Philips TDA9850T-V1 Datasheet

DATA SH EET
Preliminary specification File under Integrated Circuits, IC02
1995 Jun 19
INTEGRATED CIRCUITS
TDA9850
I
C-bus controlled BTSC
stereo/SAP decoder
1995 Jun 19 2
Philips Semiconductors Preliminary specification
I2C-bus controlled BTSC stereo/SAP decoder
TDA9850
FEATURES
Quasi alignment-free application due to automatic adjustment of channel separation via I2C-bus
Dbx noise reduction circuit
Dbx decoded stereo, Second Audio Program (SAP) or
mono selectable at the AF outputs
Additional SAP output without dbx, including de-emphasis
High integration level with automatically tuned integrated filters
Input level adjustment I
2
C-bus controlled
Alignment-free SAP processing
Stereo pilot PLL circuit with ceramic resonator,
automatic adjustment procedure for stereo channel separation, two pilot thresholds selectable via I2C-bus
Automatic pilot cancellation
Composite input noise detector with I2C-bus selectable
thresholds for stereo and SAP off
I2C-bus transceiver.
GENERAL DESCRIPTION
The TDA9850 is a bipolar-integrated BTSC stereo/SAP decoder (I
2
C-bus controlled) for application in TV sets,
VCRs and multimedia.
QUICK REFERENCE DATA
ORDERING INFORMATION
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
CC
supply voltage 8.5 9 9.5 V
I
CC
supply current 58 75 mA
V
comp(rms)
input signal voltage (RMS value) 100% modulation L + R; fi= 300 Hz 250 mV
V
oR(rms)
;
V
oL(rms)
output signal voltage (RMS value) 100% modulation L + R; fi= 300 Hz 500 mV
G
LA
input level adjustment control 3.5 +4.0 dB
α
cs
stereo channel separation fL= 300 Hz; fR= 3 kHz 25 35 dB
THD
L,R
total harmonic distortion L + R fi= 1 kHz 0.2 %
S/N signal-to-noise ratio 500 mV (RMS) mono output signal
CCIR noise weighting filter (peak value)
60 dB
DIN noise weighting filter (RMS value)
73 dBA
TYPE NUMBER
PACKAGE
NAME DESCRIPTION VERSION
TDA9850 SDIP32 plastic shrink dual in-line package; 32 leads (400 mil) SOT232-1 TDA9850T SO32 plastic small outline package; 32 leads; body width 7.5 mm SOT287-1
1995 Jun 19 3
Philips Semiconductors Preliminary specification
I2C-bus controlled BTSC stereo/SAP decoder
TDA9850
License information
A license is required for the use of this product. For further information, please contact:
COMPANY BRANCH ADDRESS
THAT Corporation Licensing Operations 734 Forest St.
Marlborough, MA 01752 USA Tel.: (508) 229-2500 Fax: (508) 229-2590
Tokyo Office 405 Palm House, 1-20-2 Honmachi
Shibuya-ku, Tokyo 151 Japan Tel.: (03) 3378-0915 Fax: (03) 3374-5191
1995 Jun 19 4
Philips Semiconductors Preliminary specification
I
2
C-bus controlled BTSC stereo/SAP decoder
TDA9850
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in
_white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in
white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...
BLOCK DIAGRAM
o
ok, full pagewidth
composite baseband input
+
+
C2
13
14
15
C5
16
Q1
ceramic resonator
17
DEMATRIX
+
MODE
SELECT
+
C6
18
+
C7
19
DE-EMPHASIS
L+R
LR/SAP
OUTL
OUTR
27
21
STEREO DECODER
SAP without DBX
23
C8
22
R1
C3
C4
LOGIC, I2C-
TRANSCEIVER
MAD
28
7
stereo mono SAP to audio processing
98
SDA SCL
SUPPLY
+
C18
24
6
+
C19
12
10
V
ref
V
CAP
V
CC
SAP
DEMODULATOR
+
C16
5
C15
4
INPUT
LEVEL
ADJUST
+
11
C1
NOISE
DETECTOR
STEREO/SAP
SWITCH
C17
26
TDA9850
STEREO ADJUST
DBX
+
C14
3
C13
R3
R2
1
2
+
32
+
31
+
30
+
29
C12
C11
C10
C9
+
25
+
20
C
L
C
R
only during adjustment
MHA010
Fig.1 Block, application and test diagram.
