Philips TDA7053A User Manual

INTEGRATED CIRCUITS

DATA SH EET

TDA7053A

Stereo BTL audio output amplifier
with DC volume control

Product specification
Supersedes data of 1995 Nov 09
File under Integrated Circuits, IC01

1997 Jul 15

Philips Semiconductors Product specification

Stereo BTL audio output amplifier with DC

TDA7053A

volume control

FEATURES

• DC volume control

• Few external components

• Mute mode

• Thermal protection

• Short-circuit proof

• No switch-on and switch-off clicks

• Good overall stability

• Low power consumption

• Low HF radiation

• ESD protected on all pins.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

P

P

out

supply voltage 4.5 − 18 V
output power VP=6V

TDA7053A R

TDA7053AT R
G
G
I

q(tot)

v
C

voltage gain 39.5 40.5 41.5 dB
gain control 68.0 73.5 − dB
total quiescent current VP=6V; RL=∞−22 25 mA

THD total harmonic distortion

TDA7053A P

TDA7053AT P

out
out

GENERAL DESCRIPTION

The TDA7053A (2 × 1 W) and TDA7053AT (2 × 0.5 W) are
stereo BTL output amplifiers with DC volume control.
The devices are designed for use in TV and monitors, but
are also suitable for battery-fed portable recorders and
radios.

Missing Current Limiter (MCL)

A MCL protection circuit is built-in. The MCL circuit is
activated when the difference in current between the
output terminal of each amplifier exceeds 100 mA
(typical 300 mA). This level of 100 mA allows for
headphone applications (single-ended).

=8Ω 0.85 1.0 − W

L

=16Ω 0.5 0.55 − W

L

= 0.5 W − 0.3 1 %
= 0.25 W − 0.3 1 %

ORDERING INFORMATION

TYPE

NUMBER

TDA7053A DIP16
TDA7053AT SO16

NAME DESCRIPTION VERSION

plastic dual in-line package; 16 leads (300 mil); long body
plastic small outline package; 16 leads; body width 7.5 mm

1997 Jul 15 2

PACKAGE

SOT38-1

SOT162-1

Philips Semiconductors Product specification

Stereo BTL audio output amplifier with DC
volume control

BLOCK DIAGRAM

TDA7053A

TDA7053AT

V

ref

STABILIZER

input 1

DC volume

control 1

4

2

V

P

5

I i

Ι

I i

TEMPERATURE

PROTECTION

TDA7053A

positive

16

output 1

negative

13

output 1

input 2

DC volume

control 2

6

8

not

connected

1,3,11,15

I i

ΙΙ

I i

signal

ground

power

ground 1

Fig.1 Block diagram.

12

negative
output 2

9

positive
output 2

14

107

power

ground 2

MSA717 - 2

1997 Jul 15 3

Philips Semiconductors Product specification

Stereo BTL audio output amplifier with DC
volume control

PINNING

SYMBOL PIN DESCRIPTION

n.c. 1 not connected
VC1 2 DC volume control 1
n.c. 3 not connected
V

I (1)

V

P

V

I (2)

SGND 7 signal ground
VC2 8 DC volume control 2
OUT2+ 9 positive output 2
PGND2 10 power ground 2
n.c. 11 not connected
OUT2− 12 negative output 2
OUT1− 13 negative output 1
PGND1 14 power ground 1
n.c. 15 not connected
OUT1+ 16 positive output 1

4 voltage input 1
5 positive supply voltage
6 voltage input 2

1

n.c.

2

VC1

n.c.

3

V

4

I (1)

V

V

I (2)

SGND

VC2

P

TDA7053A

TDA7053AT

5
6
7
8

MSA719 - 2

Fig.2 Pin configuration.

TDA7053A

16

OUT1

n.c.

15

PGND1

14
13

OUT1
OUT2

12

n.c.

11

PGND2

10

OUT2

9

FUNCTIONAL DESCRIPTION

The TDA7053A and TDA7053AT are stereo output
amplifiers with two DC volume control stages, designed for
TV and monitors, but also suitable for battery-fed portable
recorders and radios.

In conventional DC volume control circuits the control or
input stage is AC coupled to the output stage via external
capacitors to keep the offset voltage low.

The two DC volume control stages are integrated into the
input stages so that no coupling capacitors are required
and a low offset voltage is still maintained. The minimum
supply voltage also remains low.

The BTL principle offers the following advantages:

• Lower peak value of the supply current

• The frequency of the ripple on the supply voltage is twice

the signal frequency.

