CONSULT FACTORY FOR CURRENT REVISION
REVISIONS
REVISION
DESCRIPTION
APPROVED
DATE
A
Updated part numbers
Luis Vargas
1/9/09
B
Edited Part Numbers
Luis Vargas
6/21/2009
C
Edited
Luis Vargas
12/2/2010
D
Add par. 3.4.2 Logic microcircuits and Radiation characteristics (
ECO# 10527)
C. Albright
4/2/12
E
Changed par. 3.1.1 split supply and load variation from frequency
stability Vs. temperature characteristics, phase noise limits @10Hz
and 100 Hz) ( ECO# 10548)
C. Albright
4/26/12
SPECIFICATION CONTROL DRAWING
Q-TECH CORPORATION
10150 W. JEFFERSON BLVD.
CULVER CITY, CA 90232-3510
PREPARED BY:
Luis Vargas
DATE
4/25/12
LOW PROFILE 32 PIN Flat-Pack HYBRID CRYSTAL
OSCILLATOR, TCXO, CLASS S,
Standard Design For HCMOS up to 90MHz
UNLESS OTHERWISE
SPECIFIED, DIMENSIONS
ARE IN INCHES.
TOLERANCES:
3 PLACE DECIMAL = .005
2 PLACE DECIMAL = .02
1 PLACE DECIMAL = .1
FRACTIONS = ± 1/16
ANGLES = 2 DEGREES
CHECKED BY:
B. Remtulla
DATE
4/26/12
DRAWING NO.:
QT821 and QT822
Square-Wave
REVISION
E
RELEASED BY:
P. Steinblums 4/26/12
APPROVED BY:
C. Albright
DATE
4/26/12
SCALE
NONE
SIZE
A
CAGE CODE
51774
SHEET 1 of 10
50MHz TCXO ,Vcc=12v,+25ºC
9/17/08
-180
-170
-160
-150
-140
-130
-120
-110
-100
-90
-80
-70
-60
-50
-40
-30
110100100010000100000
Frequency Offset, HZ
L(f), dBc
0
0.05
0.1
0.15
0.2
0.25
0.3
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
frequency drift, PPM
elapsed time, days
Aging Data
-50 -45 -40 -35 -30 -25 -20 -15 -10 -5 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 35 90
temp, deg
freq error, PPM
2.0
1.5
1.0
0.5
0.0
-0.5
-1.0
-1.5
-2.0
Example 2 of Temperature Stability
Example 1 of Temperature Stability
temp, deg
freq error, PPM
ITAR-CONTROLLED Q-TECH PROPRIETARY DO NOT COPY OR DISTRIBUTE WITHOUT Q-TECH APPROVAL
QT821 and QT822 Square-Wave
32 PIN Flat-Pack
REV.
Q-TECH Corporation
10150 W. Jefferson Blvd.
Culver City, CA 90232
SIZE
A
CAGE NO.
51774
Sheet 2 of 10
E
1.0 SCOPE
This specification establishes the detail requirements for low profile hybrid, hermetically sealed,
HCMOS output temperature compensated crystal oscillators (TCXO) for use in space flight missions
2.0 APPLICABLE DOCUMENTS
The following documents of the latest issue form a part of this drawing to the extent specified herein.
2.1 Specifications and Standards
SPECIFICATIONS
MILITARY
MIL-S-19500
Semiconductor Devices, General Specification For
MIL-PRF-55310
Crystal Oscillators, General Specification For
MIL-PRF-38535
Integrated Circuits, (Microcircuits) Manufacturing, General Specification For
MIL-PRF-38534
Hybrid Microcircuits, General Specification For
STANDARDS
MILITARY
MIL-STD-202
Test Methods for Electronic and Electrical Component Parts
MIL-STD-883
Test Methods and Procedures for Microelectronics
MIL-STD-1686
Electrostatic Discharge Control Program for Protection of Electrical and Electronics Parts,
Assemblies and Equipment.
