Philips UMA1016AT, UMA1016xT, UMA1016BT Datasheet

DATA SH EET
Product specification Supersedes data of June 1992 File under Integrated Circuits, IC03
1995 Jul 12
INTEGRATED CIRCUITS
UMA1016xT
1995 Jul 12 2
Philips Semiconductors Product specification
Frequency synthesizer for radio communication equipment
UMA1016xT
FEATURES
RF input frequencies to 1 GHz
Fully programmable RF divider
3-wire serial bus interface
On-chip 3 to 16 MHz crystal oscillator
Mask programmable ÷2to÷31 reference divider ratio
Up to 1 MHz channel spacing
Crystal frequency buffered output
Dual register architecture for fast Tx/Rx switching in
TDD single synthesizer systems
Phase detector compensated for supply and temperature variations
Power-down mode.
APPLICATIONS
900 MHz cordless telephones
Portable battery-powered radio equipment.
GENERAL DESCRIPTION
The UMA1016xT is a low power synthesizer for radio communications. Manufactured in bipolar technology, it is designed for a 70 to 1000 kHz channel spacing in the 500 to 1000 MHz band. The channel is programmed via a 3-wire serial bus. The internal dual register architecture allows a single synthesizer to be used in TDD systems. Fast switching between transmit and receive frequencies is achieved without the need for bus overhead. It also incorporates a sensitive, low power RF divider and a dead-zone-eliminated 3-state phase comparator. A power-down mode enables the circuit to be idled.
QUICK REFERENCE DATA
ORDERING INFORMATION
Notes
1. UMA1016AT has a Reference Division Factor of 27.
2. UMA1016AT has a Reference Division Factor of 16.
3. UMA1016xT is a customized version.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
V
CC
supply voltage 4.5 5.5 V
V
DD
supply voltage 4.5 5.5 V
I
CC
+ I
DD
supply current 12 mA
I
DD(pd)
digital supply current in power-down 0.8 mA
f
ref
phase comparator frequency 70 250 1000 kHz
RF
I
RF input frequency T
amb
= 10 to +70°C 500 800 MHz
T
amb
= 0 to +70°C 500 1000 MHz
T
amb
operating ambient temperature 10 +70 °C
TYPE
NUMBER
PACKAGE
NAME PIN POSITION VERSION
UMA1016AT
(1)
SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
UMA1016BT
(2)
SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
UMA1016xT
(3)
SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
1995 Jul 12 3
Philips Semiconductors Product specification
Frequency synthesizer for radio communication equipment
UMA1016xT
BLOCK DIAGRAM
Fig.1 Block diagram.
handbook, full pagewidth
MGA193 - 1
REGISTER
Tx
LATCH
RF
DIVIDER
Rx
LATCH
OSCILLATOR
BIAS
GENERATORS
PHASE
DETECTOR
INTERFACE
Ck DQ
AMPLIFIER
BUFFER
DIVIDER
2 – 31
.
.
REGISTER
Tx
LATCH
MAIN
DIVIDER
Rx
LATCH
12
3
4
5
6
7
16
15
14
12
11
10
9
CP
V
CC
AGND
Tx/Rx
EN
CK
DATA
RO1 RO2
V
DD
REFCK
HPDN
DGND
RFI
UMA1016XT
1995 Jul 12 4
Philips Semiconductors Product specification
Frequency synthesizer for radio communication equipment
UMA1016xT
PINNING
SYMBOL PIN DESCRIPTION
RO1 1 crystal oscillator input or TCXO
input RO2 2 oscillator output to crystal circuit V
DD
3 5 V supply to digital section
REFCK 4 reference crystal frequency
buffered output HPDN 5 Hardware Power-Down Not;
IC operates when pin is HIGH DGND 6 digital ground RFI 7 1 GHz RF signal input i.c. 8 internally connected DATA 9 programming bus data input CK 10 programming bus clock input EN 11 programming bus enable input
(active LOW) TX/
RX 12 transmit (HIGH)/receive (LOW)
mode select input i.c. 13 internally connected AGND 14 analog ground V
CC
15 5 V supply to charge pump
circuit CP 16 charge pump output
Fig.2 Pin configuration.
handbook, halfpage
1 2 3 4 5 6 7 8
16 15 14 13 12 11 10
9
CP V
CC
AGND i.c. TX/RX
EN CK DATA
RO1
RO2 V
DD
REFCK
HPDN
DGND
RFI
i.c.
UMA1016XT
MGA192 - 1
FUNCTIONAL DESCRIPTION General
The UMA1016xT is a low power synthesizer for radio communications in the range 500 to 1000 MHz. It includes an oscillator circuit, reference divider, RF divider, 3-state phase and frequency comparator, charge pump and main control circuit for the transfer of serial data into two internal registers.
