Philips SMD User Manual

technical note

Philips Magnetic Products

Philips Components

SMD Coil Formers and Cores

Philips Magnetic Products

Contents

Introduction 3

Ferrite Material Properties 6

Range Overview 7

E5.3/2.7/2 8

E6.3/2.9/2 10

EFD10 12

EFD12 14

EFD15 16

EFD20 18

EP7 20

ER9.5 22

ER11 24

RM4/I 26

RM5/I 28

RM6S/I 30

RM6S/ILP 32

Tag plate TGPS-9 34

SMD Coil Formers and Cores

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Range of SMD accessories and cores

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Introduction

With its new range of surface-mount coil formers, Philips Components offers a real solution to circuit designers wishing to take maximum advantage of surface-mount technology in their designs.

The trend toward full surface-mount technology has been hampered by the problems of introducing inductive components (inductors and transformers for example) in surface-mount execution.

These devices, consisting of cores, coil-formers and windings held together by clips, were not easily converted to surface-mount versions, and former designs, based on "gull-wing" terminations (see Fig.1) have not been entirely satisfactory.

Disadvantages of "gull-wing" pins

In particular, tensions introduced by the winding wire, which is wrapped around the upper part of the gull-wing terminations, can severely degrade the coplanarity of the solder pads. The use of thin wire windings is a partial solution to this problem but this introduces limitations on coil design. Furthermore, during soldering of the winding wire to the termination, spillage of solder onto the solder pad can further degrade coplanarity. However, for very small coil formers gull-wing pins are the only possible design due to space limitations. For small to medium sized coil formers there is a better solution: U-pins.

Fig.1 The “gull-wing” design.

> 0.1 mm

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Advantages of the U-pin design

The introduction of Philips' new range of surface-mount, coil formers, however, solves all these problems. These feature "U-pin" terminations (Fig.2) securely embedded in the plastic coil former body. These pins are thicker and wider than most gull-wing pins and therefore stronger.

The solder pads, located beneath the plastic body and in contact with it, form a rigid structure with a guaranteed coplanarity of less than 0.1 mm, according to IEC 191-2Q.

The upper part of the U-pins protrude from the plastic body and offer a large area on which to terminate the windings. Since these are physically separated from the solder pads, tension introduced by the winding wire will not affect coplanarity, and neither will solder used to attach the winding wires spill onto the solder pads. The contact surface of the pads is also much larger than typical gullwing solder pads, making them ideal for these relatively heavy components.

Moreover, with this design, the thickness of the winding wire is no longer a limitation, allowing circuit designers far more freedom in their choice of wire.

High-grade plastic

The coil former body is of high-grade liquid-crystal polymer (LCP) offering excellent thermal stability. The body is exceptionally tough and can withstand soldering

temperatures up to 350

C and operating temperatures up

to 180

Excellent ferrites

In combination with Philips' extensive range of ferrite cores, these new coil formers provide surface-mount solutions in a host of applications from wide-band signal transformers to power transformers. When assembled with windings, coil-formers, cores and a newly-designed clip with a flat upper surface (ideal for vacuum pickup), the products can easily be inserted by a pick and place assembly line.

clean solder pads

Fig.2 The U-pin design

< 0.1 mm

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Initial permeability µ

-f = ≤10 kHz, B < 0.1mT, 1800 900 ∼80 4700 10000 12000

T = 25 oC

Saturation flux density B

mT f = 10 kHz, T = 25

C ∼500 ∼450 ∼330 ∼360 ∼360 ∼400

at Field strength H A/m 3000 3000 3000 250 250 250 Remanence B

mT T = 25

C ∼150 ∼150 ∼200 ∼100 ∼80 ∼100

Coercivity H

A/m T = 25

C ∼15 ∼60 ∼170 ∼10 ∼5 ∼4

Power loss density P

kW/m

f = 25kHz, B = 200mT 70 - - - -

(typical, sine wave f = 100kHz, B = 100mT 50 200 - - - excitation) f = 500kHz, B = 50mT 180 180 - - -

f = 1MHz, B = 30mT 300 140 300 - f = 3MHz, B = 10mT - 240 150 - -

Curie temperature T

C-≥200 ≥220 ≥260 ≥125 ≥125 ≥130

Resistivity (DC) ρΩm T = 25 oC ∼2 ∼10 ∼10

∼1 ∼0.5 ∼0.5

Density g/cm

T = 25

C ∼4.8 ∼4.7 ∼4.6 ∼4.8 ∼4.9 ∼4.9

Ferrite material properties

PARAMETER SYMBOL UNIT TEST CONDITIONS 3F3 3F4 4F1 3E4 3E5 3E6

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Range overview

Core Type Core materials SMD

3F3 3F4 3E4 3E5 3E6 coil former

E5.3/2.7/2 E6.3/2.9/2

EFD10 EFD12 EFD15 EFD20

EP7

ER9.5

ER11 RM4/I RM5/I RM6/I

RM6/ILP

EFD assembly

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Coil former material Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance

with UL94V-0.

