Rainbow Electronics AT77C102B User Manual
1. Features
• Sensitive Layer Over a 0.35 µm CMOS Array
• Image Zone: 0.4 x 14 mm = 0.02" x 0.55"
• Image Array: 8 x 280 = 2240 pixels
• Pixel Pitch: 50 µm x 50 µm = 500 dpi
• Pixel Clock: up to 2 MHz Enabling up to 1780 Frames per Second
• Die Size: 1.64 x 17.46 mm
• Operating Voltage: 3V to 3.6V
• Naturally Protected Against ESD: > 16 kV Air Discharge
• Power Consumption: 16 mW at 3.3V, 1 MHz, 25°C
• Operating Temperature Range: -40°C to +85°C
• Chip-on-Board (COB), Chip-on-Board (COB) with Connector
• Complies With the European Directive for Restriction of Hazardous Substances
(RoHS Directive)
2. Applications
• PDA (Access Control, Data Protection)
• Notebook, PC-add on (Access Control, e-business)
• PIN Code Replacement
• Automated Teller Machines, POS
• Building Access
• Electronic Keys (Cars, Home)
• Portable Fingerprint Imaging for Law Enforcement
• TV Access
Thermal
Fingerprint
Sensor with
0.4 mm x 14 mm
(0.02" x 0.55")
Sensing Area
and
Digital Output
(On-chip ADC)
Figure 2-1. FingerChip® Packages
Chip-on-board Package
with Connector
Chip-on-board Package
Actual size
AT77C102B
FingerChip®
(COB)
Rev. 5364A–BIOM–09/05
Table 2-1. Pin Description for Chip-on-Board Package: AT77C102B-CB01YV
Pin Number Name Type
1GNDGND
2 AVE Analog output
3 AVO Analog output
4TPPPower
5 TPE Digital input
6VCCPower
7GNDGND
8 RST Digital input
9 PCLK Digital input
10 OE Digital input
11 ACKN Digital output
12 De0 Digital output
13 Do0 Digital output
14 De1 Digital output
15 Do1 Digital output
16 De2 Digital output
17 Do2 Digital output
18 De3 Digital output
19 Do3 Digital output
20 FPL GND
21 GND GND
The die attach is connected to pins 1, 7 and 21, and must be grounded. The FPL pin must be
grounded.
GND
AVE
AVO
TPP
TPE
VCC
GND
RST
PCLK
OE
ACKN
De0
Do0
De1
Do1
De2
Do2
De3
Do3
FPL
GND
2
AT77C102B
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
5364A–BIOM–09/05
AT77C102B
Table 2-2. Pin Description for COB with Connector Package: AT77C102B-CB02YV
Pin Number Name Type
1FPLGND
2 Not connected
3 Not connected
4 DE3 Digital output
5 DO3 Digital output
6 DE2 Digital output
7 DO2 Digital output
8 DE1 Digital output
9 DO1 Digital output
10 DE0 Digital output
11 DO0 Digital output
12 AVE Analog output
13 AVO Analog output
14 TPP Power
15 TPE Digital input
16 VCC Power
17 GND GND
(1)
18 RST Digital input
19 PCLK Digital input
20 OE Digital input
21 ACKN Digital output
Note: 1. Ref. Connector: FH18-21S-0.3SHW (HIROSE).
5364A–BIOM–09/05
3
Figure 2-2. COB with Flex
(1)
Flex with metallizations up
Flex with metallizations down
Figure 2-3. Flex Output Side
1
3
Note: 1. Flex is not provided by Atmel.
(FingerChip Connector Side)
Flex Output
Metallizations Up
2
4
AT77C102B
5364A–BIOM–09/05
3. Description
AT77C102B
The AT77C102B is part of the Atmel FingerChip monolithic fingerprint sensor family for which no
optics, no prism and no light source are required.
The AT77C102B is a single-chip, high-performance, low-cost sensor based on temperature
physical effects for fingerprint sensing.
The AT77C102B has a linear shape, which captures a fingerprint image by sweeping the finger
across the sensing area. After capturing several images, Atmel proprietary software can reconstruct a full 8-bit fingerprint image.
The AT77C102B has a small surface combined with CMOS technology, and a Chip-on-Board
package assembly. These facts contribute to a low-cost device.
The device delivers a programmable number of images per second, while an integrated analogto-digital converter delivers a digital signal adapted to interfaces such as an EPP parallel port, a
USB microcontroller or directly to microprocessors. No frame grabber or glue interface is therefore necessary to send the frames. These facts make AT77C102B an easy device to include in
any system for identification or verification applications.
Table 3-1. Absolute Maximum Ratings
()
Parameter Symbol Comments Value
Positive supply voltage V
Temperature stabilization
power
CC
TPP GND to 4.6
Front plane FPL GND to V
Digital input voltage RST PCLK GND to V
Storage temperature T
Lead temperature
(soldering, 10 seconds)
T
stg
leads
Do not solder Forbidden
GND to 4.6 Note: Stresses beyond those listed
under “Absolute Maximum Ratings”
may cause permanent damage to the
device. These are stress ratings only
CC
CC
-50 to +95
+0.5
+0.5
and functional operation of the device at
these or any other conditions beyond
those indicated in the operational
sections of this specification is not
implied. Exposure to absolute
maximum rating conditions for extended
periods may affect device reliability.
Table 3-2. Recommended Conditions Of Use
Parameter Symbol Comments Min Typ Max Unit
Positive supply voltage V
CC
Front plane FPL Must be grounded GND V
Digital input voltage CMOS levels V
Digital output voltage CMOS levels V
Digital load C
Analog load
Operating temperature range T
C
R
amb
L
A
A
Not connected
V grade -40°C to +85°C°C
Maximum current on TPP ITPP 0 100 mA
3V 3.3V 3.6V V
50 pF
pF
kΩ
5364A–BIOM–09/05
5
Table 3-3. Resistance
Parameter Min Value Standard Method
ESD
On pins. HBM (Human Body Model) CMOS I/O 2 kV MIL-STD-883 - method 3015.7
On die surface (Zapgun)
Air discharge
Mechanical Abrasion
Number of cycles without lubricant multiply by an estimated factor
of 20 for correlation with a real finger
Chemical Resistance
Cleaning agent, acid, grease, alcohol, diluted acetone 4 hours Internal method
±16 kV
200 000 MIL E 12397B
NF EN 6100-4-2
Table 3-4. Specifications
Explanation Of Test Levels
I 100% production tested at +25°C
II 100% production tested at +25°C, and sample tested at specified temperatures (AC testing done on sample)
III Sample tested only
IV Parameter is guaranteed by design and/or characterization testing
V Parameter is a typical value only
VI 100% production tested at temperature extremes
D 100% probe tested on wafer at T
= +25°C
amb
Table 3-5. Physical Parameter
Parameter Test Level Min Typ Max Unit
Resolution IV 50 µm
Size IV 8 x 280 Pixel
Yield: number of bad pixels I 5 Bad pixels
Equivalent resistance on TPP pin I 20 30 47 Ω
6
AT77C102B
5364A–BIOM–09/05
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