Philips psmn023-80ls Datasheet

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Page 1

PSMN023-80LS

N-channel QFN3333 80 V 23 mΩ standard level MOSFET

Rev. 2 — 18 August 2010 Product data sheet

1. Product profile

1.1 General description

Stan dard level N-channel MOSFET in QFN3333 package qualified to 1 50 °C. This product is designed and qualified for use in a wide range of industrial, communications and power supply equipment.

1.2 Features and benefits

 High efficiency due to low switching

and conduction losses

 Suitable for standard level gate drive

sources

 Small footprint for compact designs

1.3 Applications

 DC-to-DC converters  Lithium-ion battery protection

 Load switching

1.4 Quick reference data

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

tot

Static characteristics

DSon

drain-source voltage

drain current Tmb=25°C; VGS=10V;

total power dissipation

junction temperature

drain-source on-state resistance

Tj≥ 25 °C; Tj≤ 175°C --80V

--34A

see Figure 1 Tmb= 25 °C; see Figure 2 --65W

-55 - 150 °C

VGS=10V; ID=10A; T

= 100 °C; see Figure 12

=10V; ID=10A;

=25°C; see Figure 13

--38mΩ

- 1923mΩ

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NXP Semiconductors

PSMN023-80LS

N-channel QFN3333 80 V 23 mΩ standard level MOSFET

Table 1. Quick reference data

…continued

Symbol Parameter Conditions Min Typ Max Unit

Dynamic characteristics

Q Q

GD G(tot)

gate-drain charge VGS=10V; ID=30A;

=40V; see Figure 14;

total gate charge - 21 - nC

see Figure 15

Avalanche ruggedness

DS(AL)S

non-repetitive drain-source avalanche energy

VGS=10V; T ID=34A; V R

sup

=50Ω; unclamped

j(init)

≤ 80 V;

=25°C;

2. Pinning information

drain

8765

1234

Transparent

top view

SOT873-1 (QFN3333)

Table 2. Pinning information

Pin Symbol Description Simplified outline Graphic symbol

1Ssource 2Ssource 3Ssource 4 G gate 5,6,7,8 D drain mb D mounting base; connected to

-4.8-nC

--37mJ

bb076

3. Ordering information

Table 3. Ordering information

Type number Package

PSMN023-80LS QFN3333 plastic thermal enhanced very thin small outline package;

Name Description Version

no leads; 8 terminals

SOT873-1

Product data sheet Rev. 2 — 18 August 2010 2 of 14

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NXP Semiconductors

4. Limiting values

PSMN023-80LS

N-channel QFN3333 80 V 23 mΩ standard level MOSFET

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

DGR

tot

stg

sld(M)

Source-drain diode

Avalanche ruggedness

DS(AL)S

drain-source voltage Tj≥ 25 °C; Tj≤ 175 °C - 80 V drain-gate voltage Tj≥ 25 °C; Tj≤ 175 °C; RGS=20kΩ -80V gate-source voltage -20 20 V drain current VGS=10V; Tmb= 100 °C; see Figure 1 -22A

=10V; Tmb=25°C; see Figure 1 -34A

peak drain current pulsed; tp≤ 10 µs; Tmb=25°C;

- 137 A

see Figure 3 total power dissipation Tmb=25°C; see Figure 2 -65W storage temperature -55 150 °C junction temperature -55 150 °C peak soldering temperature - 260 °C

source current Tmb=25°C - 34 A peak source current pulsed; tp≤ 10 µs; Tmb= 25 °C - 137 A

non-repetitive drain-source avalanche energy

VGS=10V; T

≤ 80 V; RGS=50Ω; unclamped

sup

=25°C; ID=34A;

j(init)

-37mJ

(A)

0 50 100 150 200

003aae497

(°C)

VGS ≥ 10 V

Fig 1. Continuous drain current as a function of

mounting base temperature

120

der

(%)

0 20015050 100

003aab937

Tmb (°C)

