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TDA1572T
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Philips TDA1572T Datasheet

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INTEGRATED CIRCUITS
DATA SH EET
TDA1572T
AM receiver
Product specification File under Integrated Circuits, IC01
May 1992
AM receiver TDA1572T

GENERAL DESCRIPTION

The TDA1572T integrated AM receiver circuit performs all the active functions and part of the filtering required of an AM radio receiver. It is intended for use in mains-fed home receivers and car radios. The circuit can be used for oscillator frequencies up to 50 MHz and can handle RF signals up to 500 mV.
RF radiation and sensitivity to interference are minimized by an almost symmetrical design. The controlled-voltage oscillator provides signals with extremely low distortion and high spectral purity over the whole frequency range, even when tuning with variable capacitance diodes. If required, band switching diodes can easily be applied. Selectivity is obtained using a block filter before the IF amplifier.

Features

• Inputs protected against damage by static discharge
• Gain-controlled RF stage
• Double balanced mixer
• Separately buffered, voltage-controlled and
temperature-compensated oscillator, designed for simple coils
• Gain-controlled IF stage with wide AGC range
• Full-wave, balanced envelope detector
• Internal generation of AGC voltage with possibility of
second-order filtering
• Buffered field strength indicator driver with short-circuit protection
• AF preamplifier with possibilities for simple AF filtering
• Electronic standby switch
• IF output for stereo demodulator and search tuning.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
P
I
P
Supply voltage range 7.5 8.5 14.0 V Supply current range VP = 8.5 V 15 25 28 mA RF input voltage (RMS value)
V
iFR(rms)
V
iRF(rms)
V
oIF(rms)
V
oAF(rms)
for (S + N)/N = 6 dB m = 30% − 1.5 −µV
for THD = 3% m = 80% − 500 − mV IF output voltage (RMS value) Vi = 2 mV(rms) 180 230 290 mV AF output voltage (RMS value) V
= 2 mV(rms);
i
= 1 MHz; m = 30%;
f
i
fm = 400 Hz 240 310 390 mV
AGC range
for 1 dB
i
oAF
− 86 − dB
∆V
Change of V
i
change of V
Indicator driver (pin 13)
Output voltage Vi = 500 mV(rms);
V
o
RL= 2.7 kΩ 2.5 2.8 3.1 V

PACKAGE OUTLINE

20-lead mini-pack; plastic (SO20; SOT163A); SOT163-1; 1996 August 13.
May 1992 2
AM receiver TDA1572T
= 57.
B
= 65; Q
o
= 4.8 kΩ.
I
= 3 kΩ; Z
3-4
Fig.1 Block diagram and test circuits (connections shown in broken lines are not part of the test circuits).
= 700 Ωat R
F
Filter data: Z
(1) Coil data: TOKO sample no. 7XNS-A7523DY; L1 : N1/N2 = 12/32; Q
May 1992 3
AM receiver TDA1572T

PINNING

1 MXO mixer output 2 STB standby switch 3 IFI1 IF input 1 4 IFI2 IF input 2 5 DET detector 6 AFO1 AF output 1 7 AGC1 AGC stage 1 8 ACG2 AGC stage 2
9 AFO2 AF output 2 10 n.c. not connected 11 n.c. not connected 12 IFO IF output 13 IND indicator output 14 OSO buffered oscillator output 15 OSC1 oscillator 1 16 OSC2 oscillator 2 17 V
P
18 RFI1 RF input 1 19 RFI2 RF input 2 20 GND ground
supply voltage
Fig.2 Pinning diagram.
May 1992 4
AM receiver TDA1572T
FUNCTIONAL DESCRIPTION Gain-controlled RF stage and mixer
The differential amplifier in the RF stage employs an AGC negative feedback network to provide a wide dynamic range. Very good cross-modulation behaviour is achieved by AGC delays at the various signal stages. Large signals are handled with low distortion and the (S + N)/N ratio of small signals is improved. Low noise working is achieved in the differential amplifier by using transistors with low base resistance.
A double balanced mixer provides the IF output signal to pin 1.

