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TDA1308
installation Guide
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Philips TDA1308, TDA1308A installation Guide

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INTEGRATED CIRCUITS
DATA SH EET
TDA1308; TDA1308A
Class AB stereo headphone driver
Product specification Supersedes data of 2002 Feb 27
2002 Jul 19
Class AB stereo headphone driver TDA1308; TDA1308A

FEATURES

• Wide temperature range
• No switch ON/OFF clicks
• Excellent power supply ripple rejection
• Low power consumption
• Short-circuit resistant
• High performance

GENERAL DESCRIPTION

TheTDA1308;TDA1308AisanintegratedclassABstereo headphonedrivercontainedinanSO8,DIP8oraTSSOP8 plasticpackage. The device is fabricatedina 1 mm CMOS process and has been primarily developed for portable digital audio applications.
The difference between the TDA1308 and the TDA1308A
is that the TDA1308A can be used at low supply voltages. – high signal-to-noise ratio – high slew rate – low distortion
• Large output voltage swing.

QUICK REFERENCE DATA

VDD=5V; VSS=0V; T
=25°C; fi= 1 kHz; RL=32Ω; unless otherwise specified.
amb
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
DD
supply voltage TDA1308
single 3.0 5.0 7.0 V dual 1.5 2.5 3.5 V
supply voltage TDA1308A
single 2.4 5.0 7.0 V dual 1.2 2.5 3.5 V
V
SS
I
DD
P
tot
P
o
(THD + N)/S total harmonic distortion
negative supply voltage −1.5 −2.5 −3.5 V supply current no load − 35mA total power dissipation no load − 15 25 mW maximum output power THD < 0.1%; note 1 − 60 − mW
note 1
plus noise-to-signal ratio
− 0.03 0.06 %
−−70 −65 dB
R
=5kΩ; note 2 −−92 −89 dB
L
R
=5kΩ; note 3 −−52 −40 dB
L
R
=5kΩ−−101 − dB
L
S/N signal-to-noise ratio 100 110 − dB
α
cs
PSRR power supply ripple rejection f T
amb
channel separation − 70 − dB
R
= 5 kΩ−105 − dB
L
= 100 Hz; V
i
ripple(p-p)
= 100 mV − 90 − dB
ambient temperature −40 − +85 °C
Notes
1. V
2. VDD= 2.4 V; V
3. VDD= 2.4 V; V
= 5 V; V
DD
= 3.5 V (at 0 dB).
O(p-p)
= 1.62 V (at −4.8 dBV); for TDA1308A only.
O(p-p)
= 1.19 V (at −7.96 dBV); for TDA1308A only.
O(p-p)
2002 Jul 19 2
Class AB stereo headphone driver TDA1308; TDA1308A

ORDERING INFORMATION

TYPE NUMBER
PACKAGE
NAME DESCRIPTION VERSION
TDA1308 DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1
TDA1308T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 TDA1308AT SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 TDA1308TT TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1

BLOCK DIAGRAM

handbook, halfpage
INA(neg) INA(pos)
OUTA
V
SS
TDA1308(A)
1
2 3
4
MKA779
8
7
6 5
V
DD
OUTB
INB(neg) INB(pos)
Fig.1 Block diagram.

PINNING

SYMBOL PIN DESCRIPTION
OUTA 1 output A CD) 2 inverting input A INA(pos) 3 non-inverting input A V
SS
4 negative supply INB(pos) 5 non-inverting input B INB(neg) 6 inverting input B OUTB 7 output B V
DD
8 positive supply
2002 Jul 19 3
handbook, halfpage
OUTA
1 2
TDA1308(A)
INA(pos)
3 4
V
SS
Fig.2 Pin configuration.
MKA780
8 7 6 5
V
DD
OUTBINA(neg) INB(neg) INB(pos)
Class AB stereo headphone driver TDA1308; TDA1308A
handbook, full pagewidth
V
DD
INA/B(pos) INA/B(neg)
OUTA/B
V
SS
I
1
M1
M4
D4
D3D2D1
M2 M3
M5
A1
A2
C
m
M6
MKA781
Fig.3 Equivalent schematic diagram.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
DD
t
SC(O)
T
stg
T
amb
V
esd
supply voltage 0 8.0 V output short-circuit duration T
=25°C; P
amb
=1W 20 − s
tot
storage temperature −65 +150 °C operating ambient temperature −40 +85 °C electrostatic discharge note 1 −2000 +2000 V
note 2 −200 +200 V
Notes
1. Human body model: C = 100 pF; R = 1500 Ω; 3 pulses positive plus 3 pulses negative.
2. Machine model: C = 200 pF: L = 0.5 mH: R = 0 Ω; 3 pulses positive plus 3 pulses negative.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT
R
th j-a
thermal resistance from junction to ambient in free air
DIP8 109 K/W
SO8 210 K/W TSSOP8 220 K/W

