Philips TDA8944J User Manual

TDA8944J

2 x 7 W stereo Bridge Tied Load (BTL) audio amplifier

Rev. 02 — 14 February 2000 Product specification

1. General description

The TDA8944J is a dual-channel audio power amplifier with an output power of
2 × 7 W at an 8 Ω load and a 12 V supply. The circuit contains two Bridge Tied Load
(BTL) amplifierswith an all-NPN output stage and standby/mutelogic. The TDA8944J
comes in a 17-pin DIL-bent-SIL (DBS) power package. The TDA8944J is
printed-circuit board (PCB) compatible with all other types in the TDA894x family.
One PCB footprint accommodates both the mono and the stereo products.

2. Features

■ Few external components

■ Fixed gain

■ Standby and mute mode

■ No on/off switching plops

■ Low standby current

■ High supply voltage ripple rejection

■ Outputs short-circuit protected to ground, supply and across the load

c

c

■ Thermally protected

■ Printed-circuit board compatible.

3. Applications

■ Mains fed applications (e.g. TV sound)

■ PC audio

■ Portable audio.

4. Quick reference data

Table 1: Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

V

CC

I

q

I

stb

supply voltage 6 12 18 V
quiescent supply current VCC=12V; RL= ∞ - 2436mA
standby supply current - - 10 µA

Philips Semiconductors

TDA8944J

2 x 7 W stereo BTL audio amplifier

Table 1: Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

P

o

THD total harmonic distortion P
G

v

SVRR supply voltage ripple

5. Ordering information

Table 2: Ordering information

Type number Package

TDA8944J DBS17P plastic DIL-bent-SIL power package;

6. Block diagram

dth

…continued

output power THD = 10%; RL=8Ω;

=12V

V

CC

= 1 W - 0.03 0.1 %

o

67- W

voltage gain 31 32 33 dB

50 65 - dB

rejection

Name Description Version

SOT243-1

17 leads (lead length 12 mm)

CC1

V

CC2

V

IN1−
IN1+

IN2−
IN2+

MODE

SVR

Fig 1. Block diagram.

8
6

9
12

10

STANDBY/

MUTE LOGIC

11

3

TDA8944J

16

V

CC

20

kΩ

SHORT CIRCUIT

TEMPERATURE

20

kΩ

GND115GND2

PROTECTION

2

AND

14

17

MBK933

1

OUT1−

4

OUT1+

OUT2−

OUT2+

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Product specification Rev. 02 — 14 February 2000 2 of 21

Philips Semiconductors

7. Pinning information

7.1 Pinning

TDA8944J

2 x 7 W stereo BTL audio amplifier

handbook, halfpage

OUT1−

GND1

V

CC1

OUT1+

n.c.

IN1+

n.c.
IN1−
IN2−

MODE

SVR
IN2+

n.c.

OUT2−

GND2

V

CC2

OUT2+

1
2
3
4
5
6
7
8
9

TDA8944J

10
11
12
13
14
15
16
17

MBK936

Fig 2. Pin configuration.

7.2 Pin description

Table 3: Pin description

Symbol Pin Description

OUT1− 1 negative loudspeaker terminal 1
GND1 2 ground channel 1
V

CC1

OUT1+ 4 positive loudspeaker terminal 1
n.c. 5 not connected
IN1+ 6 positive input 1
n.c. 7 not connected
IN1− 8 negative input 1
IN2− 9 negative input 2
MODE 10 mode selection input (standby, mute, operating)
SVR 11 half supply voltage decoupling (ripple rejection)
IN2+ 12 positive input 2

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Product specification Rev. 02 — 14 February 2000 3 of 21

3 supply voltage channel 1

© Philips Electronics N.V. 2000. All rights reserved.

Philips Semiconductors

TDA8944J

2 x 7 W stereo BTL audio amplifier

Table 3: Pin description

Symbol Pin Description

n.c. 13 not connected
OUT2− 14 negative loudspeaker terminal 2
GND2 15 ground channel 2
V

CC2

OUT2+ 17 positive loudspeaker terminal 2

8. Functional description

The TDA8944J is a stereo BTL audio power amplifier capable of delivering 2 × 7W
output power to an 8 Ω load at THD = 10%, using a 12 V power supply and an
external heatsink. The voltage gain is fixed at 32 dB.

