Philips TEA1533T, TEA1533AT User Manual

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Page 1

INTEGRATED CIRCUITS

DATA SH EET

TEA1533T; TEA1533AT

GreenChip

Product speciﬁcation Supersedes data of 2002 May 31

II SMPS control IC

2002 Aug 23

Page 2

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC

FEATURES Distinctive features

• Universal mains supply operation (70 to 276 V AC)

• High level of integration, giving a very low external

component count.

Green features

• Valley or zero voltage switching for minimum switching losses

• Efficient quasi-resonant operation at high power levels

• Frequency reductionat low power standby for improved

system efficiency (<3 W)

• Cycle skipping mode at very low loads; Pi <300 mW at no-load operation for a typical adapter application

• On-chip start-up current source.

Protection features

• Safe restart mode for system fault conditions

• Continuous mode protection by means of

demagnetization detection (zero switch-on current)

• Accurateand adjustable overvoltage protection(latched in TEA1533T, safe restart in TEA1533AT)

• Short winding protection

• Undervoltage protection (foldback during overload)

• Overtemperatureprotection (latched inTEA1533T, safe

restart in TEA1533AT)

• Low and adjustable overcurrent protection trip level

• Soft (re)start

• Mains voltage-dependent operation enabling level.

TEA1533T; TEA1533AT

APPLICATIONS

Besides typical application areas, i.e. adapters and chargers, the device can be used in TV and monitor supplies and all applications that demand an efficient and cost-effective solution up to 250 W.

TEA1533T

TEA1533AT

2002 Aug 23 2

MGU499

Fig.1 Basic application diagram.

Page 3

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC

GENERAL DESCRIPTION

The GreenChip Switched Mode Power Supply (SMPS) control ICs operatingdirectly from the rectified universalmains.A high level of integration leads to a cost effective power supply with a very low number of external components.

The special built-in green functions allow the efficiency to be optimum at all power levels. This holds for quasi-resonant operation at high power levels, as well as fixed frequency operation with valley switching at medium power levels. At low power (standby) levels, the system operates at a reduced frequency and with valley detection.

(1) GreenChip is a trademark of Koninklijke Philips

Electronics N.V.

ORDERING INFORMATION

TYPE

NUMBER

TEA1533T SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 TEA1533AT

(1)

II is the second generation of green

NAME DESCRIPTION VERSION

The proprietary high voltage BCD800 process makes direct start-up possible from the rectified mains voltage in an effective and green way. A second low voltage BICMOS IC is used for accurate, high-speed protection functions and control.

Highly efficient and reliable supplies can easily be designed using the GreenChipII control IC.

PACKAGE

TEA1533T; TEA1533AT

2002 Aug 23 3

Page 4

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2002 Aug 23 4

ok, full pagewidth

BLOCK DIAGRAM

Philips Semiconductors Product speciﬁcation

GreenChip

GND

CTRL

prot(CTRL)

M-level

−1

burst detect

2.5 V

SUPPLY

MANAGEMENT

internal

FREQUENCY

UVLO start

supply

VOLTAGE

CONTROLLED

OSCILLATOR

CONTROL

POWER-ON

RESET

OVER-

TEMPERATURE

PROTECTION

DEMAG SHORT

PROTECTION

UVLO

< 4.5 V

or UVLO

(TEA1533AT)

LOGIC

UP/DOWN

COUNTER

LOGIC

START-UP

CURRENT SOURCE

OCP

VALLEY

100

VOLTAGE

PROTECTION

LEB

blank

OCP

OVER-

DRIVER

prot(DEM)

clamp

start

soft

DRAIN

12, 13

0.5 V

HVS n.c.

DEM

DRIVER

sense

II SMPS control IC

TEA1533T; TEA1533AT

TEA1533T

TEA1533AT

MAXIMUM

ON-TIME

PROTECTION

Fig.2 Block diagram.

short

winding

0.88 V

OVERPOWER PROTECTION

MGU500

Page 5

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC

TEA1533T; TEA1533AT

PINNING FUNCTIONAL DESCRIPTION

SYMBOL PIN DESCRIPTION

n.c. 1 not connected V

2 supply voltage

GND 3 ground

The TEA1533 is the controller of a compact flyback converter, and is situated at the primary side. An auxiliary winding of the transformer provides demagnetization detection and powers the IC after start-up.

