1999 Aug 02 2
Philips Semiconductors Preliminary specification
TV microcontrollers with Closed Captioning (CC)
and On-Screen Display (OSD)
SAA55xx
CONTENTS
1 FEATURES
2 GENERAL DESCRIPTION
3 QUICK REFERENCE DATA
4 ORDERING INFORMATION
5 BLOCK DIAGRAM
6 PINNING INFORMATION
6.1 Pinning
6.2 Pin description
7 MICROCONTROLLER
7.1 Microcontroller features
8 MEMORY ORGANIZATION
8.1 ROM bank switching
8.2 RAM organisation
8.3 Data memory
8.4 SFR memory
8.5 Character set feature bits
8.6 External (auxiliary) memory
9 REDUCED POWER MODES
9.1 Idle mode
9.2 Power-down mode
9.3 Standby mode
10 I/O FACILITY
10.1 I/O ports
10.2 Port type
10.3 Port alternative functions
10.4 LED support
11 INTERRUPT SYSTEM
11.1 Interrupt enable structure
11.2 Interrupt enable priority
11.3 Interrupt vector address
11.4 Level/edge interrupt
12 TIMER/COUNTER
13 WATCHDOG TIMER
13.1 Watchdog Timer operation
14 PULSE WIDTH MODULATORS
14.1 PWM control
14.2 Tuning Pulse Width Modulator (TPWM)
14.3 TPWM control
14.4 Software ADC (SAD)
15 I2C-BUS SERIAL I/O
15.1 I2C-bus port selection
16 MEMORY INTERFACE
16.1 Memory structure
16.2 Memory mapping
16.3 Addressing memory
16.4 Page clearing
17 DATA CAPTURE
17.1 Data Capture features
18 DISPLAY
18.1 Display features
18.2 Display modes
18.3 Display feature descriptions
18.4 Character and attribute coding
18.5 Screen and global controls
18.6 Text display controls
18.7 Display positioning
18.8 Character set
18.9 ROM addressing
18.10 Redefinable characters
18.11 Display synchronization
18.12 Video/Data switch (Fast Blanking) polarity
18.13 Video/data switch adjustment
18.14 RGB brightness control
18.15 Contrast reduction
19 MEMORY MAPPED REGISTERS (MMR)
20 LIMITING VALUES
21 CHARACTERISTICS
22 QUALITY AND RELIABILITY
23 APPLICATION INFORMATION
24 ELECTROMAGNETIC COMPATIBILITY
(EMC) GUIDELINES
25 PACKAGE OUTLINES
26 SOLDERING
26.1 Introduction to soldering through-hole mount
packages
26.2 Soldering by dipping or by solder wave
26.3 Manual soldering
26.4 Suitability of through-hole mount IC packages
for dipping and wave soldering methods
27 DEFINITIONS
28 LIFE SUPPORT APPLICATIONS
29 PURCHASE OF PHILIPS I2C COMPONENTS