POWEREX CM1200HA-34H Datasheet

MITSUBISHI HVIGBT MODULES
CM1200HA-34H
HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules
INSULATED TYPE
CM1200HA-34H
IC................................................................ 1200A
HIGH POWER SWITCHING USE
V
CES ....................................................... 1700V
1-element in a pack
APPLICATION
Inverters, Converters, DC choppers, Induction heating, DC to DC converters.
OUTLINE DRAWING & CIRCUIT DIAGRAM Dimensions in mm
130 114
4 - M8 NUTS
20
±0.25
30
140
124
6 - φ 7 MOUNTING HOLES
14.5
C
C
G E
E
CIRCUIT DIAGRAM
35
11
C
E
5
C
E
CM
3 - M4 NUTS
57
±0.25
C
16.5
18
E
18.5
2.5
61.5
57
±0.25
C
E
G
38
5
HVIGBT MODULES (High Voltage Insulated Gate Bipolar Transistor Modules)
28
LABEL
31.5
Feb. 2000
MITSUBISHI HVIGBT MODULES
CM1200HA-34H
HIGH POWER SWITCHING USE
HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules
MAXIMUM RATINGS (Tj = 25°C)
Symbol Item Conditions UnitRatings
CES
V VGES IC ICM IE IEM PC Tj Tstg Viso
Collector-emitter voltage Gate-emitter voltage
Collector current
(Note 2)
Emitter current
(Note 2)
Maximum collector dissipation
(Note 3)
Junction temperature Storage temperature Isolation voltage
Mounting torque
Mass
ELECTRICAL CHARACTERISTICS (Tj = 25°C)
Symbol Item Conditions
CES
I V
GE(th)
IGES VCE(sat)
Cies Coes Cres QG td (on) tr td (off) tf VEC trr Qrr Rth(j-c)Q Rth(j-c)R Rth(c-f)
Note 1. Pulse width and repetition rate should be such that the device junction temp. (Tj) does not exceed Tjmax rating.
Collector cutoff current Gate-emitter threshold voltage Gate-leakage current Collector-emitter saturation voltage Input capacitance Output capacitance Reverse transfer capacitance Total gate charge Turn-on delay time Turn-on rise time Turn-off delay time Turn-off fall time
(Note 2)
Emitter-collector voltage
(Note 2)
Reverse recovery time
(Note 2)
Reverse recovery charge Thermal resistance
Contact thermal resistance
2. I
E, VEC, trr, Qrr & die/dt represent characteristics of the anti-parallel, emitter to collector free-wheel diode.
3. Junction temperature (T
4. Pulse width and repetition rate should be such as to cause negligible temperature rise.
j) should not increase beyond 150°C.
GE = 0V
V
CE = 0V
V
C = 25°C
T Pulse (Note 1)
C = 25°C
T Pulse (Note 1)
C = 25°C, IGBT part
T
— Charged part to base plate, rms, sinusoidal, AC 60Hz 1min. Main terminals screw M8 Mounting screw M6 Auxiliary terminals screw M4 Typical value
VCE = VCES, VGE = 0V
C = 120mA, VCE = 10V
I V
GE = VGES, VCE = 0V j = 25°C
T
j = 125°C
T V
CE = 10V GE = 0V
V
CC = 850V, IC = 1200A, VGE = 15V
V
CC = 850V, IC = 1200A
V
GE1 = VGE2 = 15V
V
G = 1.6
R
I
C = 1200A, VGE = 15V (Note 4)
Resistive load switching operation
E = 1200A, VGE = 0V
I
E = 1200A
I die / dt = –2400A / µs Junction to case, IGBT part Junction to case, FWDi part Case to fin, conductive grease applied
12500 –40 ~ +150 –40 ~ +125
6.67 ~ 13.00
2.84 ~ 6.00
0.88 ~ 2.00
Limits
Min Typ Max
— — — — — — — — — — — — — — — —
0.008
INSULATED TYPE
1700
±20 1200 2400 1200 2400
4000
1.5
5.54.5
2.75
3.30 140
20.0
7.6
6.6 — — — —
2.40 — 200 — —
24
6.5
0.5
3.58 — — — — —
1.20
1.50
2.00
0.60
3.12
2.00 —
0.010
0.032 —
V V A A A A
W
°C °C
V N·m N·m N·m
kg
Unit
mA
V
µA
V
nF nF nF
µC
µs µs µs µs
V
µs
µC
K/W K/W K/W
HVIGBT MODULES (High Voltage Insulated Gate Bipolar Transistor Modules)
Feb. 2000
Loading...
+ 2 hidden pages