HIGH-RELIABILITY LVPECL OR LVDS MINIATURE CLOCK OSCILLATORS
Description
Q-Tech’s surface-mount QT93 series oscillators consist of
a 2.5Vdc and 3.3Vdc differential PECL or LVDS output
oscillator IC and a round AT high-precision quartz crystal
built in a rugged surface-mount ceramic miniature
package. It was designed to be replaceable and
retrofitable into the footprint of a 7 x 5mm COTS
LVPECL or LVDS oscillator.
Frequency stability vs. temperature codes may not be available in all frequencies.
For Non-Standard requirements, contact Q-Tech Corporation at Sales@Q-Tech.com
Packaging OptionsOther Options Available For An Additional Charge
• Standard packaging in anti-static plastic tube (60pcs/tube)
• Tape and Reel (800pcs/reel) is available for an additional
charge.
Specifications subject to change without prior notice.
Q-T ECH Co rpo rat ion - 1 015 0 W. J efferson Boulevard, Culver City 90232 - Tel: 310-836-7900 - Fax: 310-836-2157 - www.q-t e c h.c om
QT93W & P (Revision E, October 2010) (ECO #10000)
• (*) Hot Solder Dip Sn60 per MIL-PRF 55310
• P. I. N. D. test
(MIL-STD 883, Method 2020)
3
Q-TECH
0 20 40 60 80 100 120 140 160
180
200 220 240 260
280
300 320 340 360 380 400 420 Time (s)
25
50
75
100
125
150
175
200
225
250
TEMP(*C)
0
60s min.
120s max.
60s min.
120s max.
225º min.
240º max.
60s min.
150s max.
240º
Ramp down (6ºC/s Max)
Ramp up (3ºC/s Max)
TYPICAL REFLOW PROFILE FOR Sn-Pb ASSEMBLY
FEEDING (PULL) DIRECTION
ø13.0±0.5
2.5
4.699±0.1
5º MAX
ø1.5
2.0
1.75±0.1
0.3±.005
ø1.5
2.0±0.1
5.5±0.1
7.747±0.1
4.0±0.1
ø178±1orø330±1
26
24.0±0.3
16±0.1
9.271
±0.1
120º
65
62
250
4
3
Vcc
Vcc
Vcc
250
62
QT93NP
Q
Q
THEVENIN EQUIVALENT 2.5V LVPECL
QT93LW
6
Vcc
3
54
100
Q
Q
VOL
VOH
LVDS TERMINATION
QT93LP
3
654
Vcc
50
50
Vcc-2V
Vcc-2V
Q
Q
STANDARD TERMINATION LVPECL
65
82
130
4
3
Vcc
Vcc
Vcc
130
82
QT93LP
Q
Q
THEVENIN EQUIVALENT 3.3V LVPECL
HIGH-RELIABILITY LVPECL OR LVDS MINIATURE CLOCK OSCILLATORS
COR PORATI ON
Output Waveform (Typical)Test Circuit
Typical start-up time of an LVPECL 3.3Vdc 200MHz at -55ºC 0.833ms
QT93W and QT93P SERIES
2.5 to 3.3Vdc - 40MHz to 320MHz
Reflow Profile
Environmental and Mechanical Specifications
Environmental TestTest Conditions
Temperature cyclingMIL-STD-883, Method 1010, Cond. B
Constant accelerationMIL-STD-883, Method 2001, Cond. A, Y1
Seal: Fine and Gross LeakMIL-STD-883, Method 1014, Cond. A and C
Vibration sinusoidalMIL-STD-202, Method 204, Cond. D
Shock, non operatingMIL-STD-202, Method 213, Cond. I
Resistance to solder heatMIL-STD-202, Method 210, Cond. C
Resistance to solventsMIL-STD-202, Method 215
SolderabilityMIL-STD-202, Method 208
ESD Classification
Moisture Sensitivity Level J-STD-020, MSL=1
Q-T ECH Co rpo rat ion - 1 015 0 W. J efferson Boulevard, Culver City 90232 - Tel: 310-836-7900 - Fax: 310-836-2157 - www.q-t e c h.c om
QT93W & P (Revision E, October 2010) (ECO #10000)
Typical plot of an LVDS 3.3Vdc 250MHz
MIL-STD-883, Method 3015,
Class 1 HBM 0 to 1,999V
The Tristate function on pin 1 has a built-in pull-up resistor so it can be left floating or tied to Vcc without deteriorating the electrical performance.