With the three-level MODE input the device can be switched from ‘standby’ to ‘mute’
and to ‘operating’ mode.

The TDA8944J outputs are protected by an internal thermal shutdown protection
mechanism and a short-circuit protection.

8.1 Input configuration

The TDA8944J inputs can be driven symmetrical (floating) as well as asymmetrical.
In the asymmetrical mode one input pin is connected via a capacitor to the signal
ground which should be as close as possible to the SVR (electrolytic) capacitor
ground. Note that the DC level of the input pins is half of the supply voltage VCC, so
coupling capacitors for both pins are necessary.

…continued

16 supply voltage channel 2

The input cut-off frequency is:

f

icut off–()

=

1

------------------------------ -

2RiCi×()–

(1)

For Ri=45kΩ and Ci= 220 nF:

f

i cut off–()

------------------------------------------------------------------ -

24510

1

3

× 220× 109–×()–

16 Hz==

(2)

As shown in Equation 1 and 2, large capacitor values for the inputs are not
necessary; so the switch-on delay during charging of the input capacitors, can be
minimized. This results in a good low frequency response and good switch-on
behaviour.

Remark: TopreventHF oscillations do not leave the inputs open, connect a capacitor
of at least 1.5 nF across the input pins close to the device.

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8.2 Power amplifier

The power amplifier is a Bridge Tied Load (BTL) amplifier with an all-NPN output
stage, capable of delivering a peak output current of 2 A.

The BTL principle offers the following advantages:

•

•

•

•

8.2.1 Output power measurement

The output power as a function of the supply voltage is measured on the output pins
at THD = 10%; see Figure 8. The maximum output power is limited by the maximum
supply voltage of 12 V and the maximum available output current: 2 A repetitive peak
current.

8.2.2 Headroom

Typical CD music requires at least 12 dB (factor 15.85) dynamic headroom –
compared to the average power output – for transferring the loudest parts without
distortion. At VCC=12V, RL=8Ω and Po= 4 W at THD = 0.1% (see Figure 6), the
Average Listening Level (ALL) – music power – without any distortion yields:

P

TDA8944J

2 x 7 W stereo BTL audio amplifier

Lower peak value of the supply current
The ripple frequency on the supply voltage is twice the signal frequency
No expensive DC-blocking capacitor
Good low frequency performance.

= 4 W/15.85 = 252 mW.

o(ALL)

The power dissipation can be derived from Figure 11 on page 10 for 0 dB
respectively 12 dB headroom.

Table 4: Power rating as function of headroom

Headroom Power output (THD = 0.1%) Power dissipation (P)

0 dB P
12 dB P

=4W 8W

o

= 252 mW 4 W

o(ALL)

For the average listening level a power dissipation of 4 W can be used for a heatsink
calculation.

8.3 Mode selection

The TDA8944J has three functional modes, which can be selected by applying the
proper DC voltage to pin MODE. See Figure 4 and 5 for the respective DC levels,
which depend on the supply voltage level. The MODE pin can be driven by a 3-state
logic output stage: e.g. a microcontroller with additional components for DC-level
shifting.

Standby — In this mode the current consumption is very low and the outputs are
floating. The device is in standby mode when (VCC− 0.5 V) < V
the MODE pin is left floating (high impedance). The power consumption of the
TDA8944J will be reduced to <0.18 mW.

MODE<VCC

, or when

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Product specification Rev. 02 — 14 February 2000 5 of 21

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Philips Semiconductors

Mute — In this mode the amplifier is DC-biased but not operational (no audio output);

the DC level of the input and output pins remain on half the supply voltage. This

allows the input coupling and Supply Voltage Ripple Rejection (SVRR) capacitors to
be charged to avoid pop-noise. The device is in mute mode when
3V<V

Operating — In this mode the amplifier is operating normally. The operating mode is
activated at V

8.3.1 Switch-on and switch-off

To avoid audible plops during supply voltage switch-on or switch-off, the device is set
to standby mode before the supply voltage is applied (switch-on) or removed
(switch-off).

The switch-on and switch-off time can be influenced by an RC-circuit on the MODE
pin. Rapid on/off switching of the device or the MODE pin may cause ‘click- and
pop-noise’. This can be prevented by proper timing of the RC-circuit on the MODE
pin.