Solder pad material Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated Maximum operating temperature 155 oC, IEC 85 class F Resistance to soldering heat “IEC 68-2-20” part2, test Tb, method 1B: 350 oC, 3.5s. Solderability “IEC 68-2-20” part2, test Ta, method 1: 235

C, 2s

Clip material stainless (CrNi) steel

Clamping force ∼ 5N

Type number CLM-E5.3/2

Fig. 1 SMD coil former for E5.3/2.7/2

Fig. 2 Clamp for E5.3/2.7/2

E5.3/2.7/2

Winding data

Coil former data

Clip data

Number of Number of Winding area Winding width Average length Type number

sections solder pads (mm

) (mm) of turn (mm)

1 6 1.5 2.6 12.6 CPHS E5.3/2-1S-6P 262

× 0.6 2 × 1.0 13 CPHS E5.3/2-2S-6P

Fig. 3 Cover for E5.3/2.7/2

Cover material Liquid crystal polymer

(LCP)

Type number COV-E5.3/2

Cover data

4.7 max.

3.6

2.3

1.5

± 0.1 ±0.1

+0.1 0

+0.1

2.15

3.7

-0,15

2.6min.

-0.1

2.9

4.9max.

1.65.5

1.2

0.6

3.7

5.3max. 7.85max.

0.25

0.5

4.9

1.85

1.5

5.8

4.8 max

1.6 max4.8 max

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Σ (l/A) core factor (C1) 5.13 mm

-1

effective volume 31.4 mm

effective length 12.7 mm

effective area 2.5 mm

min

minimum area 2.3 mm

m mass of core half ∼0.08 g

3F3 265 ±25% ∼1080 ∼0 E5.3/2.7/2-3F3 3F4 165 ±25% ∼675 ∼0 E5.3/2.7/2-3F4 3E5 1400 +40/-30% ∼5700 ∼0 E5.3/2.7/2-3E5 3E6 1600 +40/-30% ∼6520 ∼0 E5.3/2.7/2-3E6

B(mT) at Core loss at Core loss at Core loss at Core loss at

Grade H = 250 A/m f = 100 kHz f = 400 kHz f = 1MHz f = 3MHz

f = 25kHz B = 100mT B = 50mT B = 30mT B = 10mT

T = 100 oC T = 100 oC T = 100 oC T = 100 oC T = 100 oC

Effective core parameters

symbol parameter value unit

Core halves for general purpose transformers and power applications

Grade A

(nH) µ

Airgap (µm) Type number

Properties of core sets under power conditions

3F3 ≥ 300 ≤ 0.005 ≤ 0.008 - 3F4 ≥ 250 - - ≤ 0.006 ≤ 0.010

Fig. 3 E5.3/2.7/2 core half

E5.3/2.7/2

±0.05

2.65

+0.1

1.9

-0.1

3.8

1.4

5.25

+0.2 0

-0.1

0.1

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Coil former material Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance

with UL94V-0.

C, 2s

Cover material Liquid crystal polymer

(LCP)

Type number COV-

E6.3/2

Fig. 1 SMD coil former for E6.3/2.9/2

Fig. 2 Cover for E6.3/2.9/2

E6.3/2.9/2

Winding data

Coil former data

Cover data

Number of Number of Winding area Winding width Average length Type number

sections solder pads (mm

) (mm) of turn (mm)

1 6 1.62 2.7 12.8 CPHS-E6.3/2-1S-6P

262 × 0.45 2 × 0.75 12.8 CPHS-E6.3/2-2S-6P

4.7max.

4.4 ± 0.08

3.5

2.3 ± 0.05 +0.1

1.5

5.08

6.4 max.

5.5 0

3.5

- 0.1

2.7 min.

+0.1

±0.05

2.1

2.9

5 max.

0.6

0.25

1.2

8.6 max.

1.66.5

2.54

1.6

7.7 max

5.1 max.

6.9 max

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Σ (l/A) core factor (C1) 3.67 mm

-1

effective volume 40.6 mm

effective length 12.2 mm

effective area 3.3 mm

min

minimum area 2.6 mm

m mass of core half ∼0.12 g

3F3 360 ±25% ∼ 1050 ∼0 E6.3/2.9/2-3F3 3F4 225 ±25% ∼ 660 ∼0 E6.3/2.9/2-3F4 3E5 1700 +40/-30% ∼ 4960 ∼0 E6.3/2.9/2-3E5 3E6 2100 +40/-30% ∼ 6130 ∼0 E6.3/2.9/2-3E6

B(mT) at Core loss at Core loss at Core loss at Core loss at

Grade H = 250 A/m f = 100 kHz f = 400 kHz f = 1MHz f = 3MHz

f = 25kHz B = 100mT B = 50mT B = 30mT B = 10mT

T = 100 oC T = 100 oC T = 100 oC T = 100 oC T = 100 oC

Effective core parameters

symbol parameter value unit

Core halves for general purpose transformers and power applications

Grade A

(nH) µ

Airgap (µm) Type number

Properties of core sets under power conditions

3F3 ≥ 300 ≤ 0.007 ≤ 0.010 −− 3F4 ≥ 250 - −≤ 0.008 ≤ 0.013

Fig. 3 E6.3/2.9/2 core half

E6.3/2.9/2

+ 0.2

3.6

0 0

1.4

- 0.1

+ 0.1

- 0.1

1.85

2.9

6.3

- 0.25

-0,1

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