Philips SMD User Manual

technical note

Philips Magnetic Products

Philips
Components

SMD Coil Formers and Cores

Philips Magnetic Products

1

Contents

Introduction 3

Ferrite Material Properties 6

Range Overview 7

E5.3/2.7/2 8

E6.3/2.9/2 10

EFD10 12

EFD12 14

EFD15 16

EFD20 18

EP7 20

ER9.5 22

ER11 24

RM4/I 26

RM5/I 28

RM6S/I 30

RM6S/ILP 32

Tag plate TGPS-9 34

SMD Coil Formers
and Cores

Philips Magnetic Products

2

Range of SMD accessories and cores

Philips Magnetic Products

3

Introduction

With its new range of surface-mount coil formers, Philips
Components offers a real solution to circuit designers
wishing to take maximum advantage of surface-mount
technology in their designs.

The trend toward full surface-mount technology has been
hampered by the problems of introducing inductive
components (inductors and transformers for example) in
surface-mount execution.

These devices, consisting of cores, coil-formers and
windings held together by clips, were not easily converted
to surface-mount versions, and former designs, based on
"gull-wing" terminations (see Fig.1) have not been entirely
satisfactory.

Disadvantages of "gull-wing" pins

In particular, tensions introduced by the winding wire,
which is wrapped around the upper part of the gull-wing
terminations, can severely degrade the coplanarity of the
solder pads. The use of thin wire windings is a partial
solution to this problem but this introduces limitations on
coil design. Furthermore, during soldering of the winding
wire to the termination, spillage of solder onto the solder
pad can further degrade coplanarity. However, for very
small coil formers gull-wing pins are the only possible
design due to space limitations. For small to medium sized
coil formers there is a better solution: U-pins.

Fig.1 The “gull-wing” design.

> 0.1 mm

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4

Advantages of the U-pin design

The introduction of Philips' new range of surface-mount,
coil formers, however, solves all these problems. These
feature "U-pin" terminations (Fig.2) securely embedded in
the plastic coil former body. These pins are thicker and
wider than most gull-wing pins and therefore stronger.

The solder pads, located beneath the plastic body and in
contact with it, form a rigid structure with a guaranteed
coplanarity of less than 0.1 mm, according to
IEC 191-2Q.

The upper part of the U-pins protrude from the plastic
body and offer a large area on which to terminate the
windings. Since these are physically separated from the
solder pads, tension introduced by the winding wire will
not affect coplanarity, and neither will solder used to attach
the winding wires spill onto the solder pads. The contact
surface of the pads is also much larger than typical gull­wing solder pads, making them ideal for these relatively
heavy components.

Moreover, with this design, the thickness of the winding
wire is no longer a limitation, allowing circuit designers far
more freedom in their choice of wire.

High-grade plastic

The coil former body is of high-grade liquid-crystal
polymer (LCP) offering excellent thermal stability. The
body is exceptionally tough and can withstand soldering

temperatures up to 350

o

C and operating temperatures up

to 180

o

C.

Excellent ferrites

In combination with Philips' extensive range of ferrite
cores, these new coil formers provide surface-mount
solutions in a host of applications from wide-band signal
transformers to power transformers.
When assembled with windings, coil-formers, cores and a
newly-designed clip with a flat upper surface (ideal for
vacuum pickup), the products can easily be inserted by a
pick and place assembly line.

clean solder pads

Fig.2 The U-pin design

< 0.1 mm

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5

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6

Initial permeability µ

i

-f = ≤10 kHz, B < 0.1mT, 1800 900 ∼80 4700 10000 12000

T = 25 oC

Saturation flux density B

s

mT f = 10 kHz, T = 25

o

C ∼500 ∼450 ∼330 ∼360 ∼360 ∼400

at Field strength H A/m 3000 3000 3000 250 250 250
Remanence B

r

mT T = 25

o

C ∼150 ∼150 ∼200 ∼100 ∼80 ∼100

Coercivity H

c

A/m T = 25

o

C ∼15 ∼60 ∼170 ∼10 ∼5 ∼4

Power loss density P

v

kW/m

3

f = 25kHz, B = 200mT 70 - - - -

(typical, sine wave f = 100kHz, B = 100mT 50 200 - - -
excitation) f = 500kHz, B = 50mT 180 180 - - -

f = 1MHz, B = 30mT 300 140 300 - ­f = 3MHz, B = 10mT - 240 150 - -

Curie temperature T

c

o

C-≥200 ≥220 ≥260 ≥125 ≥125 ≥130

Resistivity (DC) ρΩm T = 25 oC ∼2 ∼10 ∼10

5

∼1 ∼0.5 ∼0.5

Density g/cm

3

T = 25

o

C ∼4.8 ∼4.7 ∼4.6 ∼4.8 ∼4.9 ∼4.9

Ferrite material properties

PARAMETER SYMBOL UNIT TEST CONDITIONS 3F3 3F4 4F1 3E4 3E5 3E6

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7

Range overview

Core Type Core materials SMD

3F3 3F4 3E4 3E5 3E6 coil former

E5.3/2.7/2
E6.3/2.9/2

EFD10
EFD12
EFD15
EFD20

EP7

ER9.5

ER11
RM4/I
RM5/I
RM6/I

RM6/ILP

EFD assembly

Philips Magnetic Products

8

Coil former material Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance

with UL94V-0.

Solder pad material Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
Maximum operating temperature 155 oC, IEC 85 class F
Resistance to soldering heat “IEC 68-2-20” part2, test Tb, method 1B: 350 oC, 3.5s.
Solderability “IEC 68-2-20” part2, test Ta, method 1: 235

o

C, 2s

Clip material stainless (CrNi) steel

Clamping force ∼ 5N

Type number CLM-E5.3/2

Fig. 1 SMD coil former for E5.3/2.7/2

Fig. 2 Clamp for E5.3/2.7/2

E5.3/2.7/2

Winding data

Coil former data

Clip data

Number of Number of Winding area Winding width Average length Type number

sections solder pads (mm

2

) (mm) of turn (mm)

1 6 1.5 2.6 12.6 CPHS E5.3/2-1S-6P
262

× 0.6 2 × 1.0 13 CPHS E5.3/2-2S-6P

Fig. 3 Cover for E5.3/2.7/2

Cover material Liquid crystal polymer

(LCP)

Type number COV-E5.3/2

Cover data

4.7 max.

3.6

2.3

1.5

± 0.1
±0.1

+0.1
0

+0.1

2.15

0

3.7

-0,15

2.6min.

0

0

-0.1

2.9

4.9max.

1.65.5

1.2

0.6

3.7

5.3max. 7.85max.

