.
Enable Bit = 0 disables the interrupt.
SymbolPositionFunction
EAIE.7Disables all interrupts. If EA = 0, no interrupt is
acknowledged. If EA = 1, each interrupt source is
individually enabled or disabled by setting or clearing
its enable bit.
–IE.6Reserved
–IE.5Reserved
ESIE.4Serial Port interrupt enable bit
ET1IE.3Timer 1 interrupt enable bit
EX1IE.2External interrupt 1 enable bit
ET0IE.1Timer 0 interrupt enable bit
EX0IE.0External interrupt 0 enable bit
User software should never write 1s to reserved bits, because they may be used in future AT89
products.
Figure 1. Interrupt Sources
INT0
TF0
INT1
TF1
RI
0
1
0
1
TI
IE0
IE1
10
AT89LS51
3053A–8051–05/02
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AT89LS51
Oscillator
Characteristics
XTAL1 and XTAL2 are the input and output, respectively, of an inverting amplifier that can be
configured for use as an on-chip oscillator, as shown in Figure 2. Either a quartz crystal or
ceramic resonator may be used. To drive the device from an external clock source, XTAL2
should be left unconnected while XTAL1 is driven, as shown in Figure 3. There are no requirements on the duty cycle of the external clock signal, since the input to the internal clocking
circuitry is through a divide-by-two flip-flop, but minimum and maximum voltage high and low
time specifications must be observed.
Figure 2. Oscillator Connections
C2
C1
Note:C1, C2 = 30 pF ± 10 pF for Crystals
=40pF± 10 pF for Ceramic Resonators
XTAL2
XTAL1
GND
Figure 3. External Clock Drive Configuration
NC
EXTERNAL
OSCILLATOR
SIGNAL
XTAL2
XTAL1
GND
Idle ModeIn idle mode, the CPU puts itself to sleep while all the on-chip peripherals remain active. The
mode is invoked by software. The content of the on-chip RAM and all the special function registers remain unchanged during this mode. The idle mode can be terminated by any enabled
interrupt or by a hardware reset.
Note that when idle mode is terminated by a hardware reset, the device normally resumes program execution from where it left off, up to two machine cycles before the internal reset
algorithm takes control. On-chip hardware inhibits access to internal RAM in this event, but
access to the port pins is not inhibited. To eliminate the possibility of an unexpected write to a
port pin when idle mode is terminated by a reset, the instruction following the one that invokes
idle mode should not write to a port pin or to external memory.
Power-down
Mode
In the Power-down mode, the oscillator is stopped, and the instruction that invokes Powerdown is the last instruction executed. The on-chip RAM and Special Function Registers retain
their values until the Power-down mode is terminated. Exit from Power-down mode can be initiated either by a hardware reset or by activation of an enabled external interrupt (INT0
INT1)
. Reset redefines the SFRs but does not change the on-chip RAM. The reset should not
be activated before V
is restored to its normal operating level and must be held active long
CC
or
enough to allow the oscillator to restart and stabilize.
3053A–8051–05/02
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Page 12
Table 5 . Status of External Pins During Idle and Power-down Modes
ModeProgram MemoryALEPSENPORT0PORT1PORT2PORT3
IdleInternal11DataDataDataData
IdleExternal11FloatDataAddressData
Power-downInternal00DataDataDataData
Power-downExternal00FloatDataDataData
Program
Memory Lock
Bits
Programming
the Flash –
Parallel Mode
The AT89LS51 has three lock bits that can be left unprogrammed (U) or can be programmed
(P) to obtain the additional features listed in the following table.
Table 6 . Lock Bit Protection Modes
Program Lock Bits
LB1LB2LB3Protection Type
1UUUNo program lock features
2PUUMOVC instructions executed from external program memory
are disabled from fetching code bytes from internal memory,
EA
is sampled and latched on reset, and further
programming of the Flash memory is disabled
3PPUSame as mode 2, but verify is also disabled
4PPPSame as mode 3, but external execution is also disabled
When lock bit 1 is programmed, the logic level at the EA
reset. If the device is powered up without a reset, the latch initializes to a random value and
holds that value until reset is activated. The latched value of EA
logic level at that pin in order for the device to function properly.
The AT89LS51 is shipped with the on-chip Flash memory array ready to be programmed. The
programming interface needs a high-voltage (12-volt) program enable signal and is compatible with conventional third-party Flash or EPROM programmers.
