DISCRETE SEMICONDUCTORS
DATA SH EET
PLB16004U
Microwave power transistor
Product specification
Supersedes data of December 1994
1997 Feb 18
Philips Semiconductors Product specification
Microwave power transistor PLB16004U
FEATURES
• Diffused emitter ballasting resistors
improve excellent current sharing
and withstanding a high VSWR
• Interdigitated common-base
structure provides high emitter
efficiency
• Gold metallization with barrier
realizes very stable characteristics
and excellent lifetime
• Multicell geometry gives good
balance of dissipated power and
low thermal resistance
• Internal input and output
prematching networks allow an
easier design of circuits.
APPLICATIONS
Intended for use in common-base
class C power amplifiers at 1.6 GHz.
DESCRIPTION
NPN silicon planar epitaxial
microwave power transistor in a
SOT437A glued cap metal ceramic
flange package, with base connected
to flange.
QUICK REFERENCE DATA
Microwave performance up to T
=25°C in a common base class C
mb
narrowband amplifier.
MODE OF
OPERATIONf(GHz)
V
(V)
CC
P
(W)
L
G
(dB)
p
η
C
(%)
Zi; Z
(Ω)
Class C (CW) 1.6 28 >4.5 >8.5 >40 see Figs 5
and 6
PINNING - SOT437A
PIN DESCRIPTION
1 collector
2 emitter
3 base connected to flange
handbook, 4 columns
Top view
1
c
b
3
2
e
MAM112
Fig.1 Simplified outline and symbol.
L
WARNING
Product and environmental safety - toxic materials
This product contains beryllium oxide. The product is entirely safe provided that the BeO slab is not damaged.
All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety
precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of
the user. It must never be thrown out with the general or domestic waste.
1997 Feb 18 2
Philips Semiconductors Product specification
Microwave power transistor PLB16004U
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
V
CES
V
CEO
V
EBO
I
C
P
tot
T
stg
T
j
T
sld
Note
1. Up to 0.3 mm from ceramic.
collector-base voltage open emitter − 40 V
collector-emitter voltage RBE=0 − 40 V
collector-emitter voltage open base − 15 V
emitter-base voltage open collector − 3V
DC collector current − 0.5 A
total power dissipation Tmb=75°C − 9W
storage temperature −65 +150 °C
junction temperature − 200 °C
soldering temperature t ≤ 10 s; note 1 − 235 °C
10
handbook, halfpage
P
tot
(W)
8
6
4
2
0
05050 100 200
150
T ( C)
mb
Fig.2 Power derating curve.
MLC457
o
1997 Feb 18 3
Philips Semiconductors Product specification
Microwave power transistor PLB16004U
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS MAX. UNIT
R
th j-mb
R
th mb-h
Note
1. See
“Mounting recommendations in the General part of handbook SC19a”.
CHARACTERISTICS
=25°C unless otherwise specified.
T
mb
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
I
CES
V
(BR)CBO
V
(BR)CES
V
(BR)EBO
h
FE
thermal resistance from junction to mounting base Tj= 100 °C 11 K/W
thermal resistance from mounting base to heatsink note 1 0.3 K/W
collector cut-off current RBE= 0; VCE=30V − 200 µA
collector-base breakdown voltage IC= 1 mA; IE=0 40 − V
collector-emitter breakdown voltage IC= 1 mA; IE=0 40 − V
emitter-base breakdown voltage IC= 1 mA; IE=0 3 − V
DC current gain IC= 300 mA; VCE= 5 V 15 100
APPLICATION INFORMATION
Microwave performance up to T
MODE OF
OPERATION
f
(GHz)
=25°C in a common-base test circuit as shown in Fig.3.
mb
V
(V)
CC
P
(W)
L
G
(dB)
p
η
(%)
C
Zi; Z
L
(Ω)
Class C (CW) 1.6 28 typ. 5 typ. 10 typ. 50 see Figs 5 and 6
1997 Feb 18 4