Philips UDA1325 User Manual

Page 1
INTEGRATED CIRCUITS
DATA SH EET
UDA1325
Universal Serial Bus (USB) CODEC
Preliminary specification File under Integrated Circuits, IC01
1999 May 10
Page 2
Universal Serial Bus (USB) CODEC UDA1325
FEATURES General
• High Quality USB-compliant Audio/HID device
• Supports 12 Mbits/s serial data transmission
• Fully USB Plug and Play operation
• Supports ‘Bus-powered’ and ‘Self-powered’ operation
• 3.3 V power supply
• Low power consumption with optional efficient power
control
• On-chip clock oscillator, only an external crystal is required.

Audio playback channel

• One isochronous output endpoint
• Supports multiple audio data formats (8, 16 and 24 bits)
• Adaptive sample frequency support from 5 to 55 kHz
• One master 20-bit I2S digital stereo playback output,
I2S and LSB justified serial formats
• One slave 20-bit I2S digital stereo playback input, I2S and LSB justified serial formats
• Selectable volume control for left and right channel
• Soft mute control
• Digital bass and treble tone control
• Selectable on-chip digital de-emphasis
• Low total harmonic distortion (typical 90 dB)
• High signal-to-noise ratio (typical 95 dB)
• One stereo Line output.

Audio recording channel

• One isochronous input endpoint
• Supports multiple audio data formats (8, 16 and 24 bits)
• Twelve selectable sample rates (4, 8, 16 or 32 kHz;
5.5125, 11.025, 22.05 or 44.1 kHz; 6, 12, 24 or 48 kHz) via analog PLL (APLL).
• Selectable sample rate between 5 to 55 kHz via a second oscillator (optional)
• One slave 20-bit I2S digital stereo recording input, I2S and LSB justified serial formats
• Programmable Gain Amplifier for left and right channel
• Low total harmonic distortion (typical 85 dB)
• High signal-to-noise ratio (typical 90 dB)
• One stereo Line/Microphone input.

USB endpoints

• 2 control endpoints
• 2 interrupt endpoints
• 1 isochronous data sink endpoint
• 1 isochronous data source endpoint.

Document references

•
“USB Specification”
•
“USB Device Class Definition for Audio Devices”
•
“Device Class Definition for Human Interface Devices (HID)”
•
“USB HID Usage Table”
•
“USB Common Class Specification”
.
.
1999 May 10 2
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Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325

APPLICATIONS

• USB monitors
• USB speakers
• USB microphones
• USB headsets
• USB telephone/answering machines
• USB links in consumer audio devices.

GENERAL DESCRIPTION

The UDA1325 is a single chip stereo USB codec incorporating bitstream converters designed for implementation in USB-compliant audio peripherals and multimedia audio applications. It contains a USB interface, an embedded microcontroller, an Analog-to-Digital Interface (ADIF) and an Asynchronous Digital-to-Analog Converter (ADAC).
The USB interface consists of an analog front-end and a USB processor. The analog front-end transforms the differential USB data into a digital data stream. The USB processor buffers the incoming and outgoing data from the analog front-end and handles all low-level USB protocols. The USB processor selects the relevant data from the universal serial bus, performs an extensive error detection and separates control information and audio information. The control information is made accessible to the microcontroller. At playback, the audio information becomes available at the digital I module or is fed directly to the ADAC. At recording, the audio information is delivered by the ADIF or by the digital I2S input of the I2S-bus interface.
2
S output of the digital I/O
All I2S inputs and I2S outputs support standard I2S-bus format and the LSB justified serial data format with word lengths of 16, 18 and 20 bits.
Via the digital I/O module with its I2S input and output, an external DSP can be used for adding extra sound processing features for the audio playback channel.
The microcontroller is responsible for handling the high-level USB protocols, translating the incoming control requests and managing the user interface via general purpose pins and an I2C-bus.
The ADAC enables the wide and continuous range of playback sampling frequencies. By means of a Sample Frequency Generator (SFG), the ADAC is able to reconstruct the average sample frequency from the incoming audio samples. The ADAC also performs the playback sound processing. The ADAC consists of a FIFO, an unique audio feature processing DSP, the SFG, digital filters, a variable hold register, a Noise Shaper (NS) and a Filter Stream DAC (FSDAC) with line output drivers. The audio information is applied to the ADAC via the USB processor or via the digital I2S input of the digital I/O module.
The ADIF consists of an Programmable Gain Amplifier (PGA), an Analog-to-Digital Converter (ADC) and a Decimator Filter (DF). An Analog Phase Lock Loop (APLL) or oscillator is used for creating the clock signal of the ADIF. The clock frequency for the ADIF can be controlled via the microcontroller. Several clock frequencies are possible for sampling the analog input signal at different sampling rates.
The wide dynamic range of the bitstream conversion technique used in the UDA1325 for both the playback and recording channel guarantees a high audio sound quality.

ORDERING INFORMATION

TYPE NUMBER
NAME DESCRIPTION VERSION
UDA1325PS SDIP42 plastic shrink dual in-line package; 42 leads (600 mil) SOT270-1 UDA1325H QFP64 plastic quad flat package; 64 leads (lead length 1.95 mm);
body 14 × 20 × 2.8 mm
1999 May 10 3
PACKAGE
SOT319-2
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Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supplies
V
DDE
V
DDI
I
DD(tot)
I
DD(tot)(ps)
Dynamic performance DAC
(THD + N)/S total harmonic distortion plus
S/N signal-to-noise ratio at bipolar zero A-weighted at code 0000H 90 95 − dBA V
o(FS)(rms)
supply voltage periphery 4.75 5.0 5.25 V supply voltage core 3.0 3.3 3.6 V total supply current − 60 tbf mA total supply current in power-saving
note 1 − 360 −µA
mode
= 44.1 kHz; RL=5kΩ
f
s
noise-to-signal ratio
f
= 1 kHz (0 dB) −−90 −80 dB
i
− 0.0032 0.01 %
f
= 1 kHz (−60 dB) −−30 −20 dB
i
− 3.2 10 %
full-scale output voltage
VDD= 3.3 V − 0.66 − V
(RMS value)
Dynamic performance PGA and ADC
(THD + N)/S total harmonic distortion plus
noise-to-signal ratio
f
= 44.1 kHz;
s
PGA gain = 0 dB
f
= 1 kHz; (0 dB);
i
Vi= 1.0 V (RMS) f
= 1 kHz (−60 dB) −−30 −20 dB
i
−−85 −80 dB
− 0.0056 0.01 %
− 3.2 10.0 %
S/N signal-to-noise ratio V
= 0.0 V 90 95 − dBA
i
General characteristics
f
i(s)
T
amb
audio input sample frequency 5 − 55 kHz operating ambient temperature 0 25 70 °C
Note
1. Exclusive the IDDE current which depends on the components connected to the I/O pins.
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Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325

BLOCK DIAGRAM

handbook, full pagewidth
V
SSX
XTAL1b XTAL2b
V
DDX
V
DDA3 XTAL2a XTAL1a
V
SSA3
GP2/DO
GP3/WSO
GP4/BCKO
GP1/DI
GP0/BCKI
GP5/WSI
24 (19) 25 (20) 26 (21) 28 (22) 52 (39) 53 (40) 54 (41) 55 (42)
63 (4) 1 (5) 2 (6) 13 (14) 17 (16) 15 (15)
OSC
48 MHz
OSC ADC
CLK 27
TIMING
ANALOG
PLL
D+ 8 (9) 6 (8)
ANALOG FRONT-END
USB-PROCESSOR
D−
P0.7 to P0.0
7, 5, 3, 64, 62, 60, 58, 56
DIGITAL I/O
P2.0 to P2.7 14, 16, 18, 20,
22, 23, 29, 30
MICRO-
CONTROLLER
(10) 9 (11) 10 (12) 11 (13) 12 (23) 32 (24) 33 (29) 38 (30) 39 (33) 42 (35) 44
(17) 19 (18) 21
V V V V V V V V V V
SCL SDA
DDI SSI SSE DDE DDO SSO DDA1 SSA1 DDA2 SSA2
PSEN
WS
BCK
ALE
VINL
VINR
VRN VRP
31
57 (1)
DA
59 (2) 61 (3)
48
EA
50
43 (34)
47 (36)
49 (37) 51 (38)
PGA
PGA
INTERFACE
MUX
SAMPLE
I2S-BUS
LEFT
Σ∆ ADC
DECIMATOR
FILTER
FREQUENCY GENERATOR
UDA1325
RIGHT
Σ∆ ADC
REFERENCE VOLTAGE
45, 46 41 (32) 40 (31) n.c.
V
ref(AD)
V
FIFO
AUDIO FEATURE
PROCESSING DSP
UPSAMPLE FILTERS
VARIABLE HOLD REGISTER
3rd-ORDER NOISE SHAPER
ref(DA)
LEFT
DAC
RIGHT
DAC
TEST
CONTROL
BLOCK
− +
+
−
(7) 4 (26) 35 (27) 36
(25) 34
(28) 37
MGM108
SHTCB TC RTCB
VOUTL
VOUTR
The pin numbers given in parenthesis refer to the SDIP42 version.
Fig.1 Block diagram (QFP64 package).
1999 May 10 5
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Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325

