Q-Tech’s surface-mount QT78 Series oscillators consist
of an IC 5Vdc, 3.3Vdc, 2.5Vdc, 1.8Vdc clock square
wave generator and a round AT high-precision quartz
crystal built in a rugged surface-mount ceramic J-lead
miniature package.
QT78 SERIES
HIGH RELIABILITY MINIATURE CRYSTAL CLOCK OSCILLATORS
Frequency stability vs. temperature codes may not be available in all frequencies.
For Non-Standard requirements, contact Q-Tech Corporation at Sales@Q-Tech.com
Packaging OptionsOther Options Available For An Additional Charge
• Standard packaging in anti-static plastic tube (60pcs/tube)
• Tape and Reel (1,000pcs/reel) is available for an additional
charge.
Specifications subject to change without prior notice.
Q-TECH Corporation - 10150 W. Jefferson Boulevard, Culver City 90232 - Tel: 310-836-7900 - Fax: 310-836-2157 - www.q-t ech.c om
QT78 (Revision H, January 2011) (ECO #10085)
• (*) Hot Solder Dip Sn60 per MIL-PRF 55310
• P. I. N. D. test
(MIL-STD 883, Method 2020)
3
QT78 SERIES
0 20 40 60 80 100 120 140 160
180
200 220 240 260
280
300 320 340 360 380 400 420Time (s)
25
50
75
100
125
150
175
200
225
250
TEMP(*C)
0
60s min.
120s max.
60s min.
120s max.
225º min.
240º max.
60s min.
150s max.
240º
Ramp down (6ºC/s Max)
Ramp up (3ºC/s Max)
TYPICAL REFLOW PROFILE FOR Sn-Pb ASSEMBLY
FEEDING (PULL) DIRECTION
ø13.0±0.5
2.5
4.80±0.1
5º MAX
ø1.5
2.0
1.75±0.1
0.3±.005
ø1.5
2.0±0.1
5.5±0.1
10.01±0.1
4.0±0.1
ø178±1orø330±1
26
24.0±0.3
16±0.1
14.53
±0.1
120º
Q-TECH
COR PORATI ON
Reflow ProfileEmbossed Tape and Reel Information For QT78
The five transition periods for the typical reflow process are:
• Preheat
• Flux activation
• Thermal equalization
• Reflow
• Cool down
HIGH RELIABILITY MINIATURE CRYSTAL CLOCK OSCILLATORS
1.8 to 5.0Vdc - 15kHz to 150MHz
Environmental Specifications
Q-Tech Standard Screening/QCI (MIL-PRF55310) is available for all of our QT78 Products. Q-Tech can also customize screening
and test procedures to meet your specific requirements. The QT78 product is designed and processed to exceed the following test
conditions:
Temperature cyclingMIL-STD-883, Method 1010, Cond. B
Constant accelerationMIL-STD-883, Method 2001, Cond. A, Y1
Seal: Fine and Gross LeakMIL-STD-883, Method 1014, Cond. A and C
Burn-in160 hours, 125°C with load
Aging30 days, 70°C, ±1.5ppm max
Vibration sinusoidalMIL-STD-202, Method 204, Cond. D
Shock, non operatingMIL-STD-202, Method 213, Cond. I (See Note 1)
Thermal shock, non operatingMIL-STD-202, Method 107, Cond. B
Ambient pressure, non operatingMIL-STD-202, 105, Cond. C, 5 minutes dwell time minimum
Resistance to solder heatMIL-STD-202, Method 210, Cond. B
Moisture resistanceMIL-STD-202, Method 106
Terminal strengthMIL-STD-202, Method 211, Cond. C
Resistance to solventsMIL-STD-202, Method 215
SolderabilityMIL-STD-202, Method 208
ESD ClassificationMIL-STD-883, Method 3015, Class 1 HBM 0 to 1,999V
Moisture Sensitivity LevelJ-STD-020, MSL=1
Note 1: Additional shock results successfully passed on 16MHz, 40MHz, and 80MHz
QT78 (Revision H, January 2011) (ECO #10085)
Dimensions are in mm. Tape is compliant to EIA-481-A.
Reel size vs. quantity:
Reel size (Diameter in mm)
178
330
Environmental TestTest Conditions
• Shock 850g peak, half-sine, 1 ms duration (MIL-STD-202, Method 213, Cond. D modified)
HIGH RELIABILITY MINIATURE CRYSTAL CLOCK OSCILLATORS
1.8 to 5.0Vdc - 15kHz to 150MHz
Output Waveform (Typical)
Frequency vs. Temperature Curve
Test Circuit
The Tristate function on pin 1 has a built-in pull-up resistor typical 50kΩ, so it can
be left floating or tied to Vdd without deteriorating the electrical performance.
