Philips SMD User Manual

technical note Philips Magnetic Products

SMD Coil Formers and Cores

Philips

Components

SMD Coil Formers

and Cores

Contents

Introduction	3
Ferrite Material Properties	6
Range Overview	7
E5.3/2.7/2	8
E6.3/2.9/2	10
EFD10	12
EFD12	14
EFD15	16
EFD20	18
EP7	20
ER9.5	22
ER11	24
RM4/I	26
RM5/I	28
RM6S/I	30
RM6S/ILP	32
Tag plate TGPS-9	34

1

Philips Magnetic Products

Range of SMD accessories and cores

2

Philips Magnetic Products

Introduction

With its new range of surface-mount coil formers, Philips Components offers a real solution to circuit designers wishing to take maximum advantage of surface-mount technology in their designs.

The trend toward full surface-mount technology has been hampered by the problems of introducing inductive components (inductors and transformers for example) in surface-mount execution.

These devices, consisting of cores, coil-formers and windings held together by clips, were not easily converted to surface-mount versions, and former designs, based on "gull-wing" terminations (see Fig.1) have not been entirely satisfactory.

Disadvantages of "gull-wing" pins

In particular, tensions introduced by the winding wire, which is wrapped around the upper part of the gull-wing terminations, can severely degrade the coplanarity of the solder pads. The use of thin wire windings is a partial solution to this problem but this introduces limitations on coil design. Furthermore, during soldering of the winding wire to the termination, spillage of solder onto the solder pad can further degrade coplanarity. However, for very small coil formers gull-wing pins are the only possible design due to space limitations. For small to medium sized coil formers there is a better solution: U-pins.

3

> 0.1 mm

Fig.1 The “gull-wing” design.

Philips Magnetic Products

clean solder pads

< 0.1 mm

Fig.2 The U-pin design

Advantages of the U-pin design

The introduction of Philips' new range of surface-mount, coil formers, however, solves all these problems. These feature "U-pin" terminations (Fig.2) securely embedded in the plastic coil former body. These pins are thicker and wider than most gull-wing pins and therefore stronger.

The solder pads, located beneath the plastic body and in contact with it, form a rigid structure with a guaranteed coplanarity of less than 0.1 mm, according to

IEC 191-2Q.

The upper part of the U-pins protrude from the plastic body and offer a large area on which to terminate the windings. Since these are physically separated from the solder pads, tension introduced by the winding wire will not affect coplanarity, and neither will solder used to attach the winding wires spill onto the solder pads. The contact surface of the pads is also much larger than typical gullwing solder pads, making them ideal for these relatively heavy components.

Moreover, with this design, the thickness of the winding wire is no longer a limitation, allowing circuit designers far more freedom in their choice of wire.

High-grade plastic

The coil former body is of high-grade liquid-crystal polymer (LCP) offering excellent thermal stability. The body is exceptionally tough and can withstand soldering temperatures up to 350 oC and operating temperatures up to 180 oC.

Excellent ferrites

In combination with Philips' extensive range of ferrite cores, these new coil formers provide surface-mount solutions in a host of applications from wide-band signal transformers to power transformers.

When assembled with windings, coil-formers, cores and a newly-designed clip with a flat upper surface (ideal for vacuum pickup), the products can easily be inserted by a pick and place assembly line.

4

Philips Magnetic Products

5

Philips Magnetic Products

Ferrite material properties

PARAMETER	SYMBOL UNIT			TEST CONDITIONS	3F3	3F4	4F1	3E4	3E5	3E6
Initial permeability	i		-	f = ≤10 kHz, B < 0.1mT,	1800	900	80	4700	10000	12000
				T = 25 oC
Saturation flux density Bs			mT	f = 10 kHz, T = 25 oC	500	450	330	360 360 400
at Field strength	H		A/m		3000	3000	3000	250	250	250
Remanence	Br		mT	T = 25 oC	150	150	200	100	80	100
Coercivity	Hc		A/m	T = 25 oC	15	60	170	10	5	4
Power loss density	P	v	kW/m3	f = 25kHz, B = 200mT	70	-	-		-	-
(typical, sine wave				f = 100kHz, B = 100mT	50	200	-		-	-
excitation)				f = 500kHz, B = 50mT	180	180	-		-	-
				f = 1MHz, B = 30mT	300	140	300		-	-
				f = 3MHz, B = 10mT	-	240	150		-	-
Curie temperature	T	c	oC	-	≥200	≥220	≥260	≥125	≥125	≥130
Resistivity (DC)	ρ		Ωm	T = 25 oC	2	10	105	1	0.5	0.5
Density			g/cm3	T = 25 oC	4.8	4.7	4.6	4.8	4.9	4.9

6

Philips Magnetic Products

Range overview

Core Type		Core materials			SMD
3F3	3F4	3E4	3E5	3E6	coil former

E5.3/2.7/2

E6.3/2.9/2

EFD10

EFD12

EFD15

EFD20

EP7

ER9.5

ER11

RM4/I

RM5/I

RM6/I

RM6/ILP

EFD assembly

7

Philips Magnetic Products

E5.3/2.7/2

3.6 ± 0.1
2.3 ± 0.1
+0.1
1.5	0
4.7 max.	+0.1	0	0 -0.1
	2.15		2.9
	0.6
3.7
5.3 max.