0.25

0.5

4.9

1.85

1.5

5.8

6

4.8 max

1.6 max4.8 max

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9

Σ (l/A) core factor (C1) 5.13 mm

-1

V

e

effective volume 31.4 mm

3

l

e

effective length 12.7 mm

A

e

effective area 2.5 mm

2

A

min

minimum area 2.3 mm

2

m mass of core half ∼0.08 g

3F3 265 ±25% ∼1080 ∼0 E5.3/2.7/2-3F3
3F4 165 ±25% ∼675 ∼0 E5.3/2.7/2-3F4
3E5 1400 +40/-30% ∼5700 ∼0 E5.3/2.7/2-3E5
3E6 1600 +40/-30% ∼6520 ∼0 E5.3/2.7/2-3E6

B(mT) at Core loss at Core loss at Core loss at Core loss at

Grade H = 250 A/m f = 100 kHz f = 400 kHz f = 1MHz f = 3MHz

f = 25kHz B = 100mT B = 50mT B = 30mT B = 10mT

T = 100 oC T = 100 oC T = 100 oC T = 100 oC T = 100 oC

Effective core parameters

symbol parameter value unit

Core halves for general purpose transformers and power applications

Grade A

L

(nH) µ

e

Airgap (µm) Type number

Properties of core sets under power conditions

3F3 ≥ 300 ≤ 0.005 ≤ 0.008 - ­3F4 ≥ 250 - - ≤ 0.006 ≤ 0.010

Fig. 3 E5.3/2.7/2 core half

E5.3/2.7/2

±0.05

2.65

+0.1

1.9

0

2

0

-0.1

3.8

1.4

5.25

+0.2
0

0

-0.1

±

0.1

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Coil former material Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance

with UL94V-0.

Solder pad material Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
Maximum operating temperature 155 oC, IEC 85 class F
Resistance to soldering heat “IEC 68-2-20” part2, test Tb, method 1B: 350 oC, 3.5s.
Solderability “IEC 68-2-20” part2, test Ta, method 1: 235

o

C, 2s

Cover material Liquid crystal polymer

(LCP)

Type number COV-

E6.3/2

Fig. 1 SMD coil former for E6.3/2.9/2

Fig. 2 Cover for E6.3/2.9/2

E6.3/2.9/2

Winding data

Coil former data

Cover data

Number of Number of Winding area Winding width Average length Type number

sections solder pads (mm

2

) (mm) of turn (mm)

1 6 1.62 2.7 12.8 CPHS-E6.3/2-1S-6P

262 × 0.45 2 × 0.75 12.8 CPHS-E6.3/2-2S-6P

4.7max.

4.4
± 0.08

3.5

2.3 ± 0.05
+0.1

1.5

0

5.08

6.4 max.

5.5
0

3.5

- 0.1

2.7 min.

+0.1

0

±0.05

2.1

2.9

5 max.

0.6

0.25

1.2

8.6 max.

1.66.5

2.54

1.6

7.7 max

5.1 max.

6.9 max

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Σ (l/A) core factor (C1) 3.67 mm

-1

V

e

effective volume 40.6 mm

3

l

e

effective length 12.2 mm

A

e

effective area 3.3 mm

2

A

min

minimum area 2.6 mm

2

m mass of core half ∼0.12 g

3F3 360 ±25% ∼ 1050 ∼0 E6.3/2.9/2-3F3
3F4 225 ±25% ∼ 660 ∼0 E6.3/2.9/2-3F4
3E5 1700 +40/-30% ∼ 4960 ∼0 E6.3/2.9/2-3E5
3E6 2100 +40/-30% ∼ 6130 ∼0 E6.3/2.9/2-3E6

B(mT) at Core loss at Core loss at Core loss at Core loss at

Grade H = 250 A/m f = 100 kHz f = 400 kHz f = 1MHz f = 3MHz

f = 25kHz B = 100mT B = 50mT B = 30mT B = 10mT

T = 100 oC T = 100 oC T = 100 oC T = 100 oC T = 100 oC

Effective core parameters

symbol parameter value unit

Core halves for general purpose transformers and power applications

Grade A

L

(nH) µ

e

Airgap (µm) Type number

Properties of core sets under power conditions

3F3 ≥ 300 ≤ 0.007 ≤ 0.010 −−
3F4 ≥ 250 - −≤ 0.008 ≤ 0.013

Fig. 3 E6.3/2.9/2 core half

E6.3/2.9/2

+ 0.2

3.6

0
0

1.4

- 0.1

0

+ 0.1

0

- 0.1

1.85

2.9

0

6.3

- 0.25

0

-0,1

2

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Coil former material Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance

with UL94V-0.

Solder pad material Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
Maximum operating temperature 155 oC, IEC 85 class F
Resistance to soldering heat “IEC 68-2-20” part2, test Tb, method 1B: 350 oC, 3.5s.
Solderability “IEC 68-2-20” part2, test Ta, method 1: 235

o

C, 2s

Clamp material stainless(CrNi) steel

Clamping force ∼ 15N

Type number CLM-EFD10

Fig. 1 SMD coil former for EFD10

Fig. 2 Clamp for EFD10

EFD10

Winding data

Coil former data

Clamp data

Number of Number of Winding area Winding width Average length Type number

sections solder pads (mm

2

) (mm) of turn (mm)

1 8 4.2 6.05 14.8 CPHS-EFD10-1S-8P

2.8

11

1.8

3

MBW122

0.8

7.3-0.15

5.7-0.1

4.8+0.1

3
9

11.7max.

1.6+0.1

2.5-0.1

5.4max.0.3

1.8

7.1-0.15

6.05min.

12

14.7max.

0.3

2

12 - 0.3

9.4

2.5

10 - 0.3

10.5

± 0.2

88

4

MBW128

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5.2 ± 0.1

Σ (l/A) core factor (C1) 3.29 mm

-1

V

e

effective volume 171 mm

3

l

e

effective length 23.7 mm

A

e

effective area 7.2 mm

2

A

min

minimum area 6.5 mm

2

m mass of core half ∼0.45 g

3F3 25±5% ∼ 66 ∼540 EFD10-3F3-A25-S

40±8% ∼ 105 ∼300 EFD10-3F3-A40-S

63±10% ∼ 165 ∼170 EFD10-3F3-A63-S

500±25% ∼ 1290 ∼0 EFD10-3F3-S

3F4 25±5% ∼ 66 ∼520 EFD10-3F4-A25-S

40±8% ∼ 105 ∼280 EFD10-3F4-A40-S

63±10% ∼ 165 ∼150 EFD10-3F4-A63-S

280±25% ∼ 730 ∼0 EFD10-3F4-S
3E4 1400 +40/-30% ∼ 3670 ∼ 0 EFD10-3E4-S
3E5 2000 +40/-30% ∼ 5240 ∼ 0 EFD10-3E5-S

B(mT) at Core loss at Core loss at Core loss at Core loss at

Grade H = 250 A/m f = 100 kHz f = 400 kHz f = 1MHz f = 3MHz

f = 25kHz B = 100mT B = 50mT B = 30mT B = 10mT

T = 100 oC T = 100 oC T = 100 oC T = 100 oC T = 100 oC

Effective core parameters

symbol parameter value unit

Core sets for general purpose transformers and power applications

Grade A

L

(nH) µ

e

Airgap (µm) Type number

Properties of core sets under power conditions

3F3 ≥ 315 ≤ 0.02 ≤ 0.035 −−
3F4 ≥ 250 −−≤ 0.034 ≤ 0.055

Fig. 3 EFD10 core half

EFD10

3.75 ± 0.15

10.5 ± 0.3

7.65 ± 0.25

4.55 ± 0.15

2.7 ± 0.1

MBW131

0.2

1.45 ± 0.05

Philips Magnetic Products

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Coil former material Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance

with UL94V-0.