Consequently, a reduced power supply with smaller
capacitors can be used which results in cost reductions.

For portable applications there is a trend to decrease the
supply voltage, resulting in a reduction of output power at
conventional output stages. Using the BTL principle
increases the output power.

The maximum gain of the amplifier is fixed at 40.5 dB.
The DC volume control stages have a logarithmic control
characteristic. Therefore, the total gain can be controlled
from +40.5 to −33 dB.

If the DC volume control voltage falls below 0.4 V, the
device will switch to the mute mode.

The amplifier is short-circuit protected to ground, V

and

P

across the load. A thermal protection circuit is also
implemented. If the crystal temperature rises above
150 °C the gain will be reduced, thereby reducing the
output power.

Special attention is given to switch-on and switch-off
clicks, low HF radiation and a good overall stability.

1997 Jul 15 4

Philips Semiconductors Product specification

Stereo BTL audio output amplifier with DC

TDA7053A

volume control

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

P

I

ORM

I

OSM

P

tot

t

sc

V

n

T

amb

T

stg

T

vj

THERMAL CHARACTERISTICS

supply voltage − 18 V
repetitive peak output current − 1.25 A
non-repetitive peak output current − 1.5 A
total power dissipation T

amb

≤ 25 °C
TDA7053A − 2.5 W
TDA7053AT − 1.32 W

short-circuit time − 1hr
input voltage pins 2, 4, 6 and 8 − 5V
operating ambient temperature −40 +85 °C
storage temperature −55 +150 °C
virtual junction temperature − +150 °C

SYMBOL PARAMETER VALUE UNIT

R

th j-a

thermal resistance from junction to ambient in free air

TDA7053A 50 K/W
TDA7053AT 95 K/W

Power dissipation

TDA7053A:

Assume V

= 6 V and RL=8Ω.

P

The maximum sine wave dissipation is 2 × 0.9 W = 1.8 W.
The R

of the package is 50 K/W therefore T

th j-a

amb(max)

= 150 − (50 × 1.8) = 60 °C.

TDA7053AT:

Assume V

= 6 V and RL=16Ω.

P

The maximum sine wave dissipation is 2 × 0.46 W = 0.92 W.
The R

of the package is 95 K/W therefore T

th j-a

amb(max)

= 150 − (95 × 0.92) = 62.6 °C.

1997 Jul 15 5

Philips Semiconductors Product specification

Stereo BTL audio output amplifier with DC

TDA7053A

volume control

CHARACTERISTICS

VP=6V; T
(see Fig.13).

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

P

I

q(tot)

Maximum gain; V

P

out

THD total harmonic distortion

G

v

V

I(rms)

V

no

B bandwidth at −1dB − note 3 − Hz
SVRR supply voltage ripple rejection note 4 34 38 − dB
V

O(os)

Z

i

α

cs

G

 channel unbalance note 5 −−1dB

v

Mute position; V

V

O

DC volume control

G

C

I

DC

=25°C; fi= 1 kHz; TDA7053A: RL=8Ω; TDA7053AT: RL=16Ω; unless otherwise specified

amb

supply voltage 4.5 − 18 V
total quiescent current VP=6V; RL=∞; note 1 − 22 25 mA

≥ 1.4 V

2,8

output power THD = 10%

TDA7053A 1.0 1.1 − W
TDA7053AT 0.5 0.55 − W

TDA7053A P
TDA7053AT P

= 0.5 W − 0.3 1 %

out

= 0.25 W − 0.3 1 %

out

voltage gain 39.5 40.5 41.5 dB
input signal handling (RMS value) Gv= 0 dB; THD < 1% 1 −−V
noise output voltage fi= 500 kHz; note 2 − 210 −µV

DC output offset voltage V16− V13 and V12− V9− 0 200 mV
input impedance (pins 4 and 6) 15 20 25 kΩ
channel separation RS=5kΩ 40 −−dB

= 0 dB; note 6 −−1dB

G

1

= 0.4 V ±30 mV

2,8

output voltage in mute position Vi= 1.0 V; note 7 − 30 40 µV

gain control 68.5 73.5 − dB
volume control current V2=V8=0V −20 −25 −30 µA

Notes

1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being
equal to the DC output offset voltage divided by R

.

L

2. The noise output voltage (RMS value) at fi= 500 kHz is measured with RS=0Ω and bandwidth = 5 kHz.

3. 20 Hz to 300 kHz (typical).

4. The ripple rejection is measured with RS=0Ω and fi= 100 Hz to 10 kHz. The ripple voltage of 200 mV (RMS value)
is applied to the positive supply rail.

