Page 1
DATA SH EET
ook, halfpage
DISCRETE SEMICONDUCTORS
M3D109
PXTA14
NPN Darlington transistor
Product data sheet
Supersedes data of 1999 Apr 14
2004 Dec 09
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NXP Semiconductors Product data sheet
7
NPN Darlington transistor PXTA14
FEATURES
• High current (max. 500 mA)
• Low voltage (max. 30 V).
APPLICATIONS
• High input impedance preamplifiers.
DESCRIPTION
NPN Darlington transistor in a SOT89 plastic pack age.
complement: PXTA64.
PNP
MARKING
T YPE NUMBER MARKING CODE
(1)
PXTA14 *1N
Note
1. * = p: Made in Hong Kong.
* = t: Made in Malaysia.
* = W: Made in China.
PINNING
PIN DESCRIPTION
1 emitter
2 collector
3 base
321
Fig.1 Simplified outline (SOT89) and symbol.
23
TR1
TR2
1
sym08
ORDERING INFORMATION
PACKAGE
T YPE NUMBER
NAME DESCRIPTION VERSION
PXTA14 SC-62 plastic surface mounted package; collector pad for good heat
transfer; 3 leads
SOT89
2004 Dec 09 2
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NXP Semiconductors Product data sheet
NPN Darlington transistor PXTA14
LIMITING VALUES
In accordance with the Absolu te Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
V
CES
V
EBO
I
C
I
CM
I
B
P
tot
T
stg
T
j
T
amb
Note
1. Device mounted on a printed-circuit board, single-sided copp er, tin-plated, mounting pad for collector 6 cm2.
For other mounting conditions, see “Thermal considerations for th e SOT89 in the General Part of associated
Handbook”.
collector-base voltage open emitter − 30 V
collector-emitter voltage VBE = 0 V − 30 V
emitter-base voltage open collector − 10 V
collector current (DC) − 500 mA
peak collector current − 1 A
base current (DC) − 200 mA
total power dissipation T
≤ 25 °C; note 1 − 1.3 W
amb
storage temperature −65 +150 °C
junction temperature − 150 °C
ambient temperature −65 +150 °C
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
R
th(j-a)
th(j-s)
thermal resistance from junction to ambient note 1 96 K/W
thermal resistance from junction to solder point 16 K/W
Note
1. Device mounted on a printed-circuit board, single-sided copp er, tin-plated, mounting pad for collector 6 cm2.
For other mounting conditions, see “Thermal considerations for th e SOT89 in the General Part of associated
Handbook”.
CHARACTERISTICS
T
= 25 °C unless otherwise specified.
amb
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
I
CBO
I
CES
I
EBO
h
FE
collector-base cut-off curren t IE = 0 A; VCB = 30 V − 100 nA
collector-emitter cut-off current VBE = 0 V; VCE = 30 V − 100 nA
emitter cut-off current IC = 0 A; VEB = 10 V − 100 nA
DC current gain IC = 10 mA; VCE = 5 V; (see Fig.2) 10 000 −
IC = 100 mA; VCE = 5 V; (see Fig.2) 20 000 −
V
V
V
f
T
CEsat
BEsat
BEon
collector-emitter saturation voltage IC = 100 mA; IB = 0.1 mA − 1.5 V
base-emitter saturation vo ltage IC = 100 mA; IB = 0.1 mA − 1.5 V
base-emitter on-state voltage IC = 100 mA; VCE = 5 V − 2 V
transition frequency IC = 30 mA; VCE = 5 V; f = 100 MHz 125 − MHz
2004 Dec 09 3
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NXP Semiconductors Product data sheet
NPN Darlington transistor PXTA14
80000
handbook, full pagewidth
h
FE
60000
40000
20000
0
−1
10
VCE = 2 V.
1
10 10
Fig.2 DC current gain; typical values.
MGD837
2
IC (mA)
3
10
2004 Dec 09 4
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NXP Semiconductors Product data sheet
9
NPN Darlington transistor PXTA14
PACKAGE OUTLINE
Plastic surface-mounted package; collector pad for good heat transfer; 3 leads SOT8
w M
D
b
p3
123
b
p2
b
p1
e
1
e
B
A
E
L
p
H
E
c
0 2 4 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
1.6
mm
1.4
OUTLINE
VERSION
SOT89 TO-243 SC-62
b
p1
0.48
0.35
b
p2
0.53
0.40
IEC JEDEC JEITA
b
1.8
1.4
p3
c
0.44
0.23
D
E
4.6
2.6
4.4
2.4
REFERENCES
3.0
H
4.25
3.75
L
1.2
0.8
w
p
0.13
EUROPEAN
PROJECTION
ISSUE DATE
04-08-03
06-03-16
E
e
e
1
1.5
2004 Dec 09 5
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NXP Semiconductors Product data sheet
NPN Darlington transistor PXTA14
DATA SHEET STATUS
DOCUMENT
STATUS
Objective data sheet Development This document contains data from the objective specification for product
Preliminary data sheet Qualification This document contains data from the preliminary specification.
Product data sheet Production This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this do cument was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
http://www.nxp.com.
URL
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Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modificati on .
(1)
PRODUCT
STATUS
(2)
DEFINITION
development.
above those given in the Characteristics sections of this
document is not implied. Exposure to limiting values for
extended periods may affect device reliability.
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http://www.nxp.com/profile/terms, including those
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Export control ⎯ This document as well as the item(s)
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national authorities.
Quick reference data ⎯ The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Limiting values ⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC
the device. Limiting values are stress ratings only an d
operation of the device at these or any other conditions
2004 Dec 09 6
60134) may cause permanent damage to
Page 7
NXP Semiconductors
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
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All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this documen t d oes not form part of any quotation or contract, is believe d t o b e a ccur ate a nd re li a ble and may be change d
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Printed in The Netherlands R75/04/pp7 Date of release: 2004 Dec 09 Document order number: 9397 750 13901
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