POWEREX CM100TF-24H Datasheet

CM100TF-24H
Powerex, Inc., 200 Hillis Street, Youngwood, Pennsylvania 15697-1800 (724) 925-7272
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Outline Drawing and Circuit Diagram
Six-IGBT IGBTMOD™ H-Series Module
100 Amperes/1200 Volts
Description:
Powerex IGBTMOD™ Modules are designed for use in switching applications. Each module consists of six IGBT Transistors in a three phase bridge configuration, with each transistor having a reverse­connected super-fast recovery free-wheel diode. All components and interconnects are isolated from the heat sinking baseplate, offering simplified system assem­bly and thermal management.
Features:
Low Drive PowerLow VDiscrete Super-Fast Recovery
High Frequency OperationIsolated Baseplate for Easy
CE(sat)
(135ns) Free-Wheel Diode (20-25kHz)
Heat Sinking
Dimensions Inches Millimeters
A 4.21 107.0 B 4.02 102.0 C 3.543±0.01 90.0±0.25 D3.15±0.0180.0±0.25 E1.57 40.0 F 1.38 35.0 G 1.28 32.5 H 1.26 Max. 32.0 Max
J 1.18 30.0 K 0.98 25.0 L 0.96 24.5 M 0.79 20.0 N 0.67 17.0
Dimensions Inches Millimeters
P 0.57 14.5 Q 0.55 14.0 R 0.47 12.0 S 0.43 11.0 T 0.39 10.0 U 0.33 8.5 V 0.30 7.5
W 0.24 Rad. Rad. 6.0
X 0.24 6.0 Y 0.22 5.5 Z M5 Metric M5
AA 0.08 2.0
Applications:
AC Motor ControlMotion/Servo ControlUPSWelding Power SuppliesLaser Power Supplies
Ordering Information:
Example: Select the complete part module number you desire from the table below -i.e. CM100TF-24H is a 1200V (V
), 100 Ampere
CES
Six-IGBT IGBTMOD™ Power Module.
Type Current Rating V
Amperes Volts (x 50)
CM 100 24
CES
343
Powerex, Inc., 200 Hillis Street, Youngwood, Pennsylvania 15697-1800 (724) 925-7272
CM100TF-24H Six-IGBT IGBTMOD™ H-Series Module
100 Amperes/1200 Volts
Absolute Maximum Ratings, Tj = 25 °C unless otherwise specified
Ratings Symbol CM100TF-24H Units
Junction Temperature T Storage Temperature T Collector-Emitter Voltage (G-E SHORT) V Gate-Emitter Voltage V Collector Current I Peak Collector Current I Diode Forward Current I Diode Forward Surge Current I Power Dissipation P
j
stg CES GES
C
CM
F
FM
d
Max. Mounting Torque M5 Terminal Screws 17 in-lb Max. Mounting Torque M5 Mounting Screws 17 in-lb Module Weight (T ypical) 830 Grams V Isolation V
* Pulse width and repetition rate should be such that device junction temperature does not exceed the device rating.
RMS
–40 to 150 °C –40 to 125 °C
1200 Volts
±20 Volts 100 Amperes
200* Amperes
100 Amperes
200* Amperes
780 Watts
2500 Volts
Static Electrical Characteristics, Tj = 25 °C unless otherwise specified
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Collector-Cutoff Current I Gate Leakage Current I Gate-Emitter Threshold V oltage V Collector-Emitter Saturation Voltage V
CES GES
GE(th)
CE(sat)
VCE = V VGE = V
, VGE = 0V 1.0 mA
CES
, VCE = 0V 0.5
GES
µ
IC = 10mA, VCE = 10V 4.5 6.0 7.5 Volts
IC = 100A, VGE = 15V 2.5 3.4** V olts
A
IC = 100A, VGE = 15V, Tj = 150°C 2.25 Volts Total Gate Charge Q Diode Forward Voltage V
** Pulse width and repetition rate should be such that device junction temperature rise is negligible.
G
FM
VCC = 600V, IC = 100A, VGS = 15V 500 nC
IE = 100A, VGS = 0V 3.4 V olts
Dynamic Electrical Characteristics, Tj = 25 °C unless otherwise specified
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Input Capacitance C Output Capacitance C Reverse Transfer Capacitance C Resistive Turn-on Delay Time t
d(on)
Load Rise Time t Switch Turn-off Delay Time t
d(off)
Times Fall Time t Diode Reverse Recovery Time t Diode Reverse Recovery Charge Q
ies
oes
res
rr
VGE = 0V, VCE = 10V, f = 1MHZ 7 nF
r
f
VCC = 600V, IC = 100A, 350 ns
V
GE1
= V
= 15V, RG = 3.1 300 ns
GE2
IE = 100A, diE/dt = –200A/µs––250ns
rr
IE = 100A, diE/dt = –200A/µs 0.74
–– 20nF
4 nF – 250 ns
350 ns
µ
C
Thermal and Mechanical Characteristics, Tj = 25 °C unless otherwise specified
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Thermal Resistance, Junction to Case R Thermal Resistance, Junction to Case R Contact Thermal Resistance R
th(j-c) th(j-c) th(c-f)
Per Module, Thermal Grease Applied 0.025 °C/W
Per IGBT 0.16 °C/W Per FWDi 0.35 °C/W
344
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