Philips SCN2661AC1A28, SCN2661BA1F28, SCN2661BC1A28, SCN2661BC1F28, SCN2661BC1N28 Datasheet

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Philips Semiconductors Product specification
SCN2661/SCN68661
Enhanced programmable communications interface (EPCI)
1
1994 Apr 27 853-1070 12793

DESCRIPTION

The EPCI serializes parallel data characters received from the microprocessor for transmission. Simultaneously, it can receive serial data and convert it into parallel data characters for input to the microcomputer.
The SCN2661 contains a baud rate generator which can be programmed to either accept an external clock or to generate internal transmit or receive clocks. Sixteen different baud rates can be selected under program control when operating in the internal clock mode. Each version of the EPCI (A, B, C) has a different set of baud rates.

FEATURES

Synchronous operation
5- to 8-bit characters plus paritySingle or double SYN operationInternal or external character synchronizationTransparent or non-transparent modeTransparent mode DLE stuffing (Tx) and detection (Rx)Automatic SYN or DLE-SYN insertion SYN, DLE and DLESYN
stripping
Odd, even, or no parityLocal or remote maintenance loopback modeBaud rate: DC to 1Mbps (1X clock)
Asynchronous operation
5- to 8-bit characters plus parity1, 1-1/2 or 2 stop bits transmittedOdd, even, or no parityParity, overrun and framing error detectionLine break detection and generationFalse start bit detectionAutomatic serial echo mode (echoplex)Local or remote maintenance loopback modeBaud rate: DC to 1Mbps
(1X clock) DC to 62.5kbps (16X clock) DC to 15.625kbps (64X clock)

OTHER FEATURES

Internal or external baud rate clock
3 baud rate sets
16 internal rates for each set
Double-buffered transmitter and receiver

PIN CONFIGURATIONS

D1 D0
V
CC
RxC/BKDET DTR
RTS DSR
RESET BRCLK TxD TxEMT
/DSCHG CTS
DCD TxRDYRxRDY
R/W
A0
CE
A1
TxC
/XSYNC
D7
D6
D5
D4
GND
RxD
D3
D2
DIP
PLCC
INDEX
CORNER
TOP VIEW
NOTE:
Pin Functions the same as 28-pin DIP.
28 27 26 25 24 23 22 21 20 19 18 17 16 15
1 2 3 4 5 6 7 8
9 10 11 12 13 14
26
25
19
1812
11
5
4 1
SD00077
Dynamic character length switching
Full- or half-duplex operation
TTL compatible inputs and outputs
RxC and TxC pins are short-circuit protected
Single +5V power supply
No system clock required

APPLICATIONS

Intelligent terminals
Network processors
Front-end processors
Remote data concentrators
Computer-to-computer links
Serial peripherals
BISYNC adaptors
Philips Semiconductors Product specification
SCN2661/SCN68661
Enhanced programmable communications interface (EPCI)
1994 Apr 27
2

ORDERING CODE

VCC = +5V +5%
PACKAGES
Commercial
0°C to +70°C
Industrial
-40°C to +85°C
DWG #
28-Pin Ceramic Dual In-Line Package (cerdip) 0.6” Wide
SCN2661BC1F28 SCN2661CC1F28
SCN2661BA1F28 SCN2661CA1F28
0589B
28-Pin Plastic Dual In-Line Package (DIP) 0.6” Wide
SCN2661AC1N28 SCN2661BC1N28
SCN2661CC1N28
Contact Factory SOT117-2
28-Pin Plastic Lead Chip Carrier (PLCC)
SCN2661AC1A28 SCN2661BC1A28 SCN2661CC1A28
Contact Factory SOT261-3

BLOCK DIAGRAM

DATA BUS
D0–D7
RESET
A
0
A
1
R/W
CE
DATA BUS
BUFFER
OPERATION CONTROL
MODE REGISTER 1
BAUD RATE
GENERATOR
AND
CLOCK CONTROL
SNE/DLE CONTROL
SYN 1 REGISTER SYN 2 REGISTER
DLE REGISTER
TRANSMITTER
TRANSMIT DATA
TxD
MODE REGISTER 2
COMMAND REGISTER
STATUS REGISTER
BRCLK
TxC/SYNC
RxC/BKDET
DSR
MODEM
CONTROL
DCD CTS RTS DTR
TxEMT/*
DSCHG
HOLDING REGISTER
TRANSMIT
SHIFT REGISTER
TxRDY*
RECEIVE DATA
RECEIVE
RECEIVER
RxD
RxRDY
*
HOLDING REGISTER
SHIFT REGISTER
NOTES:
* Open–drain output pin.
SD00078