Solder pad material Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
Maximum operating temperature 155 oC, IEC 85 class F
Resistance to soldering heat “IEC 68-2-20” part2, test Tb, method 1B: 350 oC, 3.5s.
Solderability “IEC 68-2-20” part2, test Ta, method 1: 235

o

C, 2s

Clamp material stainless(CrNi) steel

Clamping force ∼ 20N

Type number CLM-EFD12

Fig. 1 SMD coil former for EFD12

Fig. 2 clamp for EFD12

EFD12

Winding data

Coil former data

Clamp data

Number of Number of Winding area Winding width Average length Type number

sections solder pads (mm

2

) (mm) of turn (mm)

1 8 6.5 7.65 18.6 CPHS-EFD12-1S-8P

2.812.5

1.8

3

MBW123

8.65-0.15

6.55-0.1

5.65+0.1

0.8

9

13.7max.

3.1-0.1

2.2+0.1

6.2max.

0.3

1.8

8.7-0.15

7.65min.

0.3

13.4

16.2max. 23

14 - 0.3

11.5

2.5

12 - 0.3

12.5

± 0.2

9.410.5

4

MBW129

Philips Magnetic Products

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6.2 ± 0.1

Σ (l/A) core factor (C1) 2.50 mm

-1

V

e

effective volume 325 mm

3

l

e

effective length 28.5 mm

A

e

effective area 11.4 mm

2

A

min

minimum area 10.7 mm

2

m mass of core half ∼0.9 g

3F3 40±5% ∼ 80 ∼490 EFD12-3F3-A40-S

63±8% ∼ 125 ∼280 EFD12-3F3-A63-S
100±10% ∼ 200 ∼160 EFD12-3F3-A100-S
700±25% ∼ 1370 ∼0 EFD12-3F3-S

3F4 40±5% ∼ 80 ∼470 EFD12-3F4-A40-S

63±8% ∼ 125 ∼260 EFD12-3F4-A63-S
100±10% ∼ 200 ∼140 EFD12-3F4-A100-S
380±25% ∼ 760 ∼0 EFD12-3F4-S

3E4 1900 +40/-30% ∼ 3780 ∼ 0 EFD12-3E4-S
3E5 2800 +40/-30% ∼ 5570 ∼ 0 EFD12-3E5-S

B(mT) at Core loss at Core loss at Core loss at Core loss at

Grade H = 250 A/m f = 100 kHz f = 400 kHz f = 1MHz f = 3MHz

f = 25kHz B = 100mT B = 50mT B = 30mT B = 10mT

T = 100 oC T = 100 oC T = 100 oC T = 100 oC T = 100 oC

Effective core parameters

symbol parameter value unit

Core sets for general purpose transformers and power applications

Grade A

L

(nH) µ

e

Airgap (µm) Type number

Properties of core sets under power conditions

3F3 ≥ 315 ≤ 0.04 ≤ 0.065 −−
3F4 ≥ 250 −−≤ 0.065 ≤ 0.11

Fig. 3 EFD12 core half

EFD12

4.55 ± 0.15

3.5 ± 0.1

12.5 ± 0.3
9 ± 0.25

5.4 ± 0.15

MBW132

0.2

2 ± 0.1

Philips Magnetic Products

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Coil former material Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance

with UL94V-0.

Solder pad material Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
Maximum operating temperature 155 oC, IEC 85 class F
Resistance to soldering heat “IEC 68-2-20” part2, test Tb, method 1B: 350 oC, 3.5s.
Solderability “IEC 68-2-20” part2, test Ta, method 1: 235

o

C, 2s

Clip material stainless(CrNi) steel

Clamping force ∼ 12.5N each

Type number CLI-EFD15

Fig. 1 SMD coil former for EFD15

Fig. 2 Clip for EFD15

EFD15

Winding data

Coil former data

Clip data

Number of Number of Winding area Winding width Average length Type number

sections solder pads (mm2) (mm) of turn (mm)

1 8 16.7 9.15 25.6 CPHS-EFD15-1S-8P

Fig. 2 Clamp for EFD15

Clamp material stainless(CrNi) steel

Clamping force ∼ 25N

Type number CLM-EFD15

Clamp data

10.55 - 0.15

6.65 - 0.1

5.55+0.1

10.4 - 0.15

9.15 min

0.3

2

2.8

15

3.75

11.25

16.7 max

3.7 - 0.1

2.6 + 0.1

0.3 7.5 max

1.8

161

18.7 max

2

3.75

MBW143

5

4.5

19

13.3

MBW144

2.6

0

16.5

-0.3

13.5
12

4

±0.2

14.3

±0.2

15

12.5

4

Philips Magnetic Products

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5.5 ± 0.25

Σ (l/A) core factor (C1) 2.27 mm

-1

V

e

effective volume 510 mm

3

l

e

effective length 34.0 mm

A

e

effective area 15.0 mm

2

A

min

minimum area 12.2 mm

2

m mass of core half ∼1.4 g

3F3 63±5% ∼ 115 ∼350 EFD15-3F3-A63-S

100±8% ∼ 180 ∼170 EFD15-3F3-A100-S
160±10% ∼ 290 ∼100 EFD15-3F3-A160-S
780±25% ∼ 1400 ∼0 EFD15-3F3-S

3F4 63±5% ∼ 115 ∼350 EFD15-3F4-A63-S

100±8% ∼ 180 ∼160 EFD15-3F4-A100-S
160±10% ∼ 290 ∼90 EFD15-3F4-A160-S
400±25% ∼ 720 ∼0 EFD15-3F4-S

3E4 2000 +40/-30% ∼ 3610 ∼ 0 EFD15-3E4-S
3E5 ≥ 2500 ≥ 4510 ∼ 0 EFD15-3E5-S

B(mT) at Core loss at Core loss at Core loss at Core loss at

Grade H = 250 A/m f = 100 kHz f = 400 kHz f = 1MHz f = 3MHz

f = 25kHz B = 100mT B = 50mT B = 30mT B = 10mT

T = 100 oC T = 100 oC T = 100 oC T = 100 oC T = 100 oC

Effective core parameters

symbol parameter value unit

Core sets for general purpose transformers and power applications

Grade A

L

(nH) µ

e

Airgap (µm) Type number

Properties of core sets under power conditions

3F3 ≥ 315 ≤ 0.06 ≤ 0.10 −−
3F4 ≥ 250 −−≤ 0.10 ≤ 0.16

Fig. 3 EFD15 core half

EFD15

7.5 ± 0.15

15 ± 0.4

11 ± 0.35

5.3 ± 0.15

4.65 ± 0.15

2.4 ± 0.1

MBW145

0.2

Philips Magnetic Products

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Coil former material Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance

with UL94V-0.