QUALITY SPECIFICATION

In accordance with
Handbook”
. The handbook can be ordered using the code 9398 510 63011.
“UZW-BO/FQ-0601”
. The numbers of the quality specification can be found in the
“Quality Reference
2002 Jul 19 4
Class AB stereo headphone driver TDA1308; TDA1308A

CHARACTERISTICS

VDD=5V; VSS=0V; T
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supplies
V
DD
supply voltage TDA1308
single 3.0 5.0 7.0 V dual 1.5 2.5 3.5 V
supply voltage TDA1308A
single 2.4 5.0 7.0 V dual 1.2 2.5 3.5 V
V
SS
I
DD
P
tot
negative supply voltage −1.5 −2.5 −3.5 V supply current no load − 35mA total power dissipation no load − 15 25 mW
DC characteristics
V
I(os)
I
bias
V
CM
G
v
I
O
R
O
V
O
input offset voltage − 10 − mV input bias current − 10 − pA common mode voltage 0 − 3.5 V open-loop voltage gain RL=5kΩ−70 − dB maximum output current (THD + N)/S < 0.1% − 60 − mA output resistance − 0.25 −Ω output voltage swing note 1 0.75 − 4.25 V
PSRR power supply rejection ratio fi= 100 Hz;
α
cs
C
L
channel separation − 70 − dB
load capacitance −−200 pF
AC characteristics
(THD + N)/S totalharmonicdistortion plus
noise-to-signal ratio
S/N signal-to-noise ratio 100 110 − dB f
G
P
o
C
i
unity gain frequency open-loop; RL=5kΩ− 5.5 − MHz maximum output power (THD + N)/S < 0.1% − 60 − mW
input capacitance − 3 − pF SR slew rate unity gain inverting − 5 − V/µs B power bandwidth unity gain inverting − 20 − kHz
=25°C; fi= 1 kHz; RL=32Ω; unless otherwise specified.
amb
RL=16Ω 1.5 − 3.5 V RL=5kΩ 0.1 − 4.9 V
− 90 − dB
V
ripple(p-p)
= 100 mV
RL=5kΩ−105 − dB
note 2 −−70 −65 dB
− 0.03 0.06 %
note 3 −−52 −40 dB
− 0.25 1.0 %
=5kΩ; note 2 −−101 − dB
R
L
− 0.0009 − %
2002 Jul 19 5
Class AB stereo headphone driver TDA1308; TDA1308A
Notes
1. Values are proportional to VDD; (THD + N)/S < 0.1%.
2. VDD= 5.0 V; V
3. VDD= 2.4 V; V