V
DD
supplies power to the digital circuits while VCC powers the charge pump. VDD and VCC are nominally 5 V but will operate in the range 4.5 V to 5.5 V.
Reduced noise coupling is facilitated by separate digital and analog ground pins which must always be externally connected to the same DC potential to prevent the flow of large currents across the die.
The synthesizer is placed in idle mode during power-down but the oscillator and buffer remain operative and may be used as a clock for system timing.
Main divider
The main divider is a fully programmable pulse-swallow type. Following a sensitive (50 mV, 13 dBm) input amplifier, the RF signal is applied to a 13-bit divider (MD13 to MD1). The division ratio is provided via the serial bus to two 13-bit latches, corresponding to transmit and receive frequencies. The serial programming register is written to under processor control, independently of divider operation. This removes difficulty if using a low data bus transmission speed. The new ratio is transferred to the appropriate latch when the programming enable signal (
EN) returns HIGH.
The last register bit (PB0) is used to determine whether the new value is loaded into the transmit (PB0 = 1) or receive (PB0 = 0) frequency latch. To avoid spurious phase changes, the divider incorporates the new ratio only at the end of the on-going reference period. The minimum division ratio is 512. One reference cycle is required to update a new ratio. Internal power-on occurs rapidly.
1995 Jul 12 5
Philips Semiconductors Product specification
Frequency synthesizer for radio communication equipment
UMA1016xT
Oscillator
External capacitive feedback is applied to the common collector Colpitts oscillator which has high voltage supply rejection and negligible temperature drift. It is designed to function as an input buffer without the need for external components when a TCXO or other clock is used. A separate output buffer, which remains active during power-down (HPDN taken LOW), provides a TTL compatible signal to drive external logic circuits (REFCK).
Reference divider
The reference divider has a fixed divider ratio set by metal masking between 2 and 31. For example, a 4 MHz crystal connected to the oscillator and a ÷16 ratio allows a channel spacing of 250 kHz. Other frequencies and ratios are possible.
Phase comparator
The phase comparator combines a phase and frequency detector and charge pump (see Fig.3). The charge pump current is internally fixed and determined for fast switching. It is compensated against power supply and temperature variation.
The detector is assembled from dual D-type flip-flops which, together with feedback, remove the ‘dead’ zone. Upon the detection of a phase error, either UP or DO go HIGH. This gates the appropriate current generator to source or sink 1.75 mA at the output pin. When no phase error is detected, CP becomes 3-state. The tuning voltage of the VCO is established from the sum of the current pulses into the loop filter.
A simple passive loop filter may be used to offer high performance without requiring an operational-amp. The phase comparator function is summarized in Table 2.
Main control interface
The programming control interface permits access to two internal latches, denoted Tx and Rx. The serial input bits on DATA, entered MSB first, are converted to a parallel word and stored in the appropriate latch under the control of the last entered register bit (PB0). When this is set
HIGH, data serially fed to the register is loaded into the transmit (Tx) latch; when PB0 is LOW, the data is transferred to the receive latch (Rx).
The data sent to the synthesizer is loaded in bursts framed by the signal
EN. Programming clock edges, together with their appropriate data bits, are ignored until EN becomes active (LOW). The internal latches are updated with the latest programming data whenEN returns inactive (HIGH). Only the last 15 bits serially clocked into the device are retained within the programming register. One extra shift register bit (PB7) can be internally added via metal masking to allow direct software compatibility with a 7-bit swallow counter and a 64/65 dual-modulus prescaler. No check is made on the number of clock pulses received during the time that programming is enabled. EN going HIGH while CLOCK is still LOW generates an active clock edge causing a shift of the data bits.
Data programmed into the register is lost during power-down (HPDN taken LOW). The maximum serial bus clock speed is specified as 5 MHz. Minimum speed is limited by the clock edge rise and fall times to ensure that no data transparency condition can exist.
Independent of any serial programming activity, the RF divider chain uses the data previously stored within the selected latch to determine the synthesized channel frequency. The Tx/Rx signal controls which latch is read to preload the counter bits at each division cycle. When new data is updated into the device, it is used during the cycle following latch selection by the Tx/Rx control line.
If the Tx/Rx line is tied LOW, only data loaded into the Rx latch is used. In this event the serial data stream clocked into the synthesizer must terminate with an ‘0’. The logic diagram for the first bits of the programming interface is shown in Fig.3. The other bits are processed in a similar manner by a further 9 stages of the shift register-latches-multiplexer.
The signals supplied to the circuit are described by the timing diagram. The table of values has been specified for maximum bus speed. Under slow clocking conditions, rise and fall times must not be excessively slow.
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