Solder pad material Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
Maximum operating temperature 155 oC, IEC 85 class F
Resistance to soldering heat “IEC 68-2-20” part2, test Tb, method 1B: 350 oC, 3.5s.
Solderability “IEC 68-2-20” part2, test Ta, method 1: 235

o

C, 2s

Clip material stainless(CrNi) steel

Clamping force ∼ 20N each

Type number CLI-EFD20

Fig. 1 SMD coil former for EFD20

Fig. 2 Clip for EFD20

EFD20

Winding data

Coil former data

Clip data

Number of Number of Winding area Winding width Average length Type number

sections solder pads (mm

2

) (mm) of turn (mm)

1 10 27.7 13.5 34.1 CPHS-EFD20-1S-10P

Fig. 2 Clamp for EFD20

Clamp material stainless(CrNi) steel

Clamping force ∼ 30N

Type number CLM-EFD20

Clamp data

14.8 - 0.2

10.5 - 0.15

9.2 + 0.1

5 -0.1

9.5 max

14.8-0.2

13.5 min

0.3

2

2.8

20

7.5 ±0.05

1

15 ± 0.05

21.7 max

3.9 + 0.1

0.3

1.8

21

23.7 max

2

3.75

MBW148

5

24

18.3

6

MBW146

4

0

21.5

19.3

- 0.3

18.5

17

4.7

±0.2

20

17.5

±0.2

4

Philips Magnetic Products

19

7.7 ± 0.25

Σ (l/A) core factor (C1) 1,52 mm

-1

V

e

effective volume 1460 mm

3

l

e

effective length 47.0 mm

A

e

effective area 31.0 mm

2

A

min

minimum area 29.0 mm

2

m mass of core half ∼3.5 g

3F3 63±3% ∼ 75 ∼500 EFD20-3F3-E63-S

100±3% ∼ 120 ∼240 EFD20-3F3-A100-S

160±5% ∼ 195 ∼140 EFD20-3F3-A160-S

250±8% ∼ 300 ∼90 EFD20-3F3-A250-S
315±10% ∼ 425 ∼65 EFD20-3F3-A315-S

1200±25% ∼ 1450 ∼0 EFD20-3F3

3F4 63±3% ∼ 75 ∼500 EFD20-3F4-E63-S

100±3% ∼ 120 ∼240 EFD20-3F4-A100-S

160±5% ∼ 195 ∼140 EFD20-3F4-A160-S

250±8% ∼ 300 ∼90 EFD20-3F4-A250-S
315±10% ∼ 425 ∼65 EFD20-3F4-A315-S
650±25% ∼ 785 ∼0 EFD20-3F4

B(mT) at Core loss at Core loss at Core loss at Core loss at

Grade H = 250 A/m f = 100 kHz f = 400 kHz f = 1MHz f = 3MHz

f = 25kHz B = 100mT B = 50mT B = 30mT B = 10mT

T = 100 oC T = 100 oC T = 100 oC T = 100 oC T = 100 oC

Effective core parameters

symbol parameter value unit

Core halves/sets for general purpose transformers and power applications

Grade A

L

(nH) µ

e

Airgap (µm) Type number

Properties of core sets under power conditions

3F3 ≥ 315 ≤ 0.17 ≤ 0.28 −−
3F4 ≥ 300 −−≤ 0.44 ≤ 0.50

Fig. 3 EFD20 core half

EFD20

10 ± 0.15

20 ± 0.55

15.4 ± 0.5

8.9 ± 0.2

6.65 ± 0.15

3.6 ± 0.15

MBW147

0.17

Coil former material Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance

with UL94V-0.

Solder pad material Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
Maximum operating temperature 155 oC, IEC 85 class F
Resistance to soldering heat “IEC 68-2-20” part2, test Tb, method 1B: 350 oC, 3.5s.
Solderability “IEC 68-2-20” part2, test Ta, method 1: 235

o

C, 2s

Clip material stainless(CrNi) steel

Clamping force ∼ 22N

Type number CLI-EP7

Fig. 1 SMD coil former for EP7

Fig. 2 clip for EP7

EP7

Winding data

Coil former data

Clip data

Number of Number of Winding area Winding width Average length Type number

sections solder pads (mm2) (mm) of turn (mm)

1 6 4.7 3.9 17.9 CPHS-EP7-1S-6P

Philips Magnetic Products

20

7-0.1

4.5-0.1

3.5+0.1

4.9-0.1

3.9min.

1.8

2.8

0.8
3
6

9.2max.

0.3

7.3max.

7.151.8

9.85max.

0.3

2

6

3

MBW124

9

MBW130

4

9.4+0,2

4.3

6.9-0.3

0.25

7.2 + 0.4

Σ (l/A) core factor (C1) 1.45 mm

-1

V

e

effective volume 165 mm

3

l

e

effective length 15.5 mm

A

e

effective area 10.7 mm

2

A

min

minimum area 8.55 mm

2

m mass of core set ∼0.8 g

3F3 25±3% ∼ 30 ∼790 EP7-3F3-E25

40±3% ∼ 48 ∼440 EP7-3F3-A40

63±3% ∼ 76 ∼260 EP7-3F3-A63
100±3% ∼ 121 ∼150 EP7-3F3-A100
160±5% ∼ 193 ∼85 EP7-3F3-A160

1000±25% ∼ 1210 ∼0 EP7-3F3

3F4 100±3% ∼ 121 ∼150 EP7-3F4-A100

160±5% ∼ 193 ∼85 EP7-3F4-A160

600±25% ∼ 730 ∼0 EP7-3F4
3E5 5200 +40/-30% ∼ 6300 ∼0 EP7-3E5
3E6 5800 +40/-30% ∼ 7000 ∼0 EP7-3E6

B(mT) at Core loss at Core loss at Core loss at Core loss at

Grade H = 250 A/m f = 100 kHz f = 400 kHz f = 1MHz f = 3MHz

f = 25kHz B = 100mT B = 50mT B = 30mT B = 10mT

T = 100 oC T = 100 oC T = 100 oC T = 100 oC T = 100 oC

Effective core parameters

symbol parameter value unit

Core sets for general purpose transformers and power applications

Grade A

L

(nH) µ

e

Airgap (µm) Type number

Properties of core sets under power conditions

3F3 ≥ 315 ≤ 0.02 ≤ 0.035 −−
3F4 ≥ 250 −−≤ 0.033 ≤ 0.053

Fig. 3 EP7 core set

EP7

Philips Magnetic Products

21

3.4 - 0.2

6.5 - 0.3

1.7 ± 0.1

5 + 0.4

7.5 - 0.2

9.4 - 0.4

MBW133

Philips Magnetic Products

22

Coil former material Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance

with UL94V-0.