PINNING

SYMBOL
PIN
QFP64
PIN
SDIP42
I/O DESCRIPTION
GP3/WSO 1 5 I/O general purpose pin 3 or word select output GP4/BCKO 2 6 I/O general purpose pin 4 or bit clock output P0.5 3 − I/O Port 0.5 of the microcontroller SHTCB 4 7 I shift clock of the test control block (active HIGH) P0.6 5 − I/O Port 0.6 of the microcontroller D− 6 8 I/O negative data line of the differential data bus, conforms to the USB
standard P0.7 7 − I/O Port 0.7 of the microcontroller D+ 8 9 I/O positive data line of the differential data bus, conforms to the USB
standard V V V V
DDI SSI SSE DDE
910−digital supply voltage for core 10 11 − digital ground for core 11 12 − digital ground for I/O pads 12 13 − digital supply voltage for I/O pads
GP1/DI 13 14 I/O general purpose pin 1 or data input P2.0 14 − I/O Port 2.0 of the microcontroller GP5/WSI 15 15 I/O general purpose pin 5 or word select input P2.1 16 − I/O Port 2.1 of the microcontroller GP0/BCKI 17 16 I/O general purpose pin 0 or bit clock input P2.2 18 − I/O Port 2.2 of the microcontroller SCL 19 17 I/O serial clock line I
2
C-bus P2.3 20 − I/O Port 2.3 of the microcontroller SDA 21 18 I/O serial data line I
2
C-bus P2.4 22 − I/O Port 2.4 of the microcontroller P2.5 23 − I/O Port 2.5 of the microcontroller V
SSX
24 19 − crystal oscillator ground (48 MHz) XTAL1b 25 20 I crystal input (analog; 48 MHz) XTAL2b 26 21 O crystal output (analog; 48 MHz) CLK 27 − O 48 MHz clock output signal V
DDX
28 22 − supply crystal oscillator (48 MHz) P2.6 29 − I/O Port 2.6 of the microcontroller P2.7 30 − I/O Port 2.7 of the microcontroller PSEN 31 − I/O program store enable (active LOW) V V
DDO SSO
32 23 − supply voltage for operational amplifier
33 24 − operational amplifier ground VOUTL 34 25 O voltage output left channel TC 35 26 I test control input (active HIGH) RTCB 36 27 I asynchronous reset input of the test control block (active HIGH) VOUTR 37 28 O voltage output right channel
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Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325
SYMBOL
V
DDA1
V
SSA1
V
ref(DA)
V
ref(AD)
V
DDA2
PIN
QFP64
38 29 − analog supply voltage 1
39 30 − analog ground 1
40 31 O reference voltage output DAC
41 32 O reference voltage output ADC
42 33 − analog supply voltage 2
PIN
SDIP42
I/O DESCRIPTION
VINL 43 34 I input signal left channel PGA V
SSA2
44 35 − analog ground 2 n.c. 45 −−not connected n.c. 46 −−not connected VINR 47 36 I input signal right channel PGA EA 48 −−external access (active LOW) VRN 49 37 I negative reference input voltage ADC ALE 50 −−address latch enable (active HIGH) VRP 51 38 I positive reference input voltage ADC V
DDA3
52 39 − supply voltage for crystal oscillator and analog PLL XTAL2a 53 40 O crystal output (analog; ADC) XTAL1a 54 41 I crystal input (analog; ADC) V
SSA3
55 42 − crystal oscillator and analog PLL ground P0.0 56 − I/O Port 0.0 of the microcontroller DA 57 1 I data Input (digital) P0.1 58 − I/O Port 0.1 of the microcontroller WS 59 2 I word select Input (digital) P0.2 60 − I/O Port 0.2 of the microcontroller BCK 61 3 I bit clock Input (digital) P0.3 62 − I/O Port 0.3 of the microcontroller GP2/DO 63 4 I/O general purpose pin 2 or data output P0.4 64 − I/O Port 0.4 of the microcontroller
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Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325
handbook, full pagewidth
GP3/WSO
GP4/BCKO
P0.5
SHTCB
P0.6
D−
P0.7
D+
V
DDI
V
SSI
V
SSE
V
DDE
GP1/DI
P2.0
GP5/WSI
P2.1
GP0/BCKI
P2.2
SCL
56
28
DDX
V
SSA3
V 55
29
P2.6
XTAL1a 54
30
P2.7
P0.4
GP2/DO
P0.3
BCK
P0.2WSP0.1DAP0.0
64
63
62
61
60
59
58
57 1 2 3 4 5 6 7 8 9
23
P2.5
UDA1325H
24
25
SSX
V
XTAL1b
26
27
CLK
XTAL2b
10 11 12 13 14 15 16 17 18 19
20
21
22
P2.3
SDA
P2.4
XTAL2a
V
53
52
31
32
PSEN
V
DDA3
51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
DDO
VRP ALE VRN EA VINR n.c. n.c. V
SSA2
VINL V
DDA2
V
ref(AD)
V
ref(DA)
V
SSA1
V
DDA1
VOUTR RTCB TC VOUTL V
SSO
MGL349
Fig.2 Pin configuration (QFP64 package).
1999 May 10 8
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Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325
FUNCTIONAL DESCRIPTION The Universal Serial Bus (USB)
Data and power is transferred via the USB over a 4-wire cable. The signalling occurs over two wires and point-to-point segments. The signals on each segment are differentially driven into a cable of 90 Ω intrinsic impedance. The differential receiver features input sensitivity of at least 200 mV and sufficient common mode
handbook, halfpage
GP3/WSO
GP4/BCKO
GP5/WSI
GP0/BCKI
DA
WS
BCK
GP2/DO
SHTCB
D− D+
V
DDI
V
SSI
V
SSE
V
DDE
GP1/DI
SCL
SDA
V
SSX
XTAL1b XTAL2b
1 2 3 4 5 6 7 8
9 10 11 12 13 14 15 16 17 18 19 20
UDA1325
MGM106
42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 2221
V
SSA3
XTAL1a XTAL2a
V
DDA3
VRP VRN VINR
V
SSA2 VINL V
DDA2 V
ref(AD) V
ref(DA) V
SSA1 V
DDA1 VOUTR
RTCB TC VOUTL
V
SSO V
DDO V
DDX
rejection.

The analog front-end

The analog front-end is an on-chip generic USB transceiver. It is designed to allow voltage levels up to V
DD
from standard or programmable logic to interface with the physical layer of the USB. It is capable of receiving and transmitting serial data at full speed (12 Mbits/s).

The USB processor

The USB processor forms the interface between the analog front-end, the ADIF, the ADAC and the microcontroller. The USB processor consists of:
• A bit clock recovery circuit
• The Philips Serial Interface Engine (PSIE)
• The Memory Management Unit (MMU)
• The Audio Sample Redistribution (ASR) module.

Bit clock recovery

The bit clock recovery circuit recovers the clock from the incoming USB data stream using four times over-sampling principle. It is able to track jitter and frequency drift specified by the USB specification.

Philips Serial Interface Engine (PSIE)

The Philips SIE implements the full USB protocol layer. It translates the electrical USB signals into data bytes and control signals. Depending upon the USB device address and the USB endpoint address, the USB data is directed to the correct endpoint buffer. The data transfer could be of bulk, isochronous, control or interrupt type.
Fig.3 Pin configuration (SDIP42 package).
1999 May 10 9
The functions of the PSIE include: synchronization pattern recognition, parallel/serial conversion, bit stuffing/de-stuffing, CRC checking/generation, PID verification/generation, address recognition and handshake evaluation/generation.
The amount of bytes/packet on all endpoints is limited by the PSIE hardware to 8 bytes/packet, except for both isochronous endpoints (336 bytes/packet).
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Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325

Memory Management Unit (MMU) and integrated RAM

The MMU and integrated RAM handle the temporary data storage of all USB packets that are received or sent over the bus.
The MMU and integrated RAM handle the differences between data rate of the USB and the application allowing the microcontroller to read and write USB packets at its own speed.
The audio data is transferred via an isochronous data sink endpoint or source endpoint and is stored directly into the RAM. Consequently, no handshaking mechanism is used.

Audio Sample Redistribution (ASR)

The ASR reads the audio samples from the MMU and integrated RAM and distributes these samples equidistant over a 1 ms frame period. The distributed audio samples are translated by the digital I/O module to standard I
2
S-bus format or 16, 18 or 20 bits LSB-justified I2S-bus format. The ASR generates the bit clock output (BCKO) and the Word Select Output signal (WSO) of the I2S output.

The 80C51 microcontroller

The microcontroller receives the control information selected from the USB by the USB processor. It can be used for handling the high-level USB protocols and the user interfaces. The microcontroller does not handle the audio stream.
The major task of the software process that is mapped upon the microcontroller, is to control the different modules of the UDA1325 in such a way that it behaves as a USB device.
The embedded 80C51 microcontroller is compatible with the 80C51 family of microcontrollers described in the 80C51 family single-chip 8-bit microcontrollers of “Data Handbook IC20”, which should be read in conjunction with this data sheet.

The Analog-to-Digital Interface (ADIF)

The ADIF is used for sampling an analog input signal from a microphone or line input and sending the audio samples to the USB interface. The ADIF consists of a stereo Programmable Gain Amplifier (PGA), a stereo Analog-to-Digital Converter (ADC) and Decimation Filters (DFs). The sample frequency of the ADC is determined by the ADC clock (see Section “The clock source of the analog-to-digital interface”). The user can also select a digital serial input instead of an analog input. In this event the sample frequency is determined by the continuous WS clock with a range between 5 to 55 kHz. Digital serial input is possible with four formats (I
2
S-bus, 16, 18 or 20 bits
LSB-justified).
Programmable Gain Amplifier circuit (PGA)
This circuit can be used for a microphone or line input. The input audio signals can be amplified by seven different gains (−3 dB, 0 dB, 3 dB, 9 dB, 15 dB, 21 dB and 27 dB).
The gain settings are given in Table 17.

The Analog-to-Digital Converter (ADC)

The stereo ADC of the UDA1325 consists of two 3rd-order Sigma-Delta modulators. They have a modified Ritchie-coder architecture in a differential switched capacitor implementation. The oversampling ratio is 128. Both ADCs can be switched off in power saving mode (left and right separate). The ADC clock is generated by the analog PLL or the ADC oscillator.

The Decimation Filter (DF)

The decimator filter converts the audio data from 128f
s
down to 1fs with a word width of 8, 16 or 24 bits. This data can be transmitted over the USB as mono or stereo in 1, 2 or 3 bytes/sample. The decimator filters are clocked by the ADC clock.
The internal ROM size is 12 kbyte. The internal RAM size is 256 byte. A Watchdog Timer is not integrated.
1999 May 10 10
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Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325

The clock source of the analog-to-digital interface

The clock source of the ADIF is the analog PLL or the ADC oscillator. The preferred clock source can be selected. The ADC clock used for the ADC and decimation filters is obtained by dividing the clock signal coming from the analog PLL or from the ADC oscillator by a factor Q.
Using the analog PLL the user can select 3 basic APLL clock frequencies (see Table 1). By connecting the appropriate crystal the user can choose any clock signal between 8.192 and 14.08 MHz via the ADC
oscillator.
Table 1 The analog PLL clock output frequencies
FCODE (1 AND 0)
APLL CLOCK
FREQUENCY (MHz)
00 11.2896 01 8.1920 10 12.2880
11 11.2896
The dividing factor Q can be selected via the microcontroller. With this dividing factor Q the user can select a range of ADC clock signals allowing several different sample frequencies (see Table 2).
Table 2 ADC clock frequencies and sample frequencies based upon using the APLL as a clock source
APLL CLOCK
FREQUENCY (MHz)
DIVIDE FACTOR Q ADC CLOCK FREQUENCY (MHz) SAMPLE FREQUENCY (kHz)
8.1920 1 4.096 32 2 2.048 16 4 1.024 8 8 0.512 (not supported) 4 (not supported)
11.2896 1 5.6448 44.1 2 2.8224 22.05 4 1.4112 11.025 8 0.7056 5.5125
12.2880 1 6.144 48 2 3.072 24 4 1.536 12 8 0.768 6
Table 3 ADC clock frequencies and sample frequencies based upon using the OSCAD as a clock source
OSCAD CLOCK
FREQUENCY (MHz)
(1)
f
osc
DIVIDE FACTOR Q ADC CLOCK FREQUENCY (MHz) SAMPLE FREQUENCY (kHz)
(2)
Q
f
/(2Q) f
osc
/(256Q)
osc
Notes
1. The oscillator frequency (and therefore the crystal) of OSCAD must be between 8.192 and 14.08 MHz.
2. The Q factor can be 1, 2, 4 or 8.
3. Sample frequencies below 5 kHz and above 55 kHz are not supported.
1999 May 10 11
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Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325

The Asynchronous Digital-to-Analog Converter (ADAC)

The ADAC receives audio data from the USB processor or from the digital I/O-bus. The ADAC is able to reconstruct the sample clock from the rate at which the audio samples arrive and handles the audio sound processing. After the processing, the audio signal is upsampled, noise-shaped and converted to analog output voltages capable of driving a line output.
The ADAC consists of:
• A Sample Frequency Generator (SFG)
• FIFO registers
• An audio feature processing DSP
• Two digital upsampling filters and a variable hold
register
• A digital Noise Shaper (NS)
• A Filter Stream DAC (FSDAC) with integrated filter and
line output drivers.

