5.5125, 11.025, 22.05 or 44.1 kHz; 6, 12, 24 or 48 kHz)
via analog PLL (APLL).
• Selectable sample rate between 5 to 55 kHz via a
second oscillator (optional)
• One slave 20-bit I2S digital stereo recording input,
I2S and LSB justified serial formats
• Programmable Gain Amplifier for left and right channel
• Low total harmonic distortion (typical 85 dB)
• High signal-to-noise ratio (typical 90 dB)
• One stereo Line/Microphone input.
USB endpoints
• 2 control endpoints
• 2 interrupt endpoints
• 1 isochronous data sink endpoint
• 1 isochronous data source endpoint.
Document references
•
“USB Specification”
•
“USB Device Class Definition for Audio Devices”
•
“Device Class Definition for Human Interface Devices
(HID)”
•
“USB HID Usage Table”
•
“USB Common Class Specification”
.
.
1999 May 102
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Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
APPLICATIONS
• USB monitors
• USB speakers
• USB microphones
• USB headsets
• USB telephone/answering machines
• USB links in consumer audio devices.
GENERAL DESCRIPTION
The UDA1325 is a single chip stereo USB codec
incorporating bitstream converters designed for
implementation in USB-compliant audio peripherals and
multimedia audio applications. It contains a USB interface,
an embedded microcontroller, an Analog-to-Digital
Interface (ADIF) and an Asynchronous Digital-to-Analog
Converter (ADAC).
The USB interface consists of an analog front-end and a
USB processor. The analog front-end transforms the
differential USB data into a digital data stream. The USB
processor buffers the incoming and outgoing data from the
analog front-end and handles all low-level USB protocols.
The USB processor selects the relevant data from the
universal serial bus, performs an extensive error detection
and separates control information and audio information.
The control information is made accessible to the
microcontroller. At playback, the audio information
becomes available at the digital I
module or is fed directly to the ADAC. At recording, the
audio information is delivered by the ADIF or by the digital
I2S input of the I2S-bus interface.
2
S output of the digital I/O
All I2S inputs and I2S outputs support standard I2S-bus
format and the LSB justified serial data format with word
lengths of 16, 18 and 20 bits.
Via the digital I/O module with its I2S input and output, an
external DSP can be used for adding extra sound
processing features for the audio playback channel.
The microcontroller is responsible for handling the
high-level USB protocols, translating the incoming control
requests and managing the user interface via general
purpose pins and an I2C-bus.
The ADAC enables the wide and continuous range of
playback sampling frequencies. By means of a Sample
Frequency Generator (SFG), the ADAC is able to
reconstruct the average sample frequency from the
incoming audio samples. The ADAC also performs the
playback sound processing. The ADAC consists of a
FIFO, an unique audio feature processing DSP, the SFG,
digital filters, a variable hold register, a Noise Shaper (NS)
and a Filter Stream DAC (FSDAC) with line output drivers.
The audio information is applied to the ADAC via the USB
processor or via the digital I2S input of the digital I/O
module.
The ADIF consists of an Programmable Gain Amplifier
(PGA), an Analog-to-Digital Converter (ADC) and a
Decimator Filter (DF). An Analog Phase Lock Loop (APLL)
or oscillator is used for creating the clock signal of the
ADIF. The clock frequency for the ADIF can be controlled
via the microcontroller. Several clock frequencies are
possible for sampling the analog input signal at different
sampling rates.
The wide dynamic range of the bitstream conversion
technique used in the UDA1325 for both the playback and
recording channel guarantees a high audio sound quality.
The pin numbers given in parenthesis refer to the SDIP42 version.
Fig.1 Block diagram (QFP64 package).
1999 May 105
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Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
PINNING
SYMBOL
PIN
QFP64
PIN
SDIP42
I/ODESCRIPTION
GP3/WSO15I/Ogeneral purpose pin 3 or word select output
GP4/BCKO26I/Ogeneral purpose pin 4 or bit clock output
P0.53−I/OPort 0.5 of the microcontroller
SHTCB47Ishift clock of the test control block (active HIGH)
P0.65−I/OPort 0.6 of the microcontroller
D−68I/Onegative data line of the differential data bus, conforms to the USB
standard
P0.77−I/OPort 0.7 of the microcontroller
D+89I/Opositive data line of the differential data bus, conforms to the USB
standard
V
V
V
V
DDI
SSI
SSE
DDE
910−digital supply voltage for core
1011−digital ground for core
1112−digital ground for I/O pads
1213−digital supply voltage for I/O pads
GP1/DI1314I/Ogeneral purpose pin 1 or data input
P2.014−I/OPort 2.0 of the microcontroller
GP5/WSI1515I/Ogeneral purpose pin 5 or word select input
P2.116−I/OPort 2.1 of the microcontroller
GP0/BCKI1716I/Ogeneral purpose pin 0 or bit clock input
P2.218−I/OPort 2.2 of the microcontroller
SCL1917I/Oserial clock line I
2
C-bus
P2.320−I/OPort 2.3 of the microcontroller
SDA2118I/Oserial data line I
2
C-bus
P2.422−I/OPort 2.4 of the microcontroller
P2.523−I/OPort 2.5 of the microcontroller
V
2822−supply crystal oscillator (48 MHz)
P2.629−I/OPort 2.6 of the microcontroller
P2.730−I/OPort 2.7 of the microcontroller
PSEN31−I/Oprogram store enable (active LOW)
V
V
DDO
SSO
3223−supply voltage for operational amplifier
3324−operational amplifier ground
VOUTL3425Ovoltage output left channel
TC3526Itest control input (active HIGH)
RTCB3627Iasynchronous reset input of the test control block (active HIGH)
VOUTR3728Ovoltage output right channel
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Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
SYMBOL
V
DDA1
V
SSA1
V
ref(DA)
V
ref(AD)
V
DDA2
PIN
QFP64
3829−analog supply voltage 1
3930−analog ground 1
4031Oreference voltage output DAC
4132Oreference voltage output ADC
4233−analog supply voltage 2
PIN
SDIP42
I/ODESCRIPTION
VINL4334Iinput signal left channel PGA
V
SSA2
4435−analog ground 2
n.c.45−−not connected
n.c.46−−not connected
VINR4736Iinput signal right channel PGA
EA48−−external access (active LOW)
VRN4937Inegative reference input voltage ADC
ALE50−−address latch enable (active HIGH)
VRP5138Ipositive reference input voltage ADC
V
DDA3
5239−supply voltage for crystal oscillator and analog PLL
XTAL2a5340Ocrystal output (analog; ADC)
XTAL1a5441Icrystal input (analog; ADC)
V
SSA3
5542−crystal oscillator and analog PLL ground
P0.056−I/OPort 0.0 of the microcontroller
DA571Idata Input (digital)
P0.158−I/OPort 0.1 of the microcontroller
WS592Iword select Input (digital)
P0.260−I/OPort 0.2 of the microcontroller
BCK613Ibit clock Input (digital)
P0.362−I/OPort 0.3 of the microcontroller
GP2/DO634I/Ogeneral purpose pin 2 or data output
P0.464−I/OPort 0.4 of the microcontroller
FUNCTIONAL DESCRIPTION
The Universal Serial Bus (USB)
Data and power is transferred via the USB over a 4-wire
cable. The signalling occurs over two wires and
point-to-point segments. The signals on each segment are
differentially driven into a cable of 90 Ω intrinsic
impedance. The differential receiver features input
sensitivity of at least 200 mV and sufficient common mode
The analog front-end is an on-chip generic USB
transceiver. It is designed to allow voltage levels up to V
DD
from standard or programmable logic to interface with the
physical layer of the USB. It is capable of receiving and
transmitting serial data at full speed (12 Mbits/s).