Solder pad material Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
Maximum operating temperature 155 oC, IEC 85 class F
Resistance to soldering heat “IEC 68-2-20” part2, test Tb, method 1B: 350 oC, 3.5s.
Solderability “IEC 68-2-20” part2, test Ta, method 1: 235

o

C, 2s

Clamp material stainless(CrNi)steel

Clamping force ∼ 20N

Type number CLM-ER9.5

Fig. 1 SMD coil former for ER9.5

Fig. 2 clamp for ER9.5

ER9.5

Winding data

Coil former data

Clamp data

Number of Number of Winding area Winding width Average length Type number

sections solder pads (mm

2

) (mm) of turn (mm)

1 8 2.8 2.05 18.4 CPVS-ER9.5-1S-8P

2.05 min.

7.3± 0,1ø

4.45± 0.08ø

3.6±0.08ø

8.1

11.7max.

2.95± 0.1

4.4 max.

0.25

0.7

8.6 max.

2
6

1.6

10

2

1.6

4

9.8

5.5

Philips Magnetic Products

23

Σ (l/A) core factor (C1) 1.67 mm

-1

V

e

effective volume 120 mm

3

l

e

effective length 14.2 mm

A

e

effective area 8.47 mm

2

A

min

minimum area 7.60 mm

2

m mass of core half ∼0.35 g

3F3 850±25% ∼ 1145 ∼0 ER9.5-3F3-S
3F4 525±25% ∼ 700 ∼0 ER9.5-3F4-S
3E5 3600 +40/-30% ∼ 4780 ∼0 ER9.5-3E5-S
3E6 4800 +40/-30% ∼ 6380 ∼0 ER9.5-3E6-S

B(mT) at Core loss at Core loss at Core loss at Core loss at

Grade H = 250 A/m f = 100 kHz f = 400 kHz f = 1MHz f = 3MHz

f = 25kHz B = 100mT B = 50mT B = 30mT B = 10mT

T = 100 oC T = 100 oC T = 100 oC T = 100 oC T = 100 oC

Effective core parameters

symbol parameter value unit

Core sets for general purpose transformers and power applications

Grade A

L

(nH) µ

e

Airgap (µm) Type number

Properties of core sets under power conditions

3F3 ≥ 300 ≤ 0.015 ≤ 0.025 −−
3F4 ≥ 250 −−≤ 0.024 ≤ 0.038

Fig. 3 ER9.5 core half

ER9.5

0

3.5

9.5

7.1

7.5

- 0.2

0

- 0.3
+ 0.2

0

+ 0.25

0

0

+0.15

1.6

2.45 ±0.05

0

- 0.2

5

Philips Magnetic Products

24

Coil former material Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance

with UL94V-0.

Solder pad material Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
Maximum operating temperature 155 oC, IEC 85 class F
Resistance to soldering heat “IEC 68-2-20” part2, test Tb, method 1B: 350 oC, 3.5s.
Solderability “IEC 68-2-20” part2, test Ta, method 1: 235

o

C, 2s

Clip material stainless(CrNi) steel

Clamping force ∼ 25N

Type number CLM-ER11

Fig. 1 SMD coil former for ER11

Fig. 2 clamp for ER11

ER11

Winding data

Coil former data

Clip data

Number of Number of Winding area Winding width Average length Type number

sections solder pads (mm

2

) (mm) of turn (mm)

1 10 2.8 1.85 21.6 CPVS-ER11-1S-10P

+0.1

8.5

-0.2ø

5.3± 0.1ø

4.5± 0.1ø

2.8± 0.1

4.4 max.

10.6 max.

1.610

1.6

1.85 min.

9.2

12.35max.

0.25

0.7

4

8

2

4.4

11.5

5.6

Philips Magnetic Products

25

Σ (l/A) core factor (C1) 1.23 mm

-1

V

e

effective volume 174 mm

3

l

e

effective length 14.7 mm

A

e

effective area 11.9 mm

2

A

min

minimum area 10.3 mm

2

m mass of core half ∼0.5 g

3F3 1200±25% ∼ 1170 ∼0 ER11-3F3-S
3F4 725±25% ∼ 710 ∼0 ER11-3F4-S
3E5 5000 +40/-30% ∼ 4890 ∼0 ER11-3E5-S
3E6 6700 +40/-30% ∼ 6560 ∼0 ER11-3E6-S

B(mT) at Core loss at Core loss at Core loss at Core loss at

Grade H = 250 A/m f = 100 kHz f = 400 kHz f = 1MHz f = 3MHz

f = 25kHz B = 100mT B = 50mT B = 30mT B = 10mT

T = 100 oC T = 100 oC T = 100 oC T = 100 oC T = 100 oC

Effective core parameters

symbol parameter value unit

Core sets for general purpose transformers and power applications

Grade A

L

(nH) µ

e

Airgap (µm) Type number

Properties of core sets under power conditions

3F3 ≥ 300 ≤ 0.025 ≤ 0.040 −−
3F4 ≥ 250 −−≤ 0.035 ≤ 0.056

Fig. 3 ER11 core half

ER11

0

4.25

0

± 0.05

+0.15

1.5

2.45

0

- 0.2

6

- 0.25

0

11

- 0.35
+0.2

8

0

+0.3

8.7

0

Philips Magnetic Products

26

Coil former material Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance

with UL94V-0.

Solder pad material Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
Maximum operating temperature 155 oC, IEC 85 class F
Resistance to soldering heat “IEC 68-2-20” part2, test Tb, method 1B: 350 oC, 3.5s.
Solderability “IEC 68-2-20” part2, test Ta, method 1: 235

o

C, 2s

Clip material stainless steel

Clamping force ∼5 N each

Type number CLI-RM4/5

Fig. 1 SMD coil former for RM4/I

Fig. 2 Clip for RM4/I

RM4/I

Winding data

Coil former data

Clip data

Number of Number of Winding area Winding width Average length Type number

sections solder pads (mm

2

) (mm) of turn (mm)

1 6 8.4 5.75 19.8 CPVS-RM4-1S-6P

7.85-0.15ø

4.9-0.1ø
4+0.1ø

0.4

2

2.88.5

3.75

MBW125

8.8 max

0.3

7.5

10.65 max

6.8-0.1

(5.7 min)