<(VCC− 1.5 V).

MODE

MODE

TDA8944J

2 x 7 W stereo BTL audio amplifier

< 0.5 V.

8.4 Supply Voltage Ripple Rejection (SVRR)

The SVRR is measured with an electrolytic capacitor of 10 µF on pin SVR at a
bandwidth of 10 Hz to 80 kHz. Figure 13 on page 11 illustrates the SVRR as function
of the frequency. A larger capacitor value on the SVR pin improves the ripple rejection
behaviour at the lower frequencies.

8.5 Built-in protection circuits

The TDA8944J contains two types of protection circuits, i.e. short-circuit and thermal
shutdown.

8.5.1 Short-circuit protection

Short-circuit to ground or supply line — This is detected by a so-called ‘missing

current’ detection circuit which measures the current in the positive supply line and
the current in the ground line. A difference between both currents larger than 0.4 A,
switches the power stage to standby mode (high impedance).

Short-circuit across the load — This is detected by an absolute-current
measurement. An absolute-current larger than 2 A, switches the power stage to
standby mode (high impedance).

8.5.2 Thermal shutdown protection

The junction temperature is measured by a temperature sensor; at a junction
temperature of approximately 150 °C this detection circuit switches the power stage
to standby mode (high impedance).

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Philips Semiconductors

TDA8944J

2 x 7 W stereo BTL audio amplifier

9. Limiting values

Table 5: Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

V

CC

supply voltage no signal −0.3 +25 V

operating −0.3 +18 V

V

I

I

ORM

T

stg

T

amb

P

tot

V

CC(sc)

input voltage −0.3 VCC+ 0.3 V
repetitive peak output current - 2 A
storage temperature non-operating −55 +150 °C
operating ambient temperature −40 +85 °C
total power dissipation - 18 W
supplyvoltagetoguaranteeshort-circuit

-15V

protection

10. Thermal characteristics

Table 6: Thermal characteristics

Symbol Parameter Conditions Value Unit

R

th(j-a)

R

th(j-mb)

thermal resistance from junction to ambient in free air 40 K/W
thermal resistance from junction to mounting base both channels driven 6.9 K/W

11. Static characteristics

Table 7: Static characteristics

VCC=12V; T

Symbol Parameter Conditions Min Typ Max Unit

V

CC

I

q

I

stb

V

O

[3]

∆V

OUT

V

MODE

I

MODE

[1] With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal to the differential

output voltage offset (∆V
[2] The DC output voltage with respect to ground is approximately 0.5VCC.
[3] ∆V

OUT

=25°C; RL=8Ω; V

amb

supply voltage operating 6 12 18 V
quiescent supply current RL= ∞
standby supply current V
DC output voltage
differential output voltage offset - - 200 mV
mode selection input voltage operating mode 0 - 0.5 V

mode selection input current 0 < V

= V

OUT+

− V

=0V; Vi= 0 V; measured in test circuit Figure 14; unless otherwise specified.

MODE

) divided by the load resistance (RL).

OUT



OUT−

[1]

- 2436mA

MODE=VCC

--10µA

[2]

-6-V

mute mode 3 - V
standby mode V

MODE<VCC

− 0.5 - V

CC

--20µA

− 1.5 V

CC
CC

V

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Philips Semiconductors

TDA8944J

2 x 7 W stereo BTL audio amplifier

V

MODE

MGL955

20

(V)

50

handbook, halfpage

I

q

(mA)

40

30

20

10

0

0481216

MGL954

VCC (V)

20

Fig 3. Quiescent current as function of supply

50

handbook, halfpage

I

q

(mA)

40

30

20

10

0

0481216

VCC = 12 V

Fig 4. Quiescent current as function of mode voltage.

voltage.

