Philips TDA1519C-N3 Datasheet

DATA SH EET

Product specification
Supersedes data of 1998 Oct 16
File under Integrated Circuits, IC01

2000 Mar 08

INTEGRATED CIRCUITS

TDA1519C

22 W BTL or 2 × 11 W stereo power
amplifier

2000 Mar 08 2

Philips Semiconductors Product specification

22 W BTL or 2 × 11 W stereo power
amplifier

TDA1519C

FEATURES

• Requires very fewexternal components for Bridge-Tied
Load (BTL)

• Stereo or BTL application

• High output power

• Low offset voltage at output (important for BTL)

• Fixed gain

• Good ripple rejection

• Mute/standby switch

• Load dump protection

• AC and DC short-circuit-safe to ground and V

P

• Thermally protected

• Reverse polarity safe

• Capability to handle high energy on outputs (VP=0V)

• No switch-on/switch-off plop

• Protected against electrostatic discharge

• Low thermal resistance

• Identical inputs (inverting and non-inverting)

• Pin compatible with TDA1519B (TDA1519C and

TDA1519CSP).

GENERAL DESCRIPTION

The TDA1519C is an integrated class-B dual output
amplifier in a 9-lead plastic single in-line (SIL) power or
20-lead heatsink small outline package.

For the TDA1519CTH (SOT418-2) the heatsink is
positioned on top of the package, thereby allowing an
external heatsink to be mounted on top. The heatsink of
the TDA1519CTD (SOT397-1) is facing the PCB thereby
allowing the heatsink to be soldered on the copper area of
the PCB.

ORDERING INFORMATION

TYPE NUMBER

PACKAGE

NAME DESCRIPTION VERSION

TDA1519C SIL9P plastic single in-line power package; 9 leads SOT131-2
TDA1519CSP SMS9P plastic surface mounted single in-line power package; 9 leads SOT354-1
TDA1519CTH HSOP20 heatsink small outline package; 20 leads; low stand-off SOT418-2
TDA1519CTD HSOP20 heatsink small outline package; 20 leads SOT397-1

2000 Mar 08 3

Philips Semiconductors Product specification

22 W BTL or 2 × 11 W stereo power
amplifier

TDA1519C

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supplies

V

P

supply voltage operating 6.0 14.4 17.5 V

non-operating −−30 V
load dump protected −−45 V

I

ORM

repetitive peak output current −−4A

I

q(tot)

total quiescent current − 40 80 mA

I

stb

standby current − 0.1 100 µA

I

sw(on)

switch-on current −−40 µA

Inputs

Z

i

 input impedance BTL 25 −−kΩ

stereo 50 −−kΩ

Stereo application

P

o

output power THD = 10%

R

L

=4Ω−6−W

R

L

=2Ω−11 − W

α

cs

channel separation 40 −−dB

V

n(o)(rms)

noise output voltage (RMS value) − 150 −µV

BTL application

P

o

output power THD = 10%; RL=4Ω− 22 − W

SVRR supply voltage ripple rejection R

S

=0Ω
f = 100 Hz 34 −−dB
f = 1 to 10 kHz 48 −−dB

∆V

OO

 DC output offset voltage −−250 mV

T

j

junction temperature −−150 °C

2000 Mar 08 4

Philips Semiconductors Product specification

22 W BTL or 2 × 11 W stereo power
amplifier

TDA1519C

BLOCK DIAGRAM

Fig.1 Block diagram.

MGL491

handbook, full pagewidth

60
kΩ

input

reference

voltage

power
ground
(substrate)

+
+

−

5

signal
ground

2 7

9

6

183

Ω

18.1 kΩ

3

TDA1519C

15 kΩ

15 kΩ

VA

VA

C

m

mute switch

power stage

60
kΩ

standby
reference
voltage

mute
reference
voltage

1

NINV

RR

INV

OUT2

M/SS

OUT1

GND1 GND2V

P

4

8

183

Ω

18.1 kΩ

VA

C

m

mute switch

power stage

+

−

mute
switch

standby

switch

× 1

V

P

The pin numbers refer to the TDA1519C and TDA1519CSP.

2000 Mar 08 5

Philips Semiconductors Product specification

22 W BTL or 2 × 11 W stereo power
amplifier

TDA1519C

PINNING

SYMBOL

PIN

DESCRIPTION

TDA1519C;

TDA1519CSP

TDA1519CTD TDA1519CTH

NINV 1 19 2 non-inverting input
GND1 2 20 1 ground 1 (signal)
RR 3 1 20 supply voltage ripple rejection
OUT1 4 3 18 output 1
GND2 5 5 16 ground 2 (substrate)
OUT2 6 8 13 output 2
V

P

7 10 11 positive supply voltage
M/SS 8 11 10 mute/standby switch input
INV 9 12 9 inverting input
n.c. − 2, 4, 6, 7, 9

and 13 to 18

3 to 8, 12, 14,
15, 17 and 19

not connected

Fig.2 Pin configuration

(SOT131-2 and 354-1).

alfpage

NINV

GND1

RR

OUT1

GND2

OUT2

V

P

M/SS

INV

1
2
3
4
5
6
7
8
9

TDA1519C

TDA1519CSP

MGR561

page

RR

n.c.

OUT1

n.c.

GND2

n.c.
n.c.

OUT2

n.c.

V

P

GND1
NINV
n.c.
n.c.

n.c.
n.c.

n.c.

n.c.
INV
M/SS

1
2
3
4
5
6
7
8
9

10

11

12

20
19
18
17
16
15
14
13

TDA1519CTD

MGL937

Fig.3 Pin configuration

(SOT397-1).

page

GND1

NINV

n.c.
n.c.
n.c.
n.c.
n.c.
n.c.
INV

M/SS

RR
n.c.
OUT1
n.c.

n.c.
n.c.

GND2

OUT2
n.c.
V

P

1
2
3
4
5
6
7
8
9

10

11

12

20
19
18
17
16
15
14
13

TDA1519CTH

MGL936

Fig.4 Pin configuration

(SOT418-2).

2000 Mar 08 6

Philips Semiconductors Product specification

22 W BTL or 2 × 11 W stereo power
amplifier

TDA1519C

FUNCTIONAL DESCRIPTION

TheTDA1519C contains two identicalamplifiers with differential inputstages. The gain ofeach amplifier is fixedat40 dB.
A special feature of this device is the mute/standby switch which has the following features:

• Low standby current (<100 µA)

• Low mute/standby switching current (low cost supply switch)

• Mute condition.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

P

supply voltage operating − 17.5 V

non-operating − 30 V
load dump protected;

during 50 ms; tr≥ 2.5 ms

− 45 V

V

sc

AC and DC short-circuit-safe voltage − 17.5 V

V

rp

reverse polarity voltage − 6V
energy handling capability at outputs V

P

=0V − 200 mJ

I

OSM

non-repetitive peak output current − 6A

I

ORM

repetitive peak output current − 4A

P

tot

total power dissipation see Fig.5 − 25 W

T

j

junction temperature − 150 °C

T

stg

storage temperature −55 +150 °C

Fig.5 Power derating curve for SIL9P.

handbook, halfpage

−25 0 50 150

30

10

0

20

MGL492

100

P

tot

(W)

T

amb

(°C)

(1)

(2)

(3)

(1) Infinite heatsink.
(2) R

th(c-a)

= 5 K/W.

(3) R

th(c-a)

= 13 K/W.