Q-Tech QT812 User Manual

REVISIONS
REVISION DESCRIPTION APPROVED DATE
A Updated part numbers Luis Vargas 1/9/09
C
Edited Part Numbers Luis Vargas 6/21/2009 Edited Luis Vargas 12/2/2010 Changed par. 3.1.1 split supply and load variation from frequency
D
stability Vs. temperature characteristics, phase noise limits @10Hz and 100 Hz) Add par. 3.4.2 Logic microcircuits and Radiation (ECO#
10550)
C. Albright 4/26/12
CONSULT FACTORY FOR CURRENT REVISION
SPECIFICATION CONTROL DRAWING
UNLESS OTHERWISE
PREPARED BY:
SPECIFIED, DIMENSIONS
ARE IN INCHES.
TOLERANCES:
Luis Vargas
CHECKED BY:
3 PLACE DECIMAL = .005
2 PLACE DECIMAL = .02
1 PLACE DECIMAL = .1
B. Remtulla
FRACTIONS = ± 1/16
ANGLES = 2 DEGREES
RELEASED BY:
APPROVED BY:
P. Steinblums 4/26/12
C. Albright
DATE
4/25/12
LOW PROFILE 24 PIN Flat-Pack HYBRID CRYSTAL
DATE
4/26/12
DATE
4/26/12
SCALE
NONE
Q-TECH CORPORATION
10150 W. JEFFERSON BLVD.
CULVER CITY, CA 90232-3510
OSCILLATOR, TCXO, CLASS S,
Standard Design For HCMOS up to 90MHz
DRAWING NO.:
QT811 and QT812
Square-Wave
SIZE
A
CAGE CODE
51774
SHEET 1 of 10
ITAR-CONTROLLED Q-TECH PROPRIETARY DO NOT COPY OR DISTRIBUTE WITHOUT Q-TECH APPROVAL
REVISION
D
1.0 SCOPE
24 PIN Flat-Pack
This specification establishes the detail requirements for low profile hybrid, hermetically sealed, HCMOS output temperature compensated crystal oscillators (TCXO) for use in space flight missions
2.0 APPLICABLE DOCUMENTS
The following documents of the latest issue form a part of this drawing to the extent specified herein.
2.1 Specifications and Standards
MIL-S-19500 Semiconductor Devices, General Specification For
MIL-PRF-55310 Crystal Oscillators, General Specification For
MIL-PRF-38535 Integrated Circuits, (Microcircuits) Manufacturing, General Specification For
MIL-PRF-38534 Hybrid Microcircuits, General Specification For
MIL-STD-202 Test Methods for Electronic and Electrical Component Parts
MIL-STD-883 Test Methods and Procedures for Microelectronics
MIL-STD-1686 Electrostatic Discharge Control Program for Protection of Electrical and Electronics Parts,
Assemblies and Equipment.
SPECIFICATIONS
MILITARY
STANDARDS
MILITARY
2.2 Conflicting Requirements
In the event of conflict between requirements of this specification and other requirements of the
applicable detail drawing, the precedence in which requirements shall govern, in descending order, is as follows:
a) Applicable Customer purchase order. b) Applicable detail drawing. c) This specification. d) Other specifications or standards referenced in 2.1 herein.
2.3 Customer Purchase Order Special Requirements
Additional special requirements shall be specified in the applicable Customer purchase order when
additional requirements or modifications specified herein are needed for compliance to special
program or product line requirements.
3.0 PERFORMANCE REQUIREMENTS
3.1 General Definition
The TCXO is a high reliability signal generator that provides a square-wave output. The TCXO has
been designed to operate in a spaceflight environment with an expected lifetime in excess of 15 years. Lifetime is defined as the sum of operational and storage environments.
Q-TECH Corporation
10150 W. Jefferson Blvd. Culver City, CA 90232
SIZE
A
CAGE NO.
51774
QT811 and QT812 Square-Wave
24 pin DDIP
Sheet 2 of 10
REV.
D
ITAR-CONTROLLED Q-TECH PROPRIETARY DO NOT COPY OR DISTRIBUTE WITHOUT Q-TECH APPROVAL
24 PIN Flat-Pack
3.1.1 Electrical Characteristics
PARAMETER SYMBOL CONDITIONS VALUE UNIT
Frequency Nom. fo - 3. to 90 MHz Supply voltage, Nom. Vs Vs±5%
Input Current, max. Is Freq. stability vs. Operating
temperature Electrical Frequency Adjustment Min. (when specified)
Freq. stability vs. ±5 % Input Voltage Variation
Freq. stability vs. ±5 % Load Variation
Aging Max Freq. stability vs. Vacuum Short term stability RF Output
Output VOH / VOL load=15pF, Vcc=nom.