The USB processor
The USB processor forms the interface between the
analog front-end, the ADIF, the ADAC and the
microcontroller. The USB processor consists of:
• A bit clock recovery circuit
• The Philips Serial Interface Engine (PSIE)
• The Memory Management Unit (MMU)
• The Audio Sample Redistribution (ASR) module.
Bit clock recovery
The bit clock recovery circuit recovers the clock from the
incoming USB data stream using four times over-sampling
principle. It is able to track jitter and frequency drift
specified by the USB specification.
Philips Serial Interface Engine (PSIE)
The Philips SIE implements the full USB protocol layer.
It translates the electrical USB signals into data bytes and
control signals. Depending upon the USB device address
and the USB endpoint address, the USB data is directed
to the correct endpoint buffer. The data transfer could be
of bulk, isochronous, control or interrupt type.
Fig.3 Pin configuration (SDIP42 package).
1999 May 109
The functions of the PSIE include: synchronization pattern
recognition, parallel/serial conversion, bit
stuffing/de-stuffing, CRC checking/generation, PID
verification/generation, address recognition and
handshake evaluation/generation.
The amount of bytes/packet on all endpoints is limited by
the PSIE hardware to 8 bytes/packet, except for both
isochronous endpoints (336 bytes/packet).
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Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
Memory Management Unit (MMU) and integrated RAM
The MMU and integrated RAM handle the temporary data
storage of all USB packets that are received or sent over
the bus.
The MMU and integrated RAM handle the differences
between data rate of the USB and the application allowing
the microcontroller to read and write USB packets at its
own speed.
The audio data is transferred via an isochronous data sink
endpoint or source endpoint and is stored directly into the
RAM. Consequently, no handshaking mechanism is used.
Audio Sample Redistribution (ASR)
The ASR reads the audio samples from the MMU and
integrated RAM and distributes these samples equidistant
over a 1 ms frame period. The distributed audio samples
are translated by the digital I/O module to standard I
2
S-bus
format or 16, 18 or 20 bits LSB-justified I2S-bus format.
The ASR generates the bit clock output (BCKO) and the
Word Select Output signal (WSO) of the I2S output.
The 80C51 microcontroller
The microcontroller receives the control information
selected from the USB by the USB processor. It can be
used for handling the high-level USB protocols and the
user interfaces. The microcontroller does not handle the
audio stream.
The major task of the software process that is mapped
upon the microcontroller, is to control the different modules
of the UDA1325 in such a way that it behaves as a USB
device.
The embedded 80C51 microcontroller is compatible with
the 80C51 family of microcontrollers described in the
80C51 family single-chip 8-bit microcontrollers of “Data
Handbook IC20”, which should be read in conjunction with
this data sheet.
The Analog-to-Digital Interface (ADIF)
The ADIF is used for sampling an analog input signal from
a microphone or line input and sending the audio samples
to the USB interface. The ADIF consists of a stereo
Programmable Gain Amplifier (PGA), a stereo
Analog-to-Digital Converter (ADC) and Decimation Filters
(DFs). The sample frequency of the ADC is determined by
the ADC clock (see Section “The clock source of the
analog-to-digital interface”). The user can also select a
digital serial input instead of an analog input. In this event
the sample frequency is determined by the continuous WS
clock with a range between 5 to 55 kHz. Digital serial input
is possible with four formats (I
2
S-bus, 16, 18 or 20 bits
LSB-justified).
Programmable Gain Amplifier circuit (PGA)
This circuit can be used for a microphone or line input.
The input audio signals can be amplified by seven different
gains (−3 dB, 0 dB, 3 dB, 9 dB, 15 dB, 21 dB and 27 dB).
The gain settings are given in Table 17.
The Analog-to-Digital Converter (ADC)
The stereo ADC of the UDA1325 consists of two 3rd-order
Sigma-Delta modulators. They have a modified
Ritchie-coder architecture in a differential switched
capacitor implementation. The oversampling ratio is 128.
Both ADCs can be switched off in power saving mode (left
and right separate). The ADC clock is generated by the
analog PLL or the ADC oscillator.
The Decimation Filter (DF)
The decimator filter converts the audio data from 128f
s
down to 1fs with a word width of 8, 16 or 24 bits. This data
can be transmitted over the USB as mono or stereo in
1, 2 or 3 bytes/sample. The decimator filters are clocked
by the ADC clock.
The internal ROM size is 12 kbyte. The internal RAM size
is 256 byte. A Watchdog Timer is not integrated.
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Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
The clock source of the analog-to-digital interface
The clock source of the ADIF is the analog PLL or the ADC oscillator. The preferred clock source can be selected.
The ADC clock used for the ADC and decimation filters is obtained by dividing the clock signal coming from the analog
PLL or from the ADC oscillator by a factor Q.
Using the analog PLL the user can select 3 basic APLL clock frequencies (see Table 1).
By connecting the appropriate crystal the user can choose any clock signal between 8.192 and 14.08 MHz via the ADC
oscillator.
Table 1 The analog PLL clock output frequencies
FCODE (1 AND 0)
APLL CLOCK
FREQUENCY (MHz)
0011.2896
018.1920
1012.2880
1111.2896
The dividing factor Q can be selected via the microcontroller. With this dividing factor Q the user can select a range of
ADC clock signals allowing several different sample frequencies (see Table 2).
Table 2 ADC clock frequencies and sample frequencies based upon using the APLL as a clock source
APLL CLOCK
FREQUENCY (MHz)
DIVIDE FACTOR Q ADC CLOCK FREQUENCY (MHz)SAMPLE FREQUENCY (kHz)
Table 3 ADC clock frequencies and sample frequencies based upon using the OSCAD as a clock source
OSCAD CLOCK
FREQUENCY (MHz)
(1)
f
osc
DIVIDE FACTOR Q ADC CLOCK FREQUENCY (MHz)SAMPLE FREQUENCY (kHz)
(2)
Q
f
/(2Q)f
osc
/(256Q)
osc
Notes
1. The oscillator frequency (and therefore the crystal) of OSCAD must be between 8.192 and 14.08 MHz.
2. The Q factor can be 1, 2, 4 or 8.
3. Sample frequencies below 5 kHz and above 55 kHz are not supported.
1999 May 1011
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Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
The Asynchronous Digital-to-Analog Converter
(ADAC)
The ADAC receives audio data from the USB processor or
from the digital I/O-bus. The ADAC is able to reconstruct
the sample clock from the rate at which the audio samples
arrive and handles the audio sound processing. After the
processing, the audio signal is upsampled, noise-shaped
and converted to analog output voltages capable of driving
a line output.
The ADAC consists of:
• A Sample Frequency Generator (SFG)
• FIFO registers
• An audio feature processing DSP
• Two digital upsampling filters and a variable hold
register
• A digital Noise Shaper (NS)
• A Filter Stream DAC (FSDAC) with integrated filter and
line output drivers.
The Sample Frequency Generator (SFG)
The SFG controls the timing signals for the asynchronous
digital-to-analog conversion. By means of a digital PLL,
the SFG automatically recovers the applied sampling
frequency and generates the accurate timing signals for
the audio feature processing DSP and the upsampling
filters.
The lock time of the digital PLL can be chosen (see
Table 8). While the digital PLL is not in lock, the ADAC is
muted. As soon as the digital PLL is in lock, the mute is
released as described in Section “Soft mute control”.
Table 4 Frequency domains for audio processing by the
DSP
DOMAINSAMPLE FREQUENCY (kHz)
15to12
212to25
325to40
440to55
The upsampling filters and variable hold function
After the audio feature processing DSP two upsampling
filters and a variable hold function increase the
oversampling rate to 128f
.
s
The noise shaper
A 3rd-order noise shaper converts the oversampled data
to a noise-shaped bitstream for the FSDAC. The in-band
quantization noise is shifted to frequencies well above the
audio band.