Thermal Characteristics
The heat transfer model in a hybrid package is described in
figure 1.
Heat spreading occurs when heat flows into a material layer of
increased cross-sectional area. It is adequate to assume that
spreading occurs at a 45° angle.
The total thermal resistance is calculated by summing the
thermal resistances of each material in the thermal path
between the device and hybrid case.
RT = R1 + R2 + R3 + R4 + R5
The total thermal resistance RT (see figure 2) between the heat
source (die) to the hybrid case is the Theta Junction to Case
(Theta JC) in°C/W.
• Theta junction to case (Theta JC) for this product is 30°C/W.
• Theta case to ambient (Theta CA) for this part is 100°C/W.
• Theta Junction to ambient (Theta JA) is 130°C/W.
Maximum power dissipation PD for this package at 25°C is:
• PD(max) = (TJ (max) – TA)/Theta JA
• With TJ = 175°C (Maximum junction temperature of die)
• PD(max) = (175 – 25)/130 = 1.15W
Q-TECH Corporation - 10150 W. Jefferson Boulevard, Culver City 90232 - Tel: 310-836-7900 - Fax: 310-836-2157 - www.q-t ech.c om
QT78 (Revision H, January 2011) (ECO #10085)
(Figure 1)
(Figure 2)
5
Q-TECH
COR PORATI ON
Period Jitter
As data rates increase, effects of jitter become critical with
its budgets tighter. Jitter is the deviation of a timing event of
a signal from its ideal position. Jitter is complex and is
composed of both random and deterministic jitter
components. Random jitter (RJ) is theoretically unbounded
and Gaussian in distribution. Deterministic jitter (DJ) is
bounded and does not follow any predictable distribution.
DJ is also referred to as systematic jitter. A technique to
measure period jitter (RMS) one standard deviation (1σ) and
peak-to-peak jitter in time domain is to use a high sampling
rate (>8G samples/s) digitizing oscilloscope. Figure shows
an example of peak-to-peak jitter and RMS jitter (1σ) of a
QT78AC-24MHz, at 5.0Vdc.
QT78 SERIES
HIGH RELIABILITY MINIATURE CRYSTAL CLOCK OSCILLATORS
1.8 to 5.0Vdc - 15kHz to 150MHz
Phase Noise and Phase Jitter Integration
RMS jitter (1σ): 5.37ps Peak-to-peak jitter: 43ps
Phase noise is measured in the frequency domain, and is expressed as a ratio of signal power to noise power measured in a 1Hz
bandwidth at an offset frequency from the carrier, e.g. 10Hz, 100Hz, 1kHz, 10kHz, 100kHz, etc. Phase noise measurement is made
with an Agilent E5052A Signal Source Analyzer (SSA) with built-in outstanding low-noise DC power supply source. The DC source
is floated from the ground and isolated from external noise to ensure accuracy and repeatability.
In order to determine the total noise power over a certain frequency range (bandwidth), the time domain must be analyzed in the
frequency domain, and then reconstructed in the time domain into an rms value with the unwanted frequencies excluded. This may be
done by converting L(f) back to Sφ(f) over the bandwidth of interest, integrating and performing some calculations.
Symbol
∫L(f)
Sφ (f)=(180/Π)x√2 ∫L(f)df
RMS jitter = Sφ (f)/(fosc.360°)Jitter(in seconds) due to phase noise. Note Sφ (f) in degrees.
Integrated single side band phase noise (dBc)
Spectral density of phase modulation, also known as RMS phase error (in degrees)
Definition
The value of RMS jitter over the bandwidth of interest, e.g. 10kHz to 20MHz, 10Hz to 20MHz, represents 1 standard deviation of
phase jitter contributed by the noise in that defined bandwidth.
Figure below shows a typical Phase Noise/Phase jitter of a QT78AC6, 5.0Vdc, 80MHz clock at offset frequencies 10Hz to 5MHz, and
phase jitter integrated over the bandwidth of 12kHz to 1MHz.
Q-TECH Corporation - 10150 W. Jefferson Boulevard, Culver City 90232 - Tel: 310-836-7900 - Fax: 310-836-2157 - www.q-t ech.c om
QT78 (Revision H, January 2011) (ECO #10085)
6
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