Δf/fc (Ta)
Δf/fo
Vcc)
Δf/fc (Vs) Ta=+25°C
Δf/fc
(Load)
Δf/fo Δf/fo
Δf/fc(Δt) Δt=1sec. (Allan Deviation)
Vs, nom. / Ta=+25°C
Contact factory for other options available
±5 PPM Two options:
1) via an external select-at-test
2) Via External tuning voltage
Vs, nom. / Ta=+25°C 0.3 ppm
over 10 year (first year 1 ppm) ±5.0 ppm Met by design, not tested
Contact factory for other options available
resistor connected from Pin 1 to Ground
See part number generation table
50 mA
See part number generation table
±5.0 ppm
±1.2 ppm
±0.2
0.001 ppm
30 to 70
3rd
0.9Vcc / 0.1Vcc
70.1 to 90
rd
3
X
V
ppm
ppm
MHz
V
Duty cycle DC
Rise- / fall time tr / tf 20%~80% Vout, 80%~20% Vout .5…7 (see note A) nSec Load 15 pF Phase noise @ freq. offset
A:
Supply Current, rise & fall time are frequency dependent
£ (Δf) £ (Δf) £ (Δf) £ (Δf) £ (Δf)
load=15pF/ @50%Vcc, Ta=+25°C
Δf=10Hz Δf=100Hz Δf=1kHz Δf=10kHz Δf=100kHz
See part number generation table
-70
-100
-130
-140
-140
70.1 to 90 MHZ
Contact
factory for
other
options
available
%
dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz
3.2 Absolute Maximum Rating
Supply Voltage 0 to +6.0 VDC DC Input Current 50 mA maximum
Storage Temperature range -55°C to +125°C
Lead Temperature (Soldering, 10 seconds) 300°C
CHARACTERISTICS MAXIMUM RATINGS REMARKS
Note 1 Note 1
Note 1
Note 1
Notes: 1 – Without irreversible damages
ITAR-CONTROLLED Q-TECH PROPRIETARY DO NOT COPY OR DISTRIBUTE WITHOUT Q-TECH APPROVAL
Q-TECH Corporation
10150 W. Jefferson Blvd. Culver City, CA 90232
SIZE
A
CAGE NO.
51774
QT811 and QT812 Square-Wave
24 pin DDIP
Sheet 3 of 10
REV.
D
3.2.1 Physical Characteristics
24 PIN Flat-Pack
3.2.1.1 Dimensions
- The TCXO outline dimensions and terminal connections shall be as shown in Figure 1
herein.
3.2.1.2 Weight
3.2.1.3 Materials
- The TCXO shall weigh less than or equal to 15 grams.
- The TCXO package body and lead finish shall be gold in accordance with MIL-PRF-38534.
3.3 Design and Construction
The design and construction of the crystal oscillator shall be as specified herein. As a minimum, the oscillators shall meet the design and construction requirements of MIL-PRF-55310, except element evaluation shall be as specified in 3.3.1
SCREENING FLOW CHART
Operation
Non-Destruct Wire Bond Pull 100%, MIL-STD-883, Method 2023 (2.4 grams) Internal Visual MIL-STD-883, methods 2017 & 2032 condition K (class S). During the
time interval between final internal visual inspection and preparation for sealing, hybrid crystal oscillators shall be stored in a dry, controlled environment as defined in MIL-STD-883, method 2017 or in a vacuum
bake oven. Stabilization Bake 48 hrs minimum @ +150°C MIL-STD-883, Method 1008 TC B Thermal Shock MI-STD 883, Method 1011, TC A Temperature Cycling MI-STD 883, Method 1010, TC B Constant Acceleration MIL-STD-883, Method 2001, TC A (5000 gs, Y1 Axis only) PIND MIL-STD-883, Method 2020, TC B Electrical Test Frequency, Output levels, Input Current@ +25°C Burn-In (Powered with load) +125°C for 240 hours Seal Test (fine & gross) 100% Method 1014, (TC A1 for fine leak and TC C for gross leak) Electrical Test
Radiographic MIL-STD-883, Method 2012 class S External visual MIL-STD-883 Method 2009
Frequency, Output levels, Input Current
@ +25°C & Temp Extremes listed on the Electrical Specification
ITAR-CONTROLLED Q-TECH PROPRIETARY DO NOT COPY OR DISTRIBUTE WITHOUT Q-TECH APPROVAL
Q-TECH Corporation
10150 W. Jefferson Blvd. Culver City, CA 90232
SIZE
A
CAGE NO.