Fig 2. Normalized total power dissipation as a

function of solder point temperature

Product data sheet Rev. 2 — 18 August 2010 3 of 14

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NXP Semiconductors

PSMN023-80LS

N-channel QFN3333 80 V 23 mΩ standard level MOSFET

VDS (V)

003aae498

(A)

−1

1 10 10

Limit R

DSon

= VDS / I

tp =10 μs

100 μs

1 ms

10 ms 100 ms

Tmb = 25°C; IDM is a single pulse

Fig 3. Safe operating area; continuous and peak drain currents as a function of drain -sou rce voltage

5. Thermal characteristics

Table 5. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

th(j-mb)

thermal resistance from junction to mounting base

th(j-a)

thermal resistance from junction to ambient

see Figure 4 -11.3K/W

[1]

- 5360K/W

[1] R

is guaranteed by design and assumes that the device is mounted on a 40mm x 40mm x 70µm copper pad at 20°C ambient

th(j-a)

temperature. In practice R

th(j-mb)

(K/W)

= 0.5

0.2

−1

0.1

0.05

0.02

single shot

−2

−6

will be determined by the customer’s PCB characteristics

th(j-a)

−5

−4

−3

−2

−1

003aae141

δ =

(s)

Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration; typical

values

Product data sheet Rev. 2 — 18 August 2010 4 of 14

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NXP Semiconductors

6. Characteristics

PSMN023-80LS

N-channel QFN3333 80 V 23 mΩ standard level MOSFET

Table 6. Characteristics

Symbol Parameter Conditions Min Typ Max Unit

Static characteristics

(BR)DSS

GS(th)

drain-source breakdown voltage

gate-source threshold voltage

ID=250µA; VGS=0V; Tj= -55 °C 73 - - V

=250µA; VGS=0V; Tj=25°C 80--V

ID=1mA; VDS=VGS; Tj= 175 °C;

1--V

see Figure 10

=1mA; VDS=VGS; Tj=-55°C;

--4.7V

see Figure 10 I

=1mA; VDS=VGS; Tj=25°C;

2.334V

see Figure 10; see Figure 11

DSS

GSS

DSon

drain leakage current VDS=80V; VGS=0V; Tj= 25 °C - 0.1 2 µA

=80V; VGS=0V; Tj=125°C --50µA

gate leakage current VGS=-20V; VDS=0V; Tj= 25 °C - 10 100 nA

=20V; VDS=0V; Tj= 25 °C - 10 100 nA

drain-source on-state resistance

VGS=10V; ID=10A; Tj= 150 °C; see Figure 12

=10V; ID=10A; Tj= 100 °C;

- 39.9 48.3 mΩ

--38mΩ

see Figure 12 V

=10V; ID=10A; Tj=25°C;

- 1923mΩ

see Figure 13

internal gate resistance

f=1MHz - 1 - Ω

(AC)

Dynamic characteristi cs

G(tot)

total gate charge ID=0A; VDS=0V; VGS=10V;

- 18.4 - nC

see Figure 14

Q Q

GS GS(th)

=30A; VDS=40V; VGS=10V;

gate-source charge - 6.6 - nC

see Figure 14; see Figure 15

pre-threshold

-21-nC

-3.9-nC

gate-source charge

GS(th-pl)

post-threshold

-2.7-nC

gate-source charge

Q V

C C C

GS(pl)

iss oss rss

gate-drain charge - 4.8 - nC gate-source plateau

voltage input capacitance VDS=40V; VGS= 0 V; f = 1 MHz; output capacitance - 125 - pF reverse transfer

ID=30A; VDS=40V; see Figure 14; see Figure 15

Tj=25°C; see Figure 16

-5-V

- 1295 - pF

-69-pF

capacitance

d(on)

d(off)

turn-on delay time VDS=40V; RL=1.33Ω; VGS=10V;

=4.7Ω

G(ext)

rise time VDS=40V; VGS=10V; R

=4.7Ω -8-ns

G(ext)

turn-off delay time VDS=40V; RL=1.33Ω; VGS=10V;

=4.7Ω

fall time - 5.4 - ns

G(ext)