2.2 Conflicting Requirements
In the event of conflict between requirements of this specification and other requirements of the
applicable detail drawing, the precedence in which requirements shall govern, in descending order, is
as follows:
a) Applicable Customer purchase order.
b) Applicable detail drawing.
c) This specification.
d) Other specifications or standards referenced in 2.1 herein.
2.3 Customer Purchase Order Special Requirements
Additional special requirements shall be specified in the applicable Customer purchase order when
additional requirements or modifications specified herein are needed for compliance to special
program or product line requirements.
3.0 PERFORMANCE REQUIREMENTS
3.1 General Definition
The TCXO is a high reliability signal generator that provides a square-wave output. The TCXO has
been designed to operate in a spaceflight environment with an expected lifetime in excess of 15 years.
Lifetime is defined as the sum of operational and storage environments.
ITAR-CONTROLLED Q-TECH PROPRIETARY DO NOT COPY OR DISTRIBUTE WITHOUT Q-TECH APPROVAL
QT821 and QT822 Square-Wave
32 PIN Flat-Pack
REV.
Q-TECH Corporation
10150 W. Jefferson Blvd.
Culver City, CA 90232
SIZE
A
CAGE NO.
51774
Sheet 3 of 10
E
3.1.1 Electrical Characteristics
PARAMETER
SYMBOL
CONDITIONS
VALUE
UNIT
Frequency Nom.
fo - 3. to 90
MHz
Supply voltage, Nom.
Vs
Vs±5%
See part number
generation table
V
Input Current, max.
Is
Vs, nom. / Ta=+25°C
50
mA
Freq. stability vs. Operating
temperature
Δf/fc (Ta)
Contact factory for other options
available
See part number
generation table
ppm
Electrical Frequency
Adjustment Min.
(when specified)
Δf/fo
(ΔVcc)
±5 PPM Two options:
1) via an external select-at-test
resistor connected from Pin 1
to Ground
2) Via External tuning voltage
±5.0
ppm
Freq. stability vs. ±5 %
Input Voltage Variation
Δf/fc (Vs)
Ta=+25°C
±1.2
ppm
Freq. stability vs. ±5 %
Load Variation
Δf/fc
(Load)
Vs, nom. / Ta=+25°C
0.3
ppm
Aging Max
Δf/fo
over 10 year (first year ≤ 1 ppm)
±5.0
ppm
Freq. stability vs. Vacuum
Δf/fo
Met by design, not tested
±0.2
ppm
Short term stability
Δf/fc(Δt)
Δt=1sec. (Allan Deviation)
0.001
ppm
RF Output
Contact factory for other options
available
30 to 70
3rd
70.1 to
90
3rd X
MHz
Output
VOH / VOL
load=15pF, Vcc=nom.
0.9•Vcc / 0.1•Vcc
V
Duty cycle
DC
load=15pF/ @50%Vcc, Ta=+25°C
See part number
generation table
%
Rise- / fall time
tr / tf
20%~80% Vout, 80%~20% Vout
.5…7 (see note A)
nSec
Load
15
pF
Phase noise @ freq. offset
£ (Δf)
£ (Δf)
£ (Δf)
£ (Δf)
£ (Δf)
Δf=10Hz
Δf=100Hz
Δf=1kHz
Δf=10kHz
Δf=100kHz
-70
-100
-130
-140
-140
70.1 to 90
MHZ
Contact
factory for
other
options
available
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
A:
Supply Current, rise & fall time are frequency dependent
3.2 Absolute Maximum Rating
Notes: 1 – Without irreversible damages
CHARACTERISTICS
MAXIMUM RATINGS
REMARKS
Supply Voltage
0 to +6.0 VDC
Note 1
DC Input Current
50 mA maximum
Note 1
Storage Temperature range
-55°C to +125°C
Note 1
Lead Temperature (Soldering, 10 seconds)
300°C
Note 1
ITAR-CONTROLLED Q-TECH PROPRIETARY DO NOT COPY OR DISTRIBUTE WITHOUT Q-TECH APPROVAL
QT821 and QT822 Square-Wave
32 PIN Flat-Pack
REV.
