Philips TDA8927TH, TDA8927J Datasheet

INTEGRATED CIRCUITS

DATA SH EET

TDA8927

Power stage 2 × 80 W class-D audio amplifier

Objective speciﬁcation File under Integrated Circuits, IC01

2001 Dec 11

Philips Semiconductors Objective speciﬁcation

Power stage 2 × 80 W class-D audio ampliﬁer

CONTENTS

1 FEATURES 2 APPLICATIONS 3 GENERAL DESCRIPTION 4 QUICK REFERENCE DATA 5 ORDERING INFORMATION 6 BLOCK DIAGRAMS 7 PINNING INFORMATION 8 FUNCTIONAL DESCRIPTION

8.1 Power stage

8.2 Protections

8.2.1 Overtemperature

8.2.2 Short-circuit across the loudspeaker terminals

8.3 BTL operation 9 LIMITING VALUES 10 THERMAL CHARACTERISTICS 11 QUALITY SPECIFICATION 12 DC CHARACTERISTICS 13 AC CHARACTERISTICS 14 SWITCHING CHARACTERISTICS

14.1 Duty factor

TDA8927

15 TEST AND APPLICATION INFORMATION

15.1 BTL application

15.2 Remarks

15.3 Output power

15.4 Reference designs

15.5 Reference design bill of material

15.6 Curves measured in reference design 16 PACKAGE OUTLINES 17 SOLDERING

17.1 Introduction

17.2 Through-hole mount packages

17.2.1 Soldering by dipping or by solder wave

17.2.2 Manual soldering

17.3 Surface mount packages

17.3.1 Reflow soldering

17.3.2 Wave soldering

17.3.3 Manual soldering

17.4 Suitability of IC packages for wave,reflow and dipping soldering methods

18 DATA SHEET STATUS 19 DEFINITIONS 20 DISCLAIMERS

2001 Dec 11 2

Philips Semiconductors Objective speciﬁcation

Power stage 2 × 80 W class-D audio ampliﬁer

1 FEATURES

• High efficiency (>94%)

• Operating voltage from ±15 to ±30 V

• Very low quiescent current

• High output power

• Short-circuit proof across the load, only in combination

with controller TDA8929T

• Diagnostic output

• Usable as a stereo Single-Ended (SE) amplifier or as a

mono amplifier in Bridge-Tied Load (BTL)

• Electrostatic discharge protection (pin to pin)

• Thermally protected, only in combination with controller

TDA8929T.

2 APPLICATIONS

• Television sets

• Home-sound sets

TDA8927

• Multimedia systems

• All mains fed audio systems

• Car audio (boosters).

3 GENERAL DESCRIPTION

The TDA8927 is the switching power stage of a two-chip set for a high efficiency class-D audio power amplifier system. The system is split into two chips:

• TDA8927J/ST/TH; a digital power stage in a DBS17P,

RDBS17P or HSOP24 power package

• TDA8929T; the analog controller chip in a SO24

package.

With this chip set a compact 2 × 80 W audio amplifier systemcanbebuilt,operatingwithhighefficiencyand very low dissipation. No heatsink is required, or depending on supply voltage and load, a very small one. The system operates over a wide supply voltage range from ±15 up to ±30 V and consumes a very low quiescent current.

4 QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

General; VP= ±25 V

q(tot)

η efﬁciency P

supply voltage ±15 ±25 ±30 V total quiescent current no load connected − 35 45 mA

=30W − 94 − %

Stereo single-ended conﬁguration

output power RL=4Ω; THD = 10%; VP= ±25 V 60 65 − W

=4Ω; THD = 10%; VP= ±27 V 74 80 − W

Mono bridge-tied load conﬁguration

output power RL=4Ω; THD = 10%; VP= ±17 V 90 110 − W

=8Ω; THD = 10%; VP= ±25 V 120 150 − W

5 ORDERING INFORMATION

PACKAGE

TYPE NUMBER

NAME DESCRIPTION VERSION

TDA8927J DBS17P plastic DIL-bent-SIL power package; 17 leads (lead length

12 mm)

TDA8927ST RDBS17P plastic rectangular-DIL-bent-SIL power package; 17 leads (row

spacing 2.54 mm)