1

7

11.15 max

2

1.8

2.1

9.3

22

R

8.2

Philips Magnetic Products

27

2.5

Σ (l/A) core factor (C1) 1.69 mm

-1

V

e

effective volume 322 mm

3

l

e

effective length 23.3 mm

A

e

effective area 13.8 mm

2

A

min

minimum area 11.5 mm

2

m mass of core set ∼1.7 g

B(mT) at Core loss at Core loss at Core loss at Core loss at

Grade H = 250 A/m f = 100 kHz f = 400 kHz f = 1MHz f = 3MHz

f = 25kHz B = 100mT B = 50mT B = 30mT B = 10mT

T = 100 oC T = 100 oC T = 100 oC T = 100 oC T = 100 oC

Effective core parameters

symbol parameter value unit

Properties of core sets under power conditions

3F3 ≥ 300 ≤ 0.05 ≤ 0.07 −−
3F4 ≥ 250 −−≤ 0.065 ≤ 0.11

Fig. 3 RM4/I core set

RM4/I

3F3 100±3% ∼ 134 ∼ 170 RM4/I-3F3-A100

160±3% ∼ 215 ∼ 100 RM4/I-3F3-A160
250±10% ∼ 336 ∼ 50 RM4/I-3F3-A250
950±25% ∼ 1280 ∼0 RM4/I-3F3

3F4 100±3% ∼ 134 ∼ 150 RM4/I-3F4-A100

160±3% ∼ 215 ∼ 80 RM4/I-3F4-A160
250±10% ∼ 336 ∼ 40 RM4/I-3F4-A250
560±25% ∼ 750 ∼0 RM4/I-3F4

3E5 3500 +40/-30% ∼ 4700 ∼0 RM4/I-3E5

Core sets for general purpose transformers and power applications

Grade A

L

(nH) µ

e

Airgap (µm) Type number

4.6 - 0.2

> 5.8

11 - 0.5

3.9 - 0.2ø

9.8 - 0.4

9 ± 0.25

ø 7.95 + 0.4

7 + 0.4

MBW134

10.4 ± 0.1

Philips Magnetic Products

28

Coil former material Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance

with UL94V-0.

Solder pad material Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
Maximum operating temperature 155 oC, IEC 85 class F
Resistance to soldering heat “IEC 68-2-20” part2, test Tb, method 1B: 350 oC, 3.5s.
Solderability “IEC 68-2-20” part2, test Ta, method 1: 235

o

C, 2s

Clip material stainless (CrNi)steel

Clamping force ∼5 N each

Type number CLI-RM4/5

Fig. 1 SMD coil former for RM5/I

Fig. 2 Clip for RM5/I

RM5/I

Winding data

Coil former data

Clip data

Number of Number of Winding area Winding width Average length Type number

sections solder pads (mm

2

) (mm) of turn (mm)

1 8 9.8 4.9 24.9 CPVS-RM5-1S-8P

ø

ø

ø

10.1

5.9

+0.1

5

0

0

− 0.1

0

− 0.15

0.9

0.4

2.8

11.2

3.75

2

8.45 max.

0.3

3.75

11.25

14.25 max.

6.1

4.9 min.

1

14.9 max.

2

1.8

2.1

9.3

22

R

8.2

Philips Magnetic Products

29

2.5

Σ (l/A) core factor (C1) 0.935 mm

-1

V

e

effective volume 574 mm

3

l

e

effective length 23.2 mm

A

e

effective area 24.8 mm

2

A

min

minimum area 18.1 mm

2

m mass of core set ∼3.3 g

B(mT) at Core loss at Core loss at Core loss at Core loss at

Grade H = 250 A/m f = 100 kHz f = 400 kHz f = 1MHz f = 3MHz

f = 25kHz B = 100mT B = 50mT B = 30mT B = 10mT

T = 100 oC T = 100 oC T = 100 oC T = 100 oC T = 100 oC

Effective core parameters

symbol parameter value unit

Properties of core sets under power conditions

3F3 ≥ 315 ≤ 0.08 ≤ 0.11 −−
3F4 ≥ 250 −−≤ 0.11 ≤ 0.20

Fig. 3 RM5/I core set

RM5/I

3F3 100±3% ∼ 74 ∼ 300 RM5/I-3F3-A100

160±3% ∼ 119 ∼ 160 RM5/I-3F3-A160

250±3% ∼ 186 ∼ 90 RM5/I-3F3-A250

1700±25% ∼ 1270 ∼0 RM5/I-3F3

3F4 100±3% ∼ 74 ∼ 300 RM5/I-3F4-A100

160±3% ∼ 119 ∼ 160 RM5/I-3F4-A160

250±3% ∼ 186 ∼ 90 RM5/I-3F4-A250

1000±25% ∼ 750 ∼0 RM5/I-3F4
3E5 6700 +40/-30% ∼ 4980 ∼0 RM5/I-3E5
3E6 9500 +40/-30% ∼ 7050 ∼0 RM5/I-3E6

Core sets for general purpose transformers and power applications

Grade A

L

(nH) µ

e

Airgap (µm) Type number

6.8 - 0.4

9.1 ± 0.25

> 6

14.6 - 0,6

4.9 - 0.2ø

12.3 - 0.5

6.3 + 0.4

10.4 ± 0.1

ø 10.2 + 0.4

MBW135

Philips Magnetic Products

30

Coil former material Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance

with UL94V-0.

Solder pad material Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
Maximum operating temperature 155 oC, IEC 85 class F
Resistance to soldering heat “IEC 68-2-20” part2, test Tb, method 1B: 350 oC, 3.5s.
Solderability “IEC 68-2-20” part2, test Ta, method 1: 235

o

C, 2s

Clip material stainless (CrNi) steel

Clamping force ∼10 N each

Type number CLI-RM6

Fig. 1 SMD coil former for RM6S/I

Fig. 2 Clip for RM6S/I

RM6S/I

Winding data

Coil former data

Clip data

Number of Number of Winding area Winding width Average length Type number

sections solder pads (mm

2

) (mm) of turn (mm)

1 8 14 6.25 31 CPVS-RM6S-1S-8P

12.3-0.25ø

7.55-0.15ø

6.5+0.15ø

0.56.25 min

2

10.5 max0.3 2.2

5

12.5

15.7 max

7.9-0.1

1

17.45 max

2

13.7 2.8

1.814.7

3.75

5

3.75

MBW127

2.3

11.7

R

30

MBW138

9.45

Philips Magnetic Products

31

8.2 - 0.4

Σ (l/A) core factor (C1) 0.784 mm

-1

V

e

effective volume 1090 mm

3

l

e

effective length 29.2 mm

A

e

effective area 37.0 mm

2

A

min

minimum area 31.2 mm

2

m mass of core set ∼4.9 g

B(mT) at Core loss at Core loss at Core loss at Core loss at

Grade H = 250 A/m f = 100 kHz f = 400 kHz f = 1MHz f = 3MHz

f = 25kHz B = 100mT B = 50mT B = 30mT B = 10mT

T = 100 oC T = 100 oC T = 100 oC T = 100 oC T = 100 oC

Effective core parameters

symbol parameter value unit

Properties of core sets under power conditions

3F3 ≥ 315 ≤ 0.14 ≤ 0.20 −−
3F4 ≥ 250 −−≤ 0.22 ≤ 0.35

Fig. 3 RM6S/I core set

RM6S/I

3F3 63±3% ∼ 39 ∼ 950 RM6S/I-3F3-A63

100±3% ∼ 62 ∼ 500 RM6S/I-3F3-A100
160±3% ∼ 100 ∼ 300 RM6S/I-3F3-A160
250±3% ∼ 156 ∼ 150 RM6S/I-3F3-A250

2150±25% ∼ 1350 ∼0 RM6S/I-3F3
3F4 63±3% ∼ 39 ∼ 950 RM6S/I-3F4-A63

100±3% ∼ 62 ∼ 500 RM6S/I-3F4-A100
160±3% ∼ 100 ∼ 300 RM6S/I-3F4-A160
250±3% ∼ 156 ∼ 150 RM6S/I-3F4-A250

1250±25% ∼ 780 ∼0 RM6S/I-3F4
3E5 8600 +40/-30% ∼ 5370 ∼0 RM6S/I-3E5
3E6 12500 +40/-30% ∼ 6200 ∼0 RM6S/I-3E6

Core sets for general purpose transformers and power applications

Grade A

L

(nH) µ

e

Airgap (µm) Type number

2.8

10.35 ± 0.25

> 8.8

17.9 - 0.7

ø 6.4 - 0.2

14.7 - 0.6

8 + 0.4

12.4 ± 0.1

ø 12.4 + 0.5

MBW136

Philips Magnetic Products

32

Coil former material Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance

with UL94V-0.