The Filter Stream DAC (FSDAC)
The FSDAC is a semi-digital reconstruction filter that
converts the 1-bit data stream of the noise shaper to an
analog output voltage. The filter coefficients are
implemented as current sources and are summed at
virtual ground of the output operational amplifier. In this
way very high signal-to-noise performance and low clock
jitter sensitivity is achieved. A post filter is not needed
because of the inherent filter function of the DAC.
On-board amplifiers convert the FSDAC output current to
an output voltage signal capable of driving a line output.
First-In First-Out (FIFO) registers
The FIFO registers are used to store the audio samples
temporarily coming from the USB processor or from the
digital I/O input. The use of a FIFO (in conjunction with the
SFG) is necessary to remove all jitter present on the
incoming audio signal.
The sound processing DSP
A DSP processes the sound features. The control and
mapping of the sound features is explained in Section
“Controlling the playback features of the ADAC”.
Depending on the sampling rate (f
) the DSP knows four
s
frequency domains in which the treble and bass are
regulated. The domain is chosen automatically.
CONTROLLING THE PLAYBACK FEATURES
Controlling the playback features of the ADAC
The exchange of control information between the microcontroller and the ADAC is accomplished through a serial
hardware interface comprising the following pins:
L3_DATA: microcontroller interface data line
L3_MODE: microcontroller interface mode line
L3_CLK: microcontroller interface clock line.
See also the description of Port 3 of the 80C51 microcontroller.
ENDPOINT
INDEX
1in8
3in8
ENDPOINT TYPEDIRECTION
MAX. PACKET
SIZE (BYTES)
Information transfer through the microcontroller bus is organized in accordance with the so-called ‘L3’ format, in which
two different modes of operation can be distinguished; address mode and data transfer mode.
The address mode is required to select a device communicating via the L3-bus and to define the destination registers
for the data transfer mode. Data transfer for the UDA1325 can only be in one direction, from microcontroller to ADAC to
program its sound processing features and other functional features.
DDRESS MODE
A
The address mode is used to select a device (in this case the ADAC) for subsequent data transfer and to define the
destination registers. The address mode is characterized by L3_MODE being LOW and a burst of 8 pulses on L3_CLK,
accompanied by 8 data bits on L3_DATA. Data bits 0 and 1 indicate the type of the subsequent data transfer as shown
in Table 6.
1999 May 1013
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Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
Table 6 Selection of data transfer type
BIT1BIT0DATA TRANSFER TYPE
00audio feature registers (volume left, volume right, bass and treble)
01not used
10control registers
11not used
Data bits 7 to 2 represent a 6-bit device address, with bit 7 being the MSB and bit 2 the LSB. The address of the ADAC
is 000101 (bits 7 to 2). In the event that the ADAC receives a different address, it will deselect its microcontroller interface
logic.
D
AT A TRANSFER MODE
The selection preformed in the address mode remains active during subsequent data transfers, until the ADAC receives
a new address command. The data transfer mode is characterized by L3_MODE being HIGH and a burst of 8 pulses on
L3_CLK, accompanied by 8 data bits. All transfers are bitwise, i.e. they are based on groups of 8 bits. Data will be stored
in the ADAC after the eight bit of a byte has been received. The principle of a multibyte transfer is illustrated in the figure
below.
t
dbook, full pagewidth
L3MODE
L3CLOCK
L3DATA
address
ROGRAMMING THE SOUND PROCESSING AND OTHER FEATURES
P
halt
addressdata byte #1data byte #2
MGD018
The sound processing and other feature values are stored in independent registers. The first selection of the registers is
achieved by the choice of data transfer type. This is performed in the address mode, bits 1 and 0 (see Table 6).
The second selection is performed by bit 7 and/or bit 6 of the data byte depending of the selected data transfer type.
Data transfer type ‘audio feature registers’
When the data transfer type ‘audio feature registers’ is selected 4 audio feature registers can be selected depending on
bits 7 and 6 of the data byte (see Table 7).
1999 May 1014
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Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
Table 7 ADAC audio feature registers
BIT7BIT6BIT5BIT4BIT3BIT2BIT1BIT0REGISTER
00VR5VR4VR3VR2VR1VR0volume right
01VL5VL4VL3VL2VL1VL0volume left
10XBB4BB3BB2BB1BB0bass
11XTR4TR3TR2TR1TR0treble
The sequence for controlling the ADAC audio feature registers via the L3-bus is given in the figure below.
book, full pagewidth
(L3_MODE = LOW)
L3_DATA
(L3_MODE = HIGH)
L3_DATA
L3_CLK
DATA_TRANSFER_TYPE
0
bit 0
X
bit 0
0101
LEFT VOLUME; TREBLE
RIGHT VOLUME; BASS
XXXX
DEVICE ADDRESS = $5
000
X
bit 7
REGISTER
ADDRESS
XX
bit 7
MGS270
Data transfer type ‘control registers’
When the data transfer type ‘control registers’ is selected 2 general control registers can be selected depending on bit 7
of the data byte (see Table 7).
The sequence for controlling the ADAC control registers via the L3-bus is given in the figure below.
book, full pagewidth
(L3_MODE = LOW)
L3_DATA
(L3_MODE = HIGH)
L3_DATA
DATA_TRANSFER_TYPE
0
bit 0
X
bit 0
1101
XXXX
DEVICE ADDRESS = $5
000
X
bit 7
REGISTER
ADDRESSDATA OF THE CONTROL REGISTER
XX
bit 7
L3_CLK
1999 May 1015
MGS269
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Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
Table 8 ADAC general control registers
REGISTERBITDESCRIPTIONV ALUECOMMENT
Control register 00reset ADAC0 = not reset
1 = reset
1soft mute control0 = not muted
1 = mutes
2synchronous/asynchronous0 = asynchronous
3channel manipulation0 = L -> L, R -> R
4de-emphasis0 = de-emphasis off
6 and 5 audio mode00 = flat mode
7selecting bit0
Control register 11 and 0 serial I
3 and 2 digital PLL mode00 = adaptive
4digital PLL lock mode0 = adaptive
6 and 5 digital PLL lock speed00 = lock after 512 samples
01 = lock after 2048 samples
10 = lock after 4096 samples
11 = lock after 16348 samples
select 0
select 00
select 1
select 00
Soft mute control
When the mute (bit 1 of control register 0) is active for the playback channel, the value of the sample is decreased
smoothly to zero following a raised cosine curve. There are 32 coefficients used to step down the value of the data, each
one being used 32 times before stepping to the next. This amounts to a mute transition of 23 ms at f
the mute is released, the samples are returned to the full level again following a raised cosine curve with the same
coefficients being used in reversed order.
The mute, on the master channel is synchronized to the sample clock, so that operation always takes place on complete
samples.
1999 May 1016
= 44.1 kHz. When
s
Page 17
Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
Volume control
The volume of the UDA1325 can be controlled from 0 dB down to −60 dB (in steps of 1 dB). Below −60 dB the audio
signal is muted (−∞ dB). The setting of 0 dB is always referenced to the maximum available volume setting. Independant
volume control of the left and right channel is possible (balance control).
Table 9 Volume settings right playback channel
VR5VR4VR3VR2VR1VR0VOLUME (dB)
0000000
0000010
000010−1
000011−2
000100−3
.....................
111100−59
111101−60
111110−∞
111111−∞
Table 10 Volume settings left playback channel
VL5VL4VL3VL2VL1VL0VOLUME (dB)
0000000
0000010
000010−1
000011−2
000100−3
.....................
111100−59
111101−60
111110−∞
111111−∞
1999 May 1017
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Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
Treble control
For the playback channel, treble can be regulated in three audio modes: minimum, flat and maximum mode. In flat mode
the audio is not influenced. In minimum and maximum mode, the treble range is from 0 to 6 dB in steps of 2 dB.