ABSOLUTE MAXIMUM RATINGS

1
SYMBOL
PARAMETER RATING UNIT
T
A
Operating ambient temperature
2
Note 4 °C
T
STG
Storage temperature -65 to +150 °C All voltages with respect to ground
3
-0.5 to +6.0
V
NOTES:
1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or at any other condition above those indicated in the operation section of this specification is not implied.
2. For operating at elevated temperatures, the device must be derated based on +150°C maximum function temperature.
3. This product includes circuitry specifically designed for the protection of its internal devices from the damaging effect of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying any voltages larger than the rated maxima.
4. Over recommended free-air operating temperature range and supply voltage range unless otherwise specified. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
Philips Semiconductors Product specification
SCN2661/SCN68661
Enhanced programmable communications interface (EPCI)
1994 Apr 27
3

DC ELECTRICAL CHARACTERISTICS

1, 2, 3
LIMITS
SYMBOL
PARAMETER
TEST CONDITIONS
Min Typ Max
UNIT
Input voltage
V
IL
V
IH
Low High
2.0
0.8
V V
Output voltage
V
OL
V
OH
4
Low High
IOL = 2.2mA
I
OH
= -400µA 2.4
0.4
V V
I
IL
Input leakage current VIN = 0 to 5.5V 10 µA
3-State output leakage current
I
LH
I
LL
Data bus high Data bus low
VO = 4.0V
VO = 0.45V
10
10
µA µA
I
CC
Power supply current 150 mA
NOTES:
1. Over recommended free-air operating temperature range and supply voltage range unless otherwise specified. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
2. All voltages measurements are referenced to ground. All time measurements are at the 50% level for inputs (except t
BRH
and t
BRL
) and at
0.8V and 2.0V for outputs. Input levels swing between 0.4V and 2.4V , with a transition time of ≤ 20ns maximum.
3. Typical values are at +25°C, typical supply voltages and typical processing parameters.
4. INTR
, TxRDY, RxRDY and TxEMT/DSCHG outputs are open-drain.
CAPACITANCE TA = 25°C, V
CC
= 0V
LIMITS
SYMBOL
PARAMETER
TEST CONDITIONS
Min Typ Max
UNIT

Capacitance

C
IN
C
OUT
C
I/O
Input Output Input/Output
f
C
= 1MHz
Unmeasured pins tied to ground
20 20 20
pF pF pF
Philips Semiconductors Product specification
SCN2661/SCN68661
Enhanced programmable communications interface (EPCI)
1994 Apr 27
4

AC ELECTRICAL CHARACTERISTICS

1, 2, 3
LIMITS
SYMBOL
PARAMETER
TEST CONDITIONS
Min Typ Max
UNIT
Pulse width
t
RES
t
CE
Reset Chip enable
1000
250
ns ns
Setup and hold time
t
AS
t
AH
t
CS
t
CH
t
DS
t
DH
t
RXS
t
RXH
Address setup Address hold R
/W control setup
R
/W control hold Data setup for write Data hold for write RX data setup RX data hold
10 10 10 10
150
10 300 350
ns ns ns ns ns ns ns ns
t
DD
t
DF
7
t
CED
Data delay time for read Data bus floating time for read CE to CE delay
C
L
= 150pF
C
L
= 150pF
600
200 100
ns ns ns
Input clock frequency
f
BRG
f
BRG
f
R/T
6
Baud rate generator (2661A, B) Baud rate generator (2661C) TxC
or RxC
1.0
1.0 dc
4.9152
5.0688
4.9202
5.0738
1.0
MHz MHz MHz
Clock width
t
BRH
5
t
BRH
5
t
BRL
5
t
BRL
5
t
R/TH
t
R/TL
6
Baud rate High (2661A, B) Baud rate High (2661C) Baud rate Low (2661A, B) Baud rate Low (2661C) TxC
or RxC High
TxC
or RxC Low
75 70 75 70
480 480
ns ns ns ns ns ns
t
TXD
t
TCS
TxD delay from falling edge of TxC Skew between TxD changing and falling edge of TxC
output
4
C
L
= 150pF
C
L
= 150pF
0
650 ns
ns
NOTES:
1. Over recommended free-air operating temperature range and supply voltage range unless otherwise specified. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
2. All voltages measurements are referenced to ground. All time measurements are at the 50% level for inputs (except t
BRH
and t
BRL
) and at
0.8V and 2.0V for outputs. Input levels swing between 0.4V and 2.4V , with a transition time of ≤ 20ns maximum.
3. Typical values are at +25°C, typical supply voltages and typical processing parameters.
4. Parameter applies when internal transmitter clock is used.
5. Under test conditions of 5.0688MHz f
BRG
(68661) and 4.9152MHz f
BRG
(68661A, B), t
BRH
and t
BRL
measured at VIH and VIL, respectively.
6. In asynchronous local loopback mode, using 1X clock, the following parameters apply: f
R/T
= 0.83MHz max and t
R/TL
= 700ns min.
7. See AC load conditions.