The TEA1533 can operate in multi modes (see Fig.4).

n.c. 4 not connected n.c. 5 not connected CTRL 6 control input DEM 7 input from auxiliary winding for

demagnetization timing, overvoltage and overpower protection

handbook, halfpage

(kHz)

VCO fixed quasi resonant

175

n.c. 8 not connected I

sense

9 programmable current sense input n.c. 10 not connected DRIVER 11 gate driver output

HVS 12 high voltage safety spacer, not

connected

HVS 13 high voltage safety spacer, not

connected

Fig.4 Multi modes operation.

DRAIN 14 drain of external MOS switch, input for

start-up current and valley sensing

The next converter stroke is started only after demagnetization of the transformer current (zero current switching), while the drain voltage has reached the lowest voltage to prevent switching losses (green function). The primary resonant circuit of the primary inductance and draincapacitorensuresthis quasi-resonant operation. The design can be optimized in such a way that zero voltage

handbook, halfpage

n.c.

GND

n.c. n.c.

CTRL

DEM

1 2 3 4

TEA1533AT

5 6 7

TEA1533T

MGU501

14 13 12 11 10

9 8

DRAIN HVS HVS DRIVER n.c. I

sense

n.c.

switching can be reached over almost the universal mains range.

To prevent very high frequency operation at lower loads, the quasi-resonant operation changes smoothly in fixed frequency PWM control.

At very low power (standby) levels, the frequency is controlled down, via the VCO, to a minimum frequency of approximately 25 kHz.

Start-up, mains enabling operation level and undervoltage lock-out

MGU508

P (W)

Fig.3 Pin configuration.

2002 Aug 23 5

Initially, the IC is self supplying from the rectified mains voltage via pin DRAIN (see Figs 11 and 12). Supply capacitor C

is charged by the internal start-up current

VCC

source to approximately 4 V or higher, depending on the voltage on pin DRAIN.

Page 6

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC

Once the drain voltage exceeds the M-level (mains-dependent operation-enabling level), the start-up current source will continue charging capacitor C (switch S1 will be opened); see Fig.2. The IC will activate the converter as soon as the voltage on pin VCC passes the V

level. The IC supply is taken over by the

CC(start)

auxiliary winding assoon as the output voltage reaches its intended level and the IC supply from the mains voltage is subsequently stopped for high efficiency operation (green function).

The moment the voltage on pin VCC drops below the undervoltage lock-out level, the IC stops switching and enters a safe restart from the rectified mains voltage. Inhibiting the auxiliary supply by external means causes the converter to operate in a stable, well defined burst mode.

Supply management

All (internal) reference voltages are derived from a temperature compensated, on-chip band gap circuit.

VCC

handbook, halfpage

sense(max)

Fig.5 V

handbook, halfpage

(kHz)

0.52 V

sense(max)

175

TEA1533T; TEA1533AT

MGU233

MGU509

175 kHz

CTRL

1 V

(typ)

1.5 V (typ)

voltage as function of V

Current mode control

Current mode control is used for its good line regulation behaviour.

The ‘on-time’ iscontrolled by theinternally inverted control voltage, which is compared with the primary current information. The primary current is sensed across an external resistor. The driver output is latched in the logic, preventing multiple switch-on.

The internal control voltage is inverselyproportional to the external control pin voltage, with an offset of 1.5 V. This means that a voltage range from 1 to 1.5 V on pin CTRL will result in an internal control voltage range from

0.5 to 0 V (a high external control voltage results in a low duty cycle).