The Sample Frequency Generator (SFG)

The SFG controls the timing signals for the asynchronous digital-to-analog conversion. By means of a digital PLL, the SFG automatically recovers the applied sampling frequency and generates the accurate timing signals for the audio feature processing DSP and the upsampling filters.
The lock time of the digital PLL can be chosen (see Table 8). While the digital PLL is not in lock, the ADAC is muted. As soon as the digital PLL is in lock, the mute is released as described in Section “Soft mute control”.
Table 4 Frequency domains for audio processing by the
DSP
DOMAIN SAMPLE FREQUENCY (kHz)
1 5to12 212to25 325to40 440to55
The upsampling filters and variable hold function
After the audio feature processing DSP two upsampling filters and a variable hold function increase the oversampling rate to 128f
.
s

The noise shaper

A 3rd-order noise shaper converts the oversampled data to a noise-shaped bitstream for the FSDAC. The in-band quantization noise is shifted to frequencies well above the audio band.

The Filter Stream DAC (FSDAC)

The FSDAC is a semi-digital reconstruction filter that converts the 1-bit data stream of the noise shaper to an analog output voltage. The filter coefficients are implemented as current sources and are summed at virtual ground of the output operational amplifier. In this way very high signal-to-noise performance and low clock jitter sensitivity is achieved. A post filter is not needed because of the inherent filter function of the DAC. On-board amplifiers convert the FSDAC output current to an output voltage signal capable of driving a line output.

First-In First-Out (FIFO) registers

The FIFO registers are used to store the audio samples temporarily coming from the USB processor or from the digital I/O input. The use of a FIFO (in conjunction with the SFG) is necessary to remove all jitter present on the incoming audio signal.

The sound processing DSP

A DSP processes the sound features. The control and mapping of the sound features is explained in Section “Controlling the playback features of the ADAC”. Depending on the sampling rate (f
) the DSP knows four
s
frequency domains in which the treble and bass are regulated. The domain is chosen automatically.
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Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325

USB ENDPOINT DESCRIPTION

The UDA1325 has following six endpoints:
• USB control endpoint 0
• USB control endpoint 1
• USB status interrupt endpoint 1
• USB status interrupt endpoint 2
• Isochronous data sink endpoint
• Isochronous data source endpoint.
Table 5 Endpoint description
ENDPOINT
NUMBER
0 0 control (default) out 8
1 2 control out 8
2 4 interrupt in 8 3 5 interrupt in 8 4 6 isochronous out out 336 5 7 isochronous in in 336
CONTROLLING THE PLAYBACK FEATURES Controlling the playback features of the ADAC
The exchange of control information between the microcontroller and the ADAC is accomplished through a serial hardware interface comprising the following pins:
L3_DATA: microcontroller interface data line L3_MODE: microcontroller interface mode line L3_CLK: microcontroller interface clock line.
See also the description of Port 3 of the 80C51 microcontroller.
ENDPOINT
INDEX
1in8
3in8
ENDPOINT TYPE DIRECTION
MAX. PACKET
SIZE (BYTES)
Information transfer through the microcontroller bus is organized in accordance with the so-called ‘L3’ format, in which two different modes of operation can be distinguished; address mode and data transfer mode.
The address mode is required to select a device communicating via the L3-bus and to define the destination registers for the data transfer mode. Data transfer for the UDA1325 can only be in one direction, from microcontroller to ADAC to program its sound processing features and other functional features.
DDRESS MODE
A The address mode is used to select a device (in this case the ADAC) for subsequent data transfer and to define the
destination registers. The address mode is characterized by L3_MODE being LOW and a burst of 8 pulses on L3_CLK, accompanied by 8 data bits on L3_DATA. Data bits 0 and 1 indicate the type of the subsequent data transfer as shown in Table 6.
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Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325
Table 6 Selection of data transfer type
BIT1 BIT0 DATA TRANSFER TYPE
0 0 audio feature registers (volume left, volume right, bass and treble) 0 1 not used 1 0 control registers 1 1 not used
Data bits 7 to 2 represent a 6-bit device address, with bit 7 being the MSB and bit 2 the LSB. The address of the ADAC is 000101 (bits 7 to 2). In the event that the ADAC receives a different address, it will deselect its microcontroller interface logic.
D
AT A TRANSFER MODE
The selection preformed in the address mode remains active during subsequent data transfers, until the ADAC receives a new address command. The data transfer mode is characterized by L3_MODE being HIGH and a burst of 8 pulses on L3_CLK, accompanied by 8 data bits. All transfers are bitwise, i.e. they are based on groups of 8 bits. Data will be stored in the ADAC after the eight bit of a byte has been received. The principle of a multibyte transfer is illustrated in the figure below.
t
dbook, full pagewidth
L3MODE
L3CLOCK
L3DATA
address
ROGRAMMING THE SOUND PROCESSING AND OTHER FEATURES
P
halt
addressdata byte #1 data byte #2
MGD018
The sound processing and other feature values are stored in independent registers. The first selection of the registers is achieved by the choice of data transfer type. This is performed in the address mode, bits 1 and 0 (see Table 6). The second selection is performed by bit 7 and/or bit 6 of the data byte depending of the selected data transfer type.
Data transfer type ‘audio feature registers’
When the data transfer type ‘audio feature registers’ is selected 4 audio feature registers can be selected depending on bits 7 and 6 of the data byte (see Table 7).
1999 May 10 14
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Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325
Table 7 ADAC audio feature registers
BIT7 BIT6 BIT5 BIT4 BIT3 BIT2 BIT1 BIT0 REGISTER
0 0 VR5 VR4 VR3 VR2 VR1 VR0 volume right 0 1 VL5 VL4 VL3 VL2 VL1 VL0 volume left 1 0 X BB4 BB3 BB2 BB1 BB0 bass 1 1 X TR4 TR3 TR2 TR1 TR0 treble
The sequence for controlling the ADAC audio feature registers via the L3-bus is given in the figure below.
book, full pagewidth
(L3_MODE = LOW)
L3_DATA
(L3_MODE = HIGH)
L3_DATA
L3_CLK
DATA_TRANSFER_TYPE
0
bit 0
X
bit 0
0 1 0 1
LEFT VOLUME; TREBLE
RIGHT VOLUME; BASS
X X X X
DEVICE ADDRESS = $5
0 0 0
X
bit 7
REGISTER
ADDRESS
X X
bit 7
MGS270
Data transfer type ‘control registers’
When the data transfer type ‘control registers’ is selected 2 general control registers can be selected depending on bit 7 of the data byte (see Table 7).
The sequence for controlling the ADAC control registers via the L3-bus is given in the figure below.
book, full pagewidth
(L3_MODE = LOW)
L3_DATA
(L3_MODE = HIGH)
L3_DATA
DATA_TRANSFER_TYPE
0
bit 0
X
bit 0
1 1 0 1
X X X X
DEVICE ADDRESS = $5
0 0 0
X
bit 7
REGISTER
ADDRESSDATA OF THE CONTROL REGISTER
X X
bit 7
L3_CLK
1999 May 10 15
MGS269
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Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325
Table 8 ADAC general control registers
REGISTER BIT DESCRIPTION V ALUE COMMENT
Control register 0 0 reset ADAC 0 = not reset
1 = reset
1 soft mute control 0 = not muted
1 = mutes
2 synchronous/asynchronous 0 = asynchronous
3 channel manipulation 0 = L -> L, R -> R
4 de-emphasis 0 = de-emphasis off
6 and 5 audio mode 00 = flat mode
7 selecting bit 0
Control register 1 1 and 0 serial I
3 and 2 digital PLL mode 00 = adaptive
4 digital PLL lock mode 0 = adaptive
6 and 5 digital PLL lock speed 00 = lock after 512 samples
7 selecting bit 1
1 = synchronous
1=L->R, R->L
1 = de-emphasis on
01 = min. mode 10 = min. mode 11 = max. mode
2
S-bus input format 00 = I2S-bus
01 = 16-bit LSB justified 10 = 18-bit LSB justified 11 = 20-bit LSB justified
01 = fix state 1 10 = fix state 2 11 = fix state 3
1 = fixed
01 = lock after 2048 samples 10 = lock after 4096 samples 11 = lock after 16348 samples
select 0
select 00
select 1
select 00

Soft mute control

When the mute (bit 1 of control register 0) is active for the playback channel, the value of the sample is decreased smoothly to zero following a raised cosine curve. There are 32 coefficients used to step down the value of the data, each one being used 32 times before stepping to the next. This amounts to a mute transition of 23 ms at f the mute is released, the samples are returned to the full level again following a raised cosine curve with the same coefficients being used in reversed order.
The mute, on the master channel is synchronized to the sample clock, so that operation always takes place on complete samples.
1999 May 10 16
= 44.1 kHz. When
s
Page 17
Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325

Volume control

The volume of the UDA1325 can be controlled from 0 dB down to −60 dB (in steps of 1 dB). Below −60 dB the audio signal is muted (−∞ dB). The setting of 0 dB is always referenced to the maximum available volume setting. Independant volume control of the left and right channel is possible (balance control).
Table 9 Volume settings right playback channel
VR5 VR4 VR3 VR2 VR1 VR0 VOLUME (dB)
... ... ... ... ... ... ...
111100−59 111101−60 111110−∞ 111111−∞
Table 10 Volume settings left playback channel
VL5 VL4 VL3 VL2 VL1 VL0 VOLUME (dB)
... ... ... ... ... ... ...
111100−59 111101−60 111110−∞ 111111−∞
1999 May 10 17
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Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325

Treble control

For the playback channel, treble can be regulated in three audio modes: minimum, flat and maximum mode. In flat mode the audio is not influenced. In minimum and maximum mode, the treble range is from 0 to 6 dB in steps of 2 dB. The programmable treble filter is implemented digitally and has a fixed corner frequency of 3000 Hz for the minimum mode and 1500 Hz for the maximum mode. Because of the exceptional amount of programmable gain, treble should be used with adequate prior attenuation, using volume control.
Table 11 Treble settings
TR4 TR3 TR2 TR1 TR0
FLAT SET MIN. SET MAX. SET
00000000 00001000 00010000 00011000 00100022 00101022 00110022 00111022 01000044 01001044 01010044 01011044 01100066 01101066 01110066 01111066
... ... ... ... ... 0 6 6
11111066
TREBLE (dB)