12. Dynamic characteristics

Table 8: Dynamic characteristics

VCC=12V; T
22 Hz to 22 kHz; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

P

o

THD total harmonic distortion P
G

v

Z

i(dif)

V

n(o)

SVRR supply voltage ripple rejection f

V

o(mute)

α

cs

=25°C; RL=8Ω; f = 1 kHz; V

amb

= 0 V; measured in test circuit Figure 14; audio pass band

MODE

output power THD = 10% 6 7 - W

THD = 0.5% 4 5 - W

= 1 W - 0.03 0.1 %

o

voltage gain 31 32 33 dB
differential input impedance 70 90 110 kΩ
noise output voltage

ripple

f

ripple

= 1 kHz
= 100 Hz

[1]

- 90 120 µV

[2]

50 65 - dB

[2]

-60-dB

to 20 kHz

output voltage mute mode

[3]

--50µV

channel separation Rs=0Ω 50 75 - dB

[1] The noise output voltage is measured at the output in a frequency range from 20 Hz to 20 kHz (unweighted), with a source impedance

Rs=0Ω at the input.
[2] Supply voltage ripple rejection is measured at the output, with a source impedance Rs=0Ω at the input. The ripple voltage is a sine

wave with a frequency f

and an amplitude of 707 mV (RMS), which is applied to the positive supply rail.

ripple

[3] Output voltage in mute mode is measured with an input voltage of 1 V (RMS) in a bandwidth of 20 kHz, so including noise.

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Product specification Rev. 02 — 14 February 2000 8 of 21

Philips Semiconductors

TDA8944J

2 x 7 W stereo BTL audio amplifier

10

handbook, full pagewidth

V

o

(V)

1

−1

10

−2

10

−3

10

−4

10

−5

10

840

Fig 5. Output voltage as function of mode voltage.

2

10

handbook, halfpage

THD

(%)

10

1

−1

10

VCC = 12 V

MGL952

VCC = 12 V

12

10

handbook, halfpage

THD

(%)

1

−1

10

V

MODE

Po = 0.1 W

1 W

(V)

MGL957

2016

MGL953

−2

10

−2

10

−1

10110

Po (W)

2

10

−2

10

10 10

2

10

3

10

4

10

5

f (Hz)

No bandpass filter applied.

Fig 6. Total harmonic distortion as function of output

power.

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Fig 7. Total harmonic distortion as function of

frequency.

© Philips Electronics N.V. 2000. All rights reserved.

Product specification Rev. 02 — 14 February 2000 9 of 21

Philips Semiconductors

TDA8944J

2 x 7 W stereo BTL audio amplifier

20

handbook, halfpage

P

o

(W)

16

12

8

4

0

0481216

RL = 8 Ω

16 Ω

MGL959

VCC (V)

20

handbook, halfpage

P

tot

(W)

16

12

8

4

20

0

0481216

RL = 8 Ω

16 Ω

MGL960

VCC (V)

20

THD = 10%.

Fig 8. Output power as function of supply voltage. Fig 9. Total power dissipation as function of supply

voltage.

100

handbook, halfpage

η

(%)

80

MGL962

10

handbook, halfpage

P

(W)

8

RL = 8 Ω

MGL961

RL = 16 Ω

60

8 Ω

40

20

0

02468

Po (W)

10

6

4

2

0

02468

16 Ω

Po (W)

10

VCC=12V.

Fig 10. Efficiency as function of output power. Fig 11. Power dissipation as function of output power.

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Product specification Rev. 02 — 14 February 2000 10 of 21

Philips Semiconductors

TDA8944J

2 x 7 W stereo BTL audio amplifier

handbook, halfpage

0

α

cs

(dB)

−20

−40

−60

−80

−100

10 10

2

No bandpass filter applied.

Fig 12. Channel separation as function of frequency.

handbook, full pagewidth

0

SVRR

(dB)

−20

MGL958

3

10

4

10

f (Hz)

5

10

MGL956

−40

−60

−80

VCC= 12 V; Rs=0Ω; V

B

A

2

10

ripple

10

= 707 mV (peak-to-peak); no bandpass filter applied.

3

10

Curves A: inputs short-circuited
Curves B: inputs short-circuited and connected to ground (asymmetrical application)

Fig 13. Supply voltage ripple rejection as function of frequency.

