Philips TDA1011 User Manual

Download

Page 1

查询TDA1011供应商

INTEGRATED CIRCUITS

DATA SH EET

TDA1011

2 to 6 W audio power amplifier

Product speciﬁcation File under Integrated Circuits, IC01

November 1982

Page 2

Philips Semiconductors Product speciﬁcation

2 to 6 W audio power ampliﬁer TDA1011

The TDA1011 is a monolithic integrated audio amplifier circuit in a 9-lead single in-line (SIL) plastic package. The device is especially designed for portable radio and recorder applications and delivers up to 4 W in a 4 Ω load impedance. The device can deliver up to 6 W into 4 Ω at 16 V loaded supply in mains-fed applications. The maximum permissible supply voltage of 24 V makes this circuit very suitable for d.c. and a.c. apparatus, while the very low applicable supply voltage of 3,6 V permits 6 V applications. Special features are:

• single in-line (SIL) construction for easy mounting

• separated preamplifier and power amplifier

• high output power

• thermal protection

• high input impedance

• low current drain

• limited noise behaviour at radio frequencies

QUICK REFERENCE DATA

Supply voltage range V Peak output current I Output power at d

= 16 V; RL = 4 Ω P

= 12 V; RL = 4 Ω P

= 9 V; RL = 4 Ω P

= 6 V; RL = 4 Ω P

Total harmonic distortion at P

= 10%

tot

= 1 W; RL = 4 Ω d

Input impedance

preampliﬁer (pin 8) |Z

power ampliﬁer (pin 6) |Z Total quiescent current I Operating ambient temperature T Storage temperature T

PACKAGE OUTLINE

9-lead SIL; plastic (SOT110B); SOT110-1; 1996 July 23.

o o o o

tot

| > 100 kΩ

| typ. 20 kΩ

tot

amb stg

3,6 to 20 V

max. 3 A

typ. 6,5 W typ. 4,2 W typ. 2,3 W typ. 1,0 W typ. 0,2 %

typ. 14 mA

−25 to + 150 °C

−55 to +150 °C

November 1982 2

Page 3

Philips Semiconductors Product speciﬁcation

2 to 6 W audio power ampliﬁer TDA1011

November 1982 3

Fig.1 Circuit diagram.

Page 4

Philips Semiconductors Product speciﬁcation

2 to 6 W audio power ampliﬁer TDA1011

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)

Supply voltage V Peak output current I

Total power dissipation see derating curve Fig.2 Storage temperature T Operating ambient temperature T

stg amb

A.C. short-circuit duration of load

during sine-wave drive; VP = 12 V t

max. 24 V max. 3 A

−55 to + 150 °C

−25 to + 150 °C

max. 100 hours

Fig.2 Power derating curve.

HEATSINK DESIGN

Assume V

= 12 V; RL = 4 Ω; T

= 60 °C maximum; Po = 3,8 W.

amb

The maximum sine-wave dissipation is 1,8 W. The derating of 10 K/W of the package requires the following external heatsink (for sine-wave drive): R

= R

th j-a

Since R

+ R

th j-tab

= 10 K/W and R

th j-tab

th tab-h

+ R

th h-a th tab-h

150 60–

= = 50 K/W.

---------------------18,

= 1 K/W, R

= 50 − (10 + 1) = 39 K/W.

th h-a

November 1982 4

Page 5

Philips Semiconductors Product speciﬁcation

2 to 6 W audio power ampliﬁer TDA1011

D.C. CHARACTERISTICS

Supply voltage range V Repetitive peak output current I

Total quiescent current at V

= 12 V I

ORM

tot

3,6 to 20 V

<2A

typ. 14 mA

<22mA

A.C. CHARACTERISTICS

= 25 °C; VP = 12 V; RL = 4 Ω; f = 1 kHz unless otherwise speciﬁed; see also Fig.3.

amb

A.F. output power at d

= 10% (note 1)

tot

with bootstrap:

= 16 V; RL = 4 Ω P

= 12 V; RL = 4 Ω P

VP= 9 V; RL = 4 Ω P

= 6 V; RL = 4 Ω P

typ. 6,5 W

> 3,6 W

typ. 4,2 W typ. 2,3 W

typ. 1,0 W

without bootstrap:

= 12 V; RL = 4 Ω P

typ. 3,0 W

Voltage gain:

preampliﬁer (note 2) G

power ampliﬁer G

total ampliﬁer G

Total harmonic distortion at P

= 1,5 W d

typ. 23 dB

21 to 25 dB

typ. 29 dB

27 to 31 dB

typ. 52 dB

v tot

50 to 54 dB

typ. 0,3 %

tot

<1% Frequency response; −3 dB (note 3) B 60 Hz to 15 kHz Input impedance:

> 100 kΩ

preampliﬁer (note 4) |Z power ampliﬁer |Z

Output impedance preampliﬁer |Z

typ. 200 kΩ

| typ. 20 kΩ

| typ. 1 kΩ

Output voltage preampliﬁer (r.m.s. value)

< 1% (note 2) V

tot

o(rms)