Bass control

For the playback channel, bass can be regulated in three audio modes: minimum, flat and maximum mode. In flat mode the audio is not influenced. In minimum mode the bass range is from 0 to approximately 14 dB in steps of 1.5 dB. In maximum mode, the bass range is from 0 to approximately 24 dB in steps of 2 dB. The programmable bass filters are implemented digitally and have a fixed corner frequency of 100 Hz for the minimum mode and 75 Hz for the maximum mode. Because of the exceptional amount of programmable gain, bass should be used with adequate prior attenuation, using volume control.
1999 May 10 18
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Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325
Table 12 Bass boost settings
BB4 BB3 BB2 BB1 BB0
FLAT SET MIN. SET MAX. SET
00000000 00001000 00010000 00011000
0010001.11.7
0010101.11.7
0011002.43.6
0011102.43.6
0100003.75.4
0100103.75.4
0101005.27.4
0101105.27.4
0110006.89.4
0110106.89.4
0111008.411.3
0111108.411.3
10000010.2 13.3
10001010.2 13.3
10010011.915.2
10011011.915.2
10100013.7 17.3
10101013.7 17.3
10110013.7 19.2
10111013.7 19.2
11000013.7 21.2
11001013.7 21.2
11010013.7 23.2
11011013.7 23.2
... ... ... ... ... 0 13.7 23.2
11111013.7 23.2
BASS (dB)

De-emphasis

De-emphasis is controlled by bit 4 of control register 0. The de-emphasis filter can be switched on or off. The digital de-emphasis filter is dimensioned to produce the de-emphasis frequency characteristics for the sample rate 44.1 kHz. De-emphasis is synchronized to the sample clock, so that operation always takes place on complete samples.
1999 May 10 19
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Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325

Filter characteristics playback channel

The overall filter characteristic of the UDA1325 in flat mode is given in Fig.4 (de-emphasis off). The overall filter characteristic of the UDA1325 includes the filter characteristics of the DSP in flat mode plus the filter characteristic of the FSDAC (fs= 44.1 kHz)
handbook, full pagewidth
volume
(dB)
−100
−120
−140
−160
−0
−20
−40
−60
−80
MGM110
10 20 30 40 50 60 70 80 90 1000
f (kHz)
Fig.4 Overall filter characteristics of the UDA1325.
1999 May 10 20
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Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325

DSP extension port for enhanced playback audio processing

An external DSP can be used for adding extra sound processing features via the I2S inputs and outputs of the digital I/O module. The UDA1325 supports the standard I2S-bus data protocol and the LSB-justified serial data input format with word lengths of 16, 18 and 20 bits. Using the 4-pin digital I/O option the UDA1325 device acts as a master, controlling the BCKO and WSO signals. Using the 6-pin digital I/O option GP2, GP3 and GP4 are output pins (master) and GP0, GP1 and GP5 are input pins (slave).
The period of the WSO signal is determined by the number of samples in the 1 ms frame of the USB. This implies that the WSO signal does not have a constant time period, but is jittery.
The characteristic timing of the I2S-bus signals is illustrated in Figs 5 and 6.
handbook, full pagewidth
WS
BCK
DATA
t
r
t
BCK(H)
T
cy
RIGHT
t
f
t
s;WS
t
BCK(L)
t
h;WS
LSB MSB
Fig.5 Timing of digital I/O input signals.
t
s;DAT
LEFT
t
h;DAT
MGK003
1999 May 10 21
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1999 May 10 22
ook, full pagewidth
Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325
WS
BCK
DATA
WS
BCK
DATA
WS
BCK
DATA
WS
BCK
LEFT
>=8 >=8
MSB B2 MSBLSB LSB MSBB2
LEFT
MSB LSBB2
LEFT
MSB B2 B3 B4
LEFT
RIGHT
1516 1
321321
LSB
2
S-BUS
INPUT FORMAT I
2
B15
LSB-JUSTIFIED FORMAT 16 BITS
215161718 1
B17
LSB-JUSTIFIED FORMAT 18 BITS
2151617181920 1
RIGHT
MSB LSBB2 B15
RIGHT
MSB B2 B3 B4
RIGHT
B17
21516 1
215161718 1
LSB
2151617181920 1
DATA
MSB B2 B3 B4 B5 B6
LSB
B19
LSB-JUSTIFIED FORMAT 20 BITS
Fig.6 Input formats.
MSB B2 B3 B4 B5 B6
B19
LSB
MGK002
Page 23
Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325
PORT DEFINITION 80C51 Port 1 Table 13 Port 1 of the 80C51 microcontroller
8 BIT PORT 1
BIT FUNCTION LOW HIGH COMMENT
1.0 ADAC_error no error error
1.1 GP1 general purpose pins
1.2 GP2
1.3 GP3
1.4 GP4
1.5 GP5
2
1.6 SCL I
1.7 SDA
C-bus
Port 3 Table 14 Port 3 of the 80C51 microcontroller
8 BIT PORT 3
BIT FUNCTION LOW HIGH COMMENT
3.0 ASR_error no error error
3.1 PSIE_MMU_SUSPEND no suspend suspend suspend input from USB interface during normal operation or input from restart circuit
3.2 GP0 (INT0_N) general purpose pin
3.3 PSIE_MMU_INT (INT1_N) interrupt input from USB interface during normal operation or input from restart circuit
3.4 PSIE_MMU_READY
3.5 L3_MODE
3.6 L3_CLK
3.7 L3_DATA
1999 May 10 23
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Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325
MEMORY AND REGISTER SPACE 80C51 Overview registers Table 15 Register location and recommended values
after Power-on reset
ADDRESS REGISTER
RESET VALUE
0800h PGA gain 09 0801h ADIF control 5C 1000h clock shop settings 00 1001h reset control and APLL settings 00 1002h IO selection register 01 1003h power control 00 2000h ASR settings 8B 4000h data register PSIE 4001h command register PSIE
Table 16 Special function register location
ADDRESS REGISTER
RESET VALUE
CPU registers
81h SP 82h DPL
83h DPH D0h PSW E0h ACC F0h B
Interrupt registers
A8h IE 00h B8h IP 00h
ADDRESS REGISTER
RESET VALUE
Port registers
80h P0 FFh
90h P1 FFh A0h P2 FFh B0h P3 FFh
2
I
C registers (SIO1 registers)
D8h S1CON 00h D9h S1STA
DAh S1DAT DBh S1ADR

Interrupts

The UDA1325 supports up to five (of maximal 7) interrupt sources. Each interrupt source corresponds to an interrupt vector in the CPU program memory address space:
Source 0: vector 0003h external interrupt 0 (INT0_N) Source 1: vector 000Bh Timer 0 interrupt Source 2: vector 0013h external interrupt 1 (INT1_N) Source 3: vector 001Bh Timer 1 interrupt Source 4: vector 0023h UART interrupt (not present) Source 5: vector 002Bh Timer 2 interrupt (not present) Source 6: vector 0033h I2C interrupt.
NTERRUPT ENABLE REGISTER (IE)
I Each interrupt source can be individually enabled or
disabled by setting or clearing a bit in IE. This register also contains a global interrupt enable bit (EA) which can be cleared to disable all interrupts at once.
Timer 0 and Timer 1 registers
88h T01CON 00h
89h T01MOD 00h 8Ah T0L 00h 8Bh T1L 00h 8Ch T0h 00h 8Dh T1h 00h
PCON registers
87h PCON 00h
1999 May 10 24
76543210
0 0 0 0 0 0 0 0
Power On Value
EX0 (vector 0003h)) ET0 (vector 000Bh)) EX1 (vector 0013h) ET1 (vector 001Bh) ES0 (n.a.) ET2 (n.a.) ES1 (vector 0033h) EA
Page 25
Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325
Internal registers Table 17 PGA gain registers
ADDRESS REGISTER COMMENTS BIT VALUE
0800h PGA gain register reserved 7 X
PGA input selection 6 0 (do not change it) PGA gain right channel 5, 4 and 3 000 = −3dB
001 = 0 dB 010 = 3 dB 011=9dB 100 = 15 dB 101 = 21 dB 110=27dB 111=27dB
PGA gain left channel 2, 1 and 0 000 = −3dB
001 = 0 dB 010 = 3 dB 011=9dB 100 = 15 dB 101 = 21 dB 110=27dB 111=27dB
Table 18 ADIF control registers
ADDRESS REGISTER COMMENTS BIT VALUE
0801h ADIF control register reserved 7 X
number of bits per audio sample to be transmitted to the host
mono/stereo selection 4 0 = mono
selection audio input recording channel
selection high-pass filter of ADIF (DC-filter)
2
I
S-bus input serial input format
recording channel
6 and 5 00 = reserved
01 = 8 bits audio samples 10 = 16 bits audio samples 11 = 24 bits audio samples
1 = stereo
3 0 = digital serial audio input
1 = analog input
2 0 = high-pass filter off
1 = high-pass filter on
1 and 0 00 = I2S-bus
01 = 16-bit LSB justified 10 = 18-bit LSB justified 11 = 20-bit LSB justified
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Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325
Table 19 Clock shop register
ADDRESS REGISTER COMMENTS BIT VALUE
1000h clock shop settings selection ADC clock source 7 0 = ADC clock from APLL
1 = ADC clock from OSCAD
divide factor Q 6 and 5 00 = ADC clock divided-by-1
01 = ADC clock divided-by-2 10 = ADC clock divided-by-4 11 = ADC clock divided-by-8
clock ADAC 4 0 = enable
1 = disable
clock 48 MHz internal 3 0 = enable
1 = disable
clock recovered by PSIE 2 0 = enable
1 = disable
ADC clock 1 0 = enable
1 = disable
OSCAD oscillator 0 0 = power on
1 = power off
Table 20 Reset control and APLL register
ADDRESS REGISTER COMMENTS BIT VALUE
1001h reset control and APLL
settings
fcode (1 and 0) clock frequency selection APLL
reserved 5 X reset ADAC 4 0 = reset off
reset MMU 3 0 = reset off
reset digital I/O-interface 2 0 = reset off
reset ADIF 1 0 = reset off
reserved 0 X
7 and 6 00 = 256 × 44.1 kHz
01 = 256 × 32 kHz 10 = 256 × 48 kHz 11 = 256 × 44.1 kHz
1 = reset on
1 = reset on
1 = reset on
1 = reset on
1999 May 10 26
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Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325
Table 21 I/O selection register
ADDRESS REGISTER COMMENTS BIT VALUE
1002h I/O selection register microcontroller control on
48 MHz oscillator
audio format 6 and 5 00 = 4-pins I
GP4 I/O if BIT0 = 1 4 0 = output
GP3 I/O if BIT0 = 1 3 0 = output
GP2 I/O if BIT0 = 1 2 0 = output
GP1 I/O if BIT0 = 1 1 0 = output
GP4 to GP1 function 0 0 = I
7 0 = UPC control disabled
(48 MHz oscillator is enabled) 1 = UPC control enabled
2
S 01 = 6-pins I2S 10 = 3-pins I2S (only input) 11 = 3-pins I2S (only input)
1 = input
1 = input
1 = input
1 = input
2
S usage
1 = general purpose usage
Table 22 Power control register
ADDRESS REGISTER COMMENTS BIT VALUE
1003h power control register
analog modules
suspend input selection for P3.1 of the microcontroller
7 0 = suspend from USB interface
connected to P3.1 during normal operation 1 = suspend from restart circuit connected to P3.1 (e.g. after power-down)
interrupt input selection for P3.3 (INT1_N) of the microcontroller
6 0 = interrupt from USB
interface connected to P3.3 during normal operation 1 = interrupt from restart circuit connected to P3.3 (e.g. after power-down)
power APLL 5 0 = power on
1 = power off
power FSDAC 4 0 = power on
1 = power off
power ADC left 3 0 = power on
1 = power off
power ADC right 2 0 = power on
1 = power off
power PGA left 1 0 = power on
1 = power off
power PGA right 0 0 = power on
1 = power off
1999 May 10 27
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Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325
Table 23 ASR control register
ADDRESS REGISTER COMMENTS BIT VALUE
2000h ASR control register robust word clock 7 0 = off (not recommended)
1 = on (recommended)
2
serial I digital I/O interface
phase inversion (on right mono output)
bits per sample modi 3 and 2 00 = reserved
mono or stereo operation 1 0 = mono
ASR register start-up mode 0 0 = stop (e.g. at alternate
S-bus output format
6 and 5 00 = I2S-bus
01 = 16-bit LSB justified 10 = 18-bit LSB justified 11 = 20-bit LSB justified
4 0 = mono phase inversal off
1 = mono phase inversal on
01 = 8-bit audio 10 = 16-bit audio 11 = 24-bit audio
1 = stereo
setting with bandwidth equal to zero) 1=go
START-UP BEHAVIOUR AND POWER MANAGEMENT Start-up of the UDA1325
After power-on (of V
), an internal Power-on reset signal becomes HIGH after a certain RC time. This RC time is
DDA1
created by using the internal resistor (2 × 50 kΩ) divider for creating the reference voltage for the FSDAC in combination with the capacitor connected externally to the V V
DDA1
and V
. The RC time can be calculated using R = 25000 Ω and C = C
SSA1
pin. The FSDAC and the internal resistor divider are supplied by
REFDA
.
ref
During 20 ms after Power-on reset becomes HIGH the UDA1325 has to initiate the internal registers. During this initialisation, the user should prevent indicating the ‘connected’ status to the USB-host. This can be done by forcing the DP-line LOW (i.e. via one of the GP pins).