Q-TECH Corporation
10150 W. Jefferson Blvd.
Culver City, CA 90232
SIZE
A
CAGE NO.
51774
Sheet 4 of 10
E
3.2.1 Physical Characteristics
3.2.1.1 Dimensions
- The TCXO outline dimensions and terminal connections shall be as shown in Figure 1
herein.
3.2.1.2 Weight
- The TCXO shall weigh less than or equal to 15 grams.
3.2.1.3 Materials
- The TCXO package body and lead finish shall be gold in accordance with MIL-PRF-38534.
3.3 Design and Construction
The design and construction of the crystal oscillator shall be as specified herein. As a minimum, the
oscillators shall meet the design and construction requirements of MIL-PRF-55310, except element
evaluation shall be as specified in 3.3.1
SCREENING FLOW CHART
Operation
Non-Destruct Wire Bond Pull
100%, MIL-STD-883, Method 2023 (2.4 grams)
Internal Visual
MIL-STD-883, methods 2017 & 2032 condition K (class S). During the
time interval between final internal visual inspection and preparation for
sealing, hybrid crystal oscillators shall be stored in a dry, controlled
environment as defined in MIL-STD-883, method 2017 or in a vacuum
bake oven.
Stabilization Bake
48 hrs minimum @ +150°C MIL-STD-883, Method 1008 TC B
Thermal Shock
MI-STD 883, Method 1011, TC A
Temperature Cycling
MI-STD 883, Method 1010, TC B
Constant Acceleration
MIL-STD-883, Method 2001, TC A (5000 gs, Y1 Axis only)
PIND
MIL-STD-883, Method 2020, TC B
Electrical Test
Frequency, Output levels, Input Current@ +25°C
Burn-In (Powered with load)
+125°C for 240 hours
Seal Test (fine & gross)
100% Method 1014, (TC A1 for fine leak and TC C for gross leak)
Electrical Test
Frequency, Output levels, Input Current
@ +25°C & Temp Extremes listed on the Electrical Specification
Radiographic
MIL-STD-883, Method 2012 class S
External visual
MIL-STD-883 Method 2009
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QT821 and QT822 Square-Wave
32 PIN Flat-Pack
REV.
Q-TECH Corporation
10150 W. Jefferson Blvd.
Culver City, CA 90232
SIZE
A
CAGE NO.
51774
Sheet 5 of 10
E
Group A Inspection
PARAMETER
SYMBOL
CONDITIONS
VALUE
UNIT
Input Current, max.
Is
Vs, nom. / Ta=+25°C
50
mA
Freq. stability vs.
temperature
Δf/fc (Ta)
Vs, nominal and over the temperature
range indicated under part number
definition
indicated under
part number
definition
ppm
Electrical Frequency
Adjustment Min.
(when specified)
Δf/fo
(ΔVcc)
± Vs, nom. / Ta=+25°C as indicated
under part number definition
indicated under
part number
definition
ppm
Output
VOH /
VOL
load=15pF, Vcc=nom.
0.9•Vcc / 0.1•Vcc
V
Duty cycle
DC
load=15pF/ @50%Vcc, Ta=+25°C
indicated under
part number
definition
%
Rise- / fall time
tr / tf
20%~80% Vout, 80%~20% Vout
.5…7 (see note A)
nSec
External Visual
MIL-STD-883, Method 2009
A:
Supply Current, rise & fall time are frequency dependent
Group B Inspection
SUB-
GROUP
TEST DESCRIPTION
CONDITION
QTY
1
Frequency Aging
MIL-PRF-55310
Para 3.6.34.2
100%
2
Hermetic Seal 1/
Fine Leak – MIL-STD-883 Method 1014 Condition A1
Gross Leak – MIL-STD-883, Method 1014 Condition C
100%
3
Electrical 1/ (Go/NoGo)
100%
1/ Testing shall be performed after completion of Frequency Aging and before parts are shipped.
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QT821 and QT822 Square-Wave
32 PIN Flat-Pack
REV.