5. The channel unbalance is measured with V

DC1=VDC2

6. The channel unbalance at G1= 0 dB is measured with V

.

DC1=VDC2

.

7. The noise output voltage (RMS value) is measured with RS=5kΩ unweighted.

1997 Jul 15 6

Philips Semiconductors Product specification

Stereo BTL audio output amplifier with DC
volume control

40

handbook, halfpage

I

q

(mA)

30

20

10

0

04 20

81216

Fig.3 Quiescent current as a function of supply

voltage.

MBG672

V

(V)

P

12

handbook, halfpage

THD

(%)

8

4

0

−2

10

(1) VP= 4.5V.
(2) VP= 6 V; RL=8Ω.
(3) VP= 12 V; RL=25Ω.

Fig.4 THD as a function of output power.

−1

10

(1) (2) (3)

1

TDA7053A

MBG671

(W)

10

P

out

10

handbook, halfpage

THD

(%)

8

6

4

2

0

(1) Gv= 30 dB; Po= 0.1 W.
(2) Gv= 40 dB; Po= 0.1 W.

(2)

(1)

−2

Fig.5 THD as a function of frequency.

MBG669

−1

10

10110

f (kHz)

2

10

2.5

handbook, halfpage

P

out

(W)

2.0

1.5

1.0

0.5

0

0

(1) RL=8Ω.
(2) RL=16Ω.
(3) RL=25Ω.

(1) (2) (3)

4 8 12 16

MBG670

VP (V)

Fig.6 Output power as a function of supply

voltage.

1997 Jul 15 7

Philips Semiconductors Product specification

Stereo BTL audio output amplifier with DC
volume control

12

V

P

MBG668

(V)

handbook, halfpage

4

P

diss

(W)

3

2

1

0

048 16

(1) RL=8Ω.
(2) RL=16Ω.
(3) RL=25Ω.

(2) (3)(1)

80

handbook, halfpage

G

v

(dB)

40

0

−40

−80

−120

0

TDA7053A

0.4 0.8 1.2 1.6

MBG667

VVC (V)

2.0

Fig.7 Total worst case power dissipation as a

function of supply voltage.

V

no

(mV)

10

10

1

−1

−2

0

0.4 0.8 1.2 1.6
VVC (V)

handbook, halfpage

MBG664

2.0

Fig.8 Voltage gain as a function of volume control

voltage.

10110

MBG663

f (kHz)

10

SVRR

(dB)

−20

−40

−60

−80

0

−2

handbook, halfpage

(1)

(2)

−1

10

2

f = 22 Hz to 22 kHz.

Fig.9 Noise voltage as a function of volume

control voltage.

1997 Jul 15 8

(1) VDC= 1.4 V;V
(2) VDC= 0.4 V; V

ripple

ripple

= 0.2 V.

= 0.2 V.

Fig.10 SVRR as a function of frequency.

Philips Semiconductors Product specification

Stereo BTL audio output amplifier with DC
volume control

2.0

handbook, halfpage

V

in

(V)

1.6

1.2

0.8

0.4

0

020

4 8 12 16

MBG665

V

(V)

P

30

handbook, halfpage

I

VC

(µA)

20

10

0

−10

−20

−30

0

TDA7053A

0.4 0.8 1.2 1.6

MBG666

VVC (V)

2.0

THD = 1 %.

Fig.11 Input signal handling.

APPLICATION INFORMATION

The application diagram is illustrated in Fig.13.

Test conditions

T

=25°C unless otherwise specified; VP=6V;

amb

VDC= 1.4 V; fi= 1 kHz; RL=8Ω.
The quiescent current has been measured without load

impedance.
The output power as a function of the supply voltage has

been measured at THD = 10%. The maximum output
power is limited by the maximum power dissipation and the
maximum available output current.

Fig.12 Volume control current as a function of

volume control voltage.

The maximum input signal voltage is measured at
THD = 1% at the output with a voltage gain of 0 dB.

To avoid instabilities and too high distortion, the input
ground and power ground must be separated as far as
possible and connected as close as possible to the IC.

The DC volume control can be applied in several ways.
Two possible circuits are shown below the main
application diagram. The circuits at the control pin will
influence the switch-on and switch-off behaviour and the
maximum voltage gain.

For single-end applications the output peak current must
not exceed 100 mA. At higher output currents the
short-circuit protection (MCL) will be active.