The programmable treble filter is implemented digitally and has a fixed corner frequency of 3000 Hz for the minimum
mode and 1500 Hz for the maximum mode. Because of the exceptional amount of programmable gain, treble should be
used with adequate prior attenuation, using volume control.
For the playback channel, bass can be regulated in three audio modes: minimum, flat and maximum mode. In flat mode
the audio is not influenced. In minimum mode the bass range is from 0 to approximately 14 dB in steps of 1.5 dB.
In maximum mode, the bass range is from 0 to approximately 24 dB in steps of 2 dB. The programmable bass filters are
implemented digitally and have a fixed corner frequency of 100 Hz for the minimum mode and 75 Hz for the maximum
mode. Because of the exceptional amount of programmable gain, bass should be used with adequate prior attenuation,
using volume control.
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Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
Table 12 Bass boost settings
BB4BB3BB2BB1BB0
FLAT SETMIN. SETMAX. SET
00000000
00001000
00010000
00011000
0010001.11.7
0010101.11.7
0011002.43.6
0011102.43.6
0100003.75.4
0100103.75.4
0101005.27.4
0101105.27.4
0110006.89.4
0110106.89.4
0111008.411.3
0111108.411.3
10000010.213.3
10001010.213.3
10010011.915.2
10011011.915.2
10100013.717.3
10101013.717.3
10110013.719.2
10111013.719.2
11000013.721.2
11001013.721.2
11010013.723.2
11011013.723.2
...............013.723.2
11111013.723.2
BASS (dB)
De-emphasis
De-emphasis is controlled by bit 4 of control register 0. The de-emphasis filter can be switched on or off. The digital
de-emphasis filter is dimensioned to produce the de-emphasis frequency characteristics for the sample rate 44.1 kHz.
De-emphasis is synchronized to the sample clock, so that operation always takes place on complete samples.
1999 May 1019
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Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
Filter characteristics playback channel
The overall filter characteristic of the UDA1325 in flat mode is given in Fig.4 (de-emphasis off). The overall filter
characteristic of the UDA1325 includes the filter characteristics of the DSP in flat mode plus the filter characteristic of the
FSDAC (fs= 44.1 kHz)
handbook, full pagewidth
volume
(dB)
−100
−120
−140
−160
−0
−20
−40
−60
−80
MGM110
1020304050607080901000
f (kHz)
Fig.4 Overall filter characteristics of the UDA1325.
1999 May 1020
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Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
DSP extension port for enhanced playback audio processing
An external DSP can be used for adding extra sound processing features via the I2S inputs and outputs of the digital I/O
module. The UDA1325 supports the standard I2S-bus data protocol and the LSB-justified serial data input format with
word lengths of 16, 18 and 20 bits. Using the 4-pin digital I/O option the UDA1325 device acts as a master, controlling
the BCKO and WSO signals. Using the 6-pin digital I/O option GP2, GP3 and GP4 are output pins (master) and GP0,
GP1 and GP5 are input pins (slave).
The period of the WSO signal is determined by the number of samples in the 1 ms frame of the USB. This implies that
the WSO signal does not have a constant time period, but is jittery.
The characteristic timing of the I2S-bus signals is illustrated in Figs 5 and 6.
handbook, full pagewidth
WS
BCK
DATA
t
r
t
BCK(H)
T
cy
RIGHT
t
f
t
s;WS
t
BCK(L)
t
h;WS
LSBMSB
Fig.5 Timing of digital I/O input signals.
t
s;DAT
LEFT
t
h;DAT
MGK003
1999 May 1021
Page 22
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1999 May 1022
ook, full pagewidth
Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
WS
BCK
DATA
WS
BCK
DATA
WS
BCK
DATA
WS
BCK
LEFT
>=8>=8
MSB B2MSBLSBLSB MSBB2
LEFT
MSBLSBB2
LEFT
MSB B2B3B4
LEFT
RIGHT
15161
321321
LSB
2
S-BUS
INPUT FORMAT I
2
B15
LSB-JUSTIFIED FORMAT 16 BITS
2151617181
B17
LSB-JUSTIFIED FORMAT 18 BITS
21516171819201
RIGHT
MSBLSBB2B15
RIGHT
MSB B2B3B4
RIGHT
B17
215161
2151617181
LSB
21516171819201
DATA
MSB B2B3B4B5B6
LSB
B19
LSB-JUSTIFIED FORMAT 20 BITS
Fig.6 Input formats.
MSB B2B3B4B5B6
B19
LSB
MGK002
Page 23
Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
PORT DEFINITION 80C51
Port 1
Table 13 Port 1 of the 80C51 microcontroller
8 BIT PORT 1
BITFUNCTIONLOWHIGHCOMMENT
1.0ADAC_errorno errorerror
1.1GP1general purpose pins
1.2GP2
1.3GP3
1.4GP4
1.5GP5
2
1.6SCLI
1.7SDA
C-bus
Port 3
Table 14 Port 3 of the 80C51 microcontroller
8 BIT PORT 3
BITFUNCTIONLOWHIGHCOMMENT
3.0ASR_errorno errorerror
3.1PSIE_MMU_SUSPENDno suspendsuspendsuspend input from USB interface
during normal operation or input from
restart circuit
3.2GP0 (INT0_N)general purpose pin
3.3PSIE_MMU_INT (INT1_N)interrupt input from USB interface
during normal operation or input from
restart circuit
3.4PSIE_MMU_READY
3.5L3_MODE
3.6L3_CLK
3.7L3_DATA
1999 May 1023
Page 24
Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
MEMORY AND REGISTER SPACE 80C51
Overview registers
Table 15 Register location and recommended values
The UDA1325 supports up to five (of maximal 7) interrupt
sources. Each interrupt source corresponds to an interrupt
vector in the CPU program memory address space:
I
Each interrupt source can be individually enabled or
disabled by setting or clearing a bit in IE. This register also
contains a global interrupt enable bit (EA) which can be
cleared to disable all interrupts at once.
START-UP BEHAVIOUR AND POWER MANAGEMENT
Start-up of the UDA1325
After power-on (of V
), an internal Power-on reset signal becomes HIGH after a certain RC time. This RC time is
DDA1
created by using the internal resistor (2 × 50 kΩ) divider for creating the reference voltage for the FSDAC in combination
with the capacitor connected externally to the V
V
DDA1
and V
. The RC time can be calculated using R = 25000 Ω and C = C
SSA1
pin. The FSDAC and the internal resistor divider are supplied by
REFDA
.
ref
During 20 ms after Power-on reset becomes HIGH the UDA1325 has to initiate the internal registers. During this
initialisation, the user should prevent indicating the ‘connected’ status to the USB-host. This can be done by forcing the
DP-line LOW (i.e. via one of the GP pins).
Power Management
The total current drawn from the USB supply (for i.e. bus-powered operation of the UDA1325 application) must be less
than 500 µA in suspend mode. In order to reach that low current target, the total power dissipation of the UDA1325 can
be reduced by disabling all internal clocks and switching off all internal analog modules.
Important note: In order to make use of power reduction (Power-down mode) and be able to restart after power-down, a
number of precautions must be taken!
1999 May 1028
Page 29
Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
AT INITIALISATION TIME
• Bit 7of the power control register (mux_ctrl_suspend) must be set to ‘1’, in order to connect the CLK_ON of the USB
processor with P3.1 of the microcontroller
• Bit 6 of the power control register (mux_ctrl_int1) must be set to ‘0’, in order to connect the PSIE_MMU_INT output pin
of the USB processor with P3.3 (INT1_N) of the microcontroller
• Bit 7of the I/O selection register must be set to ‘1’, in order to enable the power-on control of the 48 MHz crystal
oscillator automatically by the microcontroller.