Q-TECH Corporation
10150 W. Jefferson Blvd.
Culver City, CA 90232
SIZE
A
CAGE NO.
51774
Sheet 6 of 10
E
Group C Inspection
SUB-
GROUP
TEST
DESCRIPTION
CONDITION
QTY
Vibration (random)
MI-STD 202 Method 214/ T.C. I-K (46Grms) for 3 minutes in
each plane.
Shock
MI-STD 202 Method 213 T.C. F
(1500g, 0.5ms half-sine pulse) 3 blows each direction of three
axes (18 shocks total)
Electrical Test
Frequency, Output levels, Input Current
@ +25°C & Temp Extremes listed on the Electrical
Specification.
Hermetic Seal
Fine Leak – MIL-STD-883 Method 1014 Condition A1
Gross Leak – MIL-STD-883, Method 1014 Condition C
Electrical Test
Frequency, Output levels, Input Current
@ +25°C & Temp Extremes listed on the Electrical
Specification.
Temperature
Cycling
MI-STD 883, Method 1010, TC B 100 cycles.
Electrical Test
Frequency, Output levels, Input Current
@ +25°C & Temp Extremes listed on the Electrical
Specification
Ambient Pressure
(Non-Operating
2 MI-STD 202 Method 105 T.C. C
Electrical Test
Frequency, Output levels, Input Current
@ +25°C & Temp Extremes listed on the Electrical
Specification
Storage
Temperature
Low Temp.of - 55 (+0, -5) °C
HighTemp.of +150 (+5,-0) °C
Hermetic Seal
Fine Leak – MIL-STD-883 Method 1014 Condition A1
Gross Leak – MIL-STD-883, Method 1014 Condition C
1
Electrical Test
Frequency, Output levels, Input Current @ +25°C & Temp
Extremes listed on the Electrical Specification
4 parts
(0 failures)
Resistance to
Soldering Heat
MI-STD 202 Method 210 T.C. B
Hermetic Seal
Fine Leak – MIL-STD-883, Method 1014 Condition A1
Gross Leak – MIL-STD-883, Method 1014 Condition C
3
Moisture
Resistance
MI-STD 202 Method 106
1 parts
(0 failures)
Terminal Strength
(Lead Integrity)
MI-STD 202 Method 211 T.C. B
Visual Inspection
Hermetic Seal
Fine Leak – MIL-STD-883,Method 1014 Condition A1
Gross Leak – MIL-STD-883, Method 1014 Condition C
4
Resistance To
Solvents
MI-STD 202 Method 215
1 parts
(0 failures)
NOTE: Samples from Subgroup 1 may be divided and used for Subgroups 2, 3, and 4 Inspections.
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QT821 and QT822 Square-Wave
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Q-TECH Corporation
10150 W. Jefferson Blvd.
Culver City, CA 90232
SIZE
A
CAGE NO.
51774
Sheet 7 of 10
E
3.3.1 All piece parts shall be derived from lots that meet the element evaluation requirements of MILPRF-38534, Class K, with the following exceptins:
Active elements
a) Visual inspection of silicon on sapphire microcircuits. Semicircular crack(s) or multiple
adjacent cracks, not in the active area, starting and terminating at the edge of the die
are acceptable. Attached (chip in place) sapphire is nonconductive material and shall
not be considered as foreign material and will be considered as nonconductive material
for all inspection criteria.
b) Subgroup 4, Scanning Electron Microscope (SEM) inspection. The manufacturer may
allow the die distributor, at his option, to select two (2) dice from a waffle pack
(containing a maximum quantity of 100 die), visually inspect for the worst case
metallization of the 2 dice, and take SEM photographs of the worst case.
c) Subgroup 5 radiation tests. Subgroup 5 radiation tests are not required unless
otherwise specified in the detail purchase order.
3.3.2 Processes
- Processes used for manufacturing the TCXO are selected on the basis of their ability to
meet the quality requirements for space High Reliability manufacturing. Travelers or Process Cards
are used in the manufacturing and testing of all of the TCXO Series, and might be available for
customer review. Copies of these Travelers can be provided with the TCXOs at time of shipment if
so specified on the purchase order.