Oscillator

The maximum fixed frequency of the oscillator isset by an internal current source and capacitor. The maximum frequency is reduced once the control voltage enters the VCO control window. Then, the maximum frequency changeslinearly with thecontrol voltage untilthe minimum frequency is reached (see Figs 5 and 6).

level

VCO

level

sense(max) (V)

sense(max)

VCO

Fig.6 VCO frequency as function of V

Cycle skipping

At very low power levels, a cycle skipping mode will be activated. A high control voltage will reduce the switching frequency to a minimum of 25 kHz. If the voltage on the control pin is raised even more, switch-on of the external power MOSFET will be inhibited until the voltage on the control pin has dropped to a lower value again (see Fig.7).

For system accuracy it is not the absolute voltage on the control pin that will trigger the cycle skipping mode, but a signal derived from the internal VCO will be used.

Remark 1:If the no-loadrequirementof the systemissuch that the output voltage can be regulated to its intended level at a switching frequency of 25 kHz or above, the cycle skipping mode will not be activated.

2002 Aug 23 6

Remark 2: As switching will stop when the voltage on the control pin is raised above a certain level, the burst mode has to beactivated by amicrocontroller or any other circuit sending a 30 µs, 16 mA pulse to the control input (pin CTRL) of the IC.

Page 7

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC

handbook, full pagewidth

CTRL

1.5 V − V

CTRL

150 mV

current

comparator

DRIVER

OSCILLATOR

DRIVER

sense

TEA1533T; TEA1533AT

osc

max

min

cycle

skipping

150

Vx (mV)

MGU510

Vx (mV)

The voltage levels dV1 and dV2 are fixed in the IC to 50 mV (typical) and 18 mV (typical) respectively.

Fig.7 The cycle skipping circuitry.

Demagnetization

The system will be in discontinuous conduction mode all the time. The oscillator will not start a new primary stroke until the secondary stroke has ended.

Demagnetization features a cycle-by-cycle output short-circuit protection by immediately lowering the frequency (longer off-time), thereby reducing the power

Minimum and maximum ‘on-time’

The minimum ‘on-time’ of the SMPS is determined by the Leading Edge Blanking (LEB) time. The IC limits the ‘on-time’ to 50 µs. When the system desires an ‘on-time’ longer than 50 µs, a fault condition is assumed (e.g. removed Ciin Fig.11), the IC will stop switching and enter

the safe restart mode. level. Demagnetizationrecognition is suppressedduringthe first

time. This suppression may be necessary in

suppr

applications where the transformer has a large leakage inductance, at low output voltages and at start-up.

If pin DEM is open-circuit or not connected, a fault condition is assumed and the converter will stop operating immediately. Operation will recommence as soon as the fault condition is removed.

If pin DEM is shorted to ground, again a fault condition is assumed and the converter will stop operating after the first stroke. The converter will subsequently enter the safe restart mode. This situation will persist until the short-circuit is removed.

2002 Aug 23 7

Page 8

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC

OverVoltage Protection (OVP)

An OVP mode is implemented in the GreenChip series. This works for the TEA1533 by sensing the auxiliary voltage via the current flowing into pin DEM during the secondary stroke. The auxiliary winding voltage is a well-defined replica of the output voltage. Any voltage spikes are averaged by an internal filter.

Ifthe output voltage exceedstheOVP trip level, aninternal counter starts counting subsequent OVP events. The counter has been added to prevent incorrect OVP detections which might occur during ESD or lightning events. If the output voltage exceeds the OVP trip level a fewtimes and notagain in asubsequent cycle, theinternal counter will count down with twice the speed compared with counting up. However, when typical 10 cycles of subsequent OVP events are detected, the IC assumes a true OVP and the OVP circuit switches the power MOSFET off. Next, the controller waits until the UVLO level is reached on pin VCC. When VCC drops to UVLO, capacitor C

Regarding the TEA1533T, this IC will not start switching again. Subsequently, VCC will drop again to the UVLO level, etc. Operation only recommences when the V voltage drops below a level of approximately 4.5 V (practically when V period).

will be recharged to the V

VCC

has been disconnectedfor a short

mains

start

level.