- 10.5 - ns

- 20.5 - ns

Product data sheet Rev. 2 — 18 August 2010 5 of 14

Page 6

NXP Semiconductors

003aae501

PSMN023-80LS

N-channel QFN3333 80 V 23 mΩ standard level MOSFET

Table 6. Characteristics …continued

Symbol Parameter Conditions Min Typ Max Unit

Source-drain diode

source-drain voltage IS=10A; VGS=0V; Tj=25°C;

see Figure 17

reverse recovery time IS=10A; dIS/dt = 100 A/µs; VGS=0V; recovered charge - 53 - nC

VDS=40V

- 0.85 1.2 V

-36-ns

(S)

0 10203040

003aae500

(A)

Tj = 25°C; VDS = 10 V

Fig 5. Forward transconductance as a function of

drain current; typical values

003aae502

(A)

0 0.5 1 1.5 2 2.5

= 25°C; tp = 300 µs

8.0

7.0

6.5

6.0

5.5

5.0

4.8

4.6

4.5

4.4

VGS (V ) = 4.2

(V)

Fig 6. Output characteristics: drain current as a

function of drain-source voltage; typica l v al ue s

003aae503

DSon

(mΩ)

0246

> ID X R

Tj = 175 °C

DSon

Tj = 25 °C

(V)

Fig 7. Transfer characteristics: drain current as a

function of gate-source voltage; typical values

4 8 12 16 20

(V)

Tj = 25°C; ID = 10 A

Fig 8. Drain-source on-state resistance as a function

of gate-source voltage; typical values

Product data sheet Rev. 2 — 18 August 2010 6 of 14

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NXP Semiconductors

PSMN023-80LS

N-channel QFN3333 80 V 23 mΩ standard level MOSFET

2000

(pF)

1500

1000

500

0246810

iss

rss

003aae507

(V)

f = 1 MHz; VDS = 0 V

Fig 9. Input and reverse transfer capacitances as a

function of gate-source voltage, typical values

003aae487

(A)

−1

−2

min typ max

GS(th)

(V)

-60 0 60 120 180

max

typ

min

003aae486

Tj (°C)

Fig 10. Gate-source threshold voltage as a function of

junction temperature

2.4

003aae514

−3

−4

−5

−6

0642

VGS (V)

Fig 11. Sub-threshold drain current as a function of

gate-source voltage

1.8

1.2

0.6

-60 0 60 120 180 T

(°C)

Fig 12. Normalized drain-source on-state resistance

factor as a function of junction temperature

Product data sheet Rev. 2 — 18 August 2010 7 of 14

Page 8

NXP Semiconductors

003aaa508

PSMN023-80LS

N-channel QFN3333 80 V 23 mΩ standard level MOSFET

DS on

(mΩ)

0 1020304050

4.4

4.5

4.6

4.8

003aa e504

VGS (V) = 5.0

6.5

6.0

5.5

8.0

(A)

Tj = 25°C; tp = 300 µs

Fig 13. Drain-source on-state resistance as a fun ction

of drain current; typical values

(V)

VDS = 16 V

003aae505

40 V

64 V

GS(pl)

GS(th)

GS1QGS2

G(tot)

Fig 14. Gate charge wa veform definitions

(pF)

003aae506

iss

0102030

(nC)

Tj = 25°C; ID = 30 A

Fig 15. Gate-source voltage as a function of gate

charge; typical values

VDS (V)

oss

rss

−1

= 0 V; f = 1 MHz

1 10 10

Fig 16. Input, output and reverse transfer capacitances

as a function of drain-source voltage; typical values

Product data sheet Rev. 2 — 18 August 2010 8 of 14

Page 9

NXP Semiconductors

PSMN023-80LS

N-channel QFN3333 80 V 23 mΩ standard level MOSFET

(A)

Tj = 175 °C

0 0.3 0.6 0.9 1.2

003aae508

Tj = 25 °C

(V)

VGS = 0 V

Fig 17. Source (diode forward) current as a function of source-drain (diode forward) voltage; typical values

Product data sheet Rev. 2 — 18 August 2010 9 of 14

Page 10

NXP Semiconductors

Q 8

N-channel QFN3333 80 V 23 mΩ standard level MOSFET

7. Package outline

FN3333: plastic thermal enhanced very thin small outline package; no leads;

terminals; body 3.3 x 3.3 x 1.0 mm

PSMN023-80LS

SOT873-

terminal 1 index area

B A

detail X

DIMENSIONS (mm are the original dimensions)

UNIT

mm 1

OUTLINE VERSION

SOT873-1

A1bc ee1L

max.