The AT89LS51 code memory array is programmed byte-by-byte.
pin is sampled and latched during
must agree with the current
12
AT89LS51
Programming Algorithm: Before programming the AT89LS51, the address, data, and control
signals should be set up according to the Flash programming mode table and Figure 4 and
Figure 5. To program the AT89LS51, take the following steps:
1. Input the desired memory location on the address lines.
2. Input the appropriate data byte on the data lines.
3. Activate the correct combination of control signals.
4. Raise EA
5. Pulse ALE/PROG
write cycle is self-timed and typically takes no more than 50 µs. Repeat steps 1
through 5, changing the address and data for the entire array or until the end of the
object file is reached.
Data
Polling: The AT89LS51 features Data Polling to indicate the end of a byte write cycle.
During a write cycle, an attempted read of the last byte written will result in the complement of
the written data on P0.7. Once the write cycle has been completed, true data is valid on all outputs,andthenextcyclemaybegin.Data
been initiated.
Polling may begin any time after a write cycle has
3053A–8051–05/02
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AT89LS51
Ready/Busy: The progress of byte programming can also be monitored by the RDY/BSY out-
put signal. P3.0 is pulled low after ALE goes high during programming to indicate BUSY
is pulled high again when programming is done to indicate READY.
Program Verify: If lock bits LB1 and LB2 have not been programmed, the programmed code
data can be read back via the address and data lines for verification. The status of the indi-
vidual lock bits can be verified directly by reading them back.
Reading the Signature Bytes: The signature bytes are read by the same procedure as a nor-
mal verification of locations 000H, 100H, and 200H, except that P3.6 and P3.7 must be pulled
to a logic low. The values returned are as follows.
Chip Erase: In the parallel programming mode, a chip erase operation is initiated by using the
proper combination of control signals and by pulsing ALE/PROG
500 ns.
In the serial programming mode, a chip erase operation is initiated by issuing the Chip Erase
instruction. In this mode, chip erase is self-timed and takes about 500 ms.
During chip erase, a serial read from any address location will return 00H at the data output.
low for a duration of 200 ns -
.P3.0
Programming
the Flash –
Serial Mode
Serial
Programming
Algorithm
The Code memory array can be programmed using the serial ISP interface while RST is
pulled to V
RST is set high, the Programming Enable instruction needs to be executed first before other
operations can be executed. Before a reprogramming sequence can occur, a Chip Erase
operation is required.
The Chip Erase operation turns the content of every memory location in the Code array into
FFH.
Either an external system clock can be supplied at pin XTAL1 or a crystal needs to be connected across pins XTAL1 and XTAL2. The maximum serial clock (SCK) frequency should be
less than 1/16 of the crystal frequency. With a 16 MHz oscillator clock, the maximum SCK frequency is 1 MHz.
To program and verify the AT89LS51 in the serial programming mode, the following sequence
is recommended:
1. Power-up sequence:
Apply power between VCC and GND pins.
Set RST pin to “H”.
If a crystal is not connected across pins XTAL1 and XTAL2, apply a 3 MHz to 16 MHz
clock to XTAL1 pin and wait for at least 10 milliseconds.
2. Enable serial programming by sending the Programming Enable serial instruction to
pin MOSI/P1.5. The frequency of the shift clock supplied at pin SCK/P1.7 needs to be
less than the CPU clock at XTAL1 divided by 16.
3. The Code array is programmed one byte at a time in either the Byte or Page mode. The
write cycle is self-timed and typically takes less than 1 ms at 2.7V.
4. Any memory location can be verified by using the Read instruction that returns the content at the selected address at serial output MISO/P1.6.
5. At the end of a programming session, RST can be set low to commence normal device
operation.
. The serial interface consists of pins SCK, MOSI (input) and MISO (output). After
CC
3053A–8051–05/02
13
Page 14
Power-off sequence (if needed):
Set XTAL1 to “L” (if a crystal is not used).
Set RST to “L”.
Turn V
Polling: The Data Polling feature is also available in the serial mode. In this mode, dur-
Data
power off.
CC
ing a write cycle an attempted read of the last byte written will result in the complement of the
MSB of the serial output byte on MISO.
Serial
The Instruction Set for Serial Programming follows a 4-byte protocol and is shown in Table 8.