TEA1533T; TEA1533AT

Valley switching

A new cycle starts when the power MOSFET is switched

on (see Fig.8). After the ‘on-time’ (which is determined by

the ‘sense’ voltage and the internal control voltage), the

switchis opened andthesecondary stroke starts.Afterthe

secondary stroke, the drain voltage shows an oscillation

with a frequency of approximately

----------------------------------------------2π×L

where L

is the primary self inductance of the transformer

and Cd is the capacitance on the drain node.

As soon as the oscillator voltage is high again and the

secondary stroke has ended, the circuit waits for the

lowest drain voltage before starting a new primary stroke.

This method is called valley detection. Figure 8 shows the

drain voltage together with the valley signal, the signal

indicating the secondary stroke and the oscillator signal.

In an optimum design, the reflected secondary voltage on

the primary side will force the drain voltage to zero. Thus,

zero voltage switching is very possible, preventing large



capacitive switching losses and

-- -



allowing high frequency operation, which results in small

and cost effective inductors.

×()×

× f××=

Regarding the TEA1533AT, switching starts again (safe restart mode) when the V

level is reached. This

start

process is repeated as long as the OVP condition exists. Theoutput voltage V

can be set by the demagnetization resistor, R

----------N

o OVP()

(OVP)(DEM)RDEM

aux

× V

where Nsis the number of secondary turnsand N

atwhich the OVPfunctiontrips,

o(OVP)

DEM

+{}

clamp(DEM)(pos)

is the

aux

number of auxiliary turns of the transformer. Current I

(OVP)(DEM)

The value of R

is internally trimmed.

can be adjusted to the turns ratio of the

DEM

transformer, thus making an accurate OVP possible.

2002 Aug 23 8

Page 9

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC

handbook, full pagewidth

drain

valley

secondary

stroke

primary

stroke

secondary

stroke

TEA1533T; TEA1533AT

secondary

ringing

oscillator

A: Start of new cycle at lowest drain voltage. B: Start of new cycle in a classical PWM system at high drain voltage.

Fig.8 Signals for valley switching.

OverCurrent Protection (OCP)

The cycle-by-cycle peak drain current limit circuit uses the externalsource resistor to measurethecurrent accurately. This allows optimum size determination of the transformer core (cost issue). The circuit is activated after the leading edge blanking time, t

. The OCP circuit limits the ‘sense’

leb

voltage to an internal level.

OverPower Protection (OPP)

MGU235

where:

-----------N

aux

The current information is used to adjust the peak drain current, which is measured via pin I

. The internal

sense

compensation is such that an almost mains independent maximum output power can be realized.

The OPP curve is given in Fig.9.

Duringthe primary stroke,the rectified mainsinput voltage is measured by sensing the current drawn from pin DEM. This current is dependent on the mains voltage, according

to the following formula:

DEM

≈≈

-------------- R

DEM

aux

mains

-------------------------R

DEM

2002 Aug 23 9

Page 10

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC

MGU236

handbook, halfpage

−100 µA (typ)

DEM

−24 µA (typ)

Fig.9 OPP correction curve.

Short winding protection

After the leading edge blanking time, the short winding protection circuit is activated. If the ‘sense’ voltage exceeds the short winding protection voltage V converter will stop switching. Once VCC drops below the UVLO level, capacitor C

will be recharged and the

VCC

supply will restart again. This cycle will be repeated until the short-circuit is removed (safe restart mode).

The short winding protection will also protect in case of a secondary diode short-circuit.

OverTemperature Protection (OTP)

An accurate temperature protection is provided in the circuit. When the junction temperature exceeds the thermal shutdown temperature, the IC will stop switching. When VCC drops to UVLO, capacitor C recharged to the V

start

level.

has been disconnected for a

mains

short period).

sense(max)

0.52 V (typ)

0.3 V (typ)

will be

VCC

swp

, the

TEA1533T; TEA1533AT

Control pin protection

If pin CTRL is open-circuit or not connected, a fault conditionis assumed and theconverter will stop switching. Operation will recommence as soon as the fault condition is removed.

