POWEREX CM200DU-12H Datasheet

CM200DU-12H
Powerex, Inc., 200 Hillis Street, Youngwood, Pennsylvania 15697-1800 (724) 925-7272
TC Measured
Point
E
CM
D
C
3-M5 Nuts
O
R
C2E1
GF
P PQ
E2
A B
H
J
E2 C1C2E1
G1 E1 G2 G2
M
N
O
2 - Mounting Holes
K
(6.5 Dia.)
L
0.110 - 0.5 Tab S
T
C1
V
E2 G2
E1 G1
U
Dual IGBTMOD™ U-Series Module
200 Amperes/ 600 Volts
Description:
Powerex IGBTMOD™ Modules are designed for use in switching applications. Each module consists of two IGBT Transistors in a half­bridge configuration with each tran­sistor having a reverse-connected super-fast recovery free-wheel diode. All components and inter­connects are isolated from the heat sinking baseplate, offering simplified system assembly and thermal management.
Features:
Low Drive PowerLow VDiscrete Super-Fast Recovery
Isolated Baseplate for Easy
CE(sat)
Free-Wheel Diode Heat Sinking
Outline Drawing and Circuit Diagram
Dimensions Inches Millimeters
J 0.43 11.0 K 0.71 18.0 L 0.16 4.0
Dimensions Inches Millimeters
M 0.47 12.0 N 0.53 13.5 O 0.1 2.5
P 0.63 16.0 Q 0.98 25.0 R 1.18 +0.04/-0.02 30.0 +1.0/-0.5
S 0.3 7.5
T 0.83 21.2 U 0.16 4.0
V 0.51 13.0
Applications:
AC Motor ControlMotion/Servo ControlUPSWelding Power SuppliesLaser Power Supplies
Ordering Information:
Example: Select the complete module number you desire from the table - i.e. CM200DU-12H is a 600V (V
), 200 Ampere Dual
CES
IGBTMOD™ Power Module.
Current Rating V
Type Amperes Volts (x 50)
CM 200 12
CES
29
29
Powerex, Inc., 200 Hillis Street, Youngwood, Pennsylvania 15697-1800 (724) 925-7272
CM200DU-12H Dual IGBTMOD™ U-Series Module
200 Amperes/600 Volts
Absolute Maximum Ratings, Tj = 25 °C unless otherwise specified
Ratings Symbol CM200DU-12H Units
Junction T emper ature T Storage Temperature T Collector-Emitter Voltage (G-E SHORT) V Gate-Emitter Voltage (C-E SHORT) V Collector Current (Tc = 25°C) I Peak Collector Current I Emitter Current** (Tc = 25°C) I Peak Emitter Current** I Maximum Collector Dissipation (Tc = 25°C, Tj 150°C) P
j
stg CES GES
C
CM
E
EM
c
Mounting Torque, M5 Main Ter minal 31 in-lb Mounting Torque, M6 Mounting 40 in-lb Weight 310 Grams Isolation Voltage (Main Terminal to Baseplate, AC 1 min.) V
* Pulse width and repetition rate should be such that the device junction temperature (Tj) does not exceed T **Represents characteristics of the anti-parallel, emitter-to-collector free-wheel diode (FWDi).
iso
-40 to 150 °C
-40 to 125 °C 600 Volts ±20 Volts
200 Amperes
400* Amperes
200 Amperes
400* Amperes
650 Watts
2500 Volts
rating.
j(max)
Static Electrical Characteristics, Tj = 25 °C unless otherwise specified
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Collector-Cutoff Current I Gate Leakage Voltage I Gate-Emitter Threshold Voltage V Collector-Emitter Saturation Voltage V
CES GES
GE(th)
CE(sat)
VCE = V VGE = V
, VGE = 0V 1 mA
CES
, VCE = 0V 0.5 µA
GES
IC = 20mA, VCE = 10V 4.5 6 7.5 Volts
IC = 200A, VGE = 15V, Tj = 25°C 2.4 3.0 Volts
IC = 200A, VGE = 15V, Tj = 125°C 2.6 Volts Total Gate Charge Q Emitter-Collector Voltage** V
**Represents characteristics of the anti-parallel, emitter-to-collector free-wheel diode (FWDi).
G
EC
VCC = 300V, IC = 200A, VGE = 15V 400 nC
IE = 200A, VGE = 0V 2.6 Volts
Dynamic Electrical Characteristics, Tj = 25 °C unless otherwise specified
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Input Capacitance C Output Capacitance C Reverse Transfer Capacitance C Resistive Turn-on Delay Time t Load Rise Time t Switch Turn-off Delay Time t Times Fall Time t Diode Reverse Recovery Time** t Diode Reverse Recovery Charge** Q
**Represents characteristics of the anti-parallel, emitter-to-collector free-wheel diode (FWDi).
ies oes res
d(on)
r
d(off)
f
rr
rr
VCE = 10V, VGE = 0V 9.6 nf
VCC = 300V, IC = 200A, 150 ns
V
= V
GE1
GE2
RG = 3.1V, Resistive 300 ns
Load Switching Operation 300 ns IE = 200A, diE/dt = -400A/µs 160 ns IE = 200A, diE/dt = -400A/µs 0.48 µC
= 15V, 400 ns
17.6 nf
2.6 nf
Thermal and Mechanical Characteristics, Tj = 25 °C unless otherwise specified
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Thermal Resistance, Junction to Case R Thermal Resistance, Junction to Case R Contact Thermal Resistance R
30
30
Q Per IGBT 1/2 Module 0.19 °C/W
th(j-c)
D Per FWDi 1/2 Module 0.35 °C/W
th(j-c)
th(c-f)
Per Module, Thermal Grease Applied 0.035 °C/W
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