1997 Jul 15 9

Philips Semiconductors Product specification

Stereo BTL audio output amplifier with DC
volume control

handbook, full pagewidth

TDA7053A

470 nF

input 1

Rs = 5 kΩ

4
2

STABILIZER

TEMPERATURE

PROTECTION

I + i

I − i

MCL

TDA7053A

(1)

100 nF

5

220 µF

16

13

VP = 6 V

+

(2)

−

input 2

Rs = 5 kΩ

volume

control

470 nF

DC-

volume

1 MΩ1 µF

2, 8

maximum voltage

6
8

gain 34 dB

signal

ground

I − i

I + i

10 147

power

ground

volume

control

1 µF

56 kΩ

2, 8

22 kΩ

12

−

9

+

VP = 6 V

maximum voltage

gain 40 dB

MBG673

(2)

(1) This capacitor can be omitted if the 220 µF electrolytic capacitor is connected close to pin 5.
(2) RL=8Ω.

Fig.13 Test and application diagram.

1997 Jul 15 10

Philips Semiconductors Product specification

Stereo BTL audio output amplifier with DC
volume control

PACKAGE OUTLINES

DIP16: plastic dual in-line package; 16 leads (300 mil); long body

D

seating plane

L

Z

16

e

b

b

1

9

A

1

w M

TDA7053A

SOT38-1

M

E

A

2

A

c

(e )

1

M

H

pin 1 index

1

0 5 10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

UNIT

mm

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

A

max.

4.7 0.51 3.7

OUTLINE
VERSION

SOT38-1

min.

A

1 2

max.

0.15

IEC JEDEC EIAJ

050G09 MO-001AE

b

1.40

1.14

0.055

0.045

b

0.53

0.38

0.021

0.015

1

cEe M

0.32

0.23

0.013

0.009

REFERENCES

D

21.8

21.4

0.86

0.84

8

scale

(1) (1)

6.48

6.20

0.26

0.24

E

(1)

e

0.30

1

0.15

0.13

M

L

3.9

3.4

E

8.25

7.80

0.32

0.31

EUROPEAN

PROJECTION

H

9.5

0.2542.54 7.62

8.3

0.37

0.010.100.0200.19

0.33

ISSUE DATE

w

92-10-02
95-01-19

Z

max.

2.2

0.087

1997 Jul 15 11

Philips Semiconductors Product specification

Stereo BTL audio output amplifier with DC
volume control

SO16: plastic small outline package; 16 leads; body width 7.5 mm

D

c

y

Z

16

9

TDA7053A

SOT162-1

E

H

E

A

X

v

M

A

pin 1 index

1

e

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

A

max.

2.65

0.10

A

0.30

0.10

0.012

0.004

1

A2A

2.45

2.25

0.096

0.089

0.25

0.01

b

3

p

0.49

0.36

0.019

0.013

0.014

0.009

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

8

w

b

p

cD

0.32

0.23

M

0 5 10 mm

scale

(1)E(1) (1)

10.5

10.1

0.41

0.40

eHELLpQ

7.6

1.27

7.4

0.30

0.050

0.29

A

2

10.65

10.00

0.419

0.394

A

1

1.4

0.055

1.1

0.4

0.043

0.016

detail X

0.043

0.039

1.1

1.0

Q

3

0.25 0.1

0.01

A

θ

ywv θ

0.004

Z

0.9

0.4

0.035

0.016

o

8

o

0

(A )

L

p

L

0.25

0.01

OUTLINE
VERSION

SOT162-1

IEC JEDEC EIAJ

075E03 MS-013AA

REFERENCES

1997 Jul 15 12

EUROPEAN

PROJECTION

ISSUE DATE

95-01-24
97-05-22

Philips Semiconductors Product specification

Stereo BTL audio output amplifier with DC
volume control

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

DIP

SOLDERING BY DIPPING OR BY WA VE
The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

SO

REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO

packages.

(order code 9398 652 90011).

). If the

stg max

TDA7053A

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

AVE SOLDERING

W
Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

R

EPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

1997 Jul 15 13

Philips Semiconductors Product specification

Stereo BTL audio output amplifier with DC

TDA7053A

volume control

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1997 Jul 15 14

Philips Semiconductors Product specification

Stereo BTL audio output amplifier with DC
volume control

NOTES

TDA7053A

1997 Jul 15 15

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Tel. [phone], Fax. [phone]
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. [phone], Fax. [phone]
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone]

South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone], Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. 1997 SCA55
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 547027/1200/04/pp16 Date of release: 1997 Jul 15 Document order number: 9397 750 02591