Burst mode standby

Pin CTRL is also used to implement the burst mode standby. In burst mode standby, the power supply enters a special low dissipation state. Figure 11 shows a flyback converter using the burst mode standby function. The system enters burst mode standby when the microcontroller activates NPN transistor T1 on the secondary side.

When the voltage on C measured by the microcontroller, the opto-coupler is activated by T1, sending a large current signal to pin CTRL.Inresponseto this signal, the IC stops switching and enters a ‘hiccup’ mode. This burst activation signal should be present for longer than the ‘burst blank’ period (typically 30 µs): the blanking time prevents false burst triggering due to spikes. Figure 12 shows the burst mode standby signals. The hiccup mode during burst mode standby operation does not differ from the hiccup mode at safe restart during a system fault condition (e.g. output short-circuit). The power is reduced during soft restart mode.

Burst mode standby operation continues until the microcontroller stops activating transistor T1. The system then enters the start-up sequence and begins normal switching behaviour.

burstmode

--------------- R

CTRL

exceeds a certain voltage,

micro

th(on)

Regarding the TEA1533AT, when the V

start

level is reached, switching starts again (safe restart mode). This process is repeated as long as the OTP condition exists.

2002 Aug 23 10

Page 11

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC

Soft start-up

To prevent transformer rattle during hiccup, the transformer peak current is slowly increased by the soft start function. This can be achieved by inserting a resistor and a capacitor between pin I (see Fig.10). An internal current source charges the capacitor to V = ISS× RSS, with a maximum of approximately 0.5 V.

The start level and the time constant of the increasing primary current level can be adjusted externally by changing the values of RSS and CSS.

primary(max)

τ R

SSCSS

ocpISSRSS

---------------------------------------------- -

×=

The charging currentI pin I pin I

is below approximately 0.5 V. If the voltage on

sense

exceeds 0.5 V, the soft start current source will

sense

×()–

sense

will flow aslong as the voltage on

start limiting the current ISS. At the V current source is completely switched off.

and the sense resistor

sense

level, the I

CC(start)

TEA1533T; TEA1533AT

Driver

The driver circuit to the gate of the power MOSFET has a current sourcing capabilityof 170 mA typical and a current sink capability of 700 mA typical. This permits fast turn-on and turn-off of the power MOSFET for efficient operation.

A low driver source current has been chosen to limit the ∆V/∆t at switch-on. This reduces Electro Magnetic Interference (EMI) and also limits the current spikes across R

sense

Since the soft start current ISS is subtracted from pin V

chargingcurrent, the RSSvaluewill affect the VCCcharging current level by a maximum of 60 µA (typical value).

handbook, halfpage

0.5 V

start-up

ocp

sense

MGU502

Fig.10 Soft start.

2002 Aug 23 11

Page 12

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC

TEA1533T; TEA1533AT

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134); note 1.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

Voltages

CTRL

DEM

sense

DRAIN

supply voltage continuous −0.4 +20 V voltage on pin CTRL −0.4 +5 V voltage on pin DEM current limited −0.4 − V voltage on pin I

sense

current limited −0.4 − V

voltage on pin DRAIN −0.4 +650 V

Currents

CTRL

DEM

sense

DRIVER

DRAIN

current on pin CTRL d < 10% − 50 mA current on pin DEM −250 +250 µA current on pin I

sense

−1 +10 mA current on pin DRIVER d < 10% −0.8 +2 A current on pin DRAIN − 5mA

General

tot

stg

esd

total power dissipation T

<70°C − 0.75 W

amb

storage temperature −55 +150 °C operating junction temperature −20 +145 °C electrostatic discharge voltage

pins 1 to 13 HBM class 1; note 2 − 2000 V pin DRAIN HBM class 1; note 2 − 1500 V any pin MM; note 3 − 400 V

Notes

1. All voltages are measured with respect to ground; positive currents flow into the IC; pin VCC may not be current driven. The voltage ratings are valid provided other ratings are not violated; current ratings are valid provided the maximum power rating is not violated.