TDA8927TH HSOP24 plastic, heatsink small outline package; 24 leads; low stand-off

height

SOT243-1

SOT577-1

SOT566-2

2001 Dec 11 3

Philips Semiconductors Objective speciﬁcation

Power stage 2 × 80 W class-D audio ampliﬁer

6 BLOCK DIAGRAMS

handbook, full pagewidth

EN1

SW1

REL1

STAB

DIAG

POWERUP

EN2

SW2

REL2

4 1 2 9

14 17 16

TDA8927J

TDA8927ST

CONTROL

AND

HANDSHAKE

temp

TEMPERATURE SENSOR

current

CURRENT PROTECTION

CONTROL

AND

HANDSHAKE

AND

DRIVER

HIGH

DRIVER

LOW

DRIVER

HIGH

DRIVER

LOW

DD2VDD1

13 5

SS1

DD2

TDA8927

BOOT1

OUT1

BOOT2

OUT2

810

SS1VSS2

MGW138

Fig.1 Block diagram of TDA8927J and TDA8927ST.

2001 Dec 11 4

Philips Semiconductors Objective speciﬁcation

Power stage 2 × 80 W class-D audio ampliﬁer

handbook, full pagewidth

LIM

EN1

SW1

REL1

STAB

DIAG

POWERUP

EN2

SW2

REL2

STAB

n.c.

24 21 22 6

13 16 15 7

1, 12, 18, 20

TDA8927TH

CONTROL

AND

HANDSHAKE

temp

TEMPERATURE SENSOR

current

CURRENT PROTECTION

CONTROL

AND

HANDSHAKE

DRIVER

HIGH

DRIVER

LOW

AND

DRIVER

HIGH

DRIVER

LOW

19 5 8

SS(sub)

DD2VDD1

11 2

SS1VSS2

SS1

DD2

TDA8927

BOOT1

OUT1

BOOT2

OUT2

MGW140

Fig.2 Block diagram of TDA8927TH.

2001 Dec 11 5

Philips Semiconductors Objective speciﬁcation

Power stage 2 × 80 W class-D

TDA8927

audio ampliﬁer

7 PINNING INFORMATION

SYMBOL

SW1 1 1 21 digital switch input channel 1 n.c. −−1 not connected REL1 2 2 22 digital control output channel 1 DIAG 3 3 23 digital open-drain output for overtemperature and

EN1 4 4 24 digital enable input for channel 1 V

DD1

BOOT1 6 6 3 bootstrap capacitor channel 1 STAB −−6 decoupling internal stabilizer for logic supply OUT1 7 7 4 PWM output channel 1 STAB −−7 decoupling internal stabilizer for logic supply V

SS1

STAB 9 9 − decoupling internal stabilizer for logic supply V

SS2

OUT2 11 11 9 PWM output channel 2 BOOT2 12 12 10 bootstrap capacitor channel 2 n.c. −−12 not connected V

DD2

EN2 14 14 13 digital enable input for channel 2 POWERUP 15 15 14 enable input for switching-on internal reference

REL2 16 16 15 digital control output channel 2 SW2 17 17 16 digital switch input channel 2 LIM −−17 current input for setting maximum load current limit n.c. −−18 not connected V

SS(sub)

n.c. −−20 not connected

TDA8927J TDA8927ST TDA8927TH

5 5 2 positive power supply channel 1

8 8 5 negative power supply channel 1

10 10 8 negative power supply channel 2

13 13 11 positive power supply channel 2

−−19 negative supply (substrate)

DESCRIPTION

overcurrent report

sources

2001 Dec 11 6

Philips Semiconductors Objective speciﬁcation

Power stage 2 × 80 W class-D audio ampliﬁer

handbook, halfpage

SW1

REL1

DIAG

EN1

DD1

BOOT1

OUT1

SS1

STAB

SS2

OUT2

BOOT2

DD2 EN2

POWERUP

REL2

SW2

1 2 3 4 5 6 7 8 9

TDA8927ST

10 11 12 13 14 15 16 17

TDA8927J

handbook, halfpage

EN1

DIAG REL1

SW1

n.c.