3.3.3 Interchangeability
- Each TCXO shall be interchangeable without using a special selection process.
3.3.4 Product Marking
- Each unit shall be permanently marked with the manufacturer's name or symbol,
part number, lot date code number, and serial number. The unit shall be marked with the outline of
an equilateral triangle near pin 1 to show that it contains devices which are sensitive to electrostatic
discharge.
3.4 Parts Program
Devices delivered to this specification represent the standardized Parts, Materials and Processes (PMP)
Program developed, implemented and certified for advanced applications and extended environments.
3.4.1 Quartz Crystal Resonator
- The crystal resonator used shall be constructed using premium synthetic
swept Quartz and procured to Q-TECH SCD. For the Engineering models, non-swept quartz may be
used.
3.4.2 Active devices
– The microcircuit in this part shall use CMOS technology and shall be from a wafer
proven to be radiation tolerant to 100kRad(Si) total ionizing dose.
3.4.2.1CMOS microcircuit usage – For output frequencies below 14MHz, the output microcircuit shall
be Harris SOS ACS74HMSR, Silicon on Sapphire CMOS technology. This microcircuit is specified to be
Single Event Latchup and Upset free for LET up to 100MeV-cm2/mg. For frequencies greater than or
equal to 14MHz, the CMOS microcircuit shall be 54AC00, see DSCC SMD 5962-87549. This
microcircuit is specified to be Single Event Latchup and Upset free for LET up to 93MeV-cm2/mg. For
output frequencies from 14MHz to 70MHz (3.3Vdc) or 14MHz to 100MHz (5Vdc), the manufacturer
shall be ST Microelectronics; for frequencies higher than 70MHz (3.3Vdc) or higher than 100MHz
(5.5Vdc), the manufacturer shall be National Semiconductor Corporation.
ITAR-CONTROLLED Q-TECH PROPRIETARY DO NOT COPY OR DISTRIBUTE WITHOUT Q-TECH APPROVAL
QT821 and QT822 Square-Wave
32 PIN Flat-Pack
REV.
Q-TECH Corporation
10150 W. Jefferson Blvd.
Culver City, CA 90232
SIZE
A
CAGE NO.
51774
Sheet 8 of 10
E
3.5 Traceability Requirements
Material, element and process traceability requirements shall be as specified by MIL-PRF-38534 for
Class K hybrids.
3.6 Data
3.6.1. Design Documentation
- When required by the purchase order, design, topography, process and
flow charts for all assembly/inspection and test operation for devices to be supplied under this
specification on the initial procurement shall be established and shall be available in-plant for
review by the procuring activity upon request. This design documentation shall be sufficient to
depict the physical and electrical construction of the devices supplied under the specification and
shall be traceable to the specific parts, drawings or part type numbers to which it applies, and to
the production lot(s) and inspection lot codes under which devices are manufactured and tested so
that revisions can be identified.
3.6.2. Technical Data Package.
When required by the purchase order, the following design
documentation and information is deliverable 30 days prior to the start of production. The
Technical Data Package shall consist of the following:
a) Assembly drawing(s).
b) All electrical schematics and drawings not considered proprietary.
c) The assembly and screening travelers to be used on-line to manufacture the devices
supplied to this specification.
d) Parts and materials list.
3.7 Test Report
A test report is supplied with each shipment of oscillators and includes the following information, as
a minimum:
a) A Certificate of Conformance to all specifications and purchase order requirements. As a
minimum, the Certificate of Conformance shall include the following information:
Purchase order number
Applicable part number
Manufacturer’s lot number
Lot date code
b) Parts and materials traceability information.
c) Certificate of crystal sweeping.
d) Manufacturing lot traveler.
e) Screening attributes and variables data as applicable.
f) Quality conformance inspection attributes and variables data as applicable.
g) Radiographic inspection negatives.
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QT821 and QT822 Square-Wave
32 PIN Flat-Pack
REV.