Power Management

The total current drawn from the USB supply (for i.e. bus-powered operation of the UDA1325 application) must be less than 500 µA in suspend mode. In order to reach that low current target, the total power dissipation of the UDA1325 can be reduced by disabling all internal clocks and switching off all internal analog modules.
Important note: In order to make use of power reduction (Power-down mode) and be able to restart after power-down, a number of precautions must be taken!
1999 May 10 28
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Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325
AT INITIALISATION TIME
• Bit 7of the power control register (mux_ctrl_suspend) must be set to ‘1’, in order to connect the CLK_ON of the USB processor with P3.1 of the microcontroller
• Bit 6 of the power control register (mux_ctrl_int1) must be set to ‘0’, in order to connect the PSIE_MMU_INT output pin of the USB processor with P3.3 (INT1_N) of the microcontroller
• Bit 7of the I/O selection register must be set to ‘1’, in order to enable the power-on control of the 48 MHz crystal oscillator automatically by the microcontroller.
I
N NORMAL OPERATION MODE
In normal operation working mode, a suspend can be initiated by the falling edge of the CLK_ON output signal of the USB processor. This falling edge comes about 2 ms after the rising edge of the PSIE_MMU_SUSPEND output signal of the USB processor. At this moment, several actions should be taken by the microcontroller:
• All analog modules of the UDA1325 must be switched off; this can be done by setting bits 5 to 0 of the power control register to ‘1’ and bit 0 of the clock shop register to ‘1’
• Bit 6 of the power control register (mux_ctrl_int1) must be set to ‘1’, in order to awake from power-down by the CLK_ON signal of the USB processor
• Put all GP pins in the high or low state (depending of how they are used in the UDA1325 application)
• Put the microcontroller in Power-down mode. This can be done via the PCON register of the microcontroller. This
results in an automatically switching off the 48 MHz crystal oscillator and with that all internal clocks (if they are enabled).
On the rising edge of the CLK_ON output signal, the 48 MHz crystal oscillator will be switched on automatically and with that all internal clocks (if they are enabled). At the same time, a counter starts counting for 2048 clock cycles (170 µs). This time is necessary for stabilising the 48 MHz clock of the 48 MHz crystal oscillator.
When the counter reaches its end value (after 2048 cycles), a rising edge will be detected on the P3.3 (INT1_N) of the microcontroller. At this moment, following actions should be taken by the microcontroller:
• The Power-down mode of the microcontroller must be switched off
• Re-initialise all GP pins
• All analog modules of the UDA1325 must be switched on; this can be done by setting bits 5 to 0 of the power control
register to ‘0’ and bit 0 of the clock shop register to ‘0’
• Bit 6 of the power control register (mux_ctrl_int1) must be set to ‘0’, in order to connect the PSIE_MMU_INT output pin of the USB processor again with P3.3 (INT1_N) of the microcontroller.
The UDA1325 is now back in its normal operation mode and can be put back in power reduction mode by the falling edge of the CLK_ON signal of the USB processor.
1999 May 10 29
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Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325

COMMAND SUMMARY

COMMAND NAME RECIPIENT CODING DATA PHASE
Initialization commands
Set address/enable device D0h write 1 byte Read address/enable device D0h read 1 byte Set endpoint enable device D8h write 1 byte Read endpoint enable device D8h read 1 byte Set mode device F3h write 1 byte
Data flow commands
Read interrupt register device F4h read 1 byte Select endpoint control OUT 00h read 1 byte (optional)
control IN 01h read 1 byte (optional) other endpoints 00h + endpoint index read 1 byte (optional)
Get endpoint status control OUT 40h read 1 byte
control IN 41h read 1 byte other endpoints 40h + endpoint index read 1 byte
Set endpoint status control OUT 40h write 1 byte
control IN 41h write 1 byte
other endpoints 40h + endpoint index write 1 byte Read buffer selected endpoint F0h read n bytes Write buffer selected endpoint F0h write n bytes Acknowledge setup selected endpoint F1h none Clear buffer selected endpoint F2h none Validate buffer selected endpoint FAh none
General commands
Read current frame number F5h read 1 or 2 bytes
1999 May 10 30
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Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325
COMMAND DESCRIPTIONS Command procedure
This chapter describes the commands that can be used by the microcontroller to control the USB processor. There are three basic types of commands:
• Initialization commands
• Data flow commands
• General commands.
A command is represented by an 8 bit code. It can be followed by one or more data write cycles or one or more read cycles or a combination. The PSIE_MMU_READY output connected to Port 3.4 of the microcontroller indicates that the previous action (command write, data read or data write) has completed. A new action can only be initiated if PSIE_MMU_READY is TRUE. The data is valid from the moment PSIE_MMU_READY becomes TRUE.
The PSIE contains a number of interrupt registers, one for each endpoint. Every time a transition occurs, the interrupt flag for the involved endpoint is set. The PSIE_MMU_INT connected to Port 3.3 is an OR function of all interrupt registers.