51774
QT811 and QT812 Square-Wave
24 pin DDIP
Sheet 4 of 10
REV.
D
24 PIN Flat-Pack
Group A Inspection
PARAMETER SYMBOL CONDITIONS VALUE UNIT
Input Current, max. Is Freq. stability vs.
temperature
Δf/fc (Ta)
Vs, nom. / Ta=+25°C
Vs, nominal and over the temperature range indicated under part number definition
50 mA
indicated under
part number
definition
ppm
Electrical Frequency Adjustment Min. (when specified)
Output VOH /
Duty cycle DC
Rise- / fall time tr / tf 20%~80% Vout, 80%~20% Vout .5…7 (see note A) nSec
External Visual MIL-STD-883, Method 2009
Supply Current, rise & fall time are frequency dependent
A:
Δf/fo
(ΔVcc)
VOL
± Vs, nom. / Ta=+25°C as indicated under part number definition
load=15pF, Vcc=nom.
load=15pF/ @50%Vcc, Ta=+25°C
indicated under
part number
definition
0.9Vcc / 0.1Vcc
indicated under
part number
definition
ppm
V
%
Group B Inspection
SUB-
GROUP
1 Frequency Aging
2
TEST DESCRIPTION CONDITION QTY
Hermetic Seal 1/
MIL-PRF-55310
Para 3.6.34.2
Fine Leak – MIL-STD-883 Method 1014 Condition A1 Gross Leak – MIL-STD-883, Method 1014 Condition C
100%
100%
1/ Testing shall be performed after completion of Frequency Aging and before parts are shipped.
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3 Electrical 1/ (Go/NoGo) 100%
Q-TECH Corporation
10150 W. Jefferson Blvd. Culver City, CA 90232
SIZE
A
CAGE NO.
51774
QT811 and QT812 Square-Wave
24 pin DDIP
Sheet 5 of 10
REV.
D
24 PIN Flat-Pack
Group C Inspection
SUB-
GROUP
1
3
TEST
DESCRIPTION
Vibration (random)
Shock
Electrical Test
Hermetic Seal
Electrical Test
Temperature
Cycling
Electrical Test
Ambient Pressure
(Non-Operating
Electrical Test
Storage
Temperature
Hermetic Seal
Electrical Test Frequency, Output levels, Input Current @ +25°C & Temp
Resistance to
Soldering Heat
Hermetic Seal
Moisture
Resistance
Terminal Strength
(Lead Integrity)
MI-STD 202 Method 214/ T.C. I-K (46Grms) for 3 minutes in each plane.
MI-STD 202 Method 213 T.C. F (1500g, 0.5ms half-sine pulse) 3 blows each direction of three axes (18 shocks total)
Frequency, Output levels, Input Current @ +25°C & Temp Extremes listed on the Electrical Specification.
Fine Leak – MIL-STD-883 Method 1014 Condition A1 Gross Leak – MIL-STD-883, Method 1014 Condition C
Frequency, Output levels, Input Current @ +25°C & Temp Extremes listed on the Electrical Specification.
MI-STD 883, Method 1010, TC B 100 cycles.
Frequency, Output levels, Input Current @ +25°C & Temp Extremes listed on the Electrical Specification
2 MI-STD 202 Method 105 T.C. C
Frequency, Output levels, Input Current @ +25°C & Temp Extremes listed on the Electrical Specification
Low Temp.of - 55 (+0, -5) °C HighTemp.of +150 (+5,-0) °C
Fine Leak – MIL-STD-883 Method 1014 Condition A1 Gross Leak – MIL-STD-883, Method 1014 Condition C
Extremes listed on the Electrical Specification
MI-STD 202 Method 210 T.C. B
Fine Leak – MIL-STD-883, Method 1014 Condition A1 Gross Leak – MIL-STD-883, Method 1014 Condition C
MI-STD 202 Method 106
MI-STD 202 Method 211 T.C. B
CONDITION QTY
4 parts
(0 failures)
1 parts
(0 failures)
NOTE: Samples from Subgroup 1 may be divided and used for Subgroups 2, 3, and 4 Inspections.