Programming
Instruction Set
Programming
Interface –
Parallel Mode
Table 7 . Flash Programming Modes
ModeV
WriteCodeData5VHL
Read Code Data5VHLHHLLLHHD
Write Lock Bit 15VHL
Write Lock Bit 25VHL
Write Lock Bit 35VHL
CC
Every code byte in the Flash array can be programmed by using the appropriate combination
of control signals. The write operation cycle is self-timed and once initiated, will automatically
time itself to completion.
Most major worldwide programming vendors offer support for the Atmel microcontroller series.
Please contact your local programming vendor for the appropriate software revision.
RSTPSEN
ALE/
PROG
EA/
V
(2)
12V L HHHH DINA11-8A7-0
(3)
12VHHHHH XXX
(3)
12VHHHLLXXX
(3)
12VHLHHLXXX
P2.6P2.7P3.3P3.6P3.7
PP
P0.7-0
Data
OUT
P2.3-0P1.7-0
Address
A11-8A7-0
Read Lock Bits
1, 2, 3
Chip Erase5VHL
ReadAtmelID 5VH L H H LLLLL 1EH 000000H
ReadDeviceID5VH L H H LLLLL 61H 000100H
ReadDeviceID5VH L H H LLLLL 06H 001000H
5VHLHHHHLHL
(1)
12VHLHLLXXX
P0.2,
P0.3,
P0.4
XX
Notes: 1. Each PROG pulse is 200 ns - 500 ns for Chip Erase.
2. Each PROG
3. Each PROG
4. RDY/BSY
pulse is 200 ns - 500 ns for Write Code Data.
pulse is 200 ns - 500 ns for Write Lock Bits.
signal is output on P3.0 during programming.
5. X = don’t care.
14
AT89LS51
3053A–8051–05/02
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Figure 4. Programming the Flash Memory (Parallel Mode)
AT89S51
P1.0-P1.7
P2.0 - P2.3
P2.6
P2.7
P3.3
P3.6
P3.7
XTAL2EA
V
ALE
CC
P0
ADDR.
0000H/FFFH
SEE FLASH
PROGRAMMING
MODES TABLE
A0 - A7
A8 - A11
4.5V - 5.5V
PGM
DATA
PROG
V/V
AT89LS51
IH PP
3 - 16 MHz
1
XTAL
GND
Figure 5. Verifying the Flash Memory (Parallel Mode)
AT89S51
ADDR.
0000H/FFFH
SEE FLASH
PROGRAMMING
MODES TABLE
3 - 16 MHz
A0 - A7
A8 - A11
P1.0-P1.7
P2.0 - P2.3
P2.6
P2.7
P3.3
P3.6
P3.7
XTAL 2EA
XTAL1
GND
P3.0
RST
PSEN
V
ALE
RST
PSEN
CC
P0
V
4.5V - 5.5V
PGM DATA
(USE 10K
PULLUPS)
RDY/
BSY
IH
V
IH
V
IH
3053A–8051–05/02
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Page 16
Flash Programming and Verification Characteristics (Parallel Mode)
TA= 20°C to 30°C, VCC= 4.5 to 5.5V
SymbolParameterMinMaxUnits
V
PP
I
PP
I
CC
1/t
t
AVGL
t
GHAX
t
DVG L
t
GHDX
t
EHSH
t
SHGL
t
GHSL
t
GLGH
t
AVQ V
t
ELQV
t
EHQZ
t
GHBL
t
WC
CLCL
Programming Supply Voltage11.512.5V
Programming Supply Current10mA
VCCSupply Current30mA
Oscillator Frequency316MHz
Address Setup to PROG Low48t
Address Hold After PROG48t
Data Setup to PROG Low48t
Data Hold After PROG48t
P2.7 (ENABLE)HightoV
PP
48t
CLCL
CLCL
CLCL
CLCL
CLCL
VPPSetup to PROG Low10µs
VPPHold After PROG10µs
PROG Width0.21µs
Address to Data Valid48t
ENABLE Low to Data Valid48t
Data Float After ENABLE048t
CLCL
CLCL
CLCL
PROG High to BUSY Low1.0µs
Byte Write Cycle Time50µs
Figure 6. Flash Programming and Verification Waveforms – Parallel Mode
P1.0 - P1.7
P2.0 - P2.3
PORT 0
ALE/PROG
EA/V
PP
P2.7
(ENABLE)
P3.0
(RDY/BSY)
t
AVGL
t
SHGL
PROGRAMMING
ADDRESS
DATA I N
V
t
EHSH
t
PP
DVG L
t
GLGH
t
GHBL
t
GHDX
t
t
ELQV
GHAX
t
GHSL
LOGIC 1
LOGIC 0
BUSY
t
WC
VERIFICATION
ADDRESS
t
AVQV
DATA OUT
READY
t
EHQZ
16
AT89LS51
3053A–8051–05/02
Page 17
Figure 7. Flash Memory Serial Downloading
AT89LS51
AT89LS51
V
CC
V
CC
INSTRUCTION
INPUT
DATA OUTPUT
CLOCK IN
3 - 16 MHz
P1.5/MOSI
P1.6/MISO
P1.7/SCK
XTAL2
GND
RSTXTAL1
V
IH
Flash Programming and Verification Waveforms – Serial Mode
→ Mode 2, lock bit 1 activated
→ Mode 3, lock bit 2 activated
→ Mode 4, lock bit 3 activated
A11
A10
A11
A10
A11
A11
A10
A11
A10
A9
A8
A9
A8
B2
B1
A10A9A8
A8
A9
A9
A8
A7
}
A7
A6A5A4A3A2A1A0
A6A5A4A3A2A1A0
A7
Each of the lock bit modes needs to be activated sequentially
before Mode 4 can be executed.