1995 Jun 19 5
Philips Semiconductors Preliminary specification
I2C-bus controlled BTSC stereo/SAP decoder
TDA9850
COMPONENT LIST
Electrolytic capacitors ±20%; foil capacitors ±10%; resistors ±5%; unless otherwise specified; see Fig.1.
COMPONENT VALUE TYPE REMARK
C1 10 µF electrolytic 63 V C2 470 nF foil C3 4.7 µF electrolytic 63 V C4 220 nF foil C5 10 µF electrolytic 63 V; I
leak
< 1.5 µA C6 4.7 µF electrolytic 63 V C7 4.7 µF electrolytic 63 V C8 15 nF foil C9 10 µF electrolytic 63 V ±10% C10 10 µF electrolytic 63 V ±10% C11 1 µF electrolytic 63 V C12 1 µF electrolytic 63 V C13 47 nF foil ±5% C14 10 µF electrolytic 63 V C15 100 nF foil C16 4.7 µF electrolytic 63 V
C17 100 nF foil C18 100 µF electrolytic 16 V C19 100 µF electrolytic 16 V CR 2.2 µF electrolytic 63 V CL 2.2 µF electrolytic 63 V R1 2.2 k R2 8.2 kΩ±2% R3 160 Ω±2% Q1 CSB503F58 radial leads
CSB503JF958 alternative as SMD
1995 Jun 19 6
Philips Semiconductors Preliminary specification
I2C-bus controlled BTSC stereo/SAP decoder
TDA9850
PINNING
SYMBOL PIN DESCRIPTION
VEO 1 variable emphasis output for dbx VEI 2 variable emphasis input for dbx C
NR
3 capacitor noise reduction for dbx
C
M
4 capacitor mute for SAP
C
DEC
5 capacitor DC-decoupling for SAP AGND 6 analog ground DGND 7 digital ground SDA 8 serial data input/output SCL 9 serial clock input V
CC
10 supply voltage (+9 V) COMP 11 composite input signal V
CAP
12 capacitor for electronic filtering of supply C
P1
13 capacitor for pilot detector C
P2
14 capacitor for pilot detector C
PH
15 capacitor for phase detector C
ADJ
16 capacitor for filter adjustment CER 17 ceramic resonator C
MO
18 capacitor DC-decoupling mono C
SS
19 capacitor DC-decoupling stereo/SAP C
R
20 adjustment capacitor, right channel OUTR 21 output, right channel C
SDE
22 capacitor SAP de-emphasis SAP 23 SAP output V
ref
24 reference voltage 0.5 × (VCC− 1.5 V) C
L
25 adjustment capacitor, left channel C
ND
26 noise detector capacitor OUTL 27 output, left channel MAD 28 programmable address bit C
TW
29 capacitor timing wideband for dbx C
TS
30 capacitor timing spectral for dbx C
W
31 capacitor wideband for dbx C
S
32 capacitor spectral for dbx
Fig.2 Pin configuration.
page
TDA9850
MHA012
1 2 3 4 5 6 7 8
9 10 11 12 13 14 15 16
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17
VEO
C
S
C
W
C
TS
C
TW
C
ND
C
SDE
C
L
C
R
C
SS
C
MO
V
ref
VEI
C
NR
C
M
C
DEC
AGND OUTL
SAP
OUTR
CER
MAD
DGND
SDA
SCL
V
CC
COMP
V
CAP
C
P1
C
P2
C
PH
C
ADJ
1995 Jun 19 7
Philips Semiconductors Preliminary specification
I2C-bus controlled BTSC stereo/SAP decoder
TDA9850
FUNCTIONAL DESCRIPTION Input level adjustment
The composite input signal is fed to the input level adjustment stage. The control range is from
3.5 to +4.0 dB in steps of 0.5 dB. The subaddress control 4 of Tables 5 and 6 and the level adjust setting of Table 10 allows an optimum signal adjustment during the set alignment. The maximum input signal voltage is 2 V (RMS).