ITAR-CONTROLLED Q-TECH PROPRIETARY DO NOT COPY OR DISTRIBUTE WITHOUT Q-TECH APPROVAL
Visual Inspection
4
Hermetic Seal
Resistance To
Solvents
Q-TECH Corporation
10150 W. Jefferson Blvd. Culver City, CA 90232
Fine Leak – MIL-STD-883,Method 1014 Condition A1 Gross Leak – MIL-STD-883, Method 1014 Condition C
MI-STD 202 Method 215
QT811 and QT812 Square-Wave
SIZE
A
CAGE NO.
51774
24 pin DDIP
Sheet 6 of 10
1 parts
(0 failures)
REV.
D
24 PIN Flat-Pack
3.3.1 All piece parts shall be derived from lots that meet the element evaluation requirements of MIL­PRF-38534, Class K, with the following exceptins:
Active elements
a) Visual inspection of silicon on sapphire microcircuits. Semicircular crack(s) or multiple
adjacent cracks, not in the active area, starting and terminating at the edge of the die are acceptable. Attached (chip in place) sapphire is nonconductive material and shall not be considered as foreign material and will be considered as nonconductive material for all inspection criteria.
b) Subgroup 4, Scanning Electron Microscope (SEM) inspection. The manufacturer may
allow the die distributor, at his option, to select two (2) dice from a waffle pack (containing a maximum quantity of 100 die), visually inspect for the worst case metallization of the 2 dice, and take SEM photographs of the worst case.
c) Subgroup 5 radiation tests. Subgroup 5 radiation tests are not required unless
otherwise specified in the detail purchase order.
3.3.2 Processes
- Processes used for manufacturing the TCXO are selected on the basis of their ability to
meet the quality requirements for space High Reliability manufacturing. Travelers or Process Cards are used in the manufacturing and testing of all of the TCXO Series, and might be available for customer review. Copies of these Travelers can be provided with the TCXOs at time of shipment if so specified on the purchase order.
3.3.3 Interchangeability
3.3.4 Product Marking
- Each TCXO shall be interchangeable without using a special selection process.
- Each unit shall be permanently marked with the manufacturer's name or symbol, part number, lot date code number, and serial number. The unit shall be marked with the outline of an equilateral triangle near pin 1 to show that it contains devices which are sensitive to electrostatic discharge.
3.4 Parts Program
Devices delivered to this specification represent the standardized Parts, Materials and Processes (PMP)
Program developed, implemented and certified for advanced applications and extended environments.
3.4.1 Quartz Crystal Resonator
- The crystal resonator used shall be constructed using premium synthetic swept Quartz and procured to Q-TECH SCD. For the Engineering models, non-swept quartz may be used.
3.4.2 Active devices
– The microcircuit in this part shall use CMOS technology and shall be from a wafer
proven to be radiation tolerant to 100kRad(Si) total ionizing dose.
3.4.2.1CMOS microcircuit usage – For output frequencies below 14MHz, the output microcircuit shall be Harris SOS ACS74HMSR, Silicon on Sapphire CMOS technology. This microcircuit is specified to be Single Event Latchup and Upset free for LET up to 100MeV-cm2/mg. For frequencies greater than or equal to 14MHz, the CMOS microcircuit shall be 54AC00, see DSCC SMD 5962-87549. This microcircuit is specified to be Single Event Latchup and Upset free for LET up to 93MeV-cm2/mg. For output frequencies from 14MHz to 70MHz (3.3Vdc) or 14MHz to 100MHz (5Vdc), the manufacturer shall be ST Microelectronics; for frequencies higher than 70MHz (3.3Vdc) or higher than 100MHz (5.5Vdc), the manufacturer shall be National Semiconductor Corporation.
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Q-TECH Corporation
10150 W. Jefferson Blvd. Culver City, CA 90232
SIZE
A
CAGE NO.
51774
QT811 and QT812 Square-Wave
24 pin DDIP
Sheet 7 of 10
REV.
D
3.5 Traceability Requirements
24 PIN Flat-Pack
Material, element and process traceability requirements shall be as specified by MIL-PRF-38534 for Class K hybrids.
3.6 Data
3.6.1. Design Documentation
- When required by the purchase order, design, topography, process and flow charts for all assembly/inspection and test operation for devices to be supplied under this specification on the initial procurement shall be established and shall be available in-plant for review by the procuring activity upon request. This design documentation shall be sufficient to depict the physical and electrical construction of the devices supplied under the specification and shall be traceable to the specific parts, drawings or part type numbers to which it applies, and to the production lot(s) and inspection lot codes under which devices are manufactured and tested so that revisions can be identified.