Oscillator

The differential amplifier oscillator is temperature compensated and is suitable for simple coil connection. The oscillator is voltage-controlled and has little distortion or spurious radiation. It is specially suitable for electronic tuning using variable capacitance diodes. Band switching diodes can easily be applied using the stabilized voltage V buffered oscillator output (pin 14) is available for driving a synthesizer. If this is not needed, resistor R
L(14)
Gain-controlled IF amplifier
This amplifier comprises two cascaded, variable-gain differential amplifier stages coupled by a band-pass filter. Both stages are gain-controlled by the AGC negative feedback network. The IF output is available at pin 12.
. An extra
15-20
can be omitted.

Detector

The full-wave, balanced envelope detector has very low distortion over a wide dynamic range. Residual IF carrier is blocked from the signal path by an internal low-pass filter.
AF preamplifier
This stage preamplifies the audio frequency output signal. The amplifier output has an emitter follower with a series resistor which, together with an external capacitor, yields the required low-pass for AF filtering.
AGC amplifier
The AGC amplifier provides a control voltage which is proportional to the carrier amplitude. Second-order filtering of the AGC voltage achieves signals with very little distortion, even at low audio frequencies. This method of filtering also gives fast AGC settling time which is advantageous for electronic search tuning. The AGC settling time can be further reduced by using capacitors of smaller value in the external filter (C16 and C17). The AGC voltage is fed to the RF and IF stages via suitable AGC delays. The capacitor at pin 7 can be omitted for low-cost applications.

Field strength indicator output

A buffered voltage source provides a high-level field strength output signal which has good linearity for logarithmic input signals over the whole dynamic range. If the field strength information is not needed, R
can be omitted.
L(13)

Standby switch

This switch is primarily intended for AM/FM band switching. During standby mode the oscillator, mixer and AF preamplifier are switched off.

Short-circuit protection

All pins have short-circuit protection to ground.
May 1992 5
AM receiver TDA1572T

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER MIN. MAX. UNIT
= V
V
P
17-20
| Input voltage − 12 V
|V
18-19
; −V
−V
18-19
V
18-19
I
; I20 Input current (pins 18 and 20) − 200 mA
18
P
tot
T
stg
T
amb
T
j
V
es
V
es
V
es
; V
19-20
19-20
Supply voltage (pin 17) − 16 V
− 0.6 V
− V
P
V
Total power dissipation − 500 mW Storage temperature range −55 +150 °C Operating ambient temperature range −40 +85 °C Junction temperature − +125 °C Electrostatic handling
(1)
all pins except pins 3, 6, 9, 14 −2000 +2000 V pins 3, 6, 14 −1500 +2000 V pin 9 −1000 +2000 V
Note
1. Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor; (5 pulses, both polarities).

THERMAL RESISTANCE

From junction to ambient (in free air) R
th j-a (max.)
= 95 K/W
May 1992 6
AM receiver TDA1572T