Embossed Tape and Reel Information
Dimensions are in mm. Tape is compliant to EIA-481-A.
Reel size (Diameter in mm)
178
Qty per reel (pcs)
200
4
Q-TECH
45º45º
Hybrid Case
Substrate
Die
D/A epoxy
D/A epoxy
Heat
Die
R1
D/A epoxy
Substrate
D/A epoxy
Hybrid Case
R2R3R4R5
JAJCCA
Die
T
T
T
C
A
J
CA
JC
COR PORATI ON
HIGH-RELIABILITY LVPECL OR LVDS MINIATURE CLOCK OSCILLATORS
Phase Noise and Phase Jitter Integration
Phase noise is measured in the frequency domain, and is
expressed as a ratio of signal power to noise power measured
in a 1Hz bandwidth at an offset frequency from the carrier, e.g.
10Hz, 100Hz, 1kHz, 10kHz, 100kHz, etc. Phase noise measurement is made with an Agilent E5052A Signal Source Analyzer (SSA) with built-in outstanding low-noise DC power
supply source. The DC source is floated from the ground and
isolated from external noise to ensure accuracy and repeatability.
In order to determine the total noise power over a certain
frequency range (bandwidth), the time domain must be
analyzed in the frequency domain, and then reconstructed in
the time domain into an rms value with the unwanted frequencies excluded. This may be done by converting L(f) back to
Sφ(f) over the bandwidth of interest, integrating and performing some calculations.
The value of RMS jitter over the bandwidth of interest, e.g.
10kHz to 20MHz, 10Hz to 20MHz, represents 1 standard deviation of phase jitter contributed by the noise in that defined
bandwidth.
QT93W and QT93P SERIES
2.5 to 3.3Vdc - 40MHz to 320MHz
Figure 1 shows a typical Phase Noise/Phase jitter of a
QT93LW, 3.3Vdc, 250MHz clock at offset frequencies 10Hz to
10MHz, and phase jitter integrated over the bandwidth of
12kHz to 20MHz.
Thermal Characteristics
The heat transfer model in a hybrid package is described in
figure 2.
Heat spreading occurs when heat flows into a material layer of
increased cross-sectional area. It is adequate to assume that
spreading occurs at a 45° angle.
The total thermal resistance is calculated by summing the
thermal resistances of each material in the thermal path
between the device and hybrid case.
RT = R1 + R2 + R3 + R4 + R5
The total thermal resistance RT (see figure 3) between the heat
source (die) to the hybrid case is the Theta Junction to Case
(Theta JC) in°C/W.
• Theta junction to case (Theta JC) for this product is 35°C/W.
• Theta case to ambient (Theta CA) for this part is 100°C/W.
• Theta Junction to ambient (Theta JA) is 135°C/W.
(Figure 1)
(Figure 2)
Maximum power dissipation PD for this package at 25°C is:
• PD(max) = (TJ (max) – TA)/Theta JA
• With TJ = 175°C (Maximum junction temperature of die)
• PD(max) = (175 – 25)/135 = 1.11W
QT93W & P (Revision E, October 2010) (ECO #10000)
Q-T ECH Co rpo rat ion - 1 015 0 W. J efferson Boulevard, Culver City 90232 - Tel: 310-836-7900 - Fax: 310-836-2157 - www.q-t e c h.c om
(Figure 3)
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