Initialization commands

Initialization commands are used during the enumeration process of the USB network. They are used to set the USB assigned address, enable endpoints and select the configuration of the device.
S
ET ADDRESS/ENABLE
Command: D0h. Data: write 1 byte. The set address/enable command is used to set the USB
assigned address and enable the function. The device always powers up disabled and should be enabled after a bus reset.
01234567
0
000 0000
Power On Value
Address Enable
Table 24
BIT DESCRIPTION
Address the value written becomes
the device address
Enable a ‘1’ enables this function
EAD ADDRESS/ENABLE
R Command: D0h. Data: read 1 byte. The read address/enable command is used to read the
USB assigned address and the enable bit of the device. The format of the data phase is the same as for the set address/enable command.
S
ET ENDPOINT ENABLE
Command: D8h. Data: write 1 byte. The set endpoint enable command is used to set the
enable bits for the non default endpoints.
76543210
XXXXXXX0
Power On Value
Enable Reserved
If the enable bit is ‘1’, the non default endpoints are enabled, if ‘0’, the non default endpoints are disabled. The function then only responds to the default control endpoint.
After bus reset, the enable bit is set to ‘0’.
R
EAD ENDPOINT ENABLE
Command: D8h. Data: read 1 byte. The read endpoint enable command is used to read the
enable bit for the non default endpoints of the function. The format of the data phase is the same as for the set endpoint enable command.
S
ET MODE
1999 May 10 31
Command: F3h. Data: write 1 byte.
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Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325
An interrupt is also generated after a bus reset. When the
76543210
Reset value
11111100
T T F F T T T T
Bus Reset
IsoOut IsoIn IntIsoOut IntIsoIn ErrorDebugMode AlwaysPLLClock Reserved Reserved
Reset value: gives the value of the bits after Power-on reset. Bus reset: a ‘F’ indicates that the value of the bit is not changed during a bus reset. a ‘T’ indicates that during a bus reset, the bit is reset to its reset value.
interrupt register consists of all zeros, and an interrupt was generated, there was a bus reset. The interrupt is cleared when the interrupt register is read.
76543210
0 0 0 0 0 0 0 0
ELECT ENDPOINT
S
Power On Value
Control OUT Control IN Endpoint 1 OUT Endpoint 1 IN Endpoint 2 IN Endpoint 3 IN Endpoint 4 OUT Endpoint 5 IN
Table 25
BIT DESCRIPTION
IsoOut ISO out endpoint can be
used
IsoIn ISO in endpoint can be
used
IntIsoOut allow interrupt from ISO
out endpoint
IntIsoIn allow interrupt from ISO in
endpoint
ErrorDebugMode Setting chip in debug
mode
AlwaysPLLClock the PLL clock must keep
on running
Data flow commands
Data flow commands are used to manage the data transmission between the USB endpoints and the host. Much of the data flow is initiated via the interrupt to the microcontroller. The microcontroller uses these commands to access the endpoint buffers and determine whether the endpoint buffers have valid data.
R
EAD INTERRUPT REGISTER
Command: F4h. Data: read 1 byte. The read interrupt register command returns the value of
the interrupt register. Every time a packet is received or transmitted, an interrupt will be generated and a flag specific to the physical endpoint will be set in the interrupt register. Reading the status of the endpoint will clear the flag.
Command: 00h + endpoint index. Data: optional read 1 byte. The select endpoint command initializes an internal
pointer to the start of the selected buffer. Optionally, this command can be followed by a data read. Bit 0 is low if the buffer is empty and high if the buffer is full. There is one command for every endpoint.
76543210
XXXXXXX0
ET ENDPOINT STATUS
G
Power On Value
Full/Empty
Reserved
Command: 40h + endpoint index. Data: read 1 byte. The get endpoint status command is followed by one data
read that returns the status of the last transaction of the selected endpoint. This command also resets the corresponding interrupt flag in the interrupt register, and clears the status, indicating that it was read. There is one command for every endpoint.
76543210
0 0 00 0
000
Power On Value
Data Receive/Transmit Error Code
Setup Packet Data 0/1 Packet Previous Status not Read
1999 May 10 32
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Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325
Table 26 Error codes
ERROR
CODE
RESULT
0000 no error 0001 PID encoding error; bits 7 to 4 in the PID
token are not the inversion of bits 3 to 0
0010 PID unknown; PID encoding is valid, but PID
does not exist
0011 unexpected packet; packet is not of the type
expected (token, data or acknowledge), or SETUP token received on non-control
endpoint 0100 token CRC error 0101 data CRC error 0110 time out error 0111 babble error 1000 unexpected end-of-packet 1001 sent or received NAK 1010 sent stall, a token was received, but the
endpoint was stalled 1011 overflow error, the received data packet was
larger then the buffer size of the selected
endpoint 1100 sent empty packet (ISO only) 1101 bitstuff error 1110 error in sync 1111 wrong data PID
Table 27
BIT DESCRIPTION
Data receive/transmit a ‘1’ indicates data has
been received or
transmitted successfully Error code see Table 26 Setup packet a ‘1’ indicates the last
received packet had a
SETUP token (this will
always read ‘0’ for IN
buffers) Data 0/1 packet a ‘1’ indicates the last
received packet had a
DATA 1 PID Previous status not read a ‘1’ indicates a second
event occurred before the
previous status was read
SET ENDPOINT STATUS Command: 40h + endpoint index. Data: write 1 byte. This command is used to stall or unstall an endpoint. Only
the least significant bit has a meaning. When the stalled bit is equal to 1, the endpoint is stalled, when equal to 0, the endpoint is unstalled. There is one command for every endpoint.
A stalled control endpoint is automatically unstalled when it receives a SETUP token, regardless of the contents of the packet. If the endpoint should stay in stalled state, the microcontroller should restall it.
When a stalled endpoint is unstalled, it is also re-initialized. This means that its buffer is flushed and the next DATA PID that will be sent or expected (depending on the direction of the endpoint) is DATA0.
01234567
0
Power On Value
Stalled Reserved
EAD BUFFER
R
X
XXX XXX
Command: F0h. Data: read n bytes (max. 10). The read buffer command is followed by a number of data
reads, which returns the contents of the selected endpoint data buffer. After each read, the internal buffer pointer is incremented by 1.
The buffer pointer is not reset to the buffer start by the read buffer command. This means that reading a buffer can be interrupted by any other command (except for select endpoint).
1999 May 10 33
Page 34
Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325
The data in the buffer are organized as follows:
Byte 0: transfer successful, number of data bytes (MSB) Byte 1: number of data bytes (LSB) Byte 2: data byte 0 Byte 3: data byte 1 Byte 4: data byte 2 Byte 5: data byte 3 Byte 6: data byte 4 Byte 7: data byte 5 Byte 8: data byte 6 Byte 9: data byte 7.
Bytes 0 and 1 indicate the number of bytes in the buffer. Byte 0 is the Most Significant Byte (MSB). Byte 1 is the Least Significant Byte (LSB). Only bits 1 and 0 of byte 0 are used in the number of bytes indication.
Bit 7 of byte 0 indicates if the transaction was successful (bit 7 is ‘1’ if the transaction was successful). Bits 6 to 2 of byte 0 are reserved.
RITE BUFFER
W Command: F0h. Data: write n bytes (max. 10). The write buffer command is followed by a number of data
writes, which load the endpoint buffer. After each write, the internal buffer pointer is incremented by 1.
acknowledged explicitly that it has seen the SETUP packet.
If the microcontroller is reading the data from a SETUP packet, and a new SETUP packet arrives, the device must accept this new SETUP packet. So the data, currently being read by the microcontroller, is overwritten with the new packet. On the arrival of the new packet, the commands validate buffer and clear buffer are disabled. If the microcontroller has finished reading the data from the buffer, it will try to clear the buffer. The device will ignore this command, so the new SETUP packet in the buffer is not cleared. The microcontroller will now detect the interrupt of the new SETUP packet and will start reading the new data in the buffer.
A SETUP token can be followed by an IN token. After the SETUP token, the microcontroller will start filling the IN buffer. A SETUP token will clear the IN buffer. This avoids the following problem: after a SETUP token, the microcontroller fills the IN buffer. If the SETUP token is followed by a SETUP token and shortly followed by an IN token, the device will send the contents of the IN buffer to the host. The IN buffer was filled after the first SETUP token. That is why after a SETUP token the IN buffer is cleared.
If the microcontroller is still filling the buffer when the second SETUP token arrives, the SETUP token will clear the IN buffer. If the microcontroller has filled the IN buffer, it will validate the buffer. So clearing the IN buffer on receiving a SETUP token is not enough.
The buffer pointer is not reset to the buffer start by the write buffer command. This means that writing a buffer can be interrupted by any other command (except for select endpoint).
The data must be organized in the same way as described in the read buffer command. Bits 7 to 2 of byte 0 are reserved and must be filled with zeros.
CKNOWLEDGE SETUP
A Command: F1h. Data: none. The arrival of a SETUP packet flushes the IN buffer and
disables the validate buffer and clear buffer commands for both IN and OUT endpoints.
The microcontroller needs to re-enable these commands by the acknowledge setup command. This ensures that the last SETUP packet stays in the buffer and no packet can be sent back to the host until the microcontroller has
1999 May 10 34
If a SETUP token is received, the device will also disable the validate buffer command for the IN buffer. If the microcontroller needs to fill the buffer after a SETUP token, the command acknowledge setup command must be sent to enable the validate buffer command.
C
LEAR BUFFER
Command: F2h. Data: none. When a packet is received completely, an internal
endpoint buffer full flag is set. All subsequent packets will be refused by returning a NACK to the host. When the microcontroller has read the data, it should free the buffer by the clear buffer command. When the buffer is cleared, new packets will be accepted.
Page 35
Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325
VALIDATE BUFFER Command: FAh. Data: none. When the microcontroller has written data into an IN buffer,
it should set the buffer full flag by the validate buffer command. This indicates that the data in the buffer are valid and can be sent to the host when the next IN token is received.

General commands

READ CURRENT FRAME NUMBER Command: F5h. Data: read 1 or 2 bytes. This command is followed by one or two data reads and
returns the frame number of the last successfully received SOF. The frame number is eleven bits wide. The frame number is returned least significant byte first. In case the user is only interested in the lower 8 bits of the frame number only the first byte needs to be read.
2
C MASTER/SLAVE INTERFACE
I
The I2C module implements a master/slave I2C-bus interface with integrated shift register, shift timing generation and slave address recognition. It is compliant to the I2C-bus specification IC20/Jan92. I2C standard mode (100 kHz SCL) and fast mode (400 kHz) are supported. Low speed mode and extended 10 bit addressing are unsupported.
2
Characteristics of the I
C-bus
The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a Serial Clock Line (SCL). Both lines must be connected to V
via a pull-up resistor.
DDE
The timing definition of the I2C-bus is given in Fig.7.

Programmer’s view

For a detailed description of the I
2
C-bus protocol refer to
Philips Integrated Circuits Data Handbook IC20, 8XC552.

S1CON register

The CPU can read from and write to this 8-bit SFR. Two bits are effected by the SIO1 hardware: the SI bit is set when a serial interrupt is requested, and the STO bit is cleared when a STOP condition is present on the I
2
C-bus. The STO bit is also cleared when ENS1 = ‘0’. Reset initializes S1CON to 00h.
76543210
Power On Value
CR0 CR1 AA SI STO STA ENS1 CR2
CR2, 1
0 0 0 0 0 0 0 0
AND 0-THE CLOCK RATE BITS
These three bits determine the serial clock frequency when SIO1 is in a master mode.
The various serial rates are shown in Table 28.
Table 28 Serial clock rates (SCL line)
2
I
CR2 CR1 CR0
C BIT FREQUENCY
(kHz)
0 0 0 1200 0 0 1 600 0 1 0 400 0 1 1 300 1 0 0 150 1 0 1 100 110 75 1 1 1 3.9 ... 501
When the CR bits are ‘111’, the maximum bit rate for the data transfer will be derived from the Timer 1 overflow rate divided by 2 (i.e. every time the Timer 1 overflows, the SCL signal will toggle).
The programmer’s view of the I2C library function is -with one exception- identical to that of the 8XC552 microcontroller. Only the bit rate frequency selection in S1CON and the handling of the Timer 1 overflow information deviates to accommodate 400 kHz operation.
1999 May 10 35
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1999 May 10 36
SDA
Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325
SCL
t
BUF
P
S
t
LOW
t
HD;STA
t
r
t
HD;DAT
t
HIGH
t
f
t
SU;DAT
t
SU;STA
Sr
t
HD;STA
t
SP
t
SU;STO
MBC611
P
Fig.7 Definition of timing of the I2C-bus.
handbook, full pagewidth
Page 37
Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
All digital I/Os
V
I/O
I
O
DC input/output voltage range −0.5 − V output current V
Temperature values
T
j
T
stg
T
amb
junction temperature 0 − 125 °C storage temperature −55 − +150 °C operating ambient temperature 0 25 70 °C
Electrostatic handling
V
es
electrostatic handling note 1 −3000 − +3000 V
DDE
= 5.0 V −−4mA
DDE
note 2 −300 − +300 V
V
Notes
1. Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.
2. Equivalent to discharging a 200 pF capacitor through a 2.5 µH series conductor.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th(j-a)
thermal resistance from junction to ambient
UDA1325PS in free air 48 K/W UDA1325H in free air 48 K/W

RECOMMENDED OPERATING CONDITIONS

SYMBOL PARAMETER MIN. TYP. MAX. UNIT
V V V
DDE DD I
supply voltage periphery (I/O) 4.75 5.0 5.25 V supply voltage (core) 3.0 3.3 3.6 V DC input voltage range
for D+ and D− 0.0 − V for VINL and VINR − 0.5V
DD
for digital I/Os 0.0 − V
DD
− V
DDE
V
V
1999 May 10 37
Page 38
Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325