CHARACTERISTICS

= V
V
P
voltages referenced to ground; unless otherwise specified.
SYMBOL PARAMETER MIN. TYP. MAX. UNIT
V
P
I
P
V
I
Z
i
C
i
Z
i
C
i
Z
o
C
o
I
1/Vi
V
1-17(p-p)
I
O
V
i(rms)
17-20
= 8.5 V; T
= 25 °C; fi= 1 MHz; fm= 400 Hz; m = 30%; fIF= 460 kHz; measured in test circuit of Fig.1; all
amb
Supply
Supply voltage (pin 17) 7.5 8.5 14.0 V Supply current (pin 17) 15 25 28 mA
RF stage and mixer (pins 18 and 19)
DC input voltage − VP/2 − V RF input impedance at VI < 300 µV (rms) − 5.5 − kΩ RF input capacitance − 25 − pF RF input impedance at VI > 10 mV (rms) − 8 − kΩ RF input capacitance − 22 − pF IF output impedance (pin 1) 200 −−kΩ IF output capacitance − 6 − pF Conversion transconductance
before start of AGC − 6.5 − mA/V
Maximum IF output voltage, inductive
coupling to pin 1 (peak-to-peak value) − 5 − V
DC value of output current;
at VI = 0 V (pin 1) − 1.2 − mA AGC range of input stage − 30 − dB RF signal handling capability Input voltage (RMS value)
for THD = 3% at m = 80% − 500 − mV
May 1992 7
AM receiver TDA1572T
SYMBOL PARAMETER MIN. TYP. MAX. UNIT
Oscillator
f
osc
V
(rms)
R
(ext)
R
(ext)
SVRR (SVRR = 20 log [V
V
15-20
−I
O
∆V
I
V
O
V
o(p-p)
Z
O
−I
O(peak)
V
I
Z
i
C
i
V
iIF(rms)
Z
o
V
oIF(rms)
G
v
∆V
v
Frequency range 0.1 − 60 MHz Voltage amplitude (pins 15 to 16)
(RMS value) 80 130 150 mV External load impedance (pins 16 to 15) 0.5 − 200 kΩ External load impedance for no
oscillation (pins 16 to 15) −−60 Ω Supply voltage ripple rejection
= 100 mV(rms); fp = 100 Hz
at V
P
]) − 55 − dB
17/V15
Source voltage for switching diodes
(6 x VBE) (pin 15) − 4.2 − V DC output current (for switching
diodes) (pin 15) 0 − 20 mA Change of output voltage at
= 20 mA (switch to maximum load)
∆I
15
(pin 15) − 0.3 − V
Buffered oscillator output (pin 14)
DC output voltage − 0.8 − V Output signal amplitude
(peak-to-peak value) − 320 − mV Output impedance − 170 −Ω Output current (peak value) −−3mA
IF, AGC and AF stages
DC input voltage (pins 3 and 4) − 2.0 − V IF input impedance (pins 3 to 4) 2.4 3.0 3.9 kΩ IF input capacitance − 7 − pF IF input voltage for
THD = 3% at m = 80% (pins 3 and 4)
(RMS value) − 90 − mV IF output impedance (pin 12) − 50 −Ω Unloaded IF output voltage
= 10 mV (pin 12)
at V
i
(RMS value) 180 230 290 mV Voltage gain before start of AGC
(pins 3 to 4; 6 to 20) − 68 − dB AGC range of IF stages: change of
for 1 dB change of V
V
3-4
V
= 75 mV(rms) − 55 − dB
3-4(ref)
o(AF);
May 1992 8
AM receiver TDA1572T
SYMBOL PARAMETER MIN. TYP. MAX. UNIT
AF output voltage (RMS value)
V
oAF(rms)
V
oAF(rms)
AF output impedance (pin 6) 2.8 3.5 4.2 kΩ
Z
o
AF output impedance (pin 9) 12.4 15.5 18.6 kΩ
Z
o
at V
at V
Indicator driver (pin 13)
Output voltage at V
V
o
RL= 2.7 kΩ−−140 mV Output voltage at V
V
o
R
L
−I
o
Z
o
V
o
RL= 2.7 kΩ 2.5 2.8 3.1 V Load resistance 1.5 −−kΩ Output current at Vi = 500 mV(rms) −−2.0 mA Output impedance at −Io= 0.5 mA − 220 −Ω Reverse output voltage at AM off − 6 − V
Standby switch
Switching threshold at;
V
P
T
amb
V
2-20
V
2-20
−I
2
OFF-current at V
I
2
ON-voltage 0 − 2.0 V
OFF-voltage 3.5 − 20.0 V
ON-current at V
= 50 µV(rms) − 130 − mV
3-4(IF)
= 1 mV(rms) − 310 − mV
3-4(IF)
= 0 mV(rms);
i
= 500 mV(rms);
i
= 7.5 to 14 V
= −40 to + 80 °C
= 0 V − 100 200 µA
2-20
= 14 V −−10 µA
2-20
May 1992 9
AM receiver TDA1572T