0.05

0.45

0.00

0.25

2.4

2.2

3.4

3.2

3.4

0.2

3.2

IEC JEDEC JEITA

1.80

1.58

0 1 2 mm

scale

0.65

REFERENCES

- - -- - -- - -

0.55

0.45

ywv

0.52

0.35

0.05 0.1

0.10.11.95

EUROPEAN

PROJECTION

ISSUE DATE

10-03-10 19-04-10

Fig 18. Package outline SOT873-1 (QFN3333)

Product data sheet Rev. 2 — 18 August 2010 10 of 14

Page 11

NXP Semiconductors

8. Revision history

PSMN023-80LS

N-channel QFN3333 80 V 23 mΩ standard level MOSFET

Table 7. Revision history

Document ID Release date Data sheet status Change notice Supersedes

PSMN023-80LS v.2 20100818 Product data sheet - PSMN023-80LS v.1 Modifications: PSMN023-80LS v.1 20100624 Objective data sheet - -

• Status changed from objective to product.

Product data sheet Rev. 2 — 18 August 2010 11 of 14

Page 12

NXP Semiconductors

PSMN023-80LS

N-channel QFN3333 80 V 23 mΩ standard level MOSFET

9. Legal information

9.1 Data sheet status

Document status

Objective [short] data sheet Development This document contains data from the objective specification for pro duct development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) des cribed in this document may have changed since this document was published and may differ in case of multiple devices. The latest product

status information is available on the Internet at URL http://www.nxp.com.

[1][2]

Product status

[3]

Definition

9.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied u pon to co nt ain det ailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.

9.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.

In no event shall NXP Semiconductors be lia ble for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semi conductors’ aggregat e and cumulative liabil ity towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.

Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonabl y be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.

Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteri stics sections of this document, and as such is not complete, exhaustive or legally binding.

Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.

NXP Semiconductors does not accept any liability related to any default , damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third part y customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.

Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.

Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective

, unless otherwise

Product data sheet Rev. 2 — 18 August 2010 12 of 14

Page 13

NXP Semiconductors

PSMN023-80LS

N-channel QFN3333 80 V 23 mΩ standard level MOSFET

agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document may be interpret ed or construed as an offer to sell products that is open f or acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.

Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It i s neither qua lif ied nor test ed in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equ ipment or applications.

In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, da mages or failed produ ct cl aims resulting from custome r design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications.

9.4 Trademarks

Notice: All referenced brands, prod uct names, service names and trad emarks are the property of their respective owners.

Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.

HD Radio and HD Radio logo — are trademarks of iBiquity Digital

Corporation.

10. Contact information

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected]

Product data sheet Rev. 2 — 18 August 2010 13 of 14

Page 14

NXP Semiconductors

N-channel QFN3333 80 V 23 mΩ standard level MOSFET

11. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1

1.1 General description . . . . . . . . . . . . . . . . . . . . . .1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . .1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . .2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . .2

4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3

5 Thermal characteristics . . . . . . . . . . . . . . . . . . .4

6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .5

7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . .10

8 Revision history. . . . . . . . . . . . . . . . . . . . . . . . .11

9 Legal information. . . . . . . . . . . . . . . . . . . . . . . .12

9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .12

9.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

9.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . .1 2

9.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .13

10 Contact information. . . . . . . . . . . . . . . . . . . . . .13

PSMN023-80LS

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected]

Date of release: 18 August 2010

Document identifier: PSMN023-80LS