BLOCK DIAGRAM

The EPCI consists of six major sections. These are the transmitter, receiver, timing, operation control, modern control and SYN/DLE control. These sections communicate with each other via an internal data bus and an internal control bus. The internal data bus interfaces to the microprocessor data bus via a data bus buffer.

Operation Control

This functional block stores configuration and operation commands from the CPU and generates appropriate signals to various internal sections to control the overall device operation. It contains read and write circuits to permit communications with the microprocessor via the data bus and contains mode registers 1 and 2, the command register, and the status register. Details of register addressing and protocol are presented in the EPCI programming section of this data sheet.

Timing

The EPCI contains a Baud Rate Generator (BRG) which is programmable to accept external transmit or receive clocks or to divide an external clock to perform data communications. The unit can generate 16 commonly used baud rates, any one of which can be selected for full-duplex operation. See Table 1.

Receiver

The receiver accepts serial data on the RxD pin, converts this serial input to parallel format, checks for bits or characters that are unique to the communication technique and sends an “assembled” character to the CPU.

Transmitter

The transmitter accepts parallel data from the CPU, converts it to a serial bit stream, inserts the appropriate characters or bits (based on
Philips Semiconductors Product specification
SCN2661/SCN68661
Enhanced programmable communications interface (EPCI)
1994 Apr 27
5
the communication technique) and outputs a composite serial stream of data on the TxD output pin.

Modem Control

The modern control section provides interfacing for three input signals and three output signals used for “handshaking” and status indication between the CPU and a modem.

SYN/DLE Control

This section contains control circuitry and three 8-bit registers storing the SYN1, SYN2, and DLE characters provided by the CPU. These registers are used in the synchronous mode of operation to provide the characters required for synchronization, idle fill and data transparency.
Table 1. Baud Rate Generator Characteristics
68661A (BRCLK = 4.9152MHz)
MR23–20
BAUD RATE
ACTUAL FREQUENCY
16X CLOCK
PERCENT
ERROR
DIVISOR
0000 50 0.8kHz 6144 0001 75 1.2 4096 0010 110 1.7598 –0.01 2793 0011 134.5 2.152 2284 0100 150 2.4 2048 0101 200 3.2 1536 0110 300 4.8 1024 0111 600 9.6 512 1000 1050 16.8329 0.196 292 1001 1200 19.2 256 1010 1800 28.7438 –0.19 171 1011 2000 31.9168 –0.26 154 1100 2400 38.4 128 1101 4800 76.8 64 1110 9600 153.6 32
1111 19200 307.2 16
68661B (BRCLK = 4.9152MHz)
MR23–20
BAUD RATE
ACTUAL FREQUENCY
16X CLOCK
PERCENT
ERROR
DIVISOR
0000 45.5 0.7279kHz 0.005 6752 0001 50 0.8 6144 0010 75 1.2 4096 0011 110 1.7598 –0.01 2793 0100 134.5 2.152 2284 0101 150 2.4 2048 0110 300 4.8 1024 0111 600 9.6 512 1000 1200 19.2 256 1001 1800 28.7438 –0.19 171 1010 2000 31.9168 –0.26 154 1011 2400 38.4 128 1100 4800 76.8 64 1101 9600 153.6 32 1110 19200 307.2 16
1111 38400 614.4 8
Philips Semiconductors Product specification
SCN2661/SCN68661
Enhanced programmable communications interface (EPCI)
1994 Apr 27
6
68661C (BRCLK = 5.0688MHz)
MR23–20
BAUD RATE ACTUAL FREQUENCY 16X CLOCK PERCENT ERROR DIVISOR
0000 50 0.8kHz 6336 0001 75 1.2 4224 0010 110 1.76 2880 0011 134.5 2.1523 0.016 2355 0100 150 2.4 2112 0101 300 4.8 1056 0110 600 9.6 528 0111 1200 19.2 264 1000 1800 28.8 176 1001 2000 32.081 0.253 158 1010 2400 38.4 132 1011 3600 57.6 88 1100 4800 76.8 66 1101 7200 115.2 44 1110 9600 153.6 33
1111 19200 316.8 3.125 16
NOTE: 16X clock is used in asynchronous mode. In synchronous mode, clock multiplier is 1X and BRG can be used only for TxC.