2. Human Body Model (HBM): equivalent to discharging a 100 pF capacitor through a 1.5 kΩ resistor.

3. Machine Model (MM): equivalent to discharging a 200 pF capacitor through a 0.75 µH coil and a 10 Ω resistor.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

th(j-a)

thermal resistance from junction to ambient in free air; note 1 100 K/W

Note

1. With pin GND connected to sufficient copper area on the printed-circuit board.

QUALITY SPECIFICATION

In accordance with ‘SNW-FQ-611-D’.

2002 Aug 23 12

Page 13

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC

TEA1533T; TEA1533AT

CHARACTERISTICS

=25°C; VCC= 15 V; all voltages are measured with respect to ground; currents are positive when ﬂowing into

amb

the IC; unless otherwise speciﬁed.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Start-up current source (pin DRAIN)

DRAIN

DSS

M-level mains-dependent operation

supply current drawn from pin DRAIN

VCC=0V; V

> 100 V 1.0 1.2 1.4 mA

DRAIN

with auxiliary supply; V

DRAIN

> 100 V

− 100 300 µA

breakdown voltage 650 −−V

60 − 100 V

enabling level

Supply voltage management (pin V

CC(start)

CC(UVLO)

CC(hys)

CC(h)

CC(l)

CC(restart)

CC(oper)

start-up voltage on V under voltage lock-out on V hysteresis voltage on V pin VCC charging current, high V pin VCC charging current, low V

pin VCC restart current V

supply current under normal

)

10.3 11 11.7 V

8.1 8.7 9.3 V

CC(start) DRAIN DRAIN

3V<VCC<V

DRAIN

CC(UVLO)<VCC

− V

CC(UVLO)

2.0 2.3 2.6 V > 100 V; VCC<3V −1.2 −1 −0.8 mA > 100 V;

> 100 V;

CC(UVLO)

CC(start)

−1.2 −0.75 −0.45 mA

−650 −550 −450 µA

no load on pin DRIVER 1.1 1.3 1.5 mA

operation

CC(burstmode)

supply current while not switching − 0.85 − mA

Demagnetization management (pin DEM)

th(DEM)

demagnetization comparator

50 100 150 mV

threshold voltage on pin DEM

prot(DEM)

clamp(DEM)(neg)

protection current on pin DEM V negative clamp voltage on

=50mV −50

DEM

= −150 µA −0.5 −0.25 −0.05 V

DEM

(1)

−−10 nA

pin DEM

clamp(DEM)(pos)

positive clamp voltage on

= 250 µA 0.5 0.7 0.9 V

DEM

pin DEM

suppr

suppression of transformer

1.1 1.5 1.9 µs

ringing at start of secondary stroke

Pulse width modulator

on(min)

on(max)

minimum on-time − t

leb

− ns

maximum on-time latched 40 50 60 µs

Oscillator

osc(l)

osc(h)

vco(start)

oscillator low ﬁxed frequency V oscillator high ﬁxed frequency V peak voltage on pin I

sense

, where

> 1.5 V 20 25 30 kHz

CTRL

< 1 V 145 175 205 kHz

CTRL

see Figs 6 and 7 − VCO

− mV

frequency reduction starts

2002 Aug 23 13

Page 14

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC

TEA1533T; TEA1533AT

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

vco(max)

peak voltage on pin I

sense

the frequency is equal to f

, where

osc(l)

− VCO1− 25 − mV

Duty cycle control (pin CTRL)

CTRL(min)

minimum voltage on pin CTRL for

− 1.0 − V

maximum duty cycle

CTRL(max)

maximumvoltageonpin CTRL for

− 1.5 − V

minimum duty cycle

prot(CTRL)

protection current on pin CTRL V

= 1.5V −1

CTRL

(1)

−0.8 -0.5 µA

Burst mode standby (pin CTRL)

th(burst)(on)

burst mode standby active

= 6 mA 3.3 3.8 4.3 V

burst

threshold voltage

th(burst)(on)

th(burst)(off)

burst mode standby active current 16 −−mA burst mode standby inactive

−− 6mA

current

burst-blank

burst mode standby blanking time 25 30 35 µs

Valley switch (pin DRAIN)