TEST AND APPLICATION INFORMATION

handbook, full pagewidth
= 3.5 V (at 0 dB).
O(p-p)
= 1.13 V (at −7.96 dBV); for TDA1308A only.
O(p-p)
V
DD
3.9 kΩ
V
INA
V
ref
(typ. 2.5 V)
V
INB
3.9 kΩ
3.9 kΩ
2 3
5 6
1
8
TDA1308(A)
7
4
100 µF
C6 100 µF
V
OUTA
R
L
3.9 kΩ
100 µF
R
Fig.4 Measurement circuit for inverting application.
V
OUTB
L
MKA782
2002 Jul 19 6
Class AB stereo headphone driver TDA1308; TDA1308A
handbook, full pagewidth
V
DD
BCK
WS
DATA
2 3
5 6
C5
1 nF
R3
3.9 kΩ
R4
3.9 kΩ C4
1 nF
1
TDA1308(A)TDA1545A
74
C7
100 µF
8
C8
100 µF
C2 10 µFC1100 nF
1
2
3
R1 22 kΩ
5
4
8
R2
7
33 kΩ
6
V
ref
C3 1 µF
Fig.5 Example of application with TDA1545A (stereo continuous calibration DAC).
C6 100 µF
R5 10 kΩ
R6 10 kΩ
MKA783
MKA784
handbook, halfpage
80
G
v
(dB)
RL = 32 Ω
40
no load
0
−3
10−210
−4
10
10−510−610−710
−8
fi (Hz)
Fig.6 Open-loop gain as a function of input
frequency.
2002 Jul 19 7
−70
handbook, halfpage
G
v
(dB)
−90
−110
−130
−1
10
10
−2
RL = 16 Ω
32 Ω
5 kΩ
−3
10
MKA785
−4
10
fi (Hz)
Fig.7 Crosstalk as a function of input frequency.
−5
10
Class AB stereo headphone driver TDA1308; TDA1308A
100
handbook, halfpage
P
o
(mW)
60
40
20
10
3
4
MKA786
RL = 16 Ω
32 Ω
8 Ω
5
VDD (V)
Fig.8 Output power as a function of supply voltage.
−50
handbook, halfpage
(THD+N)/S
(dB)
−70
−90
−110
−1
10
RL = 16 Ω; Po = 50 mW
RL = 32 Ω; Po = 50 mW
RL = 5 kΩ; V
−2
10
10
Fig.9 Total harmonic distortion plus noise-to-signal ratio as a function of input frequency.
2002 Jul 19 8
−3
O(p-p)
= 3.5 V
−4
10
MKA787
fi (Hz)
−5
10
Class AB stereo headphone driver TDA1308; TDA1308A
V
O(p-p)
MKA788
(V)
−40
handbook, halfpage
(THD+N)/S
(dB)
−60
−80
−100
−2
10
fi = 1 kHz
R
= 8 Ω
L
16 Ω
32 Ω
5 kΩ
−1
10
110
Fig.10 Total harmonic distortion plus noise-to-signal ratio as a function of output voltage level.
2002 Jul 19 9
Class AB stereo headphone driver TDA1308; TDA1308A

PACKAGE OUTLINES

DIP8: plastic dual in-line package; 8 leads (300 mil)

SOT97-1

seating plane
L
Z
8
pin 1 index
1
D
A
2
A
A
1
w M
b
e
b
1
b
2
5
E
4
M
E
c
(e )
1
M
H
0 5 10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
A
A
UNIT
max.
mm
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE VERSION
SOT97-1
12
min.
max.
1.73
1.14
0.068
0.045
IEC JEDEC EIAJ
050G01 MO-001 SC-504-8
b
b
0.53
0.38
0.021
0.015
1
1.07
0.89
0.042
0.035
b
2
REFERENCES
cD E e M
0.36
9.8
0.23
9.2
0.014
0.009
0.39
0.36
2002 Jul 19 10
(1) (1)
6.48
6.20
0.26
0.24
L
e
1
M
3.60
8.25
3.05
7.80
0.14
0.32
0.12
0.31
EUROPEAN
PROJECTION
E
10.0
0.39
0.33
H
8.3
w
max.
0.2542.54 7.62
1.154.2 0.51 3.2
0.010.10 0.30
0.0450.17 0.020 0.13
ISSUE DATE
95-02-04 99-12-27
(1)
Z
Class AB stereo headphone driver TDA1308; TDA1308A
SO8: plastic small outline package; 8 leads; body width 3.9 mm
D
c
y
Z
8
pin 1 index
1
e
5
A
2
A
4
w M
b
p

SOT96-1

E
H
E
1
L
detail X
A
X
v M
A
Q
(A )
L
p
A
3
θ
0 2.5 5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
mm
OUTLINE VERSION
SOT96-1
A
max.
1.75
0.069
A1A2A
0.25
1.45
0.10
1.25
0.010
0.057
0.004
0.049
IEC JEDEC EIAJ
076E03 MS-012
0.25
0.01
b
3
p
0.49
0.25
0.36
0.19
0.019
0.0100
0.014
0.0075
UNIT
inches
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
(1)E(2)
cD
5.0
4.8
0.20
0.19
REFERENCES
4.0
3.8
0.16
0.15
1.27
0.050
2002 Jul 19 11
eHELLpQZywv θ
1.05
1.0
0.4
0.039
0.016
0.7
0.6
0.028
0.024
0.25 0.10.25
0.010.010.041 0.004
EUROPEAN
PROJECTION
6.2
5.8
0.244
0.228
(1)
0.7
0.3
0.028
0.012
ISSUE DATE
97-05-22 99-12-27
o
8
o
0
Class AB stereo headphone driver TDA1308; TDA1308A
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
D
y
Z
8
pin 1 index
5
14
e
w M
b
p
c
A
2
A
1
E
H
E
L
detail X
A
X
(A3)
L
p
θ

