Datasheet PZUxB Datasheet (Philips)

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PZUxB series

Single Zener diodes in a SOD323F package

Rev. 01 — 7 March 2006 Product data sheet

1. Product proﬁle

1.1 General description

General-purpose Zener diodes in a SOD323F (SC-90) very small and ﬂat lead Surface Mounted Device (SMD) plastic package.

1.2 Features

n Total power dissipation: ≤ 310 mW n Tolerance series: B: approximately ±5 %; B1, B2, B3: sequential, approximately ±2% n Small plastic package suitable for surface mounted design n Wide working voltage range: nominal 2.4 V to 36 V

1.3 Applications

n General regulation functions

1.4 Quick reference data

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

tot

[1] Pulse test: tp≤ 300 µs;δ≤0.02. [2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.

forward voltage IF= 100 mA total power dissipation T

amb

≤ 25 °C

[1]

- - 1.1 V

[2]

- - 310 mW

[3]

- - 550 mW

Philips Semiconductors

2. Pinning information

Table 2. Pinning

Pin Description Simpliﬁed outline Symbol

1 cathode 2 anode

[1] The marking bar indicates the cathode.

3. Ordering information

Table 3. Ordering information

Type number Package

PZU2.4B to PZU36B

[1]

PZUxB series

Single Zener diodes in a SOD323F package

[1]

Name Description Version

SC-90 plastic surface mounted package; 2 leads SOD323F

sym068

4. Marking

[1] The series consists of 97 types with nominal working voltages from 2.4 V to 36 V.

Table 4. Marking codes

Type number Marking code Type number Marking code

B B1 B2 B3 B B1 B2 B3

PZU2.4 G3 - - - PZU10 GJ FH HF KB PZU2.7 G4 F3 H1 - PZU11 GK FJ HG KC PZU3.0 G5 F4 H2 - PZU12 GL FK HH KD PZU3.3 G6 F5 H3 - PZU13 GM FL HJ KE PZU3.6 G7 F6 H4 - PZU14 - - HK PZU3.9 G8 F7 H5 - PZU15 GN FM HL KF PZU4.3 G9 F8 H6 HS PZU16 GP FN HM KG PZU4.7 GA F9 H7 HT PZU18 GQ FP HN KH PZU5.1 GB FA H8 HU PZU20 GR FQ HP KJ PZU5.6 GC FB H9 HV PZU22 GS FR HQ KK PZU6.2 GD FC HA HW PZU24 GT FS HR KL PZU6.8 GE FD HB HX PZU27 GU - - PZU7.5 GF FE HC HY PZU30 GV - - PZU8.2 GG FF HD HZ PZU33 GW - - PZU9.1 GH FG HE KA PZU36 GX - - -

Product data sheet Rev. 01 — 7 March 2006 2 of 12

Philips Semiconductors

5. Limiting values

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

ZSM

tot

amb

stg

[1] tp= 100 µs; square wave; Tj=25°C prior to surge [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.

PZUxB series

Single Zener diodes in a SOD323F package

forward current - 200 mA non-repetitive peak reverse

current non-repetitive peak reverse

power dissipation total power dissipation T

amb

≤ 25 °C

junction temperature - 150 °C ambient temperature −65 +150 °C storage temperature −65 +150 °C

- see Table 8 and

[1]

-40W

[2]

- 310 mW

[3]

- 550 mW

6. Thermal characteristics

Table 6. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

th(j-a)

thermal resistance from junction to ambient

th(j-sp)

thermal resistance from junction to solder point

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. [3] Soldering point of cathode tab.

7. Characteristics

Table 7. Characteristics

Tj=25°C unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

[1] Pulse test: tp≤ 300 µs; δ≤0.02.

forward voltage IF=10mA

= 100 mA

in free air

[1]

- - 400 K/W

[2]

- - 230 K/W

[3]

- - 55 K/W

[1]

- - 0.9 V

[1]

- - 1.1 V

Product data sheet Rev. 01 — 7 March 2006 3 of 12

Philips Semiconductors

PZUxB series

Single Zener diodes in a SOD323F package

Table 8. Characteristics per type; PZU2.4B to PZU5.6B3

Tj=25°C unless otherwise speciﬁed.