OPERATING CHARACTERISTICS

= 8.5 V; fi = 1 MHz; m = 30%; fm = 400 Hz; T
V
P
SYMBOL PARAMETER MIN. TYP. MAX. UNIT
RF sensitivity
RF input voltage
(RMS value)
V
iRF(rms)
V
iRF(rms)
V
iRF(rms)
V
iRF(rms)
for (S + N)/N = 6 dB − 1.5 −µV
for (S + N)/N = 26 dB − 15 −µV
for (S + N)/N = 46 dB − 150 −µV
at start of AGC − 30 −µV
RF large signal handling
RF input voltage
(RMS value)
V
iRF(rms)
V
iRF(rms)
V
iRF(rms)
at THD = 3%; m = 80% − 500 − mV
at THD = 3%; m = 30% − 700 − mV
at THD = 10%; m = 30% − 900 − mV
AGC range
for 1 dB change
i
; V
oAF
i(ref)
for 6 dB change
i
; V
oAF
i(ref)
= 500 mV(rms) − 86 − dB
= 500 mV(rms) − 91 − dB
∆V
∆V
Change of V
i
of V Change of V
i
of V
Output signal
(RMS value)
V
oIF(rms)
IF output voltage at Vi = 2 mV(rms) 180 230 290 mV AF output voltage
V
oAF(rms)
V
oAF(rms)
at Vi = 4 µV(rms); m = 80% − 130 − mV
at Vi = 2 mV(rms) 240 310 390 mV Total harmonic distortion
THD at V THD at V THD at V (S + N)/N Signal-to-noise ratio at V
= 2 mV(rms); m = 30% − 0.5 − %
i
= 2 mV(rms); m = 80% − 1.0 − %
i
= 500 mV(rms); m = 30% − 1.0 − %
i
= 100 mV(rms) − 58 − dB
i
Supply voltage ripple rejection at V
= 100 mV(rms); fp = 100 Hz
V
P
SVRR (SVRR = 20 log [V
P/VoAF
SVRR (a) additional AF signal at IF output − 0 SVRR (b) add modulation at IF output (m
= 25 °C; measured in Fig.1; unless otherwise specified
amb
= 2 mV(rms)
i
]) − 38 − dB
(1)
= 30%) − 40 − dB
ref
− dB
May 1992 10
AM receiver TDA1572T
SYMBOL PARAMETER MIN. TYP. MAX. UNIT
Unwanted signals
Suppression of IF whistles at
= 15 µV; m = 0% related to AF signal
V
i
of m = 30%
α
2IF
α
3IF
at fi≈ 2 × f
at fi≈ 3 × f
IF IF
IF suppression at RF input;
α
IF
α
IF
for symmetrical input − 40 − dB
for asymmetrical input − 40 − dB Residual oscillator signal at mixer output;
I
1(osc)
I
1(2osc)
at f
osc
at 2 × f
osc
Note
1. AF signals at the IF output will be suppressed by a coupling capacitor to the demodulator and by full wave-detection in the demodulator.
− 37 − dB
− 44 − dB
− 1 −µA
− 1.1 −µA
Fig.3 AF output as a function of RF input in the
circuit of Fig.1; fi = 1 MHz; fm = 400 Hz; m = 30%.
May 1992 11
Fig.4 Total harmonic distortion and (S + N)/N as
functions of RF input in the circuit of Fig.1; m = 30% for (S + N)/N curve and m = 80% for THD curve.
AM receiver TDA1572T
Fig.5 Total harmonic distortion as a function of modulation frequency at Vi = 5 mV; m = 80%; measured in
the circuit of Fig.1 with C
= 0 µF and 2.2 µF.
7-20(ext)
___________
with IF filter;
 −  −  with AF filter;
− − − − − − with IF and AF filters.
Fig.6 Indicator driver voltage as a function of RF
input in the circuit of Fig.1.
May 1992 12
Fig.7 Typical frequency response curves from
Fig.1 showing the effect of filtering.
AM receiver TDA1572T
Fig.8 IF output voltage as a function of RF input in the circuit of Fig.1; fi = 1 MHz.
Fig.9 Forward transfer impedance as a function of intermediate frequency for filters 1 to 4 shown in
Fig.10; centre frequency = 455 kHz.
May 1992 13
AM receiver TDA1572T