D7
D6
D5
D4
D7
D6
D5D4D3
LB3
Byte 255
Byte 255
D3D2D1
D2
LB1
LB2
D1
Enable Serial Programming
while RST is high
array
D0
memory in the byte mode
D0
memory in the byte mode
thelockbits(aprogrammed
lock bit reads back as a “1”)
Read data from Program
memory in the Page Mode
(256 bytes)
Write data to Program
memory in the Page Mode
(256 bytes)
18
After Reset signal is high, SCK should be low for at least 64 system clocks before it goes high to clock in the enable data
bytes. No pulsing of Reset signal is necessary. SCK should be no faster than 1/16 of the system clock at XTAL1.
For Page Read/Write, the data always starts from byte 0 to 255. After the command byte and upper address byte are
latched, each byte thereafter is treated as data until all 256 bytes are shifted in/out. Then the next instruction will be ready to
be decoded.
Operating Temperature .................................. -55°C to +125°C
Storage Temperature ..................................... -65°C to +150°C
Voltage on Any Pin
with Respect to Ground ..................................... -1.0V to +7.0V
Maximum Operating Voltage ............................................ 6.6V
DC Output Current ...................................................... 15.0 mA
*NOTICE:Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability.
DC Characteristics
The values shown in this table are valid for TA= -40°C to 85°C and VCC= 2.7V to 4.0V, unless otherwise noted.
SymbolParameterConditionMinMaxUnits
V
IL
V
IL1
V
IH
V
IH1
V
OL
V
OL1
V
OH
V
OH1
I
IL
I
TL
I
LI
RRSTReset Pulldown Resistor50300KΩ
C
IO
I
CC
Notes: 1. Under steady state (non-transient) conditions, IOLmust be externally limited as follows:
2. Minimum V
Input Low Voltage(Except EA)-0.50.7V
Input Low Voltage (EA)-0.50.2V
-0.3V
CC
Input High Voltage(Except XTAL1, RST)0.2 VCC+0.9VCC+0.5V
Input High Voltage(XTAL1, RST)0.7 V
Output Low Voltage
1,2,3)I
Output Low Voltage
(Port 0, ALE, PSEN)I
Output High Voltage
(Ports 1,2,3, ALE, PSEN
Output High Voltage
(Port 0 in External Bus Mode)
(1)
(1)
(Ports
)
=0.8mA
OL
=1.6mA
OL
I
= -60 µA2.4V
OH
= -25 µA0.75 V
I
OH
I
= -10 µA0.9 V
OH
I
= -800 µA2.4V
OH
= -300 µA0.75 V
I
OH
I
= -80 µA0.9 V
OH
Logical 0 Input Current (Ports
1,2,3)V
=0.45V
IN
Logical 1 to 0 Transition Current
(Ports 1,2,3)V
IN
=2V
Input Leakage Current (Port 0,
EA
)0.45<V
IN<VCC
CC
CC
CC
CC
CC
VCC+0.5V
0.45V
0.45V
-50µA
-650µA
±10µA
Pin CapacitanceTest Freq. = 1 MHz, TA=25°C10pF
Active Mode, 12 MHz25mA
Power Supply Current
Power-down Mode
Maximum I
Maximum I
perportpin:10mA
OL
per 8-bit port:
OL
(2)
Idle Mode, 12 MHz6.5mA
VCC=4.0V30µA
Port0:26mAPorts1,2,3:15mA
Maximum total I
If I
exceeds the test condition, VOLmay exceed the related specification. Pins are not guaranteed to sink current greater
OL
for all output pins: 71 mA
OL
than the listed test conditions.
for Power-down is 2V.