CH2

CH1

4

10

f (Hz)

5

10

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Product specification Rev. 02 — 14 February 2000 11 of 21

Philips Semiconductors

13. Internal circuitry

Table 9: Internal circuitry

Pin Symbol Equivalent circuit

6 and 8 IN1+ and IN1−
12 and 9 IN2+ and IN2−

TDA8944J

2 x 7 W stereo BTL audio amplifier

V

CC

1 and 4 OUT1− and OUT1+
14 and 17 OUT2− and OUT2+

10 MODE

1 kΩ

V

CC

MGL946

V

CC

1 kΩ

V

CC

8, 9 6, 12

V

1.5 kΩ 1.5 kΩ

45 kΩ 45 kΩ

1/2 V

1 : 1 1 : 1

40 Ω

1/2 V

CC

CC

100 Ω

V

CC

(SVR)

10 kΩ

10 kΩ

CC

1, 4, 14, 17

MGL947

10

OFF

HIGH

MUTE

HIGH

MGL949

11 SVR

V

CC

Standby

20 kΩ

11

20 kΩ

MGL948

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Philips Semiconductors

14. Application information

220 nF

R

s

Symmetrical
input

R

Asymmetrical
input

signal

GND

C

i

1.5

220 nF
220 nF

s

C

i

220 nF

1.5

V

CC

R

IN1−

nF

IN1+

IN2−

nF

IN2+

MODE

TDA8944J

2 x 7 W stereo BTL audio amplifier

+V

CC

100 nF

8

R

i

45 kΩ

1/2 V

R

i

45 kΩ

6

3

CC

16

−

1/2 V

+

CC

+

−

−
+

−

+

1

4

OUT1−

OUT1+

TDA8944J

9

1/2 V

−
+

CC

+

−

R

i

45 kΩ

1/2 V

R

i

45 kΩ

12

10

STANDBY/

MUTE LOGIC

CC

−
+

−

+

V

CC

14

17

OUT2−

OUT2+

1000 µF

R

L

8 Ω

R

L

8 Ω

C1

MICROCONTROLLER

C2

On

C1 C2

0
0
1

0
1
0

MODE

Standby

Mute

Fig 14. Application diagram.

14.1 Printed-circuit board (PCB)

14.1.1 Layout and grounding

R

signal

GND

SVR

10
µF

20 kΩ

1/2 V

11

ull pagewidth

CC

20 kΩ

SHORT CIRCUIT

AND

TEMPERATURE

PROTECTION

152

GND

MGL950

For a high system performance level certain grounding techniques are essential.
The input referencegrounds haveto be tied with their respective source grounds and
must have separate tracks from the power ground tracks; this will prevent the large
(output) signal currents from interfering with the small AC input signals.
The small-signal ground tracks should be physically located as far as possible from
the power ground tracks. Supply and output tracks should be as wide as possible for
delivering maximum output power.

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Product specification Rev. 02 — 14 February 2000 13 of 21

Philips Semiconductors

TDA8944J

2 x 7 W stereo BTL audio amplifier

1.5 nF

54 mm

OUT2−

OUT2+

220 nF

+−

10 µF

56 mm

ON

MUTE

IN2−

IN2+

IN1−

dth

17

220 nF

1

OUT1−

100 nF

OUT1+

IN1+

1000 µF

V

CC

GND

MGL951

Fig 15. Printed-circuit board layout (single-sided); components view.

14.1.2 Power supply decoupling

Proper supply bypassing is critical for low-noise performance and high supply voltage
ripple rejection. The respective capacitor locations should be as close as possible to
the device and grounded to the power ground. Proper power supply decoupling also
prevents oscillations.

For suppressing higher frequency transients (spikes) on the supply line a capacitor
with low ESR – typical 100 nF – has to be placed as close as possible to the device.
For suppressing lower frequency noise and ripple signals, a large electrolytic
capacitor – e.g. 1000 µF or greater – must be placed close to the device.

The bypass capacitor on the SVR pin reduces the noise and ripple on the midrail
voltage. For good THD and noise performance a low ESR capacitor is recommended.

9397 750 06861

Product specification Rev. 02 — 14 February 2000 14 of 21

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Philips Semiconductors

14.2 Thermal behaviour and heatsink calculation

TDA8944J

2 x 7 W stereo BTL audio amplifier

The measured maximum thermal resistance of the IC package, R

th(j-mb)

is 6.9 K/W.

A calculation for the heatsink can be made, with the following parameters:

T

amb(max)

=50°C
VCC= 12 V and RL=8Ω
T

= 150 °C.

j(max)

R

is the total thermal resistance between the junction and the ambient

th(tot)

including the heatsink. In the heatsink calculations the value of R

th(mb-h)

is ignored.