DC CHARACTERISTICS

= 5.0 V; VDD= 3.3 V; T
V
DDE
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supplies
V
DDE
V
DDI
V
DDA1
V
DDA2
V
DDA3
V
DDO
V
DDX
I
DDE
I
DDI
I
DDA1
I
DDA2
I
DDA3
I
DDO
I
DDX
P
tot
P
ps
digital supply voltage periphery 4.75 5.0 5.25 V digital supply voltage core 3.0 3.3 3.6 V analog supply voltage 1 3.0 3.3 3.6 V analog supply voltage 2 3.0 3.3 3.6 V analog supply voltage 3 3.0 3.3 3.6 V operational amplifier supply voltage 3.0 3.3 3.6 V crystal oscillator supply voltage 3.0 3.3 3.6 V digital supply current periphery note 1 − 3.7 − mA digital supply current core − 39.0 − mA analog supply current 1 − 3.6 − mA analog supply current 2 − 8.0 − mA analog supply current 3 − 0.9 9.0 operational amplifier supply current − 3.0 − mA crystal oscillator supply current − 1.2 13.0 total power dissipation − 200 − mW total power dissipation in power
saving mode
=25°C; f
amb
= 48 MHz; fs= 44.1 kHz; unless otherwise specified.
osc
note 4 − 1.2 − mW
(2)
(3)
mA
mA
Inputs/outputs D+ and D−
V V
I O(H)
static DC input voltage −0.5 − V static DC output voltage HIGH RL=15kΩ
2.8 − 3.6 V
DDI
V
connected to GND
V
O(L)
high impedance data line output
I
LO
static DC output voltage LOW RL= 1.5 kΩ
connected to V
−−0.3 V
DD
−−10 µA
leakage current
V
I(diff)
V
CM(diff)
V
SE(R)(th)
differential input sensitivity 0.2 −−V differential common mode range 0.8 − 2.5 V single-ended receiver threshold
0.8 − 2.0 V
voltage
C
IN
transceiver input capacitance pin to GND −−20 pF
Digital input pins
V
IL
V
IH
input leakage current −−1µA
I
LI
C
I
LOW-level input voltage −−0.3V HIGH-level input voltage 0.7V
DDE
− V
DDE
DDE
V V
input capacitance −−5pF
1999 May 10 38
Page 39
Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
PGA and ADC
V
ref(AD)
V
ref(ADC)(pos)
V
ref(ADC)(neg)
V
I(PGA)
R
I(PGA)
Filter stream DAC
V
ref(DA)
V
O(CM)
R
O(VOUT)
R
O(L)
C
O(L)
Notes
1. This value depends strongly on the application. The specified value is the typical value obtained using the application diagram as illustrated in Fig.8.
2. At start-up of the OSCAD oscillator.
3. At start-up of the OSC48 oscillator.
4. Exclusive the IDDE current which depends on the components connected to the I/O pins.
reference voltage PGA and ADC − 0.5V positive reference voltage of the
− V
DDA2
DDA2
− V
− V
ADC negative reference voltage of the
− 0.0 − V
ADC DC input voltage VINL and VINR of
− 0.5V
DDA2
− V
the PGA DC input resistance at VINL and
− 12.5 − kΩ
VINR of the PGA
reference voltage DAC − 0.5V common mode output voltage − 0.5V output resistance at VOUTL and
− 11 −Ω
DDA1 DDA1
− V
− V
VOUTR output load resistance 2.0 −−kΩ output load capacitance −−50 pF
1999 May 10 39
Page 40
Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325

AC CHARACTERISTICS

= 5.0 V; V
V
DDE
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Driver characteristics D+ and D− (full-speed mode)
f
o(s)
t
r
t
f
t
rf(m)
V
cr
R
o(drive)
Data source timings D+ and D− (full-speed mode)
f
i(s)
f
fs(D)
t
fr(D)
t
J1(diff)
t
J2(diff)
t
W(EOP)
t
EOP(diff)
t
JR1
t
JR2
t
EOPR1
t
EOPR2
= 3.3 V; T
DDI
amb
=25°C; f
= 48 MHz; fs= 44.1 kHz; unless otherwise specified.
osc
audio sample output frequency 5 − 55 kHz rise time CL=50pF 4 − 20 ns fall time CL=50pF 4 − 20 ns rise/fall time matching (tr/tf)90−110 % output signal crossover voltage 1.3 − 2.0 V driver output resistance steady-state drive 28 − 43 Ω
audio sample input frequency 5 − 55 kHz full speed data rate 11.97 12.00 12.03 Mbits/s frame interval 0.9995 1.0000 1.0005 ms source differential jitter to next
−3.5 0.0 +3.5 ns
transition source differential jitter for paired
−4.0 0.0 +4.0 ns
transitions source end of packet width 160 − 175 ns differential to end of packet
−2.0 − +5.0 ns
transition skew receiver data jitter tolerance to next
−18.5 0.0 +18.5 ns
transition receiver data jitter tolerance for
−9.0 0.0 +9.0 ns
paired transitions end of packet width at receiver
40 −−ns
must reject as end of packet end of packet width at receiver
82 −−ns
must accept as end of packet
Serial input/output data timing
f
s
f
i(WS)
t
r
t
f
t
BCK(H)
t
BCK(L)
t
s;DAT
t
h;DAT
t
s;WS
t
h;WS
system clock frequency − 12 − MHz word selection input frequency 5 − 55 kHz rise time −−20 ns fall time −−20 ns bit clock HIGH time 55 −−ns bit clock LOW time 55 −−ns data set-up time 10 −−ns data hold time 20 −−ns word selection set-up time 20 −−ns word selection hold time 10 −−ns
1999 May 10 40
Page 41
Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
SDA and SCL lines for 100 kHz I2C devices
f
SCL
t
BUF
t
HD;STA
t
LOW
t
HIGH
t
SU;STA
t
SU;STO
t
HD;DAT
t
SU;DAT
t
r
t
f
C
L(bus)
Oscillator 1 (system clock)
f
osc
δ duty factor − 50 − % g
m
R
o
C
i(XTAL1a)
C
i(XTAL2a)
I
start
Oscillator 2 (for ADC clock)
f
osc
δ duty cycle − 50 − % g
m
R
o
C
i(XTAL1b)
C
i(XTAL2b)
I
start
SCL clock frequency 0 − 100 kHz bus free time between a STOP and
4.7 −−µs
START condition hold time (repeated) START
4.0 −−µs
condition LOW period of the SCL clock 4.7 −−µs HIGH period of the SCL clock 4.0 −−µs set-up time for a repeated START
4.7 −−µs
condition set-up time for STOP condition 4.0 −−µs data hold time 5.0 −−µs data set-up time 250 −−ns rise time of both SDA and SCL
−−1000 ns
signals fall time of both SDA and SCL
−−300 ns
signals capacitive load for each bus line −−400 pF
oscillator frequency − 48 − MHz
transconductance 12.8 22.1 30.2 mS output resistance 0.6 1.1 2.3 kΩ parasitic input capacitance XTAL1a 4.5 4.8 5.2 pF parasitic input capacitance XTAL2a 4.1 4.6 5.0 pF start-up current 3.7 7.6 13.0 mA
oscillator frequency 8.192 − 14.08 MHz
transconductance 8.1 13.6 18.1 mA/V output resistance 1.3 2.0 4.0 kΩ parasitic input capacitance XTAL1b 5.0 5.4 5.7 pF parasitic input capacitance XTAL2b 4.1 4.6 5.0 pF start-up current 2.4 5.0 8.4 mA
1999 May 10 41
Page 42
Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Analog PLL (for ADC clock)
f
clk(PLL)
δ duty factor − 50 − % t
strt(PO)
Power-on reset
t
su(PO)
PGA and ADC
V
i(FS)(rms)
C
i(PGA)
(THD + N)/S total harmonic distortion plus
S/N signal to noise ratio Vi= 0.0 V 90 95 − dBA
α
ct
f
s
OL digital output level PGA gain=0dB,
PLL clock frequency 8.1920 11.2896 12.2880 MHz
start-up time after power-on −−10 ms
power-on set-up-time note 1 25C
full-scale input voltage (RMS value) PGA gain = −3dB − 1414
ref
(2)
−−ms
(3)
− mV PGA gain=0dB − 1000 − mV PGA gain=3dB − 708 − mV PGA gain=9dB − 355 − mV PGA gain = 15 dB − 178 − mV PGA gain = 21 dB − 89 − mV PGA gain = 27 dB − 44 − mV
input capacitance of the PGA −−20 pF
f
= 44.1 kHz at
s
noise-to-signal ratio
input signal of 1 kHz; PGA gain = 0 dB; note 4
V
(0 dB)
i
1.0 V (RMS) V
(−60 dB) −−30 −20 dB
i
−−85 −80 dB
− 0.0056 0.01 %
− 3.2 10.0 %
crosstalk between channels PGA gain=0dB − 100 − dB sample frequency (128fs) 0.640 − 7.04 MHz
−−2.0 − dBFS
V
= 1 V (RMS)
i
1999 May 10 42
Page 43
Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Filter stream DAC
RES resolution 16 −−bits V
o(FS)(rms)
SVRR supply voltage ripple rejection at
∆V
channel unbalance maximum volume − 0.03 − dB
o
α
ct
(THD + N)/S total harmonic distortion plus
S/N signal-to-noise ratio at bipolar zero A-weighting at
full-scale output voltage
VDD= 3.3 V − 0.66 − V
(RMS value)
f
V
DDA
and V
DDO
ripple
V
ripple(p-p)
= 1 kHz
= 0.1 V
− 60 − dB
crosstalk between channels RL=5kΩ−95 − dB
f
= 44.1 kHz;
s
noise-to-signal ratio
RL=5kΩ; note 5
at input signal of 1 kHz (0 dB)
at input signal of 1 kHz (−60 dB)
−−90 −80 dB
− 0.0032 0.01 %
−−30 −20 dB
− 3.2 10 %
90 95 − dB
code 0000H
Notes
1. Strongly depends on the external decoupling capacitor connected to V
2. C
in µF.
ref
ref(DA)
.
3. Although a level of 1.414 V (RMS) would be required to optimal drive the ADC in this gain setting, this level can not be used. Due to the 3.3 V supply voltage input, signals of 1.17 V (RMS) and higher will result in clipping.
4. Measured with the APLL as ADC clock source.
5. Measured with I2S-bus input as digital source.
1999 May 10 43
Page 44
Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325