CC
V
V
V
V
20
AT89LS51
3053A–8051–05/02
Page 21
AT89LS51
AC Characteristics
Under operating conditions, load capacitance for Port 0, ALE/PROG, and PSEN = 100 pF; load capacitance for all other
outputs = 80 pF.
External Program and Data Memory Characteristics
16 MHz OscillatorVariable Oscillator
SymbolParameter
UnitsMinMaxMinMax
1/t
t
LHLL
t
AVLL
t
LLAX
t
LLIV
t
LLPL
t
PLPH
t
PLIV
t
PXIX
t
PXIZ
t
PXAV
t
AVI V
t
PLAZ
t
RLRH
t
WLWH
t
RLDV
t
RHDX
t
RHDZ
t
LLDV
t
AVDV
t
LLWL
t
AVWL
t
QVWX
t
QVWH
t
WHQX
t
RLAZ
t
WHLH
CLCL
Oscillator Frequency016MHz
ALE Pulse Width852t
Address Valid to ALE Low22t
Address Hold After ALE Low32t
ALE Low to Valid Instruction In1504t
ALE Low to PSEN Low32t
PSEN Pulse Width1423t
PSEN Low to Valid Instruction In823t
-40ns
CLCL
-40ns
CLCL
-30ns
CLCL
-100ns
CLCL
-30ns
CLCL
-45ns
CLCL
-105ns
CLCL
Input Instruction Hold After PSEN00ns
Input Instruction Float After PSEN37t
PSEN to Address Valid75t
-8ns
CLCL
Address to Valid Instruction In2075t
-25ns
CLCL
-105ns
CLCL
PSEN Low to Address Float1010ns
RD Pulse Width2756t
WR Pulse Width2756t
RD Low to Valid Data In1475t
-100ns
CLCL
-100ns
CLCL
-165ns
CLCL
Data Hold After RD00ns
Data Float After RD652t
ALE Low to Valid Data In3508t
Address to Valid Data In3979t
ALE Low to RD or WR Low1372393t
Address to RD or WR Low1224t
Data Valid to WR Transition13t
Data Valid to WR High2877t
Data Hold After WR13t
-503t
CLCL
-130ns
CLCL
-50ns
CLCL
-150ns
CLCL
-50ns
CLCL
-60ns
CLCL
-150ns
CLCL
-165ns
CLCL
+50ns
CLCL
RD Low to Address Float00ns
RD or WR High to ALE High23103t
-40t
CLCL
+40ns
CLCL
3053A–8051–05/02
21
Page 22
External Program Memory Read Cycle
t
LHLL
ALE
t
AVLL
t
LLPL
PSEN
t
LLAX
PORT 0
A0 - A7A0 - A7
t
AVIV
PORT 2
External Data Memory Read Cycle
t
LHLL
ALE
t
PLAZ
A8 - A15
t
LLIV
t
PLIV
t
PXIZ
t
PXIX
INSTR IN
t
PLPH
t
PXAV
t
A8 - A15
WHLH
PSEN
RD
PORT 0
PORT 2
t
LLDV
t
LLWL
t
LLAX
t
AVLL
A0 - A7 FROM RI OR DPL
t
AVWL
P2.0 - P2.7 OR A8 - A15 FROM DPH
t
AVDV
t
RLAZ
t
RLRH
t
RLDV
DATA ININSTR IN
t
RHDZ
t
RHDX
A0 - A7 FROM PCL
A8 - A15 FROM PCH
22
AT89LS51
3053A–8051–05/02
Page 23
External Data Memory Write Cycle
t
LHLL
ALE
PSEN
t
LLWL
t
WLWH
t
WHLH
AT89LS51
WR
t
AVLL
PORT 0
PORT 2
A0 - A7 FROM RI OR DPL
t
AVWL
P2.0 - P2.7 OR A8 - A15 FROM DPH
External Clock Drive Waveforms
t
0.7 V
CC
CHCX
CC
0.45V
V - 0.5V
CC
0.2 V - 0.1V
External Clock Drive
t
LLAX
t
QVWX
t
t
QVWH
DATA OUTINSTR IN
t
CLCH
t
CLCX
WHQX
A0 - A7 FROM PCL
A8 - A15 FROM PCH
t
CHCX
t
CLCL
t
CHCL
SymbolParameterMinMaxUnits
1/t
CLCL
t
CLCL
t
CHCX
t
CLCX
t
CLCH
t
CHCL
3053A–8051–05/02
Oscillator Frequency016MHz
Clock Period62.5ns
High Time20ns
Low Time20ns
Rise Time20ns
Fall Time20ns
23
Page 24
Serial Port Timing: Shift Register Mode Test Conditions
The values in this table are valid for VCC= 2.7V to 4.0V and Load Capacitance = 80 pF.