PZU

Sel Working

xxx

voltage V

(V);

=5mA

Min Max IZ= 0.5 mA IZ=5mA Max VR(V) Typ Max Max

2.4 B 2.3 2.6 1000 100 50 1 −1.6 450 8

2.7 B 2.5 2.9 1000 100 20 1 −2.0 440 8 B1 2.5 2.75 B2 2.65 2.9

3.0 B 2.80 3.20 1000 95 10 1 −2.1 425 8 B1 2.80 3.05 B2 2.95 3.20

3.3 B 3.10 3.50 1000 95 5 1 −2.4 410 8 B1 3.10 3.35 B2 3.25 3.50

3.6 B 3.40 3.80 1000 90 5 1 −2.4 390 8 B1 3.40 3.65 B2 3.55 3.80

3.9 B 3.70 4.10 1000 90 3 1 −2.5 370 8 B1 3.70 3.97 B2 3.87 4.10

4.3 B 4.01 4.48 1000 90 3 1 −2.5 350 8 B1 4.01 4.21 B2 4.15 4.34 B3 4.28 4.48

4.7 B 4.42 4.90 800 80 2 1 −1.4 325 8 B1 4.42 4.61 B2 4.55 4.75 B3 4.69 4.90

5.1 B 4.84 5.37 250 60 2 1.5 0.3 300 5.5 B1 4.84 5.04 B2 4.98 5.20 B3 5.14 5.37

5.6 B 5.31 5.92 100 40 1 2.5 1.9 275 5.5 B1 5.31 5.55 B2 5.49 5.73 B3 5.67 5.92

Maximum differential resistance r

(Ω)

dif

Reverse current I

(µA)

Temperature coefﬁcient S

(mV/K);

=5mA

Diode capacitance

(pF)

[1]

Non-repetitivepeak reverse current I

ZSM

(A)

[2]

[1] f = 1 MHz; VR=0V [2] tp= 100 µs; square wave; Tj=25°C prior to surge

Product data sheet Rev. 01 — 7 March 2006 4 of 12

Philips Semiconductors

PZUxB series

Single Zener diodes in a SOD323F package

Table 9. Characteristics per type; PZU6.2B to PZU36B

Tj=25°C unless otherwise speciﬁed.

PZU

Sel Working

xxx

voltage V

(V);

=5mA

Min Max IZ= 0.5 mA IZ=5mA Max VR(V) Typ Max Max

6.2 B 5.86 6.53 80 30 500 3 2.7 250 5.5 B1 5.86 6.12 B2 6.06 6.33 B3 6.26 6.53

6.8 B 6.47 7.14 60 20 500 3.5 3.4 215 5.5 B1 6.47 6.73 B2 6.65 6.93 B3 6.86 7.14

7.5 B 7.06 7.84 60 10 500 4 4.0 170 3.5 B1 7.06 7.36 B2 7.28 7.60 B3 7.52 7.84

8.2 B 7.76 8.64 60 10 500 5 4.6 150 3.5 B1 7.76 8.10 B2 8.02 8.36 B3 8.28 8.64

9.1 B 8.56 9.55 60 10 500 6 5.5 120 3.5 B1 8.56 8.93 B2 8.85 9.23 B3 9.15 9.55

10 B 9.45 10.55 60 10 100 7 6.4 110 3.5

B1 9.45 9.87 B2 9.77 10.21 B3 10.11 10.55

11 B 10.44 11.56 60 10 100 8 7.4 108 3

B1 10.44 10.88 B2 10.76 11.22 B3 11.10 11.56

12 B 11.42 12.60 80 10 100 9 8.4 105 3

B1 11.42 11.90 B2 11.74 12.24 B3 12.08 12.60

13 B 12.47 13.96 80 10 100 10 9.4 103 2.5

B1 12.47 13.03 B2 12.91 13.49 B3 13.37 13.96

14 B2 13.70 14.30 80 10 100 11 10.4 101 2

Maximum differential resistance r

(Ω)

dif

Reverse current I

(nA)

Temperature coefﬁcient S

(mV/K);

=5mA

Diode capacitance

(pF)

[1]

Non-repetitivepeak reverse current I

ZSM

(A)

[2]

Product data sheet Rev. 01 — 7 March 2006 5 of 12

Philips Semiconductors

PZUxB series

Single Zener diodes in a SOD323F package

Table 9. Characteristics per type; PZU6.2B to PZU36B

…continued

Tj=25°C unless otherwise speciﬁed.

