Philips PHX7N40E Datasheet

Philips Semiconductors Product specification
PowerMOS transistors PHX7N40E Avalanche energy rated

FEATURES SYMBOL QUICK REFERENCE DATA

• Repetitive Avalanche Rated
• Fast switching V
d
= 400 V
DSS
• High thermal cycling performance I
• Isolated package
g
s
= 3.8 A
D
R
DS(ON)
1

GENERAL DESCRIPTION PINNING SOT186A

N-channel, enhancement mode PIN DESCRIPTION field-effect power transistor, intendedforuse in off-line switched 1 gate mode power supplies, T.V. and computer monitor power supplies, 2 drain d.c.tod.c.converters,motorcontrol circuits and general purpose 3 source switching applications.
case isolated The PHX7N40E is supplied in the SOT186A full pack, isolated package.
case
123

LIMITING VALUES

Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
DSS
V
DGR
V
GS
I
D
I
DM
P
D
Tj, T
Drain-source voltage Tj = 25 ˚C to 150˚C - 400 V Drain-gate voltage Tj = 25 ˚C to 150˚C; RGS = 20 k - 400 V Gate-source voltage - ± 30 V Continuous drain current Ths = 25 ˚C; VGS = 10 V - 3.8 A
Ths = 100 ˚C; VGS = 10 V - 2.4 A Pulsed drain current Ths = 25 ˚C - 29 A Total dissipation Ths = 25 ˚C - 35 W Operating junction and - 55 150 ˚C
stg
storage temperature range

AVALANCHE ENERGY LIMITING VALUES

Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
E
AS
E
AR
IAS, I
1 pulse width and repetition rate limited by Tj max.
December 1998 1 Rev 1.200
Non-repetitive avalanche Unclamped inductive load, IAS = 4.8 A; - 290 mJ energy tp = 0.23 ms; Tj prior to avalanche = 25˚C;
VDD 50 V; RGS = 50 ; VGS = 10 V; refer
to fig:17 Repetitive avalanche energy1IAR = 7.2 A; tp = 2.5 µs; Tj prior to - 9.4 mJ
avalanche = 25˚C; RGS = 50 ; VGS = 10 V;
refer to fig:18 Repetitive and non-repetitive - 7.2 A
AR
avalanche current
Philips Semiconductors Product specification
PowerMOS transistors PHX7N40E Avalanche energy rated

ISOLATION LIMITING VALUE & CHARACTERISTIC

Ths = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
isol
C
isol

THERMAL RESISTANCES

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
R
th j-hs
R
th j-a

ELECTRICAL CHARACTERISTICS

Tj = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
(BR)DSS
V
(BR)DSS
T
j
R
DS(ON)
V
GS(TO)
g
fs
I
DSS
I
GSS
Q
g(tot)
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
L
d
L
s
C
iss
C
oss
C
rss
R.M.S. isolation voltage from all f = 50-60 Hz; sinusoidal - 2500 V three terminals to external waveform; heatsink R.H. 65% ; clean and dustfree
Capacitance from T2 to external f = 1 MHz - 10 - pF heatsink
Thermal resistance junction with heatsink compound - - 3.6 K/W to heatsink Thermal resistance junction - 55 - K/W to ambient
Drain-source breakdown VGS = 0 V; ID = 0.25 mA 400 - - V voltage
/ Drain-source breakdown VDS = VGS; ID = 0.25 mA - 0.1 - %/K
voltage temperature coefficient Drain-source on resistance VGS = 10 V; ID = 3.6 A - 0.7 1 Gate threshold voltage VDS = VGS; ID = 0.25 mA 2.0 3.0 4.0 V Forward transconductance VDS = 30 V; ID = 3.6 A 2 4 - S Drain-source leakage current VDS = 400 V; VGS = 0 V - 1 25 µA
VDS = 320 V; VGS = 0 V; Tj = 125 ˚C - 30 250 µA Gate-source leakage current VGS = ±30 V; VDS = 0 V - 10 200 nA
Total gate charge ID = 7.2 A; V Gate-source charge - 3 5 nC
= 320 V; VGS = 10 V - 52 62 nC
DD
Gate-drain (Miller) charge - 26 30 nC Turn-on delay time VDD = 200 V; RD = 27 ; - 12 - ns
Turn-on rise time RG = 12 -33-ns Turn-off delay time - 93 - ns Turn-off fall time - 42 - ns
Internal drain inductance Measured from drain lead to centre of die - 4.5 - nH Internal source inductance Measured from source lead to source - 7.5 - nH
bond pad Input capacitance VGS = 0 V; VDS = 25 V; f = 1 MHz - 620 - pF
Output capacitance - 108 - pF Feedback capacitance - 63 - pF
December 1998 2 Rev 1.200
Philips Semiconductors Product specification
PowerMOS transistors PHX7N40E Avalanche energy rated

SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS

Tj = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
S
I
SM
V
SD
t
rr
Q
rr
Continuous source current Ths = 25˚C - - 7.2 A (body diode) Pulsed source current (body Ths = 25˚C - - 29 A diode) Diode forward voltage IS = 7.2 A; VGS = 0 V - - 1.2 V
Reverse recovery time IS = 7.2 A; VGS = 0 V; dI/dt = 100 A/µs - 270 - ns Reverse recovery charge - 3.3 - µC
December 1998 3 Rev 1.200
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