At VCC= 12 V and RL=8Ω the measured worstcase sine-wave dissipation is 8 W;
see Figure 11. For T

= 150 °C the temperature raise - caused by the power

j(max)

dissipation - is: 150 – 50 = 100 °C.

P × R
R

th(tot)

R

th(h-a)=Rth(tot)–Rth(j-mb)

= 100 °C

th(tot)

= 100/8 = 12.5 K/W

= 12.5 – 6.9 = 5.6 K/W.

The calculation above is for an application at worstcase (stereo) sine-wave output
signals. In practice music signals will be applied, which decreases the maximum
power dissipation to approximately half of the sine-wave power dissipation (see

Section 8.2.2). This allows for the use of a smaller heatsink:

P × R
R

th(tot)

R

th(h-a)=Rth(tot)–Rth(j-mb)

= 100 °C

th(tot)

= 100/4 = 25 K/W

= 25 – 6.9 = 18.1 K/W.

To increase the lifetime of the IC, T
heatsink of approximately 12 K/W for music signals.

15. Test information

15.1 Quality information

The
applicable.

15.2 Test conditions

T

amb

unless otherwise specified.
Remark: In the graphs as function of frequency no bandpass filter was applied; see

Figure 7, 12 and 13.

should be reduced to 125 °C. This requires a

j(max)

General Quality Specification for Integrated Circuits, SNW-FQ-611D

is

=25°C; VCC= 12 V; f = 1 kHz; RL=8Ω; audio pass band 22 Hz to 22 kHz;

9397 750 06861

Product specification Rev. 02 — 14 February 2000 15 of 21

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Philips Semiconductors

16. Package outline

TDA8944J

2 x 7 W stereo BTL audio amplifier

DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm)

non-concave

D

d

j

x

E

h

view B: mounting base side

B

L

3

SOT243-1

D

h

A

2

E

A

117

e

0.48

0.38

1

e

(1)

deD

24.0

20.0

23.6

19.6

Z

DIMENSIONS (mm are the original dimensions)

UNIT A e

mm

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE
VERSION

SOT243-1

A2bpcD

17.0

4.6

4.4

0.75

0.60

15.5

IEC JEDEC EIAJ

w M

b

p

(1)

E

h

12.2

10 2.54

11.8

REFERENCES

0 5 10 mm

Fig 16. DBS17P package outline.

1.27

scale

1

e

5.08

L

E

2

h

6

3.4

3.1

Q

m

LL3m

2.4

12.4

1.6

11.0

c

e

2

Qj

2.1

4.3

1.8

EUROPEAN

PROJECTION

v M

v

0.8

x

0.4w0.03

ISSUE DATE

97-12-16
99-12-17

(1)

Z

2.00

1.45

9397 750 06861

© Philips Electronics N.V. 2000. All rights reserved.

Product specification Rev. 02 — 14 February 2000 16 of 21

Philips Semiconductors

17. Soldering

17.1 Introduction to soldering through-hole mount packages

This text gives a brief insight to wave, dip and manual soldering. A more in-depth
account of soldering ICs can be found in our

Packages

Wave soldering is the preferred method for mounting of through-hole mount IC
packages on a printed-circuit board.

17.2 Soldering by dipping or by solder wave

The maximum permissible temperature of the solder is 260 °C; solder at this
temperature must not be in contact with the joints for more than 5 seconds. The total
contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the specified maximum storage temperature (T
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.

2 x 7 W stereo BTL audio amplifier

Data Handbook IC26; Integrated Circuit

(document order number 9398 652 90011).

TDA8944J

).

stg(max)

17.3 Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400 °C, contact may be up to 5 seconds.

17.4 Package related soldering information

Table 10: Suitability of through-hole mount IC packages for dipping and wave soldering

methods

Package Soldering method

Dipping Wave

DBS, DIP, HDIP, SDIP, SIL suitable suitable

[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the

printed-circuit board.

[1]

9397 750 06861

Product specification Rev. 02 — 14 February 2000 17 of 21

© Philips Electronics N.V. 2000. All rights reserved.