SS(sub)

n.c. LIM

SW2

REL2

POWERUP

EN2

TDA8927

24 23 22 21 20 19 18 17

16 15 14 13

TDA8927TH

MGW144

1 2 3 4 5 6 7 8

9 10 11 12

n.c. V

DD1

BOOT1 OUT1 V

SS1

STAB STAB V

SS2

OUT2 BOOT2 V

DD2

n.c.

MGW142

Fig.3 Pin configuration of TDA8927J and

TDA8927ST.

2001 Dec 11 7

Fig.4 Pin configuration of TDA8927TH.

Philips Semiconductors Objective speciﬁcation

Power stage 2 × 80 W class-D audio ampliﬁer

8 FUNCTIONAL DESCRIPTION

The combination of the TDA8927J and the TDA8929T produces a two-channel audio power amplifier system usingthe class-D technology (seeFig.5).In the TDA8929T controllerdevice the analog audio input signal is converted into a digital Pulse Width Modulation (PWM) signal.

ThepowerstageTDA8927isusedfordrivingthe low-pass filter and the loudspeaker load. It performs a level shift from the low-power digital PWM signal, at logic levels, to a high-power PWM signal that switchs between the main supply lines. A second-order low-pass filter converts the PWM signal into an analog audio signal across the loudspeaker.

See the specification of the TDA8929T for a description of the controller.

8.1 Power stage

The power stage contains the high-power DMOS switches,the drivers, timing and handshaking betweenthe power switches and some control logic. For protection, a temperature sensor and a maximum current detector are built-in on the chip.

For interfacing with the controller chip the following connections are used:

• Switch (pins SW1 and SW2): digital inputs; switching from VSS to VSS+ 12 V and driving the power DMOS switches

• Release (pins REL1 and REL2): digital outputs to indicate switching from VSS to VSS+ 12 V, follows pins SW1 and SW2 with a small delay

• Enable (pins EN1 and EN2): digital inputs; at a level of VSSthe power DMOS switches are open and the PWM output is floating; at a level of VSS+ 12 V the power stage is operational and controlled by the switch pin if pin POWERUP is at VSS+12V

• Power-up (pin POWERUP): must be connected to a continuous supply voltage of at least VSS+ 5 V with respect to V

• Diagnostics(pin DIAG):digitalopen-drain output; pulled to VSS if temperature or maximum current is exceeded.

TDA8927

8.2 Protections

Temperature and short-circuit protection sensors are included in the TDA8927 power stage. These protections are only operational in combination with the TDA8929T. In the event that the maximum current or maximum temperature is exceeded the diagnostic output is activated.The controller has to take appropriate measures by shutting down the system.

8.2.1 OVERTEMPERATURE If the junction temperature (Tj) exceeds 150 °C, then

pin DIAG becomes LOW. The diagnostic pin is released if the temperature is dropped to approximately 130 °C, so there is a hysteresis of approximately 20 °C.

8.2.2 SHORT-CIRCUIT ACROSS THE LOUDSPEAKER

TERMINALS

When the loudspeaker terminals are short-circuited it will be detected by the current protection. If the output current exceeds the maximum output current of 7.5 A, then pin DIAG becomes LOW. The controller should shut down the system to prevent damage. Using the TDA8929T the system is shut down within 1 µs, and after 220 ms, it will attempt to restart the system again. During this time the dissipation is very low, so the average dissipation during a short-circuit is practically zero.

For the TDA8927TH the limit value can be externally adjusted using a resistor. For the maximum value of 7.5 A pin LIM should be connected to VSS. When a resistor R is connected between pin LIM and VSS the maximum output current can be set at a lower value, using:

O(max)

Example 1: with R

2.1 105×

--------------------------------R

ext

28 kΩ+

=27kΩ the current is limited at

ext

3.8 A. Example 2: with R

=0Ω the current is limited at 7.5 A.

ext

In the TDA8927J and the TDA8927ST pin LIM is internally connected to VSS, so I

O(max)

= 7.5 A.

ext

2001 Dec 11 8

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2001 Dec 11 9

OUT1

BOOT2

OUT2

DDA

BOOT1

SSA

+25 V

−25 V

MGU388

SSA

i(1)

MODE

i(2)