SOT505-1

v M
A
A
2.5 5 mm0
scale
DIMENSIONS (mm are the original dimensions)
A
A
UNIT
max.
mm
1.10
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE VERSION
SOT505-1
1
0.15
0.05
A2A3b
0.95
0.25
0.80
IEC JEDEC EIAJ
p
0.45
0.25
(1)E(2)
ceD
0.28
3.10
3.10
0.15
REFERENCES
2.90
2.90
0.65
2002 Jul 19 12
5.10
4.70
LH
E
L
0.70
0.40
p
wyv
0.1 0.10.10.94
EUROPEAN
PROJECTION
(1)
Z
0.70
0.35
ISSUE DATE
θ
6° 0°
99-04-09
Class AB stereo headphone driver TDA1308; TDA1308A
SOLDERING Introduction
Thistextgivesa very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011). There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when through-holeandsurfacemountcomponentsaremixedon one printed-circuit board. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended.
Through-hole mount packages
SOLDERING BY DIPPING OR BY SOLDER WAVE The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.
MANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
Surface mount packages
REFLOW SOLDERING Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied tothe printed-circuit board by screen printing,stencillingor pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.
stg(max)
). If the
Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 220 °C for thick/large packages, and below 235 °C for small/thin packages.
WAVE SOLDERING Conventional single wave soldering is not recommended
forsurfacemountdevices(SMDs)or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically developed.
If wave soldering is used the following conditions must be observed for optimal results:
• Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
• Forpackageswithleadsonfour sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
MANUAL SOLDERING Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
2002 Jul 19 13
Class AB stereo headphone driver TDA1308; TDA1308A
Suitability of IC packages for wave, reflow and dipping soldering methods
MOUNTING PACKAGE
Through-hole mount DBS, DIP, HDIP, SDIP, SIL suitable
WAVE REFLOW
(2)
− suitable
(1)
DIPPING
Surface mount BGA, HBGA, LFBGA, SQFP, TFBGA not suitable suitable −
SOLDERING METHOD
HBCC, HLQFP, HSQFP, HSOP, HTQFP,
not suitable
(3)
suitable −
HTSSOP, HVQFN, SMS
(4)
PLCC LQFP, QFP, TQFP not recommended SSOP, TSSOP, VSO not recommended
, SO, SOJ suitable suitable −
(4)(5)
suitable −
(6)
suitable −
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
.
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2002 Jul 19 14
Class AB stereo headphone driver TDA1308; TDA1308A
DATA SHEET STATUS
PRODUCT
DATA SHEET STATUS
Objective data Development This data sheet contains data from the objective specification for product
Preliminary data Qualification This data sheet contains data from the preliminary specification.
Product data Production This data sheet contains data from the product specification. Philips
(1)
STATUS
(2)

DEFINITIONS

development. Philips Semiconductors reserves the right to change the specification in any manner without notice.
Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product.
Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
DEFINITIONS Short-form specification The data in a short-form
specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.
Limiting values definition  Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device attheseor at any other conditions above those giveninthe Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information  Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make norepresentationorwarrantythatsuchapplicationswillbe suitable for the specified use without further testing or modification.
DISCLAIMERS Life support applications These products are not
designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected toresult in personal injury. Philips Semiconductorscustomersusingorsellingtheseproducts for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes  Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for theuseofanyofthese products, conveys no licence or title under any patent, copyright, or mask work right to these products,andmakes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2002 Jul 19 15
Philips Semiconductors – a w orldwide compan y
Contact information
For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2002 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands 753503/03/pp16 Date of release: 2002 Jul 19 Document order number: 9397 750 09985
SCA74
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