Q-TECH Corporation
10150 W. Jefferson Blvd.
Culver City, CA 90232
SIZE
A
CAGE NO.
51774
Sheet 9 of 10
E
3.8 Engineering Models
Engineering Models are fit, form, and function representative of Flight Models and of commercial
construction using commercial parts of same generic type as Flight Models. Completed oscillators are
not screened.
NOTES:
This oscillator is offered to meet the specifications above and is not guaranteed to meet any
other requirements.
▀ PART NUMBER GENERATION
SERIES
Output type
and supply
voltage
SYMMETRY
TEMPERATURE
RANGE (°C)
Stability
Over
Temperature
External
Tuning
Level
FREQUENCY
(MHz)
1: HCMOS, 5.0V
A:40%…60%
N: 0…+50………
±1 ppm
X: No tuning (± 1
ppm accuracy at
25°C)
E: Eng. Model
3.000…90.000
(See note 1)
2: HCMOS, 3.3V
T:(See note 2)
P: 0…+70…………
±1 ppm
R: External resistor
M: Flight Model
Q: 0…+70………
±2 ppm
V: External voltage
R: 0…+70………
±5 ppm
U: -20…+70……
±1 ppm
V: -20…+70……
±2 ppm
W:-20…+70……
±5 ppm
X: -40…+85……
±4 ppm
Y: -40…+85……
±5 ppm
Z: -40…+85……
±10 ppm
A: 0…..+50……
± 0.5ppm
G: 0….+70……
± 0.5ppm
H:-30…+70……
±2 ppm
K:-30…+70……
±4 ppm
QT82:
32 Pin
Flat
Pack
(See note 1 below)
1. Variations from standard specification are available, please contact factory.
2. 45/55 Symmetry Contact factory for options available.
EXAMPLE:
QT822AURM-50.000000 would be a Flight Mode
l version HF TCXO, 32 pin SMD flat pack, HCMOS 3.3 volts, 40/60
symmetry, stability ±1 ppm over -20…+70°C, @ 50 MHz with external tuning via external resistor
QT822AURE-50.000000 would be an Engineering Model
version HF TCXO, 32 pin SMD flat pack, HCMOS 3.3 volts,
40/60 symmetry, stability ±1 ppm over -20…+70°C, @ 50 MHz with external tuning via external resistor
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QT821 and QT822 Square-Wave
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REV.
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10150 W. Jefferson Blvd.
Culver City, CA 90232
SIZE
A
CAGE NO.
51774
Sheet 10 of 10
E
RECOMMENDED ELECTRICAL TEST DIAGRAM
FIGURE 1 INTERFACE CONTROL DRAWIN
32 Pin Flat Pack
PIN NO.
DESIGNATION
1 - 3
NC
4
External Frequency Adjustment
(when specified)
5
Ground/Case
6 - 10
NC
11
Supply Voltage
12
RF Output
13
Supply Voltage
14 - 32
NC
NOTES:
• Dimensions are in inches.
• Lead numbers are for reference only and
are not marked on the unit.
• A triangle symbol is marked on the corner
of the package to indicate Pin 1
• All pins with NC function may not be
connected as external tie or connections
(Pins may be connected internally).
1
16 17
32
1.015 MAX.
30X .050 ± .005
NON-ACCUMULATIVE
32X .015 ± .003
2X .750
.325 ± .025
2 PLACES
32X .010 ± .002
.200 MAX.
32X .072 ± .007
ESD SYMBOL
FOR PIN NO. 1
D/C S/N
Q-TECH USA
PART NUMBER
FREQUENCY
1.015 MAX.
TYP. REF.
4X R. 025 MAX.
2X .125 REF.
FLUKE 8050A
COMmA
V
VOLT-
METER
.01
uF
.01
uF
.01
uF
VC
Vcc
DEVICE
UNDER
TEST
OUT
GND
TEK2465B
OSCILLO-
SCOPE
VERT
SIGNAL
OUT
15
pF (including probes)
common
HP6205C
POWER
SUPPLY
AMP-
METER
FREQ
COUNTER
HP53181A
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