OPERATION

The functional operation of the 68661 is programmed by a set of control words supplied by the CPU. These control words specify items such as synchronous or asynchronous mode, baud rate, number of bits per character, etc. The programming procedure is described in the EPCI programming section of the data sheet.
After programming, the EPCI is ready to perform the desired communications functions. The receiver performs serial to parallel conversion of data received from a modem or equivalent device. The transmitter converts parallel data received from the CPU to a serial bit stream. These actions are accomplished within the framework specified by the control words.

Receiver

The 68661 is conditioned to receiver data when the DCD input is Low and the RxEN bit in the commands register is true. In the asynchronous mode, the receiver looks for High-to-Low (mark to space) transition of the start bit on the RxD input line. If a transition is detected, the state of the RxD line is sampled again after a delay of one-half of a bit-time. If RxD is now high, the search for a valid start bit is begun again. If RxD is still Low, a valid start bit is assumed and the receiver continues to sample the input line at one bit time intervals until the proper number of data bits, the parity bit, and one stop bit have been assembled. The data are then transferred to the receive data holding register, the RxRDY bit in the status register is set, and the RxRDY
output is asserted. If the character length is less than 8 bits, the High order unused bits in the holding register are set to zero. The parity error, framing error, and overrun error status bits are strobed into the status register on the positive going edge of RxC
corresponding to the received character boundary. If the stop bit is present, the receiver will immediately begin its search for the next start bit. If the stop bit is absent (framing error), the receiver will interpret a space as a start bit if it persists into the next bit timer interval. If a break condition is detected (RxD is Low for the entire character as well as the stop bit), only one character consisting of all zeros (with the FE status bit SR5 set) will be transferred to the holding register. The RxD input must return to a High condition before a search for the next start bit begins.
Pin 25 can be programmed to be a break detect output by appropriate setting of MR27-MR24. If so, a detected break will cause that pin to go High. When RxD returns to mark for one RxC time, pin 25 will go low. Refer to the Break Detection Timing Diagram.
When the EPCI is initialized into the synchronous mode, the receiver first enters the hunt mode on a 0 to 1 transition of RxEN (CR2). In this mode, as data are shifted into the receiver shift register a bit at a time, the contents of the register are compared to the contents of the SYN1 register. If the two are not equal, the next bit is shifted in and the comparison is repeated. When the two registers match, the hunt mode is terminated and character assembly mode begins. If single SYN operation is programmed, the SYN DETECT status bit is set. If double SYN operation is programmed, the first character assembled after SYN1 must be SYN2 in order for the SYN DETECT bit to be set. Otherwise, the EPCI returns to the hunt mode. (Note that the sequence SYN1-SYN1-SYN2 will not achieve synchronization.) When synchronization has been achieved, the EPCI continues to assemble characters and transfer then to the holding register, setting the RxRDY status bit and asserting the RxRDY
output each time a character is transferred. The PE and OE status bits are set as appropriate. Further receipt of the appropriate SYN sequence sets the SYN DETECT status bit. If the SYN stripping mode is commanded, SYN characters are not transferred to the holding register. Note that the SYN characters used to establish initial synchronization are not transferred to the holding register in any case.
External jam synchronization can be achieved via pin 9 by appropriate setting of MR27-MR24. When pin 9 is an XSYNC input, the internal SYN1, SYN1–SYN2, and DLE–SYN1 detection is disabled. Each positive going signal on XSYNC will cause the receiver to establish synchronization on the rising edge of the next RxC pulse. Character assembly will start with the RxD input at this edge. XSYNC may be lowered on the next rising edge of RxD. This external synchronization will cause the SYN DETECT status bit to be set until the status register is read. Refer to XSYNC timing diagram.
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