APPLICATION INFORMATION

handbook, full pagewidth
X4
1
1
2
2
3
3
45
4
C15
10 nF (50 V)
+V
A
R35 1 Ω
C34
47 µF
(16 V)
C38
100 nF
(63 V)
V
V
DDA1
SSA1
3839
GP0/BCKI
BCKI
digital
input
WSI
playback
recording
L1
8 7 6
digital
input
DI
BCK
WS
DA
+V
C
C18 22 pF (63 V)
C44
10 nF (63 V)
R48
1.5 kΩ
C17 22 pF (63 V)
C8
47 µF (16 V)
C22
47 µF (16 V)
L5
1.5 µH
22 Ω
R16
22 Ω
R7
V
USB
C16 10 nF (50 V)
analog
input
recording
GP5/WSI
1
GP1/DI
BCK
VINR
VINL
XTAL2b
17 15 13
61
WS
59
DA
57
D−
6
D+
8
47
43
26
UDA1325H
C32
47 µF (16 V)
C21
100 nF
(63 V)
V
SSA2
+V
A
R27 1 Ω
V
DDA2
4244
C38
12 pF (63 V)
C37
12 pF (63 V)
ADC XTAL
V
V
A(ext)
D(ext)
L8
BLM32A07
L7
BLM32A07
L6
BLM32A07
GND
C47 100 µF (16 V)
C46 100 µF (16 V)
Fig.8 Application diagram UDA1325H (continued in Fig.9).
1999 May 10 44
C5 18 pF (50 V)
C45 100 µF (16 V)
+V
+V
+V
X1 48 MHz
XTAL1b
XTAL2a XTAL1a
C6 18 pF (50 V)
A
C
D
MGM760
25
53 54
10
V
SSI
C25
100 nF
(63 V)
C24
100 nF (63 V)
9
V
DDI
L2 BLM32A07
R17 1 Ω
+V
C
11
V
SSE
100 nF
(63 V)
100 nF
(63 V)
C26
C27
12
V
DDE
L3 BLM32A07
R25 1 Ω
+V
D
Page 45
Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325
handbook, full pagewidth
C7
47 µF (16 V)
C19
100 nF
(63 V)
V
V
SSA3
5255
UDA1325H
+V
R10 1 Ω
A
DDA3
C11
100 nF
(63 V)
+V
A
R8 1 Ω
VRPVRN
5149
P0.0
56
P0.1
58
P0.2
60
P0.3
62
P0.4
64
P0.5
3
P0.6
5
P0.7
7
ALE
50
P2.0
14
P2.1
16
P2.2
18
P2.3
20
P2.4
22
P2.5
23
PSEN
31
EA
48
21 19
40 41
37
34
+V
SDA SCL V
ref(DA)
V
ref(AD)
VOUTR
VOUTL
R20
D
1 Ω
47 µF (16 V)
47 µF (16 V)
C35
C48
C36 100 nF (63 V)
C28 100 nF (63 V)
D
7
18
D
6
17
D
5
14
D
4
13
D
3
8
2 1 0
V
74HCT373D
7 4 3
11 1
A0
1
A1
2
A2
3
SS
4
C31 47 µF (16 V)
analog output
playback
D1
PCF85116-3
D D D
LE
OE
R28
4.7 kΩ
D4
19 16 15 12
9 6 5 2
20
10
C29 100 nF (63 V)
Q Q Q Q Q Q Q Q V
GND
8 7 6 5
R39 10 kΩ
A0
10
A1
9
A2
8
A3
7
A4
6
A5
5
A6
4
A7
3
A8
A9 A10 A11 A12 A13
OE
CE
PGM
V
PP
+V
D
J3
1
2
25 24 21 23 2 26
22 20 27 1
3 2 1
2
(I
C-bus)
D2
EEPM27128
+V
D
(internal ROM)
(external ROM)
7 6 5 4 3 2 1 0 CC
+V
D
100 nF
C24
(50 V)
V PTC
SCL SDA
DD
C41 47 µF (16 V)
+V
R38 10 kΩ
D
O0
11
O1
12
O2
13
O3
15
O4
16
O5
17
O6
18
O7
19
V
CC
C25
+V
100 nF
(50 V)
D
28
GND
14
GP4/BCKO
33
V
SSO
C33
100 nF
(63 V)
C39
47 µF (16 V)
2
GP3/WSO
1
GP2/DO
63
RTCB
36
TC
35
SHTCB
4
24
V
SSX
100 nF
(63 V)
100 nF
(63 V)
C28
C18
28
V
DDX
L13 BLM32A07
R26 1 Ω
+V
C
32
V
DDO
R43 1 Ω
+V
A
MGM761
BCKO WSO DO
digital output
playback
Fig.9 Application diagram UDA1325H (continued from Fig.8).
1999 May 10 45
Page 46
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1999 May 10 46
X4
L1
1
1
2
2
3
3
45
4
C15
10 nF
(50 V)
8 7 6
digital
input
playback
digital
input
recording
V
USB
C16 10 nF (50 V)
ADC XTAL
BCKI
WSI
DI
BCK
WS
DA
analog
input
recording
10 nF (63 V)
12 pF (63 V)
12 pF (63 V)
C18 22 pF (63 V)
C44
C38
C37
+V
C
R48
1.5 kΩ
C17 22 pF (63 V)
1.5 µH
C5 18 pF (50 V)
L5
47 µF (16 V)
47 µF (16 V)
GP0/BCKI
GP5/WSI
R7
22 Ω R16
22 Ω
C8
C22
1
XTAL2b
X1 48 MHz
XTAL1b
XTAL2a XTAL1a
C6 18 pF (50 V)
GP1/DI
BCK
VINR
VINL
+V
A R35
1 Ω
C34
47 µF (16 V)
C38
100 nF
(63 V)
V
SSA1
16 15 14
3
WS
2
DA
1
D−
8
D+
9
36
34
21
20
40 41
11
10
V
V
DDI
SSI
C25
100 nF
L2
(63 V)
BLM32A07
C24
100 nF
R17
(63 V)
1 Ω
+V
C
V
DDA1
2930
12
C32
47 µF (16 V)
C21
100 nF
(63 V)
V
SSA2
V
SSE
C26
100 nF
(63 V)
C27
100 nF (63 V)
book, full pagewidth
+V
A
R27 1 Ω
V
DDA2
3335
UDA1325PS
13
V
DDE
L3 BLM32A07
R25 1 Ω
+V
D
47 µF
(16 V)
100 nF
(63 V)
V
SSA3
+V
A R10
1 Ω
C7
C19
V
DDA3
3942
24
V
SSO
C33
100 nF
(63 V)
C39
47 µF
(16 V)
+V
A R8
1 Ω
C11
SDA
18
SCL
17
V
31
V
32
VOUTR
28
VOUTL
25
GP4/BCKO
6
GP3/WSO
5
GP2/DO
4
RTCB
27
TC
26
SHTCB
7
V
DDX
L13 BLM32A07
R26 1 Ω
C
ref(DA) ref(AD)
R20
+V
D
1 Ω
C36 100 nF (63 V)
47 µF (16 V)
47 µF (16 V)
C35
C48
V
V
A(ext)
D(ext)
V
BCKO WSO DO
A0 A1 A2 SS
C28 100 nF (63 V)
1 2 3
PCF85116-3
4
analog output
playback
digital output
playback
L8
BLM32A07
L7
BLM32A07
L6
BLM32A07
GND
C31 47 µF (16 V)
V
DD
8
PTC
7
D4
6 5
C47 100 µF (16 V)
SCL SDA
C29 100 nF (63 V)
C46 100 µF (16 V)
C41 47 µF (16 V)
+V
R38 10 kΩ
C45 100 µF (16 V)
D
+V
A
+V
C
+V
D
100 nF
(63 V)
VRPVRN
3837
23
V
DDO
R43 1 Ω
+V
A
22
19
V
SSX
C28
100 nF (63 V)
C18
100 nF (63 V)
+V
R39 10 kΩ
MGS271
Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325
1
2
(I
C-bus)
2
Fig.10 Application diagram UDA1325PS.
Page 47
Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325

PACKAGE OUTLINES

SDIP42: plastic shrink dual in-line package; 42 leads (600 mil)
D
seating plane
L
Z
42
pin 1 index
e
b

SOT270-1

M
E
A
2
A
A
1
w M
b
1
22
E
c
(e )
M
1
H
1
0 5 10 mm
scale
DIMENSIONS (mm are the original dimensions)
A
A
A
UNIT b
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
max.
mm
5.08 0.51 4.0
OUTLINE VERSION
SOT270-1
12
min.
max.
IEC JEDEC EIAJ
1.3
0.8
b
1
0.53
0.40
REFERENCES
0.32
0.23
cEe M
(1) (1)
D
38.9
38.4
1999 May 10 47
14.0
13.7
21
(1)
Z
1
L
M
E
3.2
15.80
2.9
15.24
EUROPEAN
PROJECTION
17.15
15.90
e
w
H
0.181.778 15.24
ISSUE DATE
90-02-13 95-02-04
max.
1.73
Page 48
Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325
QFP64: plastic quad flat package; 64 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm
c
y
X
51 33
52
pin 1 index
64
1
32
Z
e
w M
b
p
20
19
A
E
A
H
E
2
A
E
A
1
detail X
L
p
L

SOT319-2

(A )
3
θ
w M
b
e
p
Z
D
D
H
D
0 5 10 mm
scale
DIMENSIONS (mm are the original dimensions)
mm
A
max.
3.20
0.25
0.05
2.90
2.65
0.25
0.50
0.35
0.25
0.14
UNIT A1A2A3bpcE
(1)
(1) (1)(1)
D
20.1
19.9
eH
H
14.1
13.9
24.2
1
23.6
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC JEDEC EIAJ
REFERENCES
SOT319-2
1999 May 10 48
D
B
E
18.2
17.6
v M
A
v M
B
LL
p
1.0
0.6
0.2 0.10.21.95
EUROPEAN
PROJECTION
Z
D
1.2
0.8
Zywv θ
E
o
1.2
7
o
0.8
0
ISSUE DATE
95-02-04 97-08-01
Page 49
Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325
SOLDERING Introduction
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in
“Data Handbook IC26; Integrated Circuit Packages”
our (document order number 9398 652 90011).
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used.
Through-hole mount packages
S
OLDERING BY DIPPING OR BY SOLDER WAVE
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T
stg(max)
). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.
M
ANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
Surface mount packages
REFLOW SOLDERING Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C.
W
AVE SOLDERING
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically developed.
If wave soldering is used the following conditions must be observed for optimal results:
• Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
• For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
M
ANUAL SOLDERING
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
1999 May 10 49
Page 50
Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325
Suitability of IC packages for wave, reflow and dipping soldering methods
MOUNTING PACKAGE
Through-hole mount DBS, DIP, HDIP, SDIP, SIL suitable
WAVE REFLOW
(2)
− suitable
(1)
DIPPING
Surface mount BGA, SQFP not suitable suitable −
SOLDERING METHOD
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable
(4)
PLCC
, SO, SOJ suitable suitable − LQFP, QFP, TQFP not recommended SSOP, TSSOP, VSO not recommended
(3)
(4)(5) (6)
suitable −
suitable − suitable −
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
.
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
1999 May 10 50
Page 51
Philips Semiconductors Preliminary specification
Universal Serial Bus (USB) CODEC UDA1325

DEFINITIONS

Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
2
PURCHASE OF PHILIPS I
C COMPONENTS
2
Purchase of Philips I components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
C components conveys a license under the Philips’ I2C patent to use the
1999 May 10 51
Page 52
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Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. SCA All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
1999 64
Internet: http://www.semiconductors.philips.com
Printed in The Netherlands 545002/750/01/pp52 Date of release: 1999 May 10 Document order number: 9397 750 02805
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