12 MHz OscVariable Oscillator
SymbolParameter
t
XLXL
t
QVXH
t
XHQX
t
XHDX
t
XHDV
Serial Port Clock Cycle Time1.012t
Output Data Setup to Clock Rising Edge70010t
Output Data Hold After Clock Rising Edge502t
Input Data Hold After Clock Rising Edge00ns
Clock Rising Edge to Input Data Valid70010t
Shift Register Mode Timing Waveforms
INSTRUCTION
ALE
CLOCK
WRITE TO SBUF
OUTPUT DATA
CLEAR RI
INPUT DATA
AC Testing Input/Output Waveforms
0
t
QVXH
1
t
XHDV
2
t
XLXL
t
XHQX
0
VALIDVALIDVALIDVALIDVALIDVALIDVALIDVALID
1
(1)
UnitsMinMaxMinMax
CLCL
-133ns
CLCL
-80ns
CLCL
-133ns
CLCL
3
2
t
XHDX
4
5
3
6
4
7
5
8
6
7
SET TI
SET RI
µs
V - 0.5V
CC
0.45V
0.2 V + 0.9V
CC
TEST POINTS
0.2 V - 0.1V
CC
Note:1. AC Inputs during testing are driven at VCC- 0.5V for a logic 1 and 0.45V for a logic 0. Timing measurements are made at V
min. for a logic 1 and VILmax. for a logic 0.
Float Waveforms
(1)
V
LOAD
V
V
LOAD
LOAD
+ 0.1V
- 0.1V
Timing Reference
Points
- 0.1V
V
OL
+ 0.1V
V
OL
Note:1. For timing purposes, a port pin is no longer floating when a 100 mV change from load voltage occurs. A port pin begins to
Notes:1. This package conforms to JEDEC reference MS-026, Variation ACB.
2. Dimensions D1 and E1 do not include mold protrusion. Allowable
protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum
plastic body size dimensions including mold mismatch.
3. Lead coplanarity is 0.10 mm maximum.
A2A
SYMBOL
COMMON DIMENSIONS
(Unit of Measure = mm)
MIN
A––1.20
A10.05–0.15
A2 0.951.001.05
D11.7512.0012.25
D19.9010.0010.10Note 2
E11.7512.0012.25
E19.9010.0010.10Note 2
B 0.30–0.45
C0.09–0.20
L0.45– 0.75
e0.80 TYP
NOM
MAX
NOTE
26
2325 Orchard Parkway
R
San Jose, CA 95131
AT89LS51
TITLE
44A, 44-lead, 10 x 10 mm Body Size, 1.0 mm Body Thickness,
0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP)
10/5/2001
DRAWING NO.
44A
3053A–8051–05/02
REV.
B
Page 27
44J–PLCC
AT89LS51
1.14(0.045) X 45˚
B
e
0.51(0.020)MAX
45˚ MAX (3X)
Notes:1. This package conforms to JEDEC reference MS-018, Variation AC.
2. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is .010"(0.254 mm) per side. Dimension D1
and E1 include mold mismatch and are measured at the extreme
material condition at the upper or lower parting line.
Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard warranty
which is detailed in Atmel’s Terms and Conditions located on the Company’s web site. The Company assumes no responsibility for any errors
which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does
not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are granted
by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel’s products are not authorized for use as critical
components in life support devices or systems.
AT ME L®is the registered trademark of Atmel.
MCS-51
trademarks of others.
®
is the registered trademark of Intel Corporation. Terms and product names in this document may be
Printed on recycled paper.
3053A–8051–05/02xM
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