∆V/∆t

valley

valley-swon

valley recognition voltage change −85 −+85 V/µs delay from valley recognition to

− 150

(1)

− ns

switch-on

Overcurrent and short winding protection (pin I

sense(max)

swp

leb

maximum source voltage OCP ∆V/∆t = 0.1 V/µs 0.48 0.52 0.56 V propagating delay from detecting

sense(max)

to switch-off short winding protection voltage 0.83 0.88 0.96 V blanking time for current and

)

sense

∆V/∆t = 0.5 V/µs − 140 185 ns

300 370 440 ns

short winding protection

soft start current V

< 0.5 V 45 60 75 µA

sense

Overvoltage protection (pin DEM)

OVP(DEM)

OVP current on pin DEM set by resistor R

DEM

, see

54 60 66 µA Section “OverVoltage Protection (OVP)”

Overpower protection (pin DEM)

OPP(DEM)

OPP50%(DEM)

OPP current on pin DEM to start OPP correction, set by the demagnetization resistor R

DEM

OPP current on pin DEM, where

set by resistor R

DEM

Section “OverPower Protection (OPP)”

, see

−−24 −µA

−−100 −µA

maximum source voltage is limited to 0.3 V

2002 Aug 23 14

Page 15

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC

TEA1533T; TEA1533AT

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Driver (pin DRIVER)

source

sink

o(max)

source current capability of driver VCC= 9.5 V; V sink current capability of driver VCC= 9.5 V; V

= 9.5 V;

maximum output voltage of the

V VCC>12V − 11.5 12 V

DRIVER

= 9.5 V

DRIVER

=2V −−170 −88 mA

DRIVER

=2V − 300 − mA

400 700 − mA

driver

Overtemperature protection

prot(max)

maximum temperature protection

130 140 150 °C

level

prot(hys)

hysteresis for the temperature

− 8

(1)

−°C

protection level

Note

1. Guaranteed by design.

2002 Aug 23 15

Page 16

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC

TEA1533T; TEA1533AT

APPLICATION INFORMATION

A converterwith the TEA1533consists of aninput filter, atransformer with athird winding (auxiliary), and an output stage with a feedback circuit.

Capacitor C

(at pin VCC) buffers the supply voltage of the IC, which is powered via the high voltage rectified mains

VCC

during start-up and via the auxiliary winding during operation. A sense resistor converts the primary current into a voltage at pin I

. The value of this sense resistor defines the

sense

maximum primary peak current.

handbook, full pagewidth

mains

VCC

CTRL

GND

CTRL

DEM

TEA1533T

TEA1533AT

DEM

micro

µC

MICRO-

CONTROLLER

standby pulse

DRAIN

HVS

DRIVER

sense

n.c.

power MOSFET

sense

aux

Fig.11 Flyback configuration with secondary sensing using the burst mode standby.

2002 Aug 23 16

reg1

reg2

MGU503

Page 17

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC

handbook, full pagewidth

(power

MOSFET)

TEA1533T; TEA1533AT

gate

M-level

burst mode

µC

start-up

sequence

normal

operation

overvoltage

protection

(TEA1533AT)

output

short-circuit

burst mode standby

normal

operation

MGU504

Fig.12 Typical waveforms.

2002 Aug 23 17

Page 18

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC

PACKAGE OUTLINE

SO14: plastic small outline package; 14 leads; body width 3.9 mm

TEA1533T; TEA1533AT

SOT108-1

v M

pin 1 index

0 2.5 5 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

max.