OSC

IN1−

IN1+

SGND1

OSC

MODE

SGND2

IN2+

IN2−

SSAVDDA

SGND

SS2(sub)

SS1VDD1

TDA8929T

INPUT

STAGE

mute

OSCILLATOR

MODE

mute

INPUT

STAGE

12 10

SSAVDDA

PWM

MODULATOR

PWM

MODULATOR

DD2

STABI

MANAGER

23 24

21 19

22 15

13 14 17

SSD

PWM1

REL1 SW1

EN1

STAB

DIAGCUR

DIAGTMP

EN2

SW2 REL2

PWM2

REL1

SW1

EN1

STAB

DIAG

POWERUP

EN2

SW2

REL2

TDA8927J

CONTROL

AND

HANDSHAKE

TEMPERATURE SENSOR

CURRENT PROTECTION

CONTROL

AND

HANDSHAKE

AND

DRIVER

HIGH

DRIVER

LOW

DRIVER

HIGH

DRIVER

LOW

DDD

DD2VDD1

13 5

SS1

DD2

810

SS2

SS1

SSD

SGND

(0 V)

Philips Semiconductors Objective speciﬁcation

Power stage 2 × 80 W class-D

audio ampliﬁer

TDA8927

Fig.5 Typical application schematic of the class-D system using TDA8929T and the TDA8927J.

handbook, full pagewidth

Philips Semiconductors Objective speciﬁcation

Power stage 2 × 80 W class-D audio ampliﬁer

8.3 BTL operation

BTL operation can be achieved by driving the audio input channels of the controller in the opposite phase and by connecting the loudspeaker with a BTL output filter between the two PWM output pins of the power stage (see Fig.6).

handbook, full pagewidth

TDA8927J

EN1

SW1

REL1

STAB

DIAG

POWERUP

EN2

SW2

REL2

1 2 9

14 17 16

CONTROL

AND

HANDSHAKE

temp

TEMPERATURE SENSOR

current

CURRENT PROTECTION

CONTROL

AND

HANDSHAKE

AND

TDA8927

In this way the system operates as a mono BTL amplifier and with the same loudspeaker impedance a four times higher output power can be obtained.

For more information see Chapter 15.

DD2VDD1

13 5

BOOT1

DRIVER

HIGH

DRIVER

LOW

DRIVER

HIGH

DRIVER

LOW

V V

SS1

DD2

OUT1

SGND

(0 V)

BOOT2

OUT2

Fig.6 Mono BTL application.

2001 Dec 11 10

810

SS1VSS2

MGU386

Philips Semiconductors Objective speciﬁcation

Power stage 2 × 80 W class-D

TDA8927

audio ampliﬁer

9 LIMITING VALUES

In accordance with the Absolute Maximum Rate System (IEC 60134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

P(sc)

ORM

stg

amb

es(HBM)

es(MM)

supply voltage −±30 V supply voltage for

−±30 V

short-circuits across the load repetitive peak current in

− 7.5 A

output pins storage temperature −55 +150 °C ambient temperature −40 +85 °C virtual junction temperature − 150 °C electrostatic discharge

voltage (HBM)

note 1

all pins with respect to V all pins with respect to V

(class A) −500 +500 V

(class A1) −1500 +1500 V

all pins with respect to each other

−1500 +1500 V

(class A1)

electrostatic discharge voltage (MM)

note 2

all pins with respect to V all pins with respect to V

(class B) −250 +250 V

all pins with respect to each other

−250 +250 V

(class B)

Notes

1. Human Body Model (HBM); R

= 1500 Ω; C = 100 pF.

2. Machine Model (MM); Rs=10Ω; C = 200 pF; L = 0.75 µH.

10 THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

th(j-a)

thermal resistance from junction to ambient in free air

TDA8927J 40 K/W TDA8927ST 40 K/W TDA8927TH 40 K/W

th(j-c)

thermal resistance from junction to case in free air

TDA8927J ≈1.0 K/W TDA8927ST ≈1.0 K/W TDA8927TH 1 K/W

11 QUALITY SPECIFICATION

In accordance with

“SNW-FQ611-part D”

if this type is used as an audio amplifier.

2001 Dec 11 11

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