APPLICATION INFORMATION

Fig.10 IF filter variants applied to the circuit of Fig.1. For filter data, refer to Table 1.
May 1992 14
AM receiver TDA1572T
May 1992 15
Fig.11 Application diagram.
AM receiver TDA1572T
Fig.12 (S + N)/N as a function of input voltage; measured in the circuit of Fig.11 for AM stereo.
Fig.13 Total harmonic distortion (THD) as a function of input voltage; measured in the circuit of Fig.11 for AM
stereo.
May 1992 16
AM receiver TDA1572T
= 450 kHz.
0
(N1) (N2)
= 455 kHz). Filter 5 is used for AM stereo application with centre frequency f
0
L1 L1 L1 L2 L1 L1
65 (typ.) 50 75 60 75 50
33 332kΩ
24 24 24 38 dB
4.8 3.8 4.2 4.8 1.8 kΩ
57 40 52 (L1) 18 (L2) 55 20
0.70 0.67 0.68 0.68 0.70 kΩ
35 31 36 42 dB
52 49 54 64 dB
63 58 66 74 dB
centre frequency f
L
FILTER NO. 1 2 3 4 5 UNIT
Coil data
Value of C 3900 430 3900 4700 3900 4700 pF
Table 1 Data for IF filters shown in Fig.10 (Filter 1 to 4) and Fig.11 (Filter 5). Criteria for adjustment is IF = maximum (optimum selectivity curve at
N1 : N2 12 : 32 13 : (33 + 66) 15 : 31 29 : 29 13 : 31 26 : 32
o
Schematic*
Diameter of CU
laminated wire 0.09 0.08 0.09 0.08 0.09 0.07 mm
of
Q
windings
Toko order no. 7XNS-A7523DY L7PES-A0060BTG 7XNS-A7518DY 7XNS-A7521AIH 7XNS-A7519DY
Resonators
, R
Murata type SFZ455A SFZ455A SFZ455A SFT455B SFH450F
G
D (typical value) 4 4 4 6 6 dB
R
May 1992 17
Bandwidth (−3 dB) 4.2 4.2 4.2 4.5 10 kHz
9kHz
S
Filter data
B
I
Z
Q
Z
9kHz
18kHz
F
Bandwidth (−3 dB) 3.6 3.8 3.6 4.0 10 kHz
S
27kHz
S
S
* The beginning of an arrow indicates the beginning of a winding; N1 is always the inner winding, N2 the outer winding.
AM receiver TDA1572T

PACKAGE OUTLINE

SO20: plastic small outline package; 20 leads; body width 7.5 mm
D
c
y
Z
20
pin 1 index
1
e
11
A
2
10
w M
b
p

SOT163-1

E
H
E
Q
A
1
L
p
L
detail X
(A )
A
X
v M
A
A
3
θ
0 5 10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
mm
OUTLINE VERSION
SOT163-1
A
max.
2.65
0.10
A
1
0.30
0.10
0.012
0.004
A2A
2.45
2.25
0.096
0.089
IEC JEDEC EIAJ
075E04 MS-013AC
0.25
0.01
b
3
p
0.49
0.32
0.36
0.23
0.019
0.013
0.014
0.009
UNIT
inches
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
(1)E(1) (1)
cD
13.0
7.6
7.4
0.30
0.29
1.27
0.050
12.6
0.51
0.49
REFERENCES
May 1992 18
eHELLpQ
10.65
10.00
0.42
0.39
1.4
0.055
1.1
0.4
0.043
0.016
1.1
1.0
0.043
0.039
PROJECTION
0.25
0.25 0.1
0.01
0.01
EUROPEAN
ywv θ
Z
0.9
0.4
0.035
0.004
0.016
ISSUE DATE
92-11-17 95-01-24
o
8
o
0
AM receiver TDA1572T
SOLDERING Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in
“IC Package Databook”
our
Reflow soldering
Reflow soldering techniques are suitable for all SO packages.
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.
(order code 9398 652 90011).
Wave soldering
Wave soldering techniques can be used for all SO packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used.
• The longitudinal axis of the package footprint must be parallel to the solder flow.
• The package footprint must incorporate solder thieves at the downstream end.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
May 1992 19
AM receiver TDA1572T

DEFINITIONS

Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
May 1992 20
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