I
N NORMAL OPERATION MODE
In normal operation working mode, a suspend can be initiated by the falling edge of the CLK_ON output signal of the
USB processor. This falling edge comes about 2 ms after the rising edge of the PSIE_MMU_SUSPEND output signal of
the USB processor. At this moment, several actions should be taken by the microcontroller:
• All analog modules of the UDA1325 must be switched off; this can be done by setting bits 5 to 0 of the power control
register to ‘1’ and bit 0 of the clock shop register to ‘1’
• Bit 6 of the power control register (mux_ctrl_int1) must be set to ‘1’, in order to awake from power-down by the
CLK_ON signal of the USB processor
• Put all GP pins in the high or low state (depending of how they are used in the UDA1325 application)
• Put the microcontroller in Power-down mode. This can be done via the PCON register of the microcontroller. This
results in an automatically switching off the 48 MHz crystal oscillator and with that all internal clocks (if they are
enabled).
On the rising edge of the CLK_ON output signal, the 48 MHz crystal oscillator will be switched on automatically and with
that all internal clocks (if they are enabled). At the same time, a counter starts counting for 2048 clock cycles (170 µs).
This time is necessary for stabilising the 48 MHz clock of the 48 MHz crystal oscillator.
When the counter reaches its end value (after 2048 cycles), a rising edge will be detected on the P3.3 (INT1_N) of the
microcontroller. At this moment, following actions should be taken by the microcontroller:
• The Power-down mode of the microcontroller must be switched off
• Re-initialise all GP pins
• All analog modules of the UDA1325 must be switched on; this can be done by setting bits 5 to 0 of the power control
register to ‘0’ and bit 0 of the clock shop register to ‘0’
• Bit 6 of the power control register (mux_ctrl_int1) must be set to ‘0’, in order to connect the PSIE_MMU_INT output pin
of the USB processor again with P3.3 (INT1_N) of the microcontroller.
The UDA1325 is now back in its normal operation mode and can be put back in power reduction mode by the falling edge
of the CLK_ON signal of the USB processor.
1999 May 1029
Page 30
Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
COMMAND SUMMARY
COMMAND NAMERECIPIENTCODINGDATA PHASE
Initialization commands
Set address/enabledeviceD0hwrite 1 byte
Read address/enabledeviceD0hread 1 byte
Set endpoint enabledeviceD8hwrite 1 byte
Read endpoint enabledeviceD8hread 1 byte
Set modedeviceF3hwrite 1 byte
control IN01hread 1 byte (optional)
other endpoints00h + endpoint indexread 1 byte (optional)
Get endpoint statuscontrol OUT40hread 1 byte
control IN41hread 1 byte
other endpoints40h + endpoint indexread 1 byte
Set endpoint statuscontrol OUT40hwrite 1 byte
control IN41hwrite 1 byte
other endpoints40h + endpoint indexwrite 1 byte
Read bufferselected endpointF0hread n bytes
Write bufferselected endpointF0hwrite n bytes
Acknowledge setupselected endpointF1hnone
Clear bufferselected endpointF2hnone
Validate bufferselected endpointFAhnone
General commands
Read current frame numberF5hread 1 or 2 bytes
1999 May 1030
Page 31
Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
COMMAND DESCRIPTIONS
Command procedure
This chapter describes the commands that can be used by
the microcontroller to control the USB processor. There
are three basic types of commands:
• Initialization commands
• Data flow commands
• General commands.
A command is represented by an 8 bit code. It can be
followed by one or more data write cycles or one or more
read cycles or a combination. The PSIE_MMU_READY
output connected to Port 3.4 of the microcontroller
indicates that the previous action (command write, data
read or data write) has completed. A new action can only
be initiated if PSIE_MMU_READY is TRUE. The data is
valid from the moment PSIE_MMU_READY becomes
TRUE.
The PSIE contains a number of interrupt registers, one for
each endpoint. Every time a transition occurs, the interrupt
flag for the involved endpoint is set. The PSIE_MMU_INT
connected to Port 3.3 is an OR function of all interrupt
registers.
Initialization commands
Initialization commands are used during the enumeration
process of the USB network. They are used to set the USB
assigned address, enable endpoints and select the
configuration of the device.
S
ET ADDRESS/ENABLE
Command: D0h.
Data: write 1 byte.
The set address/enable command is used to set the USB
assigned address and enable the function. The device
always powers up disabled and should be enabled after a
bus reset.
01234567
0
0000000
Power On Value
Address
Enable
Table 24
BITDESCRIPTION
Addressthe value written becomes
the device address
Enablea ‘1’ enables this function
EAD ADDRESS/ENABLE
R
Command: D0h.
Data: read 1 byte.
The read address/enable command is used to read the
USB assigned address and the enable bit of the device.
The format of the data phase is the same as for the set
address/enable command.
S
ET ENDPOINT ENABLE
Command: D8h.
Data: write 1 byte.
The set endpoint enable command is used to set the
enable bits for the non default endpoints.
76543210
XXXXXXX0
Power On Value
Enable
Reserved
If the enable bit is ‘1’, the non default endpoints are
enabled, if ‘0’, the non default endpoints are disabled.
The function then only responds to the default control
endpoint.
After bus reset, the enable bit is set to ‘0’.
R
EAD ENDPOINT ENABLE
Command: D8h.
Data: read 1 byte.
The read endpoint enable command is used to read the
enable bit for the non default endpoints of the function.
The format of the data phase is the same as for the set
endpoint enable command.
S
ET MODE
1999 May 1031
Command: F3h.
Data: write 1 byte.
Page 32
Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
An interrupt is also generated after a bus reset. When the
Reset value: gives the value of the bits after Power-on
reset. Bus reset: a ‘F’ indicates that the value of the bit is
not changed during a bus reset. a ‘T’ indicates that during
a bus reset, the bit is reset to its reset value.
interrupt register consists of all zeros, and an interrupt was
generated, there was a bus reset. The interrupt is cleared
when the interrupt register is read.
76543210
00 00 00 00
ELECT ENDPOINT
S
Power On Value
Control OUT
Control IN
Endpoint 1 OUT
Endpoint 1 IN
Endpoint 2 IN
Endpoint 3 IN
Endpoint 4 OUT
Endpoint 5 IN
Table 25
BITDESCRIPTION
IsoOutISO out endpoint can be
used
IsoInISO in endpoint can be
used
IntIsoOutallow interrupt from ISO
out endpoint
IntIsoInallow interrupt from ISO in
endpoint
ErrorDebugModeSetting chip in debug
mode
AlwaysPLLClockthe PLL clock must keep
on running
Data flow commands
Data flow commands are used to manage the data
transmission between the USB endpoints and the host.
Much of the data flow is initiated via the interrupt to the
microcontroller. The microcontroller uses these
commands to access the endpoint buffers and determine
whether the endpoint buffers have valid data.
R
EAD INTERRUPT REGISTER
Command: F4h.
Data: read 1 byte.
The read interrupt register command returns the value of
the interrupt register. Every time a packet is received or
transmitted, an interrupt will be generated and a flag
specific to the physical endpoint will be set in the interrupt
register. Reading the status of the endpoint will clear the
flag.
Command: 00h + endpoint index.
Data: optional read 1 byte.
The select endpoint command initializes an internal
pointer to the start of the selected buffer. Optionally, this
command can be followed by a data read. Bit 0 is low if the
buffer is empty and high if the buffer is full. There is one
command for every endpoint.
76543210
XXXXXXX0
ET ENDPOINT STATUS
G
Power On Value
Full/Empty
Reserved
Command: 40h + endpoint index.
Data: read 1 byte.
The get endpoint status command is followed by one data
read that returns the status of the last transaction of the
selected endpoint. This command also resets the
corresponding interrupt flag in the interrupt register, and
clears the status, indicating that it was read. There is one
command for every endpoint.