PZU xxx

Sel Working

voltage V

(V);

=5mA

Maximum differential resistance r

(Ω)

dif

Reverse current I

(nA)

Temperature coefﬁcient S

(mV/K);

=5mA

Diode capacitance

(pF)

[1]

Non-repetitivepeak reverse current I

Min Max IZ= 0.5 mA IZ=5mA Max VR(V) Typ Max Max

15 B 13.84 15.52 80 15 50 11 11.4 99 2

B1 13.84 14.46 B2 14.34 14.98 B3 14.85 15.52

16 B 15.37 17.09 80 20 50 12 12.4 97 1.5

B1 15.37 16.01 B2 15.85 16.51 B3 16.35 17.09

18 B 16.94 19.03 80 20 50 13 14.4 93 1.5

B1 16.94 17.70 B2 17.56 18.35 B3 18.21 19.03

20 B 18.86 21.08 100 20 50 15 16.4 88 1.5

B1 18.86 19.70 B2 19.52 20.39 B3 20.21 21.08

22 B 20.88 23.17 100 25 50 17 18.4 84 1.3

B1 20.88 21.77 B2 21.54 22.47 B3 22.23 23.17

24 B 22.93 25.57 120 30 50 19 20.4 80 1.3

B1 22.93 23.96 B2 23.72 24.78 B3 24.54 25.57

27 B 25.1 28.9 150 40 50 21 23.4 73 1 30 B 28 32 200 40 50 23 26.6 66 1 33 B 31 35 250 40 50 25 29.7 60 0.9 36 B 34 38 300 60 50 27 33.0 59 0.8

ZSM

(A)

[2]

[1] f = 1 MHz; VR=0V [2] tp= 100 µs; square wave; Tj=25°C prior to surge

Product data sheet Rev. 01 — 7 March 2006 6 of 12

Philips Semiconductors

PZUxB series

Single Zener diodes in a SOD323F package

300

(mA)

200

100

0.6 10.8

mbg781

VF (V)

Tj=25°C PZU2.4B to PZU4.3B

Fig 1. Forward current as a function of forward

voltage; typical values

mgl274

(mV/K)

12 11

9.1

8.2

7.5

6.8

6.2

5.6

5.1

4.7

3.9

2.4

2.7

3.3

3.6

mgl273

3.0

(mA)

(mV/K)

−1

−2

−3

060

20 40

4.3

Tj=25°C to 150 °C

Fig 2. Temperature coefﬁcient as a function of

working current; typical values

006aaa687

tot

(mW)

400

300

200

100

−5

02016

4812

PZU4.7B to PZU12B

IZ (mA)

0 20015050 100

FR4 PCB, standard footprint

(°C)

amb

Tj=25°C to 150 °C

Fig 3. Temperature coefﬁcient as a function of

Fig 4. Power derating curve

working current; typical values

Product data sheet Rev. 01 — 7 March 2006 7 of 12

Philips Semiconductors

8. Package outline

PZUxB series

Single Zener diodes in a SOD323F package

Fig 5. Package outline SOD323F (SC-90)

9. Packing information

Table 10. Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.

Type number Package Description Packing quantity

PZU2.4B to PZU36B

0.5

0.3

0.80

0.65

0.25

0.10 04-09-13Dimensions in mm

[1]

2.7

2.3

1.8

1.6

1.35

1.15

0.40

0.25

3000 10000

SOD323F 4 mm pitch, 8 mm tape and reel -115 -135

[1] For further information and the availability of packing methods, seeSection 14.