Philips Semiconductors

TDA8944J

2 x 7 W stereo BTL audio amplifier

18. Revision history

Table 11: Revision history

Rev Date CPCN Description

02 000214 - Product specification; second version; supersedes initial version TDA8944J-01 of

14 April 1999 (9397 750 04881). Modifications:

Table 1 on page 1: SVRR; Typ value 65 dB → added

•

Figure 1 on page 2: Block diagram; pin numbers changed OUT2−→ 14 and OUT2+ → 17

•

Figure 2 on page 3: Pin configuration; pin numbers changed OUT2−→14 and OUT2+ → 17

•

Section 8 “Functional description”:

•

– Section 8.1 “Input configuration” on page 4 → added.

– Section 8.2 “Power amplifier” on page 5: ........, capable of delivering a peak output

current of 1.5 A → changed to 2 A.

– Section 8.2.1 “Output power measurement” on page 5 → added
– Section 8.2.2 “Headroom” on page 5 → added

Section 8.3 “Mode selection”:

•

– Standby mode: V

power consumption of the TDA8944J will be reduced to <0.18 mW → added.

– Mute mode: the DC level of the input and output pins remain on half the supply

voltage → added;

– 2.5 V < V
– Section 8.3.1 “Switch-on and switch-off” on page 6

Section 8.4 “Supply Voltage Ripple Rejection (SVRR)” on page 6 → added

•

Section 8.5 “Built-in protection circuits” on page 6 → added

•

Table 5 on page 7:

•

– P

value added 18 V

tot

– V

Table 6 on page 7:

•

– R
– R

Table 7 on page 7: V

•

Table 8 on page 8:

•

– SVRR; Typ values 65 and 60 dB → added
– α

Figure 3 to 13: figures added

•

Section 13 “Internal circuitry” on page 12: → added

•

Figure 14: figure adjusted

•

Section 14.1 “Printed-circuit board (PCB)” on page 13: → added

•

Figure 15: figure added

•

Section 14.2 “Thermal behaviour and heatsink calculation” on page 15: → added

•

Section 15.2 “Test conditions” on page 15: → added

•

01 990414 - Preliminary specification; initial version.

value added 15 V

CC(sc)

value added 40 K/W

th(j-a)

value 10 → changed to 6.9 K/W; condition ‘in free air’ → changed to ‘both channels

th(j-c)

driven’

; Typ value 75 dB → added

cs

<(VCC− 1.5 V) → changed to 3 V < V

MODE

>(VCC− 0.5 V) → changed to (VCC− 0.5 V) < V

MODE

MODE

- mute mode - value Min 2.5 → changed to 3 V

MODE

MODE<VCC

<(VCC− 1.5 V)

; The

9397 750 06861

Product specification Rev. 02 — 14 February 2000 18 of 21

© Philips Electronics N.V. 2000. All rights reserved.

Philips Semiconductors

19. Data sheet status

TDA8944J

2 x 7 W stereo BTL audio amplifier

Datasheet status Product status Definition

Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may

change in any manner without notice.

Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips

Semiconductors reserves the right to make changes at any time without notice in order to improve design and
supply the best possible product.

Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any

time without notice in order to improve design and supply the best possible product.

[1] Please consult the most recently issued data sheet before initiating or completing a design.

20. Definitions

Short-form specification — The data in a short-form specification is

extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.

Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.

Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.

[1]

21. Disclaimers

Life support — These products are not designed for use in life support

appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes — Philips Semiconductors reserves the right to
make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve
design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
licence or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products
are free from patent, copyright, or mask work right infringement, unless
otherwise specified.

9397 750 06861

© Philips Electronics N.V. 2000 All rights reserved.

Product specification Rev. 02 — 14 February 2000 19 of 21

Philips Semiconductors

2 x 7 W stereo BTL audio amplifier

Philips Semiconductors - a worldwide company

TDA8944J

Argentina: see South America
Australia: Tel. [phone], Fax. [phone]
Austria: Tel. [phone], Fax. [phone]
Belarus: Tel. [phone], Fax. [phone]
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Tel. [phone], Fax. [phone]
Canada: Tel. [phone]
China/Hong Kong: Tel. [phone], Fax. [phone]
Colombia: see South America
Czech Republic: see Austria
Denmark: Tel. [phone], Fax.[phone]
Finland: Tel. [phone], Fax.[phone]
France: Tel. [phone], Fax. [phone]
Germany: Tel. [phone], Fax. [phone]
Hungary: see Austria
India: Tel. [phone], Fax. [phone]
Indonesia: see Singapore
Ireland: Tel. [phone], Fax. [phone]
Israel: Tel. [phone], Fax. [phone]
Italy: Tel. [phone], Fax [phone]
Japan: Tel. [phone], Fax. [phone]
Korea: Tel. [phone], Fax.[phone]
Malaysia: Tel. [phone], Fax. [phone]
Mexico: Tel. [phone]
Middle East: see Italy