76543210
00 000
000
Power On Value
Data Receive/Transmit
Error Code
Setup Packet
Data 0/1 Packet
Previous Status not Read
1999 May 1032
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Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
Table 26 Error codes
ERROR
CODE
RESULT
0000no error
0001PID encoding error; bits 7 to 4 in the PID
token are not the inversion of bits 3 to 0
0010PID unknown; PID encoding is valid, but PID
does not exist
0011unexpected packet; packet is not of the type
expected (token, data or acknowledge), or
SETUP token received on non-control
endpoint
0100token CRC error
0101data CRC error
0110time out error
0111babble error
1000unexpected end-of-packet
1001sent or received NAK
1010sent stall, a token was received, but the
endpoint was stalled
1011overflow error, the received data packet was
larger then the buffer size of the selected
endpoint
1100sent empty packet (ISO only)
1101bitstuff error
1110error in sync
1111wrong data PID
Table 27
BITDESCRIPTION
Data receive/transmita ‘1’ indicates data has
been received or
transmitted successfully
Error codesee Table 26
Setup packeta ‘1’ indicates the last
received packet had a
SETUP token (this will
always read ‘0’ for IN
buffers)
Data 0/1 packeta ‘1’ indicates the last
received packet had a
DATA 1 PID
Previous status not reada ‘1’ indicates a second
event occurred before the
previous status was read
SET ENDPOINT STATUS
Command: 40h + endpoint index.
Data: write 1 byte.
This command is used to stall or unstall an endpoint. Only
the least significant bit has a meaning. When the stalled bit
is equal to 1, the endpoint is stalled, when equal to 0, the
endpoint is unstalled. There is one command for every
endpoint.
A stalled control endpoint is automatically unstalled when
it receives a SETUP token, regardless of the contents of
the packet. If the endpoint should stay in stalled state, the
microcontroller should restall it.
When a stalled endpoint is unstalled, it is also re-initialized.
This means that its buffer is flushed and the next DATA
PID that will be sent or expected (depending on the
direction of the endpoint) is DATA0.
01234567
0
Power On Value
Stalled
Reserved
EAD BUFFER
R
X
XXXXXX
Command: F0h.
Data: read n bytes (max. 10).
The read buffer command is followed by a number of data
reads, which returns the contents of the selected endpoint
data buffer. After each read, the internal buffer pointer is
incremented by 1.
The buffer pointer is not reset to the buffer start by the read
buffer command. This means that reading a buffer can be
interrupted by any other command (except for select
endpoint).
1999 May 1033
Page 34
Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
The data in the buffer are organized as follows:
Byte 0: transfer successful, number of data bytes (MSB)
Byte 1: number of data bytes (LSB)
Byte 2: data byte 0
Byte 3: data byte 1
Byte 4: data byte 2
Byte 5: data byte 3
Byte 6: data byte 4
Byte 7: data byte 5
Byte 8: data byte 6
Byte 9: data byte 7.
Bytes 0 and 1 indicate the number of bytes in the buffer.
Byte 0 is the Most Significant Byte (MSB). Byte 1 is the
Least Significant Byte (LSB). Only bits 1 and 0 of byte 0
are used in the number of bytes indication.
Bit 7 of byte 0 indicates if the transaction was successful
(bit 7 is ‘1’ if the transaction was successful). Bits 6 to 2 of
byte 0 are reserved.
RITE BUFFER
W
Command: F0h.
Data: write n bytes (max. 10).
The write buffer command is followed by a number of data
writes, which load the endpoint buffer. After each write, the
internal buffer pointer is incremented by 1.
acknowledged explicitly that it has seen the SETUP
packet.
If the microcontroller is reading the data from a SETUP
packet, and a new SETUP packet arrives, the device must
accept this new SETUP packet. So the data, currently
being read by the microcontroller, is overwritten with the
new packet. On the arrival of the new packet, the
commands validate buffer and clear buffer are disabled.
If the microcontroller has finished reading the data from
the buffer, it will try to clear the buffer. The device will
ignore this command, so the new SETUP packet in the
buffer is not cleared. The microcontroller will now detect
the interrupt of the new SETUP packet and will start
reading the new data in the buffer.
A SETUP token can be followed by an IN token. After the
SETUP token, the microcontroller will start filling the IN
buffer. A SETUP token will clear the IN buffer. This avoids
the following problem: after a SETUP token, the
microcontroller fills the IN buffer. If the SETUP token is
followed by a SETUP token and shortly followed by an IN
token, the device will send the contents of the IN buffer to
the host. The IN buffer was filled after the first SETUP
token. That is why after a SETUP token the IN buffer is
cleared.
If the microcontroller is still filling the buffer when the
second SETUP token arrives, the SETUP token will clear
the IN buffer. If the microcontroller has filled the IN buffer,
it will validate the buffer. So clearing the IN buffer on
receiving a SETUP token is not enough.
The buffer pointer is not reset to the buffer start by the write
buffer command. This means that writing a buffer can be
interrupted by any other command (except for select
endpoint).
The data must be organized in the same way as described
in the read buffer command. Bits 7 to 2 of byte 0 are
reserved and must be filled with zeros.
CKNOWLEDGE SETUP
A
Command: F1h.
Data: none.
The arrival of a SETUP packet flushes the IN buffer and
disables the validate buffer and clear buffer commands for
both IN and OUT endpoints.
The microcontroller needs to re-enable these commands
by the acknowledge setup command. This ensures that
the last SETUP packet stays in the buffer and no packet
can be sent back to the host until the microcontroller has
1999 May 1034
If a SETUP token is received, the device will also disable
the validate buffer command for the IN buffer. If the
microcontroller needs to fill the buffer after a SETUP token,
the command acknowledge setup command must be sent
to enable the validate buffer command.
C
LEAR BUFFER
Command: F2h.
Data: none.
When a packet is received completely, an internal
endpoint buffer full flag is set. All subsequent packets will
be refused by returning a NACK to the host. When the
microcontroller has read the data, it should free the buffer
by the clear buffer command. When the buffer is cleared,
new packets will be accepted.
Page 35
Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
VALIDATE BUFFER
Command: FAh.
Data: none.
When the microcontroller has written data into an IN buffer,
it should set the buffer full flag by the validate buffer
command. This indicates that the data in the buffer are
valid and can be sent to the host when the next IN token is
received.
General commands
READ CURRENT FRAME NUMBER
Command: F5h.
Data: read 1 or 2 bytes.
This command is followed by one or two data reads and
returns the frame number of the last successfully received
SOF. The frame number is eleven bits wide. The frame
number is returned least significant byte first. In case the
user is only interested in the lower 8 bits of the frame
number only the first byte needs to be read.
2
C MASTER/SLAVE INTERFACE
I
The I2C module implements a master/slave I2C-bus
interface with integrated shift register, shift timing
generation and slave address recognition. It is compliant
to the I2C-bus specification IC20/Jan92. I2C standard
mode (100 kHz SCL) and fast mode (400 kHz) are
supported. Low speed mode and extended 10 bit
addressing are unsupported.
2
Characteristics of the I
C-bus
The I2C-bus is for 2-way, 2-line communication between
different ICs or modules. The two lines are a serial data
line (SDA) and a Serial Clock Line (SCL). Both lines must
be connected to V
via a pull-up resistor.
DDE
The timing definition of the I2C-bus is given in Fig.7.
Programmer’s view
For a detailed description of the I
2
C-bus protocol refer to
Philips Integrated Circuits Data Handbook IC20, 8XC552.
S1CON register
The CPU can read from and write to this 8-bit SFR.
Two bits are effected by the SIO1 hardware: the SI bit is
set when a serial interrupt is requested, and the STO bit is
cleared when a STOP condition is present on the I
2
C-bus.
The STO bit is also cleared when ENS1 = ‘0’. Reset
initializes S1CON to 00h.
76543210
Power On Value
CR0
CR1
AA
SI
STO
STA
ENS1
CR2
CR2, 1
00 00 00 00
AND 0-THE CLOCK RATE BITS
These three bits determine the serial clock frequency
when SIO1 is in a master mode.