> 0,7 V Noise output voltage (r.m.s. value; note 5)

= 0 Ω V

= 10 kΩ

typ. 0,2 mV

n(rms)

typ. 0,6 mV

n(rms)

< 1,4 mV Noise output voltage at f = 500 kHz (r.m.s. value)

B = 5 kHz; R

= 0 Ω V

typ. 8 µV

n(rms)

November 1982 5

Page 6

Philips Semiconductors Product speciﬁcation

2 to 6 W audio power ampliﬁer TDA1011

Ripple rejection (note 6)

f = 1 to 10 kHz RR typ. 42 dB f = 100 Hz; C2 = 1 µF RR > 35 dB

Bootstrap current at onset of clipping; pin 4 (r.m.s. value) I

Notes

1. Measured with an ideal coupling capacitor to the speaker load.

2. Measured with a load resistor of 20 kΩ.

3. Measured at Po = 1 W ; the frequency response is mainly determined by C1 and C3 for the low frequencies and by C4 for the high frequencies.

4. Independent of load impedance of preamplifier.

5. Unweighted r.m.s. noise voltage measured at a bandwidth of 60 Hz to 15 kHz (12 dB/octave).

6. Ripple rejection measured with a source impedance between 0 and 2 kΩ (maximum ripple amplitude: 2 V).

7. The tab must be electrically floating or connected to the substrate (pin 9).

4(rms)

typ. 35 mA

Fig.3 Test circuit.

November 1982 6

Page 7

Philips Semiconductors Product speciﬁcation

2 to 6 W audio power ampliﬁer TDA1011

APPLICATION INFORMATION

Fig.4 Circuit diagram of a 4 W amplifier.

Fig.5 Total quiescent current as a function of supply voltage.

November 1982 7

Page 8

Philips Semiconductors Product speciﬁcation

2 to 6 W audio power ampliﬁer TDA1011

Fig.6 Track side of printed-circuit board used for the circuit of Fig.4; p.c. board dimensions 62 mm × 48 mm.

Fig.7 Component side of printed-circuit board showing component layout used for the circuit of Fig.4.

November 1982 8

Page 9

Philips Semiconductors Product speciﬁcation

2 to 6 W audio power ampliﬁer TDA1011

Fig.8 Total harmonic distortion as a function of output power across RL; _____ with bootstrap;

− − − without bootstrap; f = 1 kHz; typical values. The available output power is 5% higher when measured at pin 2 (due to series resistance of C10).

Fig.9 Output power across RL as a function of supply voltage with bootstrap; d

The available output power is 5% higher when measured at pin 2 (due to series resistance of C10).

November 1982 9

= 10%; typical values.

tot

Page 10

Philips Semiconductors Product speciﬁcation

2 to 6 W audio power ampliﬁer TDA1011

Fig.10 Voltage gain as a function of frequency; Porelative to 0 dB = 1 W; VP= 12 V; RL= 4 Ω.

Fig.11 Total harmonic distortion as a function of frequency; Po = 1 W; VP= 12 V; RL= 4 Ω.

November 1982 10

Page 11

Philips Semiconductors Product speciﬁcation

2 to 6 W audio power ampliﬁer TDA1011

Fig.12 Ripple rejection as a function of R2 (see Fig.4); RS= 0; typical values.

Fig.13 Noise output voltage as a function of R2 (see Fig.4); measured according to A-curve; capacitor C5 is

adapted for obtaining a constant bandwidth.

November 1982 11

Page 12

Philips Semiconductors Product speciﬁcation

2 to 6 W audio power ampliﬁer TDA1011

Fig.14 Noise output voltage as a function of frequency; curve a: total amplifier; curve b: power amplifier;

B = 5 kHz; RS= 0; typical values.

Fig.15 Voltage gain as a function of R2 (see Fig.4).

November 1982 12

Page 13

Philips Semiconductors Product speciﬁcation

2 to 6 W audio power ampliﬁer TDA1011

PACKAGE OUTLINE

SIL9MPF: plastic single in-line medium power package with fin; 9 leads

pin 1 index

SOT110-1

seating plane

0 5 10 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT

18.5

17.8

max.

3.7

8.7

8.0

15.8

15.4

0.67

0.50

1.40

1.14

bcD

1.40

1.14

0.48

0.38

21.8

21.4

(1)

21.4

20.7

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE

VERSION

IEC JEDEC EIAJ

REFERENCES

SOT110-1

w M

(1)

eLPP

6.48

6.20

2.54

3.9

3.4

(1)

0.25

max.

1.0

2.75

2.50

3.4

3.2

1.75

15.1

1.55

14.9

EUROPEAN

PROJECTION

q1q

5.9

4.4

5.7

4.2

ISSUE DATE

92-11-17 95-02-25

November 1982 13

Page 14

Philips Semiconductors Product speciﬁcation

2 to 6 W audio power ampliﬁer TDA1011

SOLDERING Introduction

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in

“IC Package Databook”

our

Soldering by dipping or by wave

The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.

DEFINITIONS

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development. Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later. Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

(order code 9398 652 90011).

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

stg max

). If the

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

November 1982 14