Netherlands: Tel. [phone], Fax. [phone]
New Zealand: Tel. [phone], Fax. [phone]
Norway: Tel. [phone], Fax. [phone]
Philippines: Tel. [phone], Fax. [phone]
Poland: Tel. [phone], Fax.[phone]
Portugal: see Spain
Romania: see Italy
Russia: Tel. [phone], Fax. [phone]
Singapore: Tel. [phone], Fax.[phone]
Slovakia: see Austria
Slovenia: see Italy
South Africa: Tel. [phone], Fax. [phone]
South America: Tel. [phone], Fax. [phone]
Spain: Tel. [phone], Fax. [phone]
Sweden: Tel. [phone], Fax. [phone]
Switzerland: Tel. [phone], Fax. [phone]
Taiwan: Tel. [phone], Fax. [phone]
Thailand: Tel. [phone], Fax. [phone]
Turkey: Tel. [phone], Fax. [phone]
Ukraine: Tel. [phone], Fax. [phone]
United Kingdom: Tel. [phone], Fax. [phone]
United States: Tel. [phone]
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: Tel. [phone], Fax. [phone]

For all other countries apply to: Philips Semiconductors,

International Marketing & Sales Communications,
Building BE, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. [phone]

Internet: http://www.semiconductors.philips.com

(SCA69)

9397 750 06861

Product specification Rev. 02 — 14 February 2000 20 of 21

© Philips Electronics N.V. 2000. All rights reserved.

Philips Semiconductors

Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1

5 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2

7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3

7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

8 Functional description . . . . . . . . . . . . . . . . . . . 4

8.1 Input configuration . . . . . . . . . . . . . . . . . . . . . . 4

8.2 Power amplifier. . . . . . . . . . . . . . . . . . . . . . . . . 5

8.2.1 Output power measurement . . . . . . . . . . . . . . . 5

8.2.2 Headroom. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

8.3 Mode selection . . . . . . . . . . . . . . . . . . . . . . . . . 5

8.3.1 Switch-on and switch-off. . . . . . . . . . . . . . . . . . 6

8.4 Supply Voltage Ripple Rejection (SVRR). . . . . 6

8.5 Built-in protection circuits . . . . . . . . . . . . . . . . . 6

8.5.1 Short-circuit protection . . . . . . . . . . . . . . . . . . . 6

8.5.2 Thermal shutdown protection . . . . . . . . . . . . . . 6

9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7

10 Thermal characteristics. . . . . . . . . . . . . . . . . . . 7

11 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7

12 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8

13 Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . 12

14 Application information. . . . . . . . . . . . . . . . . . 13

14.1 Printed-circuit board (PCB). . . . . . . . . . . . . . . 13

14.1.1 Layout and grounding. . . . . . . . . . . . . . . . . . . 13

14.1.2 Power supply decoupling . . . . . . . . . . . . . . . . 14

14.2 Thermal behaviour and heatsink calculation . 15

15 Test information. . . . . . . . . . . . . . . . . . . . . . . . 15

15.1 Quality information . . . . . . . . . . . . . . . . . . . . . 15

15.2 Test conditions . . . . . . . . . . . . . . . . . . . . . . . . 15

16 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16

17 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

17.1 Introduction to soldering through-hole mount

packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

17.2 Soldering by dipping or by solder wave . . . . . 17

17.3 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 17

17.4 Package related soldering information. . . . . . 17

18 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 18

19 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 19

20 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

21 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

TDA8944J

2 x 7 W stereo BTL audio amplifier

© Philips Electronics N.V. 2000. Printed in The Netherlands

All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.

The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.

Date of release: 14 February 2000 Document order number: 9397 750 06861