Solder pad material Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
Maximum operating temperature 155 oC, IEC 85 class F
Resistance to soldering heat “IEC 68-2-20” part2, test Tb, method 1B: 350 oC, 3.5s.
Solderability “IEC 68-2-20” part2, test Ta, method 1: 235

o

C, 2s

Clip material stainless (CrNi) steel

Clamping force ∼10 N each

Type number CLI-RM6/LP

Fig. 1 SMD coil former for RM6S/ILP

Fig. 2 Clip for RM6S/ILP

RM6S/ILP

Winding data

Coil former data

Clip data

Number of Number of Winding area Winding width Average length Type number

sections solder pads (mm

2

) (mm) of turn (mm)

1 8 6.4 2.8 min 31.0 CPVS-RM6S/LP-1S-8P

2

5

3.75

MBW142

2.2

0.3 7.0 max

12.3 - 0.25ø

7.55 - 0.15ø

6.5 +0.15ø

5

12.5

15.7 max

1

0.5

4.4 - 0.1

2.8 min

14.7 1.8

17.45 max

2.813.7

2

3.75

2.3

7.5

16

R

5.95

Philips Magnetic Products

33

8.2 - 0.4

Σ (l/A) core factor (C1) 0.580 mm

-1

V

e

effective volume 820 mm

3

l

e

effective length 21.8 mm

A

e

effective area 37.5 mm

2

A

min

minimum area 31.2 mm

2

m mass of core set ∼4.2 g

B(mT) at Core loss at Core loss at Core loss at Core loss at

Grade H = 250 A/m f = 100 kHz f = 400 kHz f = 1MHz f = 3MHz

f = 25kHz B = 100mT B = 50mT B = 30mT B = 10mT

T = 100 oC T = 100 oC T = 100 oC T = 100 oC T = 100 oC

Effective core parameters

symbol parameter value unit

Properties of core sets under power conditions

3F3 ≥ 300 ≤ 0.10 ≤ 0.15 −−
3F4 ≥ 250 −−≤ 0.16 ≤ 0.26

Fig. 3 RM6S/ILP core set

RM6S/ILP

3F3 2700±25% ∼ 1250 ∼ 0 RM6S/ILP-3F3
3F4 1600±25% ∼ 740 ∼ 0 RM6S/ILP-3F4
3E5 10500 +40/-30% ∼ 4850 ∼0 RM6S/ILP-3E5
3E6 15000 +40/-30% ∼ 6930 ∼0 RM6S/ILP-3E6

Core sets for general purpose transformers and power applications

Grade A

L

(nH) µ

e

Airgap (µm) Type number

2.8

> 8.8

17.9 - 0.7

ø 6.4 - 0.2

14.7 - 0.6

4.5 + 0.4

6.84 ± 0.25
ø 12.4 +0.5

9 - 0.2

MBW140

Philips Magnetic Products

34

Coil former material Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance

with UL94V-0.

Solder pad material Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
Maximum operating temperature 155 oC, IEC 85 class F
Resistance to soldering heat “IEC 68-2-20” part2, test Tb, method 1B: 350 oC, 3.5s.
Solderability “IEC 68-2-20” part2, test Ta, method 1: 235

o

C, 2s

Cover material Polyamide (PA4.6)

glass reinforced, flame retardant

in accordance with UL94V-0.

Maximum operating 130 oC, IEC 85 class B
temperature
Type number COV-9

Fig. 1 Tag plate for 9mm ring cores.

Fig. 2 Cover for TGPS-9

TGPS-9

Winding data

Coil former data

Cover data

Number of Number of Winding area Winding width Average length Type number

sections solder pads (mm

2

) (mm) of turn (mm)

- 8 - - - TGPS-9

14.7max.

10.8 min.

13 max.

3
9

0.8

1.75max.

12

1.8

0.3

1.8

2.8

11

2

˚

45

3

0.6(4x)

±0.1
11

11.7 max 0.6

6 max.

Philips Magnetic Products

35

Σ (l/A) core factor (C1) 5.17 mm

-1

V

e

effective volume 102 mm

3

l

e

effective length 22.9 mm

A

e

effective area 4.44 mm

2

m mass of core ∼ 0.5 g

Effective core parameters

symbol parameter value unit

Fig. 3 TN9/6/3 ring core

3F3 440 ±25% ∼ 1800 blue TN9/6/3-3F3

3E5

1)

2070 ±30% ∼ 8500 yellow/white TL9/6/3-3E5

3E6

2)

2435 ±30% ∼ 10000 purple/white TC9/6/3-3E6

Ring core data

Grade A

L

(nH) µ

e

Colour code Type number

TN9/6/3

Note

1. Ring cores in 3E5 are lacquered and therefore have different dimensions: OD = 9.3±0.4 mm, ID = 5.75±0.3mm, H = 3.25±0.3mm.

2. Ring cores in 3E6 are coated with parylene and therefore have different dimensions: OD = 9.0±0.2 mm, ID = 6.0±0.2mm, H = 3.0±0.15mm.

9.4 ± 0.3

5.5 ± 0.3

3.4 ± 0.3

Philips
Components

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Finland: Philips Components, ESPOO,

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Tel. [phone], Fax. [phone]

Hong Kong: Philips Hong Kong, KOWLOON,

Tel. [phone], Fax. [phone]

India: Philips India Ltd., MUMBAI,

Tel. [phone], Fax. [phone] 304

Indonesia: P.T. Philips Development Corp., JAKARTA,

Tel. [phone], Fax. [phone]

Ireland: Philips Electronics (Ireland) Ltd., DUBLIN,

Tel. [phone], Fax. [phone]

Israel: Rapac Electronics Ltd., TEL AVIV,

Tel. [phone], Fax. [phone]

Italy: Philips Components S.r.l., MILANO,

Tel. [phone], Fax. [phone]

Japan: Philips Japan Ltd., TOKYO,

Tel. [phone], Fax. [phone]

Korea (Republic of): Philips Electronics (Korea) Ltd., SEOUL,

Tel. [phone], Fax. [phone]

Malaysia: Philips Malaysia SDN Berhad,

Components Division, PULAU PINANG,
Tel. [phone], Fax. [phone]

Mexico: Philips Components, EL PASO, U.S.A.,

Tel. [phone], Fax. [phone]