1.2

	3.7	0
		-0,15
	2.6min.		1.6
4.9max.			5.5
0.25		0.5
	4.9
	7.85max.		1.85

Fig. 1 SMD coil former for E5.3/2.7/2

Winding data

	Number of	Number of	Winding area		Winding width	Average length	Type number
	sections	solder pads	(mm2)		(mm)	of turn (mm)
	1	6	1.5		2.6	12.6	CPHS E5.3/2-1S-6P
2		6	2 × 0.6		2 × 1.0	13	CPHS E5.3/2-2S-6P
Coil former data
	Coil former material			Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance
				with UL94V-0.
	Solder pad material			Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
	Maximum operating temperature			155 oC, IEC 85 class F
	Resistance to soldering heat			“IEC 68-2-20” part2, test Tb, method 1B: 350 oC, 3.5s.
	Solderability			“IEC 68-2-20” part2, test Ta, method 1: 235 oC, 2s

1.5	6

5.8

Clip data

Clip material	stainless (CrNi) steel
Clamping force	5N
Type number	CLM-E5.3/2

4.8 max

Fig. 2 Clamp for E5.3/2.7/2

Cover data

		Cover material	Liquid crystal polymer
			(LCP)
		Type number	COV-E5.3/2

	4.8 max		1.6 max

Fig. 3 Cover for E5.3/2.7/2

8

Philips Magnetic Products

+0.2

3.8 0

0

1.4 -0.1

± 0.05		+0.1	0
		1.9
2.65

5.25 ± 0.1

0 2 -0.1

E5.3/2.7/2

Effective core parameters

symbol		parameter	value	unit
Σ (l/A)		core factor (C1)	5.13	mm-1
V		effective volume	31.4	mm3
	e
le		effective length	12.7	mm
A	e	effective area	2.5	mm2
A	min	minimum area	2.3	mm2
m		mass of core half	0.08	g

Fig. 3 E5.3/2.7/2 core half

Core halves for general purpose transformers and power applications
Grade	AL (nH)	e	Airgap ( m)	Type number
3F3	265 ±25%	1080	0	E5.3/2.7/2-3F3
3F4	165 ±25%	675	0	E5.3/2.7/2-3F4
3E5	1400 +40/-30%	5700	0	E5.3/2.7/2-3E5
3E6	1600 +40/-30%	6520	0	E5.3/2.7/2-3E6

Properties of core sets under power conditions

	B(mT) at	Core loss at	Core loss at	Core loss at	Core loss at
Grade	H = 250 A/m	f = 100 kHz	f = 400 kHz	f = 1MHz	f = 3MHz
	f = 25kHz	B = 100mT	B = 50mT	B = 30mT	B = 10mT
	T = 100 oC	T = 100 oC	T = 100 oC	T = 100 oC	T = 100 oC
3F3	≥ 300	≤ 0.005	≤ 0.008	-	-
3F4	≥ 250	-	-	≤ 0.006	≤ 0.010

9

Philips Magnetic Products

E6.3/2.9/2

4.4
3.5 ± 0.08
2.3 ± 0.05
1.5	+0.1
	0
4.7 max.	+0.1	0	±0.05	5 max.
		2.1	2.9
	0.6
	5.08
6.4 max.

1.6

	5.5
	0
	3.5 - 0.1
	1.6
	2.7 min.
	6.5
0.25	1.2
	8.6 max.

2.54

Fig. 1 SMD coil former for E6.3/2.9/2

Winding data

	Number of	Number of	Winding area		Winding width	Average length	Type number
	sections	solder pads	(mm2)		(mm)	of turn (mm)
	1	6	1.62		2.7	12.8	CPHS-E6.3/2-1S-6P
2		6	2 × 0.45		2 × 0.75	12.8	CPHS-E6.3/2-2S-6P
Coil former data
	Coil former material			Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance
				with UL94V-0.
	Solder pad material			Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
	Maximum operating temperature			155 oC, IEC 85 class F
	Resistance to soldering heat			“IEC 68-2-20” part2, test Tb, method 1B: 350 oC, 3.5s.
	Solderability			“IEC 68-2-20” part2, test Ta, method 1: 235 oC, 2s

Cover data

7.7 max	5.1 max.	Cover material	Liquid crystal polymer
			(LCP)
6.9 max		Type number	COV-E6.3/2

Fig. 2 Cover for E6.3/2.9/2

10

Philips Magnetic Products

+ 0.2 3.6 0

0

1.4 - 0.1

		0.1	0
0 0.1		+
2.9		1.85
-

0

6.3 - 0.25

0 2 -0,1

E6.3/2.9/2

Effective core parameters

symbol		parameter	value	unit
Σ (l/A)		core factor (C1)	3.67	mm-1
V		effective volume	40.6	mm3
	e
le		effective length	12.2	mm
A	e	effective area	3.3	mm2
A	min	minimum area	2.6	mm2
m		mass of core half	0.12	g

Fig. 3 E6.3/2.9/2 core half

Core halves for general purpose transformers and power applications
Grade	AL (nH)	e	Airgap ( m)	Type number
3F3	360 ±25%	1050	0	E6.3/2.9/2-3F3
3F4	225 ±25%	660	0	E6.3/2.9/2-3F4
3E5	1700 +40/-30%	4960	0	E6.3/2.9/2-3E5
3E6	2100 +40/-30%	6130	0	E6.3/2.9/2-3E6

Properties of core sets under power conditions

	B(mT) at	Core loss at	Core loss at	Core loss at	Core loss at
Grade	H = 250 A/m	f = 100 kHz	f = 400 kHz	f = 1MHz	f = 3MHz
	f = 25kHz	B = 100mT	B = 50mT	B = 30mT	B = 10mT
	T = 100 oC	T = 100 oC	T = 100 oC	T = 100 oC	T = 100 oC
3F3	≥ 300	≤ 0.007	≤ 0.010	−	−
3F4	≥ 250	-	−	≤ 0.008	≤ 0.013

11

Philips Magnetic Products