Stereo decoder
The output signal of the level adjustment stage is coupled to a low-pass filter which suppresses the baseband noise above 125 kHz. The composite signal is then fed into a pilot detector/pilot cancellation circuit and into the MPX demodulator. The main L + R signal passes a 75 µs fixed de-emphasis filter and is fed into the dematrix circuit. The decoded sub-signal L R is sent to the stereo/SAP switch. To generate the pilot signal the stereo demodulator uses a PLL circuit including a ceramic resonator. The stereo channel separation is adjusted by an automatic procedure to be performed during set production. For a detailed description see Section “Adjustment procedure”. The stereo identification can be read by the I
2
C-bus (see Table 2). Two different pilot thresholds (data STS = 1; STS = 0) can be selected via the I2C-bus (see Table 14).
SAP demodulator
The composite signal is fed from the output of the input level adjustment stage to the SAP demodulator circuit through a 5f
H
band-pass filter. The demodulator level is automatically controlled. The SAP demodulator includes an internal field strength detector that mutes the SAP output in the event of insufficient signal conditions. The SAP identification signal can be read by the I2C-bus (see Table 2).
Noise detector
The composite input noise increases with decreasing antenna signal. This makes it necessary to switch stereo or SAP off at certain thresholds. These thresholds can be set via the I
2
C-bus. With ST0 to ST3 (see Table 6) the stereo threshold can be selected and with SP0 to SP3 the SAP threshold. A hysteresis can be achieved via software by making the threshold dependent of the identification bits STP and SAPP (see Table 2).
Mode selection
The stereo/SAP switch feeds either the L R signal or the SAP demodulator output signal via the internal dbx noise reduction circuit to the dematrix/switching circuit. Table 8 shows the different switch modes provided at the output pins OUTR and OUTL.
dbx decoder
The dbx circuit includes all blocks required for the noise reduction system in accordance with the BTSC system specification. The output signal is fed through a 73 µs fixed de-emphasis circuit to the dematrix block.
SAP output
Independent of the stereo/SAP switch, the SAP signal is also available at pin SAP. At SAP, the SAP signal is not dbx decoded. The capacitor at SDE provides a recommended de-emphasis (150 µs) at SAP.
Integrated filters
The filter functions necessary for stereo and SAP demodulation and part of the dbx filter circuits are provided on-chip using transconductor circuits. The required filter accuracy is attained by an automatic filter alignment circuit.
1995 Jun 19 8
Philips Semiconductors Preliminary specification
I2C-bus controlled BTSC stereo/SAP decoder
TDA9850
Adjustment procedure
C
OMPOSITE INPUT LEVEL ADJUSTMENT
Feed in from FM demodulator the composite signal with 100% modulation (25 kHz deviation) L + R; fi= 300 Hz. Set input level control via I2C-bus monitoring OUTL or OUTR (500 mV ±20 mV). Store the setting in a non-volatile memory.
A
UTOMATIC ADJUSTMENT PROCEDURE
Connect 2.2 µF capacitors from ACR and ACL to ground.
Composite input signal L = 300 Hz, R = 3.1 kHz, 14% modulation for each channel.
Mode selection setting bits: STEREO = 1, SAP = 0 (see Table 8).
Start adjustment by transmission ADJ = 1 in register ALI3. The decoder will align itself.
After 1 second minimum stop alignment by transmitting ADJ = 0 in register ALI3 read the alignment data by an I2C-bus read operation from ALR1 and ALR2 (see Chapter “I2C-bus protocol”) and store it in a non-volatile memory. The alignment procedure overwrites the previous data stored in ALI1 and ALI2.
The capacitors from ACR and ACL may be disconnected after alignment.
M
ANUAL ADJUSTMENT
Manual adjustment is necessary when no dual tone generator is available (e.g. for service).
