Philips SA9025BE Datasheet

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SA9025 900 MHz transmit modulator and
2.2 GHz fractional–N synthesizer
Objective specification 1997 Aug 01
INTEGRATED CIRCUITS
Philips Semiconductors Objective specification
900 MHz transmit modulator and 2.2 GHz fractional–N synthesizer
2
1997 Aug 01
DESCRIPTION
This specification defines the requirements for a transmitter modulator and fractional–N synthesizer IC to be used in cellular telephones which employ the North American Dual Mode Cellular System (IS–136).
FEA TURES
Low current from 3.75V supply
Low phase noise
Main loop with internal charge pump and fractional compensation
3–line serial interface bus
Power down for the synthesizers
Speedup mode for faster switching
APPLICATIONS
Cellular phones
Portable battery–powered radio equipment.
GENERAL DESCRIPTION
The SA9025 BICMOS device integrates:
Main channel synthesizer
Auxiliary synthesizer
Transmit offset synthesizer and oscillator
I/Q modulator
Power control
Reference and clock buffers
Control logic for programming and power down modes
PIN CONFIGURATION
SR01446
45464748
1 2 3 4 5 6 7
13 14 15 16 17 18 19
25
26
27
28
29
30
424344
31
32
33
34
35
36
20 21 22 23 24
8
9 10 11 12
394041 3738
PHP
V
RX
GND
GND
Ipeak
TANK1
XTAL TX DATA CLOCK LOCK STROBE GND
I Q
PHI
GNDRNGND
INA
GND
PHA
RCLK
MCLK
TANK2
Vcc
GND
GND
GND
GND
GND
DUAL
GND
GND
CC
V
CC
Vcc
V
CC
V
CC
V
CC
SA9025
LO1
RX
LO2
TX
LO1
TX
LO2
PHS out
TX1
DUAL
TX2
EN
2
XTAL
1
Q
I
Figure 1. Pin Configuration
QUICK REFERENCE DA TA
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
CC
Supply voltage V
CC
3.6 3.75 3.9 V
I
CC
Supply current TBD mA
I
CC_save
Total supply current in power–down mode
TBD mA
f
VCO
Input frequency 800 2200 MHz
f
AUX
Input frequency 10 500 MHz
f
XTAL
Crystal reference input frequency 10 40 MHz
f
PC
Maximum phase comparator frequency Main and Aux loops 5 MHz
T
amb
Operating ambient temperature –40 +85 °C
ORDERING INFORMATION
TYPE NUMBER
PACKAGE
NAME DESCRIPTION VERSION
SA9025 LQFP48 Plastic low profile quad flat package; 48 leads; body 7x7x1.4 mm SOT313-2
Philips Semiconductors Objective specification
SA9025
900 MHz transmit modulator and 2.2 GHz fractional–N synthesizer
1997 Aug 01
3
CONNECTIONS
SR01455
PHP
V
RX
GND
GND
Ipeak
TANK1
XTAL
TX
DATA
CLOCK
LOCK
STROBE
GND
I
Q
PHI
GND
RN
GND
INA
GND
PHA
RCLK
MCLK
TANK2
GND
GND
GND
GND
GND
DUAL
GND
GND
CC
V
CC
V
CC
V
CC
V
CC
LO1
RX
LO2
TX
LO1
TX
LO2
PHS out
TX1
DUAL
TX2
EN
XTAL
V
CC
V
CC
2
MAIN
DIV.
MAIN PD
and CP
AUX.
DIV.
AUX PD
and CP
REF.
DIV.
CONTROL
LOGIC
0
90
0
90
0
90
1
Q
I
÷M
÷N
÷A
Figure 2. SA9025 Block Diagram
Philips Semiconductors Objective specification
SA9025
900 MHz transmit modulator and 2.2 GHz fractional–N synthesizer
1997 Aug 01
4
PIN DESCRIPTIONS
PIN NO.