1.75

0.069

0.25

0.10

0.010

0.004

A2A

1.45

1.25

0.057

0.049

0.25

0.01

0.49

0.25

0.36

0.19

0.019

0.0100

0.014

0.0075

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1)

8.75

8.55

0.35

0.34

w M

scale

eHELLpQZywv θ

4.0

1.27

3.8

0.16

0.050

0.15

6.2

5.8

0.244

0.228

1.05

0.041

detail X

1.0

0.7

0.4

0.6

0.028

0.039

0.024

0.016

(A )

0.25

0.01 0.004

0.25 0.1

0.01

(1)

0.7

0.3

0.028

0.012

OUTLINE VERSION

SOT108-1

IEC JEDEC EIAJ

076E06 MS-012

REFERENCES

2002 Aug 23 18

EUROPEAN

PROJECTION

ISSUE DATE

97-05-22 99-12-27

Page 19

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC

SOLDERING Introduction to soldering surface mount packages

Thistext gives a very briefinsightto a complex technology. A more in-depth account of soldering ICs can be found in our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011). There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering can still be used for certainsurfacemount ICs, but it isnotsuitablefor fine pitch SMDs. In these situations reflow soldering is recommended.

Reﬂow soldering

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied tothe printed-circuit board byscreen printing, stencilling or pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.

Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 220 °C for thick/large packages, and below 235 °C for small/thin packages.

Wave soldering

Conventional single wave soldering is not recommended forsurfacemount devices (SMDs) or printed-circuitboards with a high component density, as solder bridging and non-wetting can present major problems.

To overcome these problems the double-wave soldering method was specifically developed.

TEA1533T; TEA1533AT

If wave soldering is used the following conditions must be observed for optimal results:

• Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.

• For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

• Forpackageswith leads on four sides,thefootprintmust be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners.

During placement andbefore soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C.

When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.

2002 Aug 23 19

Page 20

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC

TEA1533T; TEA1533AT

Suitability of surface mount IC packages for wave and reﬂow soldering methods

PACKAGE

(1)

SOLDERING METHOD

WAVE REFLOW

(2)

BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA not suitable suitable HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN,

not suitable

(3)

suitable

HVSON, SMS

(4)

PLCC LQFP, QFP, TQFP not recommended SSOP, TSSOP, VSO not recommended

, SO, SOJ suitable suitable

(4)(5)

suitable

(6)

suitable

Notes

1. Formore detailed information ontheBGA packages refertothe

“(LF)BGAApplication Note

”(AN01026); order a copy

from your Philips Semiconductors sales office.

2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface.

4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners.

5. Wave soldering is suitable for LQFP,TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

6. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

2002 Aug 23 20

Page 21

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC

DATA SHEET STATUS

PRODUCT

DATA SHEET STATUS

Objective data Development This data sheet contains data from the objective speciﬁcation for product

Preliminary data Qualiﬁcation This data sheet contains data from the preliminary speciﬁcation.

Product data Production This data sheet contains data from the product speciﬁcation. Philips

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

(1)

STATUS

(2)

development. Philips Semiconductors reserves the right to change the speciﬁcation in any manner without notice.

Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the speciﬁcation without notice, in order to improve the design and supply the best possible product.

Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notiﬁcation (CPCN) procedure SNW-SQ-650A.

TEA1533T; TEA1533AT

DEFINITIONS

DEFINITIONS Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.

Limiting values definition  Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device atthese or at anyotherconditionsabove those given inthe Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information  Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make norepresentationorwarranty that such applications willbe suitable for the specified use without further testing or modification.

DISCLAIMERS Life support applications  These products are not

designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result inpersonal injury. Philips Semiconductorscustomersusingor selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.

Right to make changes  Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for theuseof any of these products,conveysnolicence or title under any patent, copyright, or mask work right to these products,and makes no representationsorwarranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.

2002 Aug 23 21

Page 22

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC

TEA1533T; TEA1533AT

NOTES

2002 Aug 23 22

Page 23

Philips Semiconductors Product speciﬁcation

GreenChipTMII SMPS control IC

TEA1533T; TEA1533AT

NOTES

2002 Aug 23 23

Page 24

Philips Semiconductors – a w orldwide compan y

Contact information

For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales ofﬁces addresses send e-mail to: [email protected].

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.

Printed in The Netherlands 613502/02/pp24 Date of release: 2002 Aug 23 Document order number: 9397 750 10262

SCA74