New Zealand: Philips New Zealand Ltd., AUCKLAND,

Tel. [phone], Fax. [phone]

Norway: Norsk A/S Philips, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: Philips Electrical Industries of Pakistan Ltd., KARACHI,

Tel. [phone], Fax. [phone]

Philippines: Philips Semiconductors Philippines Inc.,

METRO MANILA, Tel. [phone], Fax. [phone]

Poland: Philips Poland Sp. z.o.o., WARSZAWA,

Tel. [phone], Fax. [phone]

Portugal: Philips Portuguesa S.A.,

Philips Components: LINDA-A-VELHA,
Tel. [phone] 3333, Fax. [phone] 3366

Russia: Philips Russia, MOSCOW,

Tel. [phone], Fax. [phone]

Singapore: Philips Singapore Pte Ltd., SINGAPORE,

Tel. [phone], Fax. [phone]

South Africa: S.A. Philips Pty Ltd., JOHANNESBURG,

Tel. [phone], Fax. [phone]

Spain: Philips Components, BARCELONA,

Tel. [phone], Fax. [phone]

Sweden: Philips Components AB, STOCKHOLM,

Tel. [phone], Fax. [phone]

Switzerland: Philips Components AG, ZÜRICH,

Tel. [phone], Fax. [phone]

Taiwan: Philips Taiwan Ltd., TAIPEI,

Tel. [phone], Fax. [phone]

Thailand: Philips Electronics (Thailand) Ltd., BANGKOK,

Tel. [phone], Fax. [phone]

Turkey: Türk Philips Ticaret A.S., GÜLTEPE/ISTANBUL,

Tel. [phone], Fax. [phone]

United Kingdom: Philips Components Ltd., DORKING,

Tel. [phone], Fax. [phone]

United States:

• Display Components, ANN ARBOR, MI,
Tel. [phone], Fax. [phone]

• Magnetic Products, SAUGERTIES, NY,
Tel. [phone], Fax. [phone]

• Passive Components, SAN JOSE, CA,
Tel. [phone], Fax. [phone]

Yugoslavia (Federal Republic of): Philips Components, BELGRADE,

Tel. [phone],Fax. [phone]

Internet:

• Display Components: www.dc.comp.philips.com

• Passive Components: www.passives.comp.philips.com

For all other countries apply to:

Philips Components, Building BF-1, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. [phone].

COB20  Philips Electronics N.V. 1998

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to
be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher
for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or
other industrial or intellectual property rights.

Printed in The Netherlands xxxx xxx xxxxx Date of release: 11/98

Printed in The Netherlands 9398 237 50011 Date of release: 6/97

Magnetic Products NAFTA Sales Offices

Alabama Over and Over, Inc., Charlotte, NC [phone]
Alaska Eclipse Marketing Group, Redmond, WA [phone]
Arizona Harper and Two, Tempe, AZ [phone]
Arkansas Philips Components, Willoughby, OH [phone]
California - Northern Criterion Sales, Santa Clara, CA [phone]
California - Southern Harper and Two, Signal Hill, CA [phone]
Colorado Philips Components, Willoughby, OH [phone]
Connecticut Philips Components, Woburn, MA [phone]
Deleware Philips Components, Woburn, MA [phone]
Florida Over and Over, Charlotte, NC [phone]
Georgia Over and Over, Charlotte, NC [phone]
Hawaii Harper and Two, Signal Hill, CA [phone]
Idaho - Northern Eclipse Marketing Group, Redmond, WA [phone]
Idaho - Southern Electrodyne, Inc., Salt Lake City, UT [phone]
Illinois - Northern Philips Components, Willoughby, OH [phone]
Illinois - Quad Cities Lorenz Sales, Cedar Rapids, IA [phone]
Illinois - Southern Lorenz Sales, St. Louis, MO [phone]
Indiana - Northern Corrao Marsh, Fort Wayne, IN [phone]
Indiana - Central and Southern Corrao Marsh, Green eld, IN [phone]
Iowa - All except Quad Cities Lorenz Sales, Cedar Rapids, IA [phone]
Kansas - Northeast Lorenz Sales, Overland Park, KS [phone]
Kansas - All except Northeast Lorenz Sales, Wichita, KS [phone]
Kentucky Corrao Marsh, Green eld, IN [phone]
Louisiana Philips Components, Willoughby, OH [phone]
Maine Philips Components, Woburn, MA [phone]
Maryland Philips Components, Willoughby, OH [phone]
Massachusetts Philips Components, Woburn, MA [phone]
Michigan Philips Components, Willoughby, OH [phone]
Minnesota Electronic Component Sales, Minneapolis, MN [phone]
Mississippi Over and Over, Charlotte, NC [phone]
Missouri - Eastern Lorenz Sales, St. Louis, MO [phone]
Missouri - Western Lorenz Sales, Overland Park, KS [phone]
Montana Electrodyne, Inc., Salt Lake City, UT [phone]
Nebraska Lorenz Sales, Cedar Rapids, IA [phone]
Nevada - Central and Northern Criterion Sales, Santa Clara, CA [phone]
Nevada - Sourthern Harper and Two, Tempe, AZ [phone]
New Hampshire Philips Components, Woburn, MA [phone]
New Jersey Philips Components, Woburn, MA [phone]
New Mexico Harper and Two, Tempe, AZ [phone]
New York - Western Philips Components, Willoughby, OH [phone]
New York - All other Philips Components, Woburn, MA [phone]
North Carlolina Over and Over, Charlotte, NC [phone]
North Dakota Electronic Component Sales, Minneapolis, MN [phone]
Ohio Philips Components, Willoughby, OH [phone]
Oklahoma Philips Components, Willoughby, OH [phone]
Oregon Eclipse Marketing Group, Beaverton, OR [phone]
Pennsylvania - Western Philips Components, Willoughby, OH [phone]
Pennsylvania - Eastern Philips Components, Woburn, MA [phone]
Rhode Island Philips Components, Woburn, MA [phone]
South Carolina Over and Over, Charlotte, NC [phone]
South Dakota Electronic Component Sales, Minneapolis, MN [phone]
Tennesse Over and Over, Charlotte, NC [phone]
Texas Philips Components, Willoughby, OH [phone]
Utah Electrodyne, Inc., Salt Lake City, UT [phone]
Vermont Philips Components, Woburn, MA [phone]
Virginia Philips Components, Willoughby, OH [phone]
Washington Eclipse Marketing Group, Redmond, WA [phone]
Washington DC Philips Components, Willoughby, OH [phone]
West Virginia Philips Components, Willoughby, OH [phone]
Wisconsin Philips Components, Willoughby, OH [phone]
Wyoming Electrodyne, Inc., Salt Lake City, UT [phone]
Canada Philips Components, Scarborough, ON [phone]
Mexico Philips Components, El Paso, TX [phone]
Puerto Rico Max Anderson Co., Caperra Heights, PR [phone]
Virgin Islands Max Anderson Co., Caperra Heights, PR [phone]