Spectral and wideband data have to be set to 10000 (middle position for adjustment range)
Composite input L = 300 Hz; 14% modulation
Adjust channel separation by varying wideband data
Composite input L = 3 kHz; 14% modulation
Adjust channel separation by varying spectral data
Iterative spectral/wideband operation for optimum
adjustment
Store data in non-volatile memory.
After every power-on, the alignment data and the input level adjustment data must be loaded from the non-volatile memory.
T
IMING CURRENT FOR RELEASE RATE
Due to possible internal and external spreading, the timing current can be adjusted via I2C-bus, see Table 9, as recommended by dbx.
1995 Jun 19 9
Philips Semiconductors Preliminary specification
I2C-bus controlled BTSC stereo/SAP decoder
TDA9850
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
Note
1. Human Body Model (HBM): C = 100 pF; R = 1.5 k; V = 2 kV; charge device model: C = 200 pF; R = 0 ; V = 300 V.
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CC
supply voltage 0 10 V
V
VCAP
voltage of V
CAP
to GND 0 V
CC
V
V
VEO
voltage of VEO to GND 0
1
⁄2V
CC
V
V
SDA
voltage of SDA to GND 0 8.5 V
V
SCL
voltage of SCL to GND 0 8.5 V
V
n
voltage of all other pins to GND VCC≥ 8.5 V 0 8.5 V
V
CC
< 8.5 V 0 V
CC
V
T
amb
operating ambient temperature Tj< 125 °C −20 +70 °C
T
stg
storage temperature 65 +150 °C
V
es
electrostatic handling HBM; note 1
SYMBOL PARAMETER VALUE UNIT
R
th j-a
thermal resistance from junction to ambient in free air
SOT232-1 55 K/W SOT287-1 68 K/W
1995 Jun 19 10
Philips Semiconductors Preliminary specification
I2C-bus controlled BTSC stereo/SAP decoder
TDA9850
REQUIREMENTS FOR THE COMPOSITE INPUT SIGNAL TO ENSURE CORRECT SYSTEM PERFORMANCE
Notes
1. Low-ohmic preferred, otherwise the signal loss and spreading at COMP, caused by Z
O
and the composite input
impedance (see Chapter “Characteristics”; row head “Input level adjustment control”) must be taken into account.
2. In order to prevent clipping at over-modulation (maximum deviation in the BTSC system for 100% modulation is 73 kHz).
3. For example colour bar or flat field white; 100% video modulation.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
COMP
L+R(rms)
composite input level for 100% modulation L + R (25 kHz deviation); RMS value; fi= 300 Hz
measured at COMP 162 250 363 mV
COMP composite input level
spreading under operating conditions
T
amb
= 20 to +70 °C; aging;
power supply influence
0.5 +0.5 dB
Z
source
source impedance note 1 low-ohmic 5 k
f
lf
low frequency roll-off 25 kHz deviation L + R; 2dB −− 5Hz
f
hf
high frequency roll-off 25 kHz deviation L + R; 2 dB 100 −−kHz
THD
L,R
total harmonic distortion L + R fi= 1 kHz; 25 kHz deviation −− 0.5 %
f
i
= 1 kHz; 125 kHz deviation;
note 2
−− 1.5 %
S/N signal-to-noise ratio
L + R/noise
CCIR 468-2 weighted quasi peak; L + R; 25 kHz deviation; f
i
= 1 kHz; 75 µs de-emphasis
critical picture modulation; note 3
44 −−dB
with sync only 54 −−dB
α
SB
side band suppression mono into unmodulated SAP carrier; SAP carrier/side band
mono signal: 25 kHz deviation, fi= 1 kHz; side band: SAP carrier frequency ±1 kHz
40 −−dB
α
SP
spectral spurious attenuation L + R/spurious
50 Hz to 100 kHz; mainly n × fH; no de-emphasis; L + R; 25 kHz deviation, f = 1 kHz as reference
n = 1, 4, 5, 6 35 −−dB n = 2, 3 26 −−dB
Loading...
+ 22 hidden pages