When the CR bits are ‘111’, the maximum bit rate for the
data transfer will be derived from the Timer 1 overflow rate
divided by 2 (i.e. every time the Timer 1 overflows, the
SCL signal will toggle).
The programmer’s view of the I2C library function is -with
one exception- identical to that of the 8XC552
microcontroller. Only the bit rate frequency selection in
S1CON and the handling of the Timer 1 overflow
information deviates to accommodate 400 kHz operation.
1999 May 1035
Page 36
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SDA
Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
SCL
t
BUF
P
S
t
LOW
t
HD;STA
t
r
t
HD;DAT
t
HIGH
t
f
t
SU;DAT
t
SU;STA
Sr
t
HD;STA
t
SP
t
SU;STO
MBC611
P
Fig.7 Definition of timing of the I2C-bus.
handbook, full pagewidth
Page 37
Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
All digital I/Os
V
I/O
I
O
DC input/output voltage range−0.5−V
output currentV
supply voltage periphery (I/O)4.755.05.25V
supply voltage (core)3.03.33.6V
DC input voltage range
for D+ and D−0.0−V
for VINL and VINR−0.5V
DD
for digital I/Os0.0−V
DD
−V
DDE
V
V
1999 May 1037
Page 38
Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
DC CHARACTERISTICS
= 5.0 V; VDD= 3.3 V; T
V
DDE
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
Supplies
V
DDE
V
DDI
V
DDA1
V
DDA2
V
DDA3
V
DDO
V
DDX
I
DDE
I
DDI
I
DDA1
I
DDA2
I
DDA3
I
DDO
I
DDX
P
tot
P
ps
digital supply voltage periphery4.755.05.25V
digital supply voltage core3.03.33.6V
analog supply voltage 13.03.33.6V
analog supply voltage 23.03.33.6V
analog supply voltage 33.03.33.6V
operational amplifier supply voltage3.03.33.6V
crystal oscillator supply voltage3.03.33.6V
digital supply current peripherynote 1−3.7−mA
digital supply current core−39.0−mA
analog supply current 1−3.6−mA
analog supply current 2−8.0−mA
analog supply current 3−0.99.0
operational amplifier supply current−3.0−mA
crystal oscillator supply current−1.213.0
total power dissipation−200−mW
total power dissipation in power
1. This value depends strongly on the application. The specified value is the typical value obtained using the application
diagram as illustrated in Fig.8.
2. At start-up of the OSCAD oscillator.
3. At start-up of the OSC48 oscillator.
4. Exclusive the IDDE current which depends on the components connected to the I/O pins.
reference voltage PGA and ADC−0.5V
positive reference voltage of the
−V
DDA2
DDA2
−V
−V
ADC
negative reference voltage of the
−0.0−V
ADC
DC input voltage VINL and VINR of
−0.5V
DDA2
−V
the PGA
DC input resistance at VINL and
−12.5−kΩ
VINR of the PGA
reference voltage DAC−0.5V
common mode output voltage−0.5V
output resistance at VOUTL and
audio sample output frequency5−55kHz
rise timeCL=50pF4−20ns
fall timeCL=50pF4−20ns
rise/fall time matching (tr/tf)90−110%
output signal crossover voltage1.3−2.0V
driver output resistancesteady-state drive28−43Ω
audio sample input frequency5−55kHz
full speed data rate11.9712.0012.03Mbits/s
frame interval0.99951.00001.0005ms
source differential jitter to next
−3.50.0+3.5ns
transition
source differential jitter for paired
−4.00.0+4.0ns
transitions
source end of packet width160−175ns
differential to end of packet
−2.0−+5.0ns
transition skew
receiver data jitter tolerance to next
−18.50.0+18.5ns
transition
receiver data jitter tolerance for
−9.00.0+9.0ns
paired transitions
end of packet width at receiver
40−−ns
must reject as end of packet
end of packet width at receiver
82−−ns
must accept as end of packet
Serial input/output data timing
f
s
f
i(WS)
t
r
t
f
t
BCK(H)
t
BCK(L)
t
s;DAT
t
h;DAT
t
s;WS
t
h;WS
system clock frequency−12−MHz
word selection input frequency5−55kHz
rise time−−20ns
fall time−−20ns
bit clock HIGH time55−−ns
bit clock LOW time55−−ns
data set-up time10−−ns
data hold time20−−ns
word selection set-up time20−−ns
word selection hold time10−−ns
1999 May 1040
Page 41
Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
SDA and SCL lines for 100 kHz I2C devices
f
SCL
t
BUF
t
HD;STA
t
LOW
t
HIGH
t
SU;STA
t
SU;STO
t
HD;DAT
t
SU;DAT
t
r
t
f
C
L(bus)
Oscillator 1 (system clock)
f
osc
δduty factor−50−%
g
m
R
o
C
i(XTAL1a)
C
i(XTAL2a)
I
start
Oscillator 2 (for ADC clock)
f
osc
δduty cycle−50−%
g
m
R
o
C
i(XTAL1b)
C
i(XTAL2b)
I
start
SCL clock frequency0−100kHz
bus free time between a STOP and
4.7−−µs
START condition
hold time (repeated) START
4.0−−µs
condition
LOW period of the SCL clock4.7−−µs
HIGH period of the SCL clock4.0−−µs
set-up time for a repeated START
4.7−−µs
condition
set-up time for STOP condition4.0−−µs
data hold time5.0−−µs
data set-up time250−−ns
rise time of both SDA and SCL
full-scale input voltage (RMS value) PGA gain = −3dB −1414
ref
(2)
−−ms
(3)
−mV
PGA gain=0dB−1000−mV
PGA gain=3dB−708−mV
PGA gain=9dB−355−mV
PGA gain = 15 dB −178−mV
PGA gain = 21 dB −89−mV
PGA gain = 27 dB −44−mV
input capacitance of the PGA−−20pF
f
= 44.1 kHz at
s
noise-to-signal ratio
input signal of
1 kHz; PGA
gain = 0 dB;
note 4
V
(0 dB)
i
1.0 V (RMS)
V
(−60 dB)−−30−20dB
i
−−85−80dB
−0.00560.01%
−3.210.0%
crosstalk between channelsPGA gain=0dB−100−dB
sample frequency (128fs)0.640−7.04MHz
−−2.0−dBFS
V
= 1 V (RMS)
i
1999 May 1042
Page 43
Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
Filter stream DAC
RESresolution16−−bits
V
o(FS)(rms)
SVRRsupply voltage ripple rejection at
∆V
channel unbalancemaximum volume−0.03−dB
o
α
ct
(THD + N)/Stotal harmonic distortion plus
S/Nsignal-to-noise ratio at bipolar zeroA-weighting at
full-scale output voltage
VDD= 3.3 V−0.66−V
(RMS value)
f
V
DDA
and V
DDO
ripple
V
ripple(p-p)
= 1 kHz
= 0.1 V
−60−dB
crosstalk between channelsRL=5kΩ−95−dB
f
= 44.1 kHz;
s
noise-to-signal ratio
RL=5kΩ; note 5
at input signal of
1 kHz (0 dB)
at input signal of
1 kHz (−60 dB)
−−90−80dB
−0.00320.01%
−−30−20dB
−3.210%
9095−dB
code 0000H
Notes
1. Strongly depends on the external decoupling capacitor connected to V
2. C
in µF.
ref
ref(DA)
.
3. Although a level of 1.414 V (RMS) would be required to optimal drive the ADC in this gain setting, this level can not
be used. Due to the 3.3 V supply voltage input, signals of 1.17 V (RMS) and higher will result in clipping.