PIN DESCRIPTION
1 PHP Proportional charge pump output 2 V
CC
Digital supply voltage
3 RX
LO1
Differential LO input
4 RX
LO2
Differential LO input 5 GND Digital Ground 6 V
CC
Tank supply voltage 7 TX
LO1
Differential Transmit LO Input 8 TX
LO2
Differential Transmit LO Input 9 GND Tank Ground
10 PHS OUT Charge pump output (transmit offset)
11 I
PEAK
PHS out current set resistor
12 TANK1 VCO differential tank 13 TANK2 VCO differential tank 14 V
CC
Tx supply voltage
15 GND Tx Ground 16 GND Tx Ground 17 GND Tx Ground 18 GND Tx Ground 19 GND Tx Ground 20 DUALTX1 Dual mode RF output 21 GND Tx Ground 22 DUALTX2 Dual mode RF output 23 GND Tx Ground
24 V
CC
Tx supply voltage 25 Q Inverting quadrature input 26 Q Non–Inverting quadrature input 27 I Non–inverting in phase modulation input 28 I Inverting in phase modulation input 29 V
CC
Tx supply voltage 30 GND Tx Ground 31 STROBE Data input latch enable 32 LOCK Lock detect 33 CLOCK Serial clock input 34 DAT A Serial data input 35 TX
EN
Transmit enable 36 XTAL
2
Crystal Oscillator emitter input 37 XTAL
1
Crystal Oscillator base Input 38 MCLK Buffered oscillator output 39 RCLK Buffered oscillator output 40 V
CC
REF supply voltage 41 PHA Auxiliary charge pump output 42 GND REF Ground 43 INA RX
IF
input
44 V
CC
CP supply voltage 45 GND CP Ground 46 RN CP current set resistor 47 GND CP Ground 48 PHI Integral charge pump output
Philips Semiconductors Objective specification
SA9025
900 MHz transmit modulator and 2.2 GHz fractional–N synthesizer
1997 Aug 01
5
OPERATING MODES & POWER DOWN CONTROL
There are two power saving modes of operation which the SA9025 can be put into, dependent on the status of the system. The intention of these different modes is to disable circuity that is not in use at the time in order to reduce power consumption. During sleep mode, only circuitry which is required to provide a master clock to
the digital portion of the system is enabled. During receive mode, circuitry which is used to perform the receive function and provide a master clock is enabled. In transmit mode all the functions of the chip are enabled which are required to perform transmit, receive and provide master clock.
SA9025 POWER MODE TRUTH TABLE
Sleep Mode Receive Mode Transmit Mode
Enabled yes no yes no yes no
Crystal Oscillator
Phase detector and charge pump (transmit offset)
VCO
SSB Up-converter
MCLK Buffer
RCLK Buffer
÷M offset loop divider
TXLO Buffer
RXLO Buffer
I/Q Modulator
Variable Gain Amp.
Control Logic
Main Divider
Reference Divider
Auxiliary Divider
Main Phase Detector and charge pump
Auxiliary Phase Detector and charge pump
Lock Detect
Philips Semiconductors Objective specification
SA9025
900 MHz transmit modulator and 2.2 GHz fractional–N synthesizer
1997 Aug 01
6
ABSOLUTE MAXIMUM RATINGS
SYMBOL PARAMETER VALUE UNIT
MIN. MAX.
V
CC
Supply voltage -0.3 +4.5 V
V
IN
Voltage applied to any other pin -0.3 VCC+0.3 V
P
N
Power dissipation, TA = 25°C (still air) 980 mW
T
JMAX
Operation junction temperature TBD °C
P
MAX
Power input/output +10/+14 dBm
I
MAX
DC current into any I/O pin -10 +10 mA
T
STG
Storage temperature –65 +150 °C
T
o
Operating temperature -40 +85 °C
DC ELECTRICAL CHARACTERISTICS
V
CC
= +3.75 V; TA = 25°C; unless otherwise stated.
SYMBO
LIMITS
L
PARAMETER
TEST CONDITIONS
MIN TYP MAX
UNITS
V
CC
Power supply range 3.6 3.75 3.9 V
Sleep mode 2
Standby mode 17
I
CC
Supply current
Operating: full power analog 95
mA
CC
y
Operating: full power digital
DUAL
1
52
I / I In-phase dif ferential input quiescent VCC /2 V
Q / Q Quadrature phase differential input quiescent VCC /2 V
V
IL
Clock, Data, Strobe, TX
EN
Input logic low –0.3 0.3 × V
CC
V
V
IH
Clock, data, strobe, TX
EN
Input logic high 0.7 × V
CC
VCC+0.3 V
T
A
Ambient temperature range -40 +25 +85 °C
Digital Outputs Lock
p
VOLOutput voltage LOW
I
O
=
2mA
0.4
V
V
OH
Output voltage HIGH IO = -2mA V
CC
– 0.4 V
Charge Pump Current Setting Resistor Input; RN, R
Ipeak
RN
External resistor to ground
6
7.5
24
k
R
Ipeak
External resistor to ground 4.7
k
V
RN
Regulated voltage
RN = 7.5 k
1.23 V
V
Ipeak
Regulated voltage
R
ipeak
= 4.7 k
1.3 V
I
peak
PHSOUT programming
R
ipeak
= 4.7 k
0.26 mA
PHS
gain
PHSOUT gain
R
ipeak
= 4.7 k
24xI
peak
mA
K
PD phase gain Transmit offset PLL in phase lock 4.33 mA/rad
Charge Pump Outputs (including fractional compensation pump, not PHS) RN = 7.5 k
Charge pump output current error
I
OPH
g
versus expected current.
1515%
I
MATCH
Sink to source current matching V
PHX =
VCC/2 –5 5 %
Current output variation versus V
PHX
V
PHX
in compliance range –10 10 %
Charge pump off, leakage current V
PHX
= VCC/2 –10
1
10 nA
V
PH
Charge pump voltage compliance
3
0.7 VCC – 0.8 V
Charge Pump Outputs (only PHS) R
ipeak
= 4.7 k
Charge pump output current error
I
OPH
g
versus expected current.
1515%
I
MATCH
Sink to source current matching V
PHS
= VCC/2 –10 10 %
Philips Semiconductors Objective specification
SA9025
900 MHz transmit modulator and 2.2 GHz fractional–N synthesizer
1997 Aug 01
7
Current output variation versus V
PH
V
PHS
in compliance range –25 25 %
V
PH
Charge pump voltage compliance 0.5 VCC–0.5 V
AC ELECTRICAL CHARACTERISTICS
VCC = +3.75 V; TA = 25°C; unless otherwise stated.
LIMITS
SYMBOL
PARAMETER
TEST CONDITIONS
MIN TYP MAX
UNITS
Modulator
Transmit LO input (AC-coupled; 50 Input power -13 -10 dBm
TX
LO 1/2
(
single-ended, 100 differential) Frequency range 900 1100 MHz
VSWR 2:1
TANK1/2 VCO tank differential inputs Frequency range 90 180 MHz
÷M PLL offset divider Maximum input frequency 180 MHz XTAL1Osc. transistor base Osc. frequency 10 40 MHz XTAL2Osc. transistor emitter Osc. frequency 10 40 MHz
XO Negative resistance –100
RCLK, MCLK
Reference buffer output Frequency range Output levels Harmonic content
Z
LOAD
= 5kΩ| | 7 pF
10
0.7
1.0
40
1.4
–10
MHz
V
P–P
dBc
TX
EN
Transmit enable
Transmit enable
Transmit disable
TX
EN
= 1
TX
EN
= 0
Logic
Q / Q
I / I
Baseband in-phase differential inputs
Maximum frequency
Diff. mod. level
Diff. input impedance
DC bias point
1.8
0.8
10.0
1.8
0.9
VCC/2
1.0
2.55
MHz
V
P-P
k
V
TX
RF
TX
RF
operating range 820 920 MHz
DUAL
TX
DUAL output SE=1, TXEN=1 (with external matching) (50)
AMPS/DAMPS 820 853 MHz
DUAL
TX
Differential output, (DUALTX) open-collector, matched to 200 differential impedance
Output level (avg. min., I and Q
quad., 0dB VGA)
Gain flatness
+9.0 +11.0
1
+13.0 dBm
dB
DUAL
TX
Linearity worst case intermod. products (0dB VGA OR +9 dBm, whichever is less, I & Q in-phase)
3rd-order 5th-order 7th-order
-42
-55
-65
-34
-45
-53
dBc
DUAL
TX
Carrier suppression (I & Q in quadrature)
VGA = 0dB
VGA = -38dB
-45
-33
-35
dBc
DUAL
TX
Sideband suppression (I & Q in quadrature)
-45 -35 dBc
2 to 284 MHz -45
824 to 849 MHz -47 dBc
DUALTXSpurious output 849 to 869 MHz -45
869 to 894 MHz -104 dBm
894 to 8490 MHz -45 dBc
TX
LO
-21
p
p
Upper Side Band –21
DUAL
TX
TX
LO
u-
conversion roducts
TXLO ±3 × TX
OFFSET
-36
dBc
Harmonics 10th -21
DUAL
TX
Broad-band noise (0dB VGA or +9 dBm, whichever is less)
869 to 894 MHz -123 dBm/Hz
p
DUAL
TX
Adjacent channel noise power
@ 30 kH
z -
95
dBc/H
z
DUALTXAlternate channel noise power @ 60 kHz –101 dBc/Hz
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