10. Soldering

3.05

2.80

2.10

1.60

1.65

0.50 (2×)

Reﬂow soldering is the only recommended soldering method. Dimensions in mm

0.500.95

001aab169

0.60

Fig 6. Reﬂow soldering footprint SOD323F (SC-90)

Product data sheet Rev. 01 — 7 March 2006 8 of 12

solder lands

solder resist

occupied area

solder paste

Philips Semiconductors

11. Mounting

PZUxB series

Single Zener diodes in a SOD323F package

43.4

0.6

0.5

006aaa487

Dimensions in mm

0.6

Dimensions in mm

PCB thickness = 1.6 mm PCB thickness = 1.6 mm

0.6

43.4

0.6

0.5

006aaa488

Fig 7. FR4 PCB, standard footprint Fig 8. FR4 PCB, mounting pad for cathode

1cm

Product data sheet Rev. 01 — 7 March 2006 9 of 12

Philips Semiconductors

Single Zener diodes in a SOD323F package

PZUxB series

12. Revision history

Table 11. Revision history

Document ID Release date Data sheet status Change notice Supersedes

PZUXB_SER_1 20060307 Product data sheet - -

Product data sheet Rev. 01 — 7 March 2006 10 of 12

Philips Semiconductors

13. Legal information

13.1 Data sheet status

PZUxB series

Single Zener diodes in a SOD323F package

Document status

Objective [short] data sheet Development This document contains data from the objective speciﬁcation for product development. Preliminary [short] data sheet Qualiﬁcation This document contains data from the preliminary speciﬁcation. Product [short] data sheet Production This document contains the product speciﬁcation.

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Deﬁnitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL

[1][2]

Product status

13.2 Deﬁnitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in modiﬁcations or additions. Philips Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet isintended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Philips Semiconductors sales ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the full data sheet shall prevail.

13.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, Philips Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.

Right to make changes — Philips Semiconductors reserves the right to make changes to information published in this document, including without limitation speciﬁcations and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.

Suitability for use — Philips Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or

[3]

http://www.semiconductors.philips.com.

Deﬁnition

malfunction of a Philips Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. Philips Semiconductors accepts no liability for inclusion and/or use of Philips Semiconductors products in such equipment or applications and therefore such inclusion and/or use is for the customer’s own risk.

Applications — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the speciﬁed use without further testing or modiﬁcation.

Limiting values — Stress above one or more limiting values (as deﬁned in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operationof the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability.

Terms and conditions of sale — Philips Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at

http://www.semiconductors.philips.com/proﬁle/terms, including those

pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by Philips Semiconductors. In case of any inconsistency or conﬂict between information in this document and such terms and conditions, the latter will prevail.

No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyanceor implication of any license under any copyrights, patents or other industrial or intellectual property rights.

13.4 Trademarks

Notice: All referencedbrands, product names, service names and trademarks are the property of their respective owners.

14. Contact information

For additional information, please visit: http://www.semiconductors.philips.com For sales ofﬁce addresses, send an email to: sales.addresses@www.semiconductors.philips.com

Product data sheet Rev. 01 — 7 March 2006 11 of 12

Philips Semiconductors

15. Contents

1 Product proﬁle . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3

8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8

9 Packing information. . . . . . . . . . . . . . . . . . . . . . 8

10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

11 Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10

13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11

13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11

13.2 Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 11

13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11

14 Contact information. . . . . . . . . . . . . . . . . . . . . 11

15 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

PZUxB series

Single Zener diodes in a SOD323F package

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.semiconductors.philips.com. For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com.

Date of release: 7 March 2006

Document identifier: PZUXB_SER_1

Datasheet PZUxB Datasheet (Philips)

Specifications and Main Features

Frequently Asked Questions

User Manual

1.1 General description

1.2 Features

1.3 Applications

1.4 Quick reference data

2. Pinning information

3. Ordering information

4. Marking

5. Limiting values

6. Thermal characteristics

7. Characteristics

8. Package outline

9. Packing information

10. Soldering

11. Mounting

12. Revision history

13. Legal information

13.1 Data sheet status

13.3 Disclaimers

13.4 Trademarks

14. Contact information

15. Contents