4. Measured with the APLL as ADC clock source.
5. Measured with I2S-bus input as digital source.
1999 May 1043
Page 44
Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
APPLICATION INFORMATION
handbook, full pagewidth
X4
1
1
2
2
3
3
45
4
C15
10 nF
(50 V)
+V
A
R35
1 Ω
C34
47 µF
(16 V)
C38
100 nF
(63 V)
V
V
DDA1
SSA1
3839
GP0/BCKI
BCKI
digital
input
WSI
playback
recording
L1
8
7
6
digital
input
DI
BCK
WS
DA
+V
C
C18
22 pF
(63 V)
C44
10 nF (63 V)
R48
1.5 kΩ
C17
22 pF
(63 V)
C8
47 µF (16 V)
C22
47 µF (16 V)
L5
1.5 µH
22 Ω
R16
22 Ω
R7
V
USB
C16
10 nF
(50 V)
analog
input
recording
GP5/WSI
1
GP1/DI
BCK
VINR
VINL
XTAL2b
17
15
13
61
WS
59
DA
57
D−
6
D+
8
47
43
26
UDA1325H
C32
47 µF
(16 V)
C21
100 nF
(63 V)
V
SSA2
+V
A
R27
1 Ω
V
DDA2
4244
C38
12 pF (63 V)
C37
12 pF (63 V)
ADC XTAL
V
V
A(ext)
D(ext)
L8
BLM32A07
L7
BLM32A07
L6
BLM32A07
GND
C47
100 µF
(16 V)
C46
100 µF
(16 V)
Fig.8 Application diagram UDA1325H (continued in Fig.9).
1999 May 1044
C5
18 pF
(50 V)
C45
100 µF
(16 V)
+V
+V
+V
X148 MHz
XTAL1b
XTAL2a
XTAL1a
C6
18 pF
(50 V)
A
C
D
MGM760
25
53
54
10
V
SSI
C25
100 nF
(63 V)
C24
100 nF
(63 V)
9
V
DDI
L2
BLM32A07
R17
1 Ω
+V
C
11
V
SSE
100 nF
(63 V)
100 nF
(63 V)
C26
C27
12
V
DDE
L3
BLM32A07
R25
1 Ω
+V
D
Page 45
Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
handbook, full pagewidth
C7
47 µF
(16 V)
C19
100 nF
(63 V)
V
V
SSA3
5255
UDA1325H
+V
R10
1 Ω
A
DDA3
C11
100 nF
(63 V)
+V
A
R8
1 Ω
VRPVRN
5149
P0.0
56
P0.1
58
P0.2
60
P0.3
62
P0.4
64
P0.5
3
P0.6
5
P0.7
7
ALE
50
P2.0
14
P2.1
16
P2.2
18
P2.3
20
P2.4
22
P2.5
23
PSEN
31
EA
48
21
19
40
41
37
34
+V
SDA
SCL
V
ref(DA)
V
ref(AD)
VOUTR
VOUTL
R20
D
1 Ω
47 µF (16 V)
47 µF (16 V)
C35
C48
C36
100 nF
(63 V)
C28
100 nF
(63 V)
D
7
18
D
6
17
D
5
14
D
4
13
D
3
8
2
1
0
V
74HCT373D
7
4
3
11
1
A0
1
A1
2
A2
3
SS
4
C31
47 µF
(16 V)
analog
output
playback
D1
PCF85116-3
D
D
D
LE
OE
R28
4.7 kΩ
D4
19
16
15
12
9
6
5
2
20
10
C29
100 nF
(63 V)
Q
Q
Q
Q
Q
Q
Q
Q
V
GND
8
7
6
5
R39
10 kΩ
A0
10
A1
9
A2
8
A3
7
A4
6
A5
5
A6
4
A7
3
A8
A9
A10
A11
A12
A13
OE
CE
PGM
V
PP
+V
D
J3
1
2
25
24
21
23
2
26
22
20
27
1
3
2
1
2
(I
C-bus)
D2
EEPM27128
+V
D
(internal ROM)
(external ROM)
7
6
5
4
3
2
1
0
CC
+V
D
100 nF
C24
(50 V)
V
PTC
SCL
SDA
DD
C41
47 µF
(16 V)
+V
R38
10 kΩ
D
O0
11
O1
12
O2
13
O3
15
O4
16
O5
17
O6
18
O7
19
V
CC
C25
+V
100 nF
(50 V)
D
28
GND
14
GP4/BCKO
33
V
SSO
C33
100 nF
(63 V)
C39
47 µF
(16 V)
2
GP3/WSO
1
GP2/DO
63
RTCB
36
TC
35
SHTCB
4
24
V
SSX
100 nF
(63 V)
100 nF
(63 V)
C28
C18
28
V
DDX
L13
BLM32A07
R26
1 Ω
+V
C
32
V
DDO
R43
1 Ω
+V
A
MGM761
BCKO
WSO
DO
digital
output
playback
Fig.9 Application diagram UDA1325H (continued from Fig.8).
1999 May 1045
Page 46
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1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
max.
mm
5.080.514.0
OUTLINE
VERSION
SOT270-1
12
min.
max.
IEC JEDEC EIAJ
1.3
0.8
b
1
0.53
0.40
REFERENCES
0.32
0.23
cEeM
(1)(1)
D
38.9
38.4
1999 May 1047
14.0
13.7
21
(1)
Z
1
L
M
E
3.2
15.80
2.9
15.24
EUROPEAN
PROJECTION
17.15
15.90
e
w
H
0.181.77815.24
ISSUE DATE
90-02-13
95-02-04
max.
1.73
Page 48
Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
QFP64: plastic quad flat package; 64 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm
c
y
X
5133
52
pin 1 index
64
1
32
Z
e
w M
b
p
20
19
A
E
A
H
E
2
A
E
A
1
detail X
L
p
L
SOT319-2
(A )
3
θ
w M
b
e
p
Z
D
D
H
D
0510 mm
scale
DIMENSIONS (mm are the original dimensions)
mm
A
max.
3.20
0.25
0.05
2.90
2.65
0.25
0.50
0.35
0.25
0.14
UNITA1A2A3bpcE
(1)
(1)(1)(1)
D
20.1
19.9
eH
H
14.1
13.9
24.2
1
23.6
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC JEDEC EIAJ
REFERENCES
SOT319-2
1999 May 1048
D
B
E
18.2
17.6
v M
A
v M
B
LL
p
1.0
0.6
0.20.10.21.95
EUROPEAN
PROJECTION
Z
D
1.2
0.8
Zywvθ
E
o
1.2
7
o
0.8
0
ISSUE DATE
95-02-04
97-08-01
Page 49
Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
SOLDERING
Introduction
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
“Data Handbook IC26; Integrated Circuit Packages”
our
(document order number 9398 652 90011).
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mount components are mixed on
one printed-circuit board. However, wave soldering is not
always suitable for surface mount ICs, or for printed-circuit
boards with high population densities. In these situations
reflow soldering is often used.
Through-hole mount packages
S
OLDERING BY DIPPING OR BY SOLDER WAVE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg(max)
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
M
ANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.
Surface mount packages
REFLOW SOLDERING
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
W
AVE SOLDERING
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
M
ANUAL SOLDERING
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
1999 May 1049
Page 50
Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
Suitability of IC packages for wave, reflow and dipping soldering methods
MOUNTINGPACKAGE
Through-hole mount DBS, DIP, HDIP, SDIP, SILsuitable
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
1999 May 1050
Page 51
Philips SemiconductorsPreliminary specification
Universal Serial Bus (USB) CODECUDA1325
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
2
PURCHASE OF PHILIPS I
C COMPONENTS
2
Purchase of Philips I
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
C components conveys a license under the Philips’ I2C patent to use the
1999 May 1051
Page 52
Philips Semiconductors – a worldwide company
Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
199964
Internet: http://www.semiconductors.philips.com
Printed in The Netherlands545002/750/01/pp52 Date of release: 1999 May 10Document order number: 9397 750 02805
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