3.6.2. Technical Data Package.
documentation and information is deliverable 30 days prior to the start of production. The Technical Data Package shall consist of the following:
a) Assembly drawing(s). b) All electrical schematics and drawings not considered proprietary. c) The assembly and screening travelers to be used on-line to manufacture the devices
supplied to this specification.
d) Parts and materials list.
3.7 Test Report
When required by the purchase order, the following design
A test report is supplied with each shipment of oscillators and includes the following information, as
a minimum:
a) A Certificate of Conformance to all specifications and purchase order requirements. As a
minimum, the Certificate of Conformance shall include the following information:
Purchase order number
Applicable part number
Manufacturer’s lot number
Lot date code
b) Parts and materials traceability information. c) Certificate of crystal sweeping. d) Manufacturing lot traveler. e) Screening attributes and variables data as applicable. f) Quality conformance inspection attributes and variables data as applicable. g) Radiographic inspection negatives.
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Q-TECH Corporation
10150 W. Jefferson Blvd. Culver City, CA 90232
SIZE
A
CAGE NO.
51774
QT811 and QT812 Square-Wave
24 pin DDIP
Sheet 8 of 10
REV.
D
3.8 Engineering Models
24 PIN Flat-Pack
Engineering Models are fit, form, and function representative of Flight Models and of commercial
construction using commercial parts of same generic type as Flight Models. Completed oscillators are not screened.
NOTES: This oscillator is offered to meet the specifications above and is not guaranteed to meet any
other requirements.
PART NUMBER GENERATION
Output type
SERIES
QT81: 24 Pin
Flat­Pack
EXAMPLE:
QT812AURM-50.000000 would be a Flight Mode
symmetry, stability ±1 ppm over -20…+70°C, @ 50 MHz with external tuning via external resistor
QT812AURE-50.000000 would be an Engineering Model
40/60 symmetry, stability ±1 ppm over -20…+70°C, @ 50 MHz with external tuning via external resistor
and supply
voltage
1: HCMOS, 5.0V
2: HCMOS, 3.3V
Q: 0…+70………
R: 0…+70………
U: -20…+70……
V: -20…+70……
W:-20…+70……
X: -40…+85……
Y: -40…+85……
Z: -40…+85……
A: 0…..+50……
G: 0….+70…… H:-30…+70…… K:-30…+70……
1. Variations from standard specification are available, please contact factory.
2. 45/55 Symmetry Contact factory for options available.
SYMMETRY
A:40%…60% N: 0…+50………
T:(See note 2) P: 0…+70…………
TEMPERATURE
RANGE (°C)
(See note 1 below)
l version HF TCXO, 24 pin SMD Falt-Pack, HCMOS 3.3 volts, 40/60
Stability
Over
Temperature
±1 ppm
±1 ppm
±2 ppm
±5 ppm
±1 ppm
±2 ppm
±5 ppm
±4 ppm
±5 ppm ±10 ppm
± 0.5ppm
± 0.5ppm
±2 ppm
±4 ppm
External
Tuning
X: No tuning (± 1 ppm accuracy at 25°C)
R: External resistor M: Flight Model
V: External voltage
Level
E: Eng. Model
FREQUENCY
(MHz)
3.000…90.000
(See note 1)
version HF TCXO, 24 pin SMD Falt-Pack, HCMOS 3.3 volts,
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Q-TECH Corporation
10150 W. Jefferson Blvd. Culver City, CA 90232
SIZE
A
CAGE NO.
51774
QT811 and QT812 Square-Wave
24 pin DDIP
Sheet 9 of 10
REV.
D
24 PIN Flat-Pack
RECOMMENDED ELECTRICAL TEST DIAGRAM
FIGURE 1 INTERFACE CONTROL DRAWING
24 Pin Flat-pack
PIN NO. DESIGNATION
1
2 - 11 NC
12 Ground/Case 13 RF Output
14 -23 NC
24 Supply Voltage
NOTES:
Dimensions are in inches.
Lead numbers are for reference only and
are not marked on the unit.
A triangle symbol is marked on the corner
of the package to indicate Pin 1
All pins with NC function may not be
connected as external tie or connections (Pins may be connected internally).
External Frequency Adjustment
(when specified)
ITAR-CONTROLLED Q-TECH PROPRIETARY DO NOT COPY OR DISTRIBUTE WITHOUT Q-TECH APPROVAL
Q-TECH Corporation
10150 W. Jefferson Blvd. Culver City, CA 90232
SIZE
A
CAGE NO.
51774
QT811 and QT812 Square-Wave
24 pin